CN106231731A - IC integration packaging need not the LED lamp bead structure of external power supply - Google Patents
IC integration packaging need not the LED lamp bead structure of external power supply Download PDFInfo
- Publication number
- CN106231731A CN106231731A CN201610767912.0A CN201610767912A CN106231731A CN 106231731 A CN106231731 A CN 106231731A CN 201610767912 A CN201610767912 A CN 201610767912A CN 106231731 A CN106231731 A CN 106231731A
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- China
- Prior art keywords
- driving chip
- rest area
- circuit
- power supply
- bridge rectifier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
Abstract
The invention belongs to IC chip encapsulation technology field, particularly relate to IC integration packaging and need not the LED lamp bead structure of external power supply, including drive circuit and board structure, it is arranged on board structure including drive circuit, drive circuit includes power supply, bridge rectifier, sampling adjusts circuit and IC driving chip, power supply is connected rectification with bridge rectifier, bridge rectifier adjusts circuit with sampling and is connected, sampling adjusts circuit and is connected with IC driving chip, bridge rectifier ground connection, arrange electric capacity C1 between bridge rectifier and sampling adjustment circuit to be filtered, electric capacity C1 other end ground connection, IC driving chip is connected with electric capacity C2 by Vdd terminal mouth, electric capacity C2 other end ground connection.Beneficial effects of the present invention: reasonable in design, by IC driving chip, detects the ac commercial power voltage of rectified 220v, regulates and controls the electric current by LED so that be consistent by the electric current of LED at phase place and input voltage, it is achieved that High Power Factor and high efficiency.LED illuminator part, without external bias circuit, can directly use city's electric drive, the substantial amounts of external component that saves, and system is applied and simple.
Description
Technical field
The invention belongs to IC chip encapsulation technology field, particularly relate to IC integration packaging and need not the LED of external power supply
Pearl structure.
Background technology
COB is the abbreviation of Chip On Board, i.e. chip on board device, and first technical process is in substrate surface heat conduction
Epoxy resin (general with the epoxy resin mixing Argent grain) covers silicon chip nest point, and then silicon chip is rest directly upon substrate table
Face, is heat-treated to till silicon chip is securely fixed in substrate, and the method followed in turn by wire bond is directly built between silicon chip and substrate
Vertical electrical connection.
Traditional LED lamp pearl COB product, needs external constant-current source or constant pressure source, by alternating current after making finished product light fixture
Be converted to the DC source driving LED luminous.LED can run into situations below while normal work:
1. power supply is operationally, and conversion efficiency directly can affect the efficiency of whole lamp, turning of the power supply overwhelming majority on market
Changing efficiency is 75-85%.
2. along with current illumination market part light fixture volume is constantly reduced, the reduction of price, the requirement of high conversion efficiency,
Needing non-isolated scheme, improve conversion efficiency, the volume of reduction gradually, meets the needs at different families but product, but adaptability
Poor, it is only applicable to single specification wattage, when the LED lamp bead wattage of design changes, need to more design and change ceramic substrate, cause
The wasting of resources.
Summary of the invention
For the problems referred to above to be solved, for problem above, the present invention provides IC integration packaging to need not external power supply
LED lamp bead structure, goes for multiple wattage, the effective situation solving to cause multiple ceramic substrate because of wattage difference,
Reach the most unified purpose.
Technical scheme: IC integration packaging need not the LED lamp bead structure of external power supply, including drive circuit and
Board structure, is arranged on described board structure including described drive circuit, and described drive circuit includes power supply, bridge rectifier
Device, sampling adjust circuit and IC driving chip, and described power supply is connected rectification with bridge rectifier, and described bridge rectifier is with described
Sampling adjusts circuit and connects, and described sampling adjusts circuit and is connected with described IC driving chip, and described bridge rectifier ground connection is described
Arrange electric capacity C1 between bridge rectifier and described sampling adjustment circuit to be filtered, described electric capacity C1 other end ground connection, described IC
Driving chip is connected with electric capacity C2 by Vdd terminal mouth, described electric capacity C2 other end ground connection；
Described sampling adjusts circuit and includes sampling resistor R1, R2 and R3, regulation resistance R4, switchs SW0, SW1 SW2, SW3
With non-essential resistance Rset, described sampling resistor R1, R2 and R3 series connection, sampling resistor R3 ground connection, described regulation resistance R4 is with described
Sampling resistor R1, R2 and R3 are in parallel, and described sampling resistor R1, R2 and R3 series connection and described regulation resistance R4 all drive with described IC
Chip connects, and described IC driving chip is connected with non-essential resistance Rset by Iset port, the described non-essential resistance Rset other end
Ground connection, described IC driving chip passes through G port ground connection, and described IC driving chip go side mouth is with switch SW0, SW1 SW2, SW3 even
Connect.
