CN203445145U - Led light source - Google Patents

Led light source Download PDF

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Publication number
CN203445145U
CN203445145U CN201320351343.3U CN201320351343U CN203445145U CN 203445145 U CN203445145 U CN 203445145U CN 201320351343 U CN201320351343 U CN 201320351343U CN 203445145 U CN203445145 U CN 203445145U
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China
Prior art keywords
chip
light source
led light
substrate
led
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Expired - Lifetime
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CN201320351343.3U
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Chinese (zh)
Inventor
冯云龙
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SHENZHEN RUNLITE TECHNOLOGY Co Ltd
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SHENZHEN RUNLITE TECHNOLOGY Co Ltd
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Priority to CN201320351343.3U priority Critical patent/CN203445145U/en
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Abstract

This utility model discloses an LED light source, comprising a substrate with a rectification zone and an illumination zone on one side, a plurality of rectification filter chips which are sealed within the rectification zone and are driven by commercial power, LED chips which are electrically connected, sealed within the illumination zone through technology of sealing chips on the board and are driven by the rectification filter chips, and a lens for covering and sealing the LED chips. The embodiment of the utility model integrates the rectification filter chips and LED chips onto one substrate through the technology of sealing chips on the board to constitute a photoelectric integration module where the rectification filter chips and the LED chips are sealed within a sealing member. The LED light source has a small structure, good universality and low cost. Furthermore, a power management chip is also sealed within the sealing body for regulating the current outputted by the rectification filter chips. The LED light source has various functions and good expandability.

