CN206088342U - Foresee deviation correcting device on silicon chip series welding - Google Patents

Abstract

The utility model provides a foresee deviation correcting device on silicon chip series welding, include: one end of the support rack is hinged at the support. Fix the horizontal migration guide rail on the support frame top, install the horizontal position adjustment motor of leading rail end portion at horizontal migration, install on the horizontal migration guide rail and can follow the slip table that the horizontal direction removed, fix the longitudinal movement guide rail on the slip table, install the vertical position adjustment motor in longitudinal movement guide rail rear end, install the cylinder that to follow longitudinal movement guide rail longitudinal movement on the longitudinal movement guide rail, install the tongs extension board at the flexible end of cylinder, install on the extension board and the vertical decurrent angle position adjustment motor of output shaft, and the tongs is receive and release to the negative pressure of cup jointing on angle position adjustment motor output shaft. This foresee deviation correcting device on silicon chip series welding can carry out automatic feeding and rectify in automatic position to the silicon chip, has realized through tri -axial linkage that silicon chip horizontal, vertical in the horizontal plane and angle position adjustment correct in silicon chip handling, and the precision improves greatly.

Description

A silicon wafer serial welding material loading and deviation correction device

technical field

The utility model relates to a feeding device, in particular to a silicon wafer serial welding feeding and deviation correcting device.

Background technique

During the silicon wafer welding production process of solar photovoltaic modules, the silicon wafers in the charging box need to be transported to the string welding workbench one by one, and then welded with the interconnection bars. In order to improve the production efficiency and accuracy of the automatic welding of silicon wafers, the feeding process of silicon wafers needs to be automated, and the position of the silicon wafers needs to be corrected before being put on the stage, so that when the subsequent silicon wafers are welded, the interconnection strips and the silicon wafers to be welded coincide.

In the prior art, Chinese patent ZL 201110176757.2 discloses "an automatic deviation correction device for silicon wafers". The silicon wafer position fine-tuning sub-mechanism in this device includes a lower deviation correction plate, a middle deviation correction plate and an upper deviation correction plate. The upper surface is used to place silicon wafers; a longitudinal position adjustment assembly is arranged between the lower surface of the upper deviation correction plate and the upper surface of the middle deviation correction plate, and the upper deviation correction plate can be moved longitudinally forward and backward under the drive of the longitudinal position adjustment assembly; A transverse position adjustment assembly is arranged between the lower surface of the middle deviation correction plate and the upper surface of the lower deviation correction plate, and the middle deviation correction plate and all parts on it can be moved horizontally left and right under the drive of the transverse position adjustment assembly; The deviation correcting plate is supported on the frame platform through a rotating adjustment assembly, and the lower deviation correcting plate and all parts on it can be rotated under the drive of the rotating adjustment assembly. The device adjusts the horizontal and vertical positions of the silicon wafer on the deviation-correcting plate by adjusting the position of the deviation-correcting plate, but the deviation-correcting device cannot precisely adjust the angle of the silicon wafer, and the structure is too complicated and the operation steps are too cumbersome.

Utility model content

In order to solve the deficiencies in the prior art, the utility model designs a silicon wafer serial welding feeding and deviation correction device specially for the silicon wafer serial welding feeding process.

In order to realize the above-mentioned technical solution, the utility model provides a silicon wafer serial welding feeding and deviation correction device, comprising: a support frame; a horizontally moving guide rail fixed on the top of the support frame; a horizontal position adjustment motor installed at the end of the horizontally moving guide rail; The sliding table installed in the horizontal moving guide rail and can move in the horizontal direction; the longitudinal moving guide rail fixed on the sliding table; the longitudinal position adjustment motor installed at the rear end of the longitudinal moving guide rail; installed on the longitudinal moving guide rail and can move along the longitudinal moving guide rail longitudinally A moving cylinder, the telescopic end of the cylinder is vertically downward; the gripper support plate installed at the telescopic end of the cylinder; the angular position adjustment motor installed on the support plate and the output shaft is vertically downward; The negative pressure on the output shaft of the motor retracts and releases the gripper.