Described board structure is in including substrate, circuit etching, LED luminescence chip rest area, driving chip rest area, element
Welding rest area, contact point, it is characterised in that the built-in described circuit etching of described substrate, described LED luminescence chip rest area, institute
State driving chip rest area, described element welds rest area, described contact point is respectively provided with on the substrate, and described LED is luminous
Placing multiple LED luminescence chips in chip rest area, described driving chip rest area is placed with IC driving chip, and described power supply leads to
Bridge type commutator is connected with described IC driving chip through circuit etching, arranges conducting outside described LED luminescence chip rest area
Line areas, described element welding rest area is multiple, and the periphery of each described welding rest area arranges contact point, described etching line
Road connects described element welding rest area, and described circuit etching collects district and connects ground wire.
Being respectively provided with silver coating on described element welding rest area and described contact point, described silver coating is 0.1-0.5mm, institute
Placing the 10-18W of multiple LED luminescence chips in stating LED luminescence chip rest area, unit's device is placed in described element welding rest area
Part, described components and parts are multiple to be all connected with described IC driving chip, and described substrate is ceramic substrate.
The size 30mm x 30mm of described substrate, described sampling resistor R1, R2 and R3 be 2.0-4.0 megaohm, described regulation
Resistance R4 is 10-20 kilo-ohm, and described non-essential resistance Rset is 80-200 kilo-ohm.
Beneficial effects of the present invention: reasonable in design, by IC driving chip, detects the electric main electricity of rectified 220v
Pressure, regulates and controls the electric current by LED so that be consistent by the electric current of LED at phase place and input voltage, it is achieved that high power
Factor and high efficiency.LED illuminator part, without external bias circuit, can directly use city's electric drive, substantial amounts of saves outside
Components and parts, system is applied and simple.
Accompanying drawing explanation
Fig. 1 is the circuit diagram of the drive circuit of the present invention.
Fig. 2 is the board structure schematic diagram of the present invention.
In figure, 1, substrate, 2, circuit etching, 3, LED luminescence chip rest area, 4, driving chip rest area, 5, element weldering
Connect rest area, 6, contact point, 7, LED luminescence chip, 8, IC driving chip, 9, conducting line areas, 10, circuit etching collect district,
11, power supply, 12, board structure, 13, bridge rectifier, 14, sampling adjust circuit.
Detailed description of the invention
Below in conjunction with the accompanying drawings the detailed description of the invention of the present invention is explained.
IC integration packaging need not the LED lamp bead structure of external power supply, and IC integration packaging need not the LED of external power supply
Pearl structure, including drive circuit and board structure, is arranged on board structure including drive circuit, drive circuit include power supply,
Bridge rectifier, sampling adjust circuit and IC driving chip, and power supply is connected rectification, bridge rectifier and sampling with bridge rectifier
Adjustment circuit connects, and sampling adjusts circuit and is connected with IC driving chip, bridge rectifier ground connection, and bridge rectifier adjusts with sampling
Arranging electric capacity C1 between circuit to be filtered, electric capacity C1 other end ground connection, IC driving chip is connected with electric capacity C2 by Vdd terminal mouth,
Electric capacity C2 other end ground connection,
Sampling adjusts circuit and includes sampling resistor R1, R2 and R3, regulation resistance R4, switch SW0, SW1 SW2, SW3 and outer
Portion resistance Rset, sampling resistor R1, R2 and R3 series connection, sampling resistor R3 ground connection, regulation resistance R4 and sampling resistor R1, R2 and R3
Parallel connection, sampling resistor R1, R2 and R3 series connection and regulation resistance R4 are all connected with IC driving chip, and IC driving chip passes through Iset end
Mouth is connected with non-essential resistance Rset, non-essential resistance Rset other end ground connection, and IC driving chip passes through G port ground connection, and IC drives core
Sheet go side mouth is connected with switch SW0, SW1 SW2, SW3.
Board structure is in including substrate, circuit etching, LED luminescence chip rest area, driving chip rest area, element welding
Rest area, contact point, it is characterised in that the built-in circuit etching of substrate, LED luminescence chip rest area, driving chip rest area, unit
Part welding rest area, contact point are arranged on substrate, place multiple LED luminescence chips, drive in LED luminescence chip rest area
Chip rest area is placed with IC driving chip, and power supply is connected with IC driving chip through circuit etching by bridge rectifier, LED
Arranging conductive line road district outside luminescence chip rest area, element welding rest area is multiple, and the periphery of each welding rest area is arranged
Contact point, circuit etching communication member welding rest area, circuit etching collects district and connects ground wire.
Being respectively provided with silver coating on element welding rest area and contact point, silver coating is that 0.1-0.5mm, LED luminescence chip is put
Putting the 10-18W placing multiple LED luminescence chips in district, components and parts are placed in element welding rest area, components and parts be multiple all with drive
Dynamic chip connects, and substrate is ceramic substrate.
