CN208705606U - A kind of Full-automatic COG bonding machine - Google Patents
A kind of Full-automatic COG bonding machine Download PDFInfo
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- CN208705606U CN208705606U CN201820985782.2U CN201820985782U CN208705606U CN 208705606 U CN208705606 U CN 208705606U CN 201820985782 U CN201820985782 U CN 201820985782U CN 208705606 U CN208705606 U CN 208705606U
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- acf
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- flattening
- manipulator
- lcd
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Abstract
The utility model discloses a kind of Full-automatic COG bonding machines, it includes that ACF attaches mechanism, precompressed mechanism and this press mechanism, it includes ACF pressure head, ACF platform, the first manipulator and CCD regulating mechanism that the ACF, which attaches mechanism, the precompressed mechanism includes that pre- pressure head, pre- flattening bench, the second manipulator, IC feed mechanism, IC amendment platform, IC picking manipulator, IC transfer robot and CCD para-position mechanism, this described press mechanism include three this flattening benchs, three this pressure heads, third manipulator and the 4th manipulator.Work efficiency is high for it, can save labour turnover, and improves product qualification rate and quality.
Description
Technical field
The utility model belongs to liquid crystal module technical field of processing equipment, especially a kind of Full-automatic COG bonding machine.
Background technique
Small size liquid crystal display product uses COG mode to drive liquid crystal display panel substantially at present, by original
IC (Integrated Circuit, integrated circuit board) the mode of circuit drives become IC binding on the glass substrate, be
After forming salient point on bare chip, directly it is connected on the glass substrate with the lead of liquid crystal display.Therefore, COG mounting means
It is more and more widely used, the use of COG bonding machines is also more and more, domestic semi-automatic such as Shenzhen " collection silver " company's production
COG bonding machines, the various bonding machines that foreign countries have the companies such as Panasonic, Hitachi to produce.
The bonding machines of the prior art is primarily present following problem: feeding is carried out by manual operation, it is independent to carry out ACF patch
Attached, operator manual handling has attached the LCD of ACF, and IC precompressed and this pressure separate two bondings, and aligning accuracy is not high, low efficiency,
Yields is low, is completely dependent on manual operation.
Summary of the invention
The purpose of the utility model is to overcome the above-mentioned problems of the prior art, provide it is a kind of work efficiency is high, at
A kind of this Full-automatic COG bonding machine low, with high accuracy.
Purpose of the utility model is realized as follows: a kind of Full-automatic COG bonding machine, it is characterised in that: it includes ACF
Attach mechanism, precompressed mechanism and this press mechanism；The ACF attaches the ACF pressure head that mechanism includes top and the ACF of lower part is flat
Platform, the precompressed mechanism include the pre- pressure head on top and the pre- flattening bench of lower part, this described press mechanism includes three this pressures
Platform, each flattening bench top are correspondingly arranged this pressure head；It is equipped in the side of ACF platform and removes LCD to ACF platform
The first manipulator and amendment the position LCD CCD regulating mechanism；The side of ACF platform and pre- flattening bench be equipped with by LCD from
ACF platform is removed to the second manipulator on pre- flattening bench；In the side of precompressed mechanism, one IC feed mechanism, the IC are set
Feed mechanism includes IC charging tray platform, IC amendment platform, IC is removed from IC charging tray platform to the IC that IC corrects platform and picks up machinery
IC is transferred to the IC transfer robot on pre- pressure head from IC amendment platform by hand, pre- pressure head be equipped with by between IC and LCD into
The CCD para-position mechanism that row precisely aligns；The side of pre- flattening bench and three this flattening benchs be equipped with by LCD from pre- flattening bench successively
It removes to the third manipulator on three this flattening benchs；It is equipped in the side of three this flattening benchs from three this flattening bench loading and unloading
4th manipulator.
The workflow of the utility model is as follows:
(1) artificial or other line board automatic chargings；
The suction nozzle of (2) first manipulators draws LCD and carries out position correction through CCD regulating mechanism；
LCD Jing Guo position correction is placed in ACF platform by (3) first manipulators；
(4) ACF platform advances, and pressure head decline attaches ACF；
(5) ACF platform retreats detection position, and detection ACF attaches effect；
It is flat that (6) second manipulators absorption LCD is placed in pre- flattening bench/IC to IC amendment of IC picking manipulator absorption simultaneously
Platform carries out position correction；
(7) transfer transfers to pre- pressure head to IC transfer robot, carries out camera shooting contraposition precompressed；
(8) third manipulator absorption LCD, which is respectively placed on three this flattening benchs, carries out this pressure；
(9) the 4th manipulators are drawn the LCD originally pressed and are placed on blanking assembly line.
Compared with prior art, the utility model has the beneficial effects that
1) the utility model includes that ACF attaches mechanism, precompressed mechanism and this press mechanism, realizes ACF attaching, precompressed and sheet
Pressure concentrates in same equipment