Description

LED light source
Technical field
The utility model relates to lighting technical field, is specifically related to a kind of LED light source.
Background technology
LED light source is exactly to take the light source that light-emitting diode is luminous element, the power module of current LED light source, light source module are separated, its power module changes into direct current by High Level AC Voltage used in everyday (AC100-220V) by current rectifying and wave filtering circuit, then by transformer or switching voltage step-down, then by a constant-current drive circuit, jointly form power module; Light source module by being assembled on pcb board, reaches the output specification of power module by single led; Power module and light source module are assembled into respectively on radiating module, radiating module conventionally by aluminium by being machined into light fixture profile.
Yet, the LED light source complex structure of prior art, the space taking is larger, product is heavier, and the many and LED of the element of power module need to be assembled on pcb board, causes cost higher, affect the universal of LED illumination, cannot embody economical and convenient that LED throws light on and brings to people's life.
Utility model content
The utility model, for deficiency of the prior art, provides a kind of structure small and exquisite, the LED light source that cost is low.
The LED light source that the utility model embodiment provides, comprising: a side is provided with the substrate of commutating zone and luminous zone; Be packaged in the electrically driven (operated) a plurality of rectifying and wave-filtering chips in ,You city, described commutating zone; By chip on board encapsulation technology, be packaged in described luminous zone, electrical connection and by the LED chip of described rectifying and wave-filtering chip drives; And covering is packaged in the lens on described LED chip.Thereby the integrated optoelectronic module by described rectifying and wave-filtering chip and LED chip formation, greatly reduces assembly cost, replacement of products is very convenient, and modular product has reduced most of power volume simultaneously, makes the versatility of product become more extensive.Particularly, on substrate, adopt unique partitioned organization design, luminous zone and commutating zone are separated; Chip on board encapsulation (Chip On Board, COB) technology is different from traditional low pressure integrated chip encapsulation; Rectifying and wave-filtering chip is to adopt the direct city of AC Driving technique electric drive, is different from the type of drive of conventional lamp, only interchange need be made into direct current, has reduced the space of a lot of electronic components and light fixture.
Further, described rectifying and wave-filtering chip is the commercial power rectification of AC100V-240V to be filtered into the chip of DC12V-300V direct voltage, and described LED chip is the chip by DC12V-300V direct voltage drive.Thereby, adopt high pressure integrated chip to encapsulate to realize optimum Match voltage.
Further, be also provided with power management district on substrate, power management district is packaged with the power management chip that is electrically connected to and regulates rectifying and wave-filtering chip output current.Thereby, the integrated optoelectronic module forming by described rectifying and wave-filtering chip, LED chip and power management chip, greatly reduces assembly cost, and replacement of products is very convenient, modular product has reduced most of power volume simultaneously, makes the versatility of product become more extensive.Power management chip is at least comprising and the adjustment of electric current adjustment, duty ratio also can be used for carrying out the storage of parameter.
Further, commutating zone arranges around luminous zone.Thereby this around being arranged so that compact conformation, encapsulation is convenient.
Further, the opposite side of described substrate is assembled on radiator.As a kind of execution mode, radiator is attached at the surface of substrate.
Further, described substrate is ceramic substrate or silicon substrate, and described lens are silica-gel lens.Preferably, substrate adopts high insulation, resistance to heat-staple ceramic substrate.
LED light source manufacture method described in the utility model embodiment, comprising: luminous zone encapsulation step: LED chip is packaged in to the luminous zone of substrate by chip on board encapsulation technology; Commutating zone encapsulation step: rectifying and wave-filtering chip package, in the commutating zone of substrate, and is electrically connected on to LED chip by described rectifying and wave-filtering chip; And lens packages step: lens are covered and are packaged on described LED chip.Thereby commutating zone and luminous zone synchronously encapsulate, adopt COB encapsulation technology, rectifying and wave-filtering chip and the LED chip that can realize power supply function are encapsulated in lens simultaneously, can reduce costs to greatest extent, can directly connect civil power and use, and reduce driving power cost.
Further, described method also comprises power management district encapsulation step: power management chip is packaged in to power management district, and is electrically connected on rectifying and wave-filtering chip.Thereby commutating zone, luminous zone and power management chip synchronously encapsulate, adopt COB encapsulation technology, the power management chip that can realize power extension function encapsulates together with rectifying and wave-filtering chip and LED chip simultaneously, reduces costs to greatest extent highly versatile.
Further, described method also comprises assembling radiator step: the side in commutating zone and luminous zone that deviates from that radiator panel is loaded on to substrate.
Further, in the encapsulation step of commutating zone, be to realize being electrically connected to of rectifying and wave-filtering chip and LED chip by welding gold thread.
The beneficial effect of the utility model embodiment is: adopt chip on board encapsulation technology that rectifying and wave-filtering chip and LED chip are integrated on same substrate and form integrated optoelectronic module, be that rectifying and wave-filtering element and LED chip unification are encapsulated in a packaging body, structure is small and exquisite, versatility is good, with low cost.In addition, in packaging body, be also packaged with the power management chip of adjustable rectifying and wave-filtering chip output current, the diverse in function of LED light source, favorable expandability.
Accompanying drawing explanation
Fig. 1 is the external structure schematic diagram of the LED light source of the utility model embodiment.
Fig. 2 is the structural principle schematic diagram of the LED light source of the utility model embodiment.
Embodiment
It should be noted that, in the situation that not conflicting, embodiment and the feature in embodiment in the application can mutually combine, and below in conjunction with the drawings and specific embodiments, the utility model are described in further detail.
The LED light source of the utility model embodiment, as shown in Figure 1 and Figure 2, comprise substrate, be laid on substrate and by rectifying and wave-filtering chip 20, the LED chip 30 that is electrically connected to and is driven by rectifying and wave-filtering chip 20 of outside mains-supplied and cover and be packaged in the lens 40 on described LED chip 30.
Substrate 10 1 sides are provided with 11He luminous zone, commutating zone 12.Wherein, commutating zone 11 arranges around luminous zone 12.Described substrate 10 is ceramic substrate or silicon substrate.
Rectifying and wave-filtering chip 20 has a plurality of, by chip on board encapsulation technology, is packaged in described commutating zone 11, adopts city's electric drive.Preferably, described rectifying and wave-filtering chip 20 is the commercial power rectification of AC100V-240V to be filtered into the chip of DC12V-300V direct voltage.
LED chip 30 is packaged in described luminous zone 12 by chip on board encapsulation technology, is electrically connected to and is driven by described rectifying and wave-filtering chip 20.Described LED chip 30 is high pressure chip, is preferably the chip by DC12V-300V direct voltage drive.By welding gold thread 31 to realize being electrically connected to of rectifying and wave-filtering chip 20 and LED chip 30.
Described lens 40 are silica-gel lens 40.
As a kind of execution mode, on substrate 10, be also provided with power management district 13, power management district 13 and be packaged with the power management chip that is electrically connected to and regulates rectifying and wave-filtering chip 20 output currents.
The opposite side of described substrate 10 is assembled in radiator (not shown).Wherein, radiator is sticked on the surface of substrate 10, has reduced the processing cost of lighting, in light fixture production process, need only, by module and radiator laminating, greatly improve radiating efficiency simultaneously.
The manufacture method of LED light source described in the utility model embodiment, comprising:
Luminous zone 12 encapsulation step: LED chip 30 is packaged in to the luminous zone 12 of substrate 10 by chip on board encapsulation technology.Owing to adopting substrate as carrier, need again LED chip 30 not pasted to PCB upper, simplified technological process, saved process costs.
Commutating zone 11 encapsulation step: rectifying and wave-filtering chip 20 is packaged in to the commutating zone 11 of substrate 10, and described rectifying and wave-filtering chip 20 is electrically connected on to LED chip 30.Wherein, in 11 encapsulation step of commutating zone, be to realize being electrically connected to of rectifying and wave-filtering chip 20 and LED chip 30 by welding gold thread 31.
Lens 40 encapsulation step: lens 40 are covered and are packaged on described LED chip 30.
As a kind of execution mode, described method also comprises power management district 13 encapsulation step: power management chip is packaged in to power management district 13, and is electrically connected on rectifying and wave-filtering chip 20.Preferably, this step is carried out after commutating zone 11 encapsulation step or lens 40 encapsulation step.
As a kind of execution mode, described method also comprises assembling radiator step: radiator panel is loaded on to deviating from a side of 11He luminous zone, commutating zone 12 of substrate 10.Preferably, this step is carried out after lens 40 encapsulation step or power management district 13 encapsulation step.
To sum up, the LED light source of the utility model embodiment and manufacture method thereof, numerous and diverse SMT and plug-in unit technique in light fixture automated production process, have been saved, adopt ceramic substrate technology, COB encapsulation technology and AC Driving technique that various chips are integrated and formed integrated optoelectronic module, make small product size less, adapt to the more LED light fixture product of small size; And, on ceramic substrate, be also packaged with the power management chip of adjustable rectifying and wave-filtering chip 20 output currents, the diverse in function of LED light source, favorable expandability.
The above is embodiment of the present utility model; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of the utility model principle; can also make some improvements and modifications, these improvements and modifications are also considered as protection range of the present utility model.