The size 30mm x 30mm of substrate, sampling resistor R1, R2 and R3 be 2.0-4.0 megaohm, and regulation resistance R4 is 10-
20 kilo-ohms, non-essential resistance Rset is 80-200 kilo-ohm.
Make the circuit diagram that use-case: Fig. 1 is the drive circuit of the present invention, power supply 220V AC after bridge rectifier rectification
Civil power is applied directly on IC driving chip, and electric main is sampled by sampling resistor R1, R2 and R3.The voltage sampled passes through
IC internal circuit judgement processes, and opens switch SW0～SW3 of correspondence.By electric current and electric current I0～I3 of switch SW0～SW3
Correspondence, and I0 to I3 electric current the most respectively is that step rises, consistent with 220V AC civil power in phase place, it is achieved that up to
The power factor of 98%.Different phase is lighted luminescence chip, thus is greatly improved the efficiency of whole lamp.
The components and parts of the external power supply used in all traditional senses are designed in a plane with LED illuminator,
LED illuminator is made up of multiple LED luminescence chips, the built-in circuit etching of ceramic substrate, the size 30mm x of ceramic substrate
30mm, the size of circuit design, solve the problem LED luminescence chip placement region that electric current dispels the heat in transmitting procedure to greatest extent
Interior placement multiple LED luminescence chip is 10-18W, is adjusted according to the demand of client, can do according to the requirement maximum of client
To 18W, each custom-designed contact point of components and parts periphery of placement in the rest area of element welding simultaneously,
Lamp bead at any time to each component parameter, well understands the duty of lamp bead, the amount of carrying out in ignition
Surveying components and parts is electric capacity and resistance, and resistance bag expands sampling resistor and non-essential resistance, and sampling resistor R1, R2, R3 are 2.0-4.0 million
Europe, regulation resistance R4 is 10-20 kilo-ohm, and non-essential resistance Rset is 80-200 kilo-ohm, when can work according to LED luminescence chip, connects
The parameter that contact records, adjusts and determines that each components and parts reach optimum condition.
IC integrated Packaging Technology flow process
Mainly include die bond-baking-bonding wire-box dam glue-baking-encapsulation-baking-welding component
Each processing step:
1. die bond: blue chip is horizontal structure, die bond can use insulating cement according to client's actual demand small-power, more greatly
High-power optional elargol or heat conductive silica gel.
2. baking: usually 120 DEG C of 1.5hrs, can be adjusted baking time according to actually used material.
3. bonding wire: use 99.99% gold thread.
4. a box dam glue: control the speed of machine run and the time of plastic emitting well, it is ensured that glue and substrate fully combine nothing
Gap, it is impossible to encounter chip.
5. baking: setting baking time according to using without the characteristic of silica gel, usual silica gel baking is set to syllogic
Baking, prevents from remaining in glue bubble.
6. encapsulation: noting strictly controlling operation maneuver well during encapsulation and board device parameter does not have bubble, foreign material produce.
7. baking: design baking time according to actually used glue property.
8. welding component: noting using tin cream not excess, device placing direction is correct, neatly.
Compared with prior art, the technical program, on the basis of tradition COB encapsulation, designs this size by independent research
Ceramic substrate combine IC chip, the size of this ceramic substrate and the circuit of etched inside are designed, drive core by IC
Sheet, detects the ac commercial power voltage of rectified 220v, regulates and controls the electric current by LED so that by the electric current of LED in phase place
It is consistent with input voltage, it is achieved that High Power Factor and high efficiency.LED illuminator part, can without external bias circuit
Directly using city's electric drive, the substantial amounts of external component that saves, system is applied and simple so that outside the light fixture of application end design
See size more lightening, attractive in appearanceization, make its wattage being suitable for wider, it is achieved that a kind of masterplate can be applicable to many moneys lamp simultaneously
Pearl, has saved production cost.
Above an example of the present invention is described in detail, but described content has been only the preferable enforcement of the present invention
Example, it is impossible to be considered the practical range for limiting the present invention.All impartial changes made according to the present patent application scope and improvement
Deng, within all should still belonging to the patent covering scope of the present invention.