In the above technical solution, the pick-and-place of the silicon wafer is realized through the negative pressure retractable gripper. After the silicon wafer is grasped, the angular position adjustment motor drives the negative pressure retractable gripper to rotate to adjust the angle of the silicon wafer. Drive the negative pressure retractable gripper to move up or down, the longitudinal position adjustment motor can drive the cylinder to move back and forth on the longitudinal movement guide rail, and the horizontal position adjustment motor can drive the longitudinal movement guide rail to move freely on the horizontal movement guide rail, through horizontal position adjustment The cooperation of the motor, the longitudinal position adjustment motor and the cylinder can realize the position adjustment of the negative pressure retractable grip in six directions, front, rear, left, right, up, and down, and then adjust the angle of the negative pressure retractable grip through the angular position adjustment motor, so as to realize The adjustment of the omni-directional position of the negative pressure retractable gripper.

Preferably, a cable protection chain is installed on the horizontal movement guide rail, one end of the cable protection chain is fixed on the horizontal movement guide rail, and the other end is fixed at the joint between the longitudinal position adjustment motor and the longitudinal movement guide rail. The electrical cables and pneumatic pipelines of the feeding device are placed in the cable protection chain, and the cable protection chain is used to protect the safety of the pipeline circuit of the device.

Preferably, the longitudinal moving guide rail and the horizontal moving guide rail are perpendicular to each other. It is convenient and precise to adjust the position of the negative pressure retractable gripper in the vertical and horizontal orientations through the vertically moving guide rails and the horizontally moving guide rails which are perpendicular to each other.

Preferably, the negative pressure retractable grip includes a support plate, and a plurality of suction cups are arranged on the lower surface of the support plate. The suction cup is directly connected to the vacuum system, and the silicon wafer can be picked and placed through the negative pressure suction of the vacuum suction cup. Since the surface of the suction cup is covered with elastic rubber or plastic, it will not cause damage to the silicon wafer during the suction process. Compared with traditional manipulators, it can better protect silicon wafers from damage.

Preferably, the horizontal position adjustment motor, the longitudinal position adjustment motor and the angular position adjustment motor are all servo motors. The servo motor can accurately control the travel of each component, which is more conducive to the precise adjustment of the silicon wafer.

The beneficial effects of a silicon wafer serial welding feeding and deviation correcting device provided by the utility model are:

(1) This silicon wafer serial welding feeding and deviation correction device is used for automatic feeding and automatic position deviation correction of silicon wafers in the process of solar silicon wafer serial welding. Loading and unloading, no need to repeatedly pick and place, the automatic deviation correction of the silicon wafer position is realized through three-axis linkage during the silicon wafer handling process, that is, the horizontal, vertical and angular position adjustment and correction of the silicon wafer in the horizontal plane are realized, and the accuracy is greatly improved;

(2) The silicon chip serial welding feeding and deviation correction device can realize the position adjustment of the negative pressure retractable gripper in six directions, front, rear, left, right, up and down, through the cooperation of the horizontal position adjustment motor, the longitudinal position adjustment motor and the cylinder, and then through the angle The position adjustment motor realizes the adjustment of the angle of the negative pressure retractable gripper, so as to realize the adjustment of the omnidirectional position of the negative pressure retractable gripper;

(3) The silicon chip serial welding feeding and deviation correction device can automatically adjust the motor position according to the different product placement positions after visual positioning calculation, which is fast and efficient, improves the efficiency of silicon chip serial welding, and makes the interconnection strip and silicon chip to be welded Precise coincidence at all places ensures the accuracy of automatic welding of silicon wafers.

Description of drawings

Fig. 1 is the three-dimensional structure schematic diagram of the present utility model.

Fig. 2 is the front view of the utility model.

Fig. 3 is a side view of the utility model.