Claims (6)

1. a LED light source, is characterized in that, comprising:
One side is provided with the substrate of commutating zone and luminous zone;
By chip on board encapsulation technology, be packaged in the electrically driven (operated) a plurality of rectifying and wave-filtering chips in ,You city, described commutating zone;
By chip on board encapsulation technology, be packaged in described luminous zone, electrical connection and by the LED chip of described rectifying and wave-filtering chip drives; And
Covering is packaged in the lens on described LED chip.
2. LED light source as claimed in claim 1, is characterized in that, described rectifying and wave-filtering chip is the commercial power rectification of AC100V-240V to be filtered into the chip of DC12V-300V direct voltage, and described LED chip is the chip by DC12V-300V direct voltage drive.
3. LED light source as claimed in claim 1, is characterized in that, is also provided with power management district on substrate, and power management district is packaged with the power management chip that is electrically connected to and regulates rectifying and wave-filtering chip output current.
4. LED light source as claimed in claim 1, is characterized in that, commutating zone arranges around luminous zone.
5. LED light source as claimed in claim 1, is characterized in that, the opposite side of described substrate is assembled on radiator.
6. the LED light source as described in any one in claim 1 to 5, is characterized in that, described substrate is ceramic substrate or silicon substrate, and described lens are silica-gel lens.
CN201320351343.3U 2013-06-19 2013-06-19 Led light source Expired - Lifetime CN203445145U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320351343.3U CN203445145U (en) 2013-06-19 2013-06-19 Led light source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320351343.3U CN203445145U (en) 2013-06-19 2013-06-19 Led light source

Publications (1)

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CN203445145U true CN203445145U (en) 2014-02-19

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103337582A (en) * 2013-06-19 2013-10-02 深圳市源磊科技有限公司 LED light source and manufacture method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103337582A (en) * 2013-06-19 2013-10-02 深圳市源磊科技有限公司 LED light source and manufacture method thereof
CN103337582B (en) * 2013-06-19 2015-04-22 深圳市源磊科技有限公司 LED light source and manufacture method thereof

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Granted publication date: 20140219

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