Claims (4)
1.IC integration packaging need not the LED lamp bead structure of external power supply, it is characterised in that includes drive circuit and board structure,
Being arranged on described board structure including described drive circuit, described drive circuit includes that power supply, bridge rectifier, sampling adjust
Circuit and IC driving chip, described power supply is connected rectification with bridge rectifier, and described bridge rectifier adjusts electricity with described sampling
Road connects, and described sampling adjusts circuit and is connected with described IC driving chip, described bridge rectifier ground connection, described bridge rectifier
And arranging electric capacity C1 between described sampling adjustment circuit to be filtered, described electric capacity C1 other end ground connection, described IC driving chip leads to
Cross Vdd terminal mouth to be connected with electric capacity C2, described electric capacity C2 other end ground connection；
Described sampling adjusts circuit and includes sampling resistor R1, R2 and R3, regulation resistance R4, switch SW0, SW1SW2, SW3 and outside
Resistance Rset, described sampling resistor R1, R2 and R3 series connection, sampling resistor R3 ground connection, described regulation resistance R4 and described sampling electricity
Resistance R1, R2 and R3 are in parallel, and described sampling resistor R1, R2 and R3 series connection and described regulation resistance R4 are all with described IC driving chip even
Connecing, described IC driving chip is connected with non-essential resistance Rset by Iset port, described non-essential resistance Rset other end ground connection, institute
State IC driving chip to be connected with switch SW0, SW1SW2, SW3 by G port ground connection, described IC driving chip go side mouth.
IC integration packaging the most according to claim 1 need not the LED lamp bead structure of external power supply, it is characterised in that described
Board structure in include substrate, circuit etching, LED luminescence chip rest area, driving chip rest area, element welding rest area,
Contact point, it is characterised in that the built-in described circuit etching of described substrate, described LED luminescence chip rest area, described driving chip
Rest area, described element welding rest area, described contact point are respectively provided with on the substrate, described LED luminescence chip rest area
Interior placement multiple LED luminescence chip, described driving chip rest area is placed with IC driving chip, and described power supply passes through bridge rectifier
Device is connected with described driving chip through circuit etching, arranges conductive line road district, described unit outside described LED luminescence chip rest area
Part welding rest area is multiple, and the periphery of each described welding rest area arranges contact point, and described circuit etching connects described unit
Part welding rest area, described circuit etching collects district and connects ground wire.
IC integration packaging the most according to claim 1 need not the LED lamp bead structure of external power supply, it is characterised in that described
Being respectively provided with silver coating on element welding rest area and described contact point, described silver coating is 0.1-0.5mm, described LED luminescence core
Placing the 10-18W of multiple LED luminescence chips in sheet rest area, components and parts, described components and parts are placed in described element welding rest area
All being connected with described IC driving chip for multiple, described substrate is ceramic substrate.
IC integration packaging the most according to claim 2 need not the LED lamp bead structure of external power supply, it is characterised in that described
The size 30mm x 30mm of substrate, described sampling resistor R1, R2 and R3 be 2.0-4.0 megaohm, and described regulation resistance R4 is 10-
20 kilo-ohms, described non-essential resistance Rset is 80-200 kilo-ohm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610767912.0A CN106231731A (en) | 2016-08-30 | 2016-08-30 | IC integration packaging need not the LED lamp bead structure of external power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610767912.0A CN106231731A (en) | 2016-08-30 | 2016-08-30 | IC integration packaging need not the LED lamp bead structure of external power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106231731A true CN106231731A (en) | 2016-12-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610767912.0A Pending CN106231731A (en) | 2016-08-30 | 2016-08-30 | IC integration packaging need not the LED lamp bead structure of external power supply |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109287023A (en) * | 2017-07-19 | 2019-01-29 | 威刚科技股份有限公司 | LED circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103313477A (en) * | 2013-06-09 | 2013-09-18 | 易美芯光（北京）科技有限公司 | LED light source module integrated with IC (integrated circuit) drive |
| CN203435189U (en) * | 2013-07-19 | 2014-02-12 | 惠州市大亚湾永昶电子工业有限公司 | Driving power integrated COB light source |
| CN105072776A (en) * | 2015-09-06 | 2015-11-18 | 深圳市源磊科技有限公司 | Integrated COB light source with power drive |
| US20160161098A1 (en) * | 2010-11-22 | 2016-06-09 | Cree, Inc. | Solid state lighting apparatuses, systems, and related methods for improved heat distribution |
-
2016
- 2016-08-30 CN CN201610767912.0A patent/CN106231731A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160161098A1 (en) * | 2010-11-22 | 2016-06-09 | Cree, Inc. | Solid state lighting apparatuses, systems, and related methods for improved heat distribution |
| CN103313477A (en) * | 2013-06-09 | 2013-09-18 | 易美芯光（北京）科技有限公司 | LED light source module integrated with IC (integrated circuit) drive |
| CN203435189U (en) * | 2013-07-19 | 2014-02-12 | 惠州市大亚湾永昶电子工业有限公司 | Driving power integrated COB light source |
| CN105072776A (en) * | 2015-09-06 | 2015-11-18 | 深圳市源磊科技有限公司 | Integrated COB light source with power drive |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109287023A (en) * | 2017-07-19 | 2019-01-29 | 威刚科技股份有限公司 | LED circuit board |
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Application publication date: 20161214 |