In the figure: 1. Support frame; 2. Horizontal moving guide rail; 3. Cable protection chain; 4. Longitudinal position adjustment motor; 5. Horizontal position adjustment motor; 6. Longitudinal moving guide rail; 7. Cylinder; 9. Angle position adjustment motor; 10. Negative pressure retractable gripper.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. All other embodiments obtained by ordinary persons in the art without creative efforts belong to the protection scope of the present utility model.

Embodiment: A device for loading and correcting deviation of silicon chip serial welding.

Referring to Fig. 1 to Fig. 3, a silicon wafer serial welding feeding and deviation correction device includes: a support frame 1, a horizontal moving guide rail 2, a cable protection chain 3, a longitudinal position adjustment motor 4, a horizontal position adjustment motor 5, a longitudinal Mobile guide rail 6, cylinder 7, gripper support plate 8, angle position adjustment motor 9 and negative pressure retractable gripper 10. The horizontal moving guide rail 2 is installed on the top of the support frame 1 through the connecting plate. The number of the support frame 1 depends on the length of the horizontal moving guide rail 2. The longer the horizontal moving guide rail 2, the more the number of support frames 1. The horizontal moving guide rail 2 adjusts the motor in the horizontal position. Driven by 5, the negative pressure retractable gripper 10 moves quickly in the horizontal direction; one end of the cable protection chain 3 is installed on the horizontally moving guide rail 2, and the other end is installed at the junction of the longitudinal position adjustment motor 4 and the longitudinally moving guide rail 6, and the entire The electrical cables and pneumatic pipelines of the device are placed in the cable protection chain 3, and the cable protection chain 3 is used to protect the safety of the pipeline circuit of the device; the longitudinal position adjustment motor 4 and the longitudinal moving guide rail 6 are connected by a coupling, and the longitudinal The moving direction of the moving guide rail 6 is perpendicular to the moving direction of the horizontal moving guide rail 2, and the longitudinal position adjustment motor 4 and the longitudinal moving guide rail 6 are installed on the slide table of the horizontal moving guide rail 2. Driven by the position adjustment motor 4, the negative pressure retractable gripper 10 is driven to realize longitudinal position adjustment and correction; one end of the cylinder block of the cylinder 7 is fixed on the slide table of the longitudinally moving guide rail 6, and the output rod end of the other end is connected with the gripper support plate. 8 is fixed, the direction of telescopic action is vertical, and the fixed-length movement is realized through the control of the pneumatic valve, which drives the negative pressure retractable gripper 10 to realize the functions of taking and unloading materials and lifting and transporting materials; the angle position adjustment motor 9 is installed on the gripper On the upper surface of the support plate 8, the output shaft end of the angular position adjustment motor 9 is connected to a fixed negative pressure retractable gripper 10. When there is an angular error in the silicon wafer, the angular position adjustment motor 9 rotates to directly drive the negative pressure retractable gripper 10. Realize the position adjustment and correction of the angle; the negative pressure retractable gripper 10 is the executive mechanism of the device, and the gripper is equipped with a negative pressure suction cup, and the position and quantity of the negative pressure suction cup can be flexibly adjusted to realize the gripping function of silicon wafers of different specifications .

In this embodiment, the horizontal position adjustment motor 5 , the longitudinal position adjustment motor 4 and the angular position adjustment motor 9 are all servo motors. The servo motor can accurately control the travel of each component, which is more conducive to the precise adjustment of the silicon wafer.

In order to better explain the utility model, the workflow of the utility model is explained as follows:

(1) The horizontal position adjustment motor 5 drives the horizontally moving guide rail 2, and drives the negative pressure retractable gripper 10 to move directly above the silicon wafer material, and then the output shaft end of the cylinder 7 stretches out, driving the negative pressure retractable gripper 10 to move to The upper surface of the silicon wafer material, then the negative pressure retractable gripper 10 uses the negative pressure suction cup to absorb the silicon wafer, and finally the negative pressure retractable gripper 10 grabs the single silicon wafer and lifts it to a fixed position with the indentation of the output shaft end of the cylinder 7. handling height;

(2) The horizontal position adjustment motor 5 drives the horizontally moving guide rail 2, and drives the silicon wafer grasped by the negative pressure retractable gripper 10 to move through directly above the positioning camera to obtain the position information of the silicon wafer;

(3) The horizontal position adjustment motor 5 drives the horizontal moving guide rail 2, and continues to drive the silicon wafers grabbed by the negative pressure retractable gripper 10 to move to the serial welding station. position, the specific working process is: during the moving process of the horizontal moving guide rail 2, the longitudinal position adjustment motor 4 drives the longitudinal moving guide rail 6 to adjust the longitudinal position of the silicon wafer, and the horizontal position adjustment motor 5 drives the horizontal moving guide rail 2 to automatically compensate the end point coordinates of the horizontal position, The angle position adjustment motor 9 directly drives the rotation of the negative pressure retractable gripper 10 to adjust the angle of the silicon wafer, and completes the automatic deviation correction of the silicon wafer position under the condition of three-axis linkage;

(4) Horizontal position adjustment motor 5 drives the horizontal moving guide rail 2 to drive the silicon chip on the negative pressure retractable gripper 10 to move to the top of the stringer welding table, and then the output shaft end of the cylinder 7 protrudes to drive the silicon chip to move to the stringer soldering station The upper surface of the table, and then the negative pressure sucker on the negative pressure retractable gripper 10 places the silicon wafer, and finally the negative pressure retractable gripper 10 that completes the loading process is lifted to the same fixed position as the output shaft end of the cylinder 7 is retracted. Handling height, execute the next working cycle.

The above description is only a preferred embodiment of the utility model, but the utility model should not be limited to the disclosed content of the embodiment and the accompanying drawings, so any equivalent or completed without departing from the disclosed spirit of the utility model Modifications all fall within the protection scope of the utility model.

Claims (5)

1. A silicon chip serial welding material loading and deviation correction device, characterized in that it comprises: support frame (1); A horizontally moving guide rail (2) fixed on the top of the support frame (1); A horizontal position adjustment motor (5) installed at the end of the horizontally moving guide rail (2); A sliding table installed in the horizontal moving guide rail (2) and movable in the horizontal direction; A longitudinally moving guide rail (6) fixed on the slide table; A longitudinal position adjustment motor (4) installed on the rear end of the longitudinally moving guide rail (6); A cylinder (7) that is installed on the longitudinally movable guide rail (6) and can move longitudinally along the longitudinally movable guide rail (6), the telescoping end of the cylinder (7) is vertically downward; The grip support plate (8) installed on the telescopic end of the cylinder (7); The angular position adjustment motor (9) that is installed on the support plate (8) and the output shaft is vertically downward; and The negative pressure retractable gripper (10) socketed on the output shaft of the angular position adjustment motor (9). 2. The silicon wafer serial welding feeding and deviation correcting device according to claim 1, characterized in that: a cable protection chain (3) is installed on the horizontally moving guide rail (2), and the cable protection chain (3) One end of it is fixed on the horizontal moving guide rail (2), and the other end is fixed on the junction of the longitudinal position adjustment motor (4) and the longitudinal moving guide rail (6). 3. The device for feeding and correcting deviation in silicon wafer serial bonding according to claim 1 or 2, characterized in that: the longitudinal moving guide rail (6) and the horizontal moving guide rail (2) are perpendicular to each other. 4 . The device for feeding and correcting deviations of silicon wafers in series soldering according to claim 3 , wherein the negative pressure retractable handle ( 10 ) includes a support plate, and a plurality of suction cups are arranged on the lower surface of the support plate. 5 . 5. The silicon chip serial welding feeding and deviation correction device according to claim 1, characterized in that: the horizontal position adjustment motor (5), the longitudinal position adjustment motor (4) and the angular position adjustment motor (9) are all servo motors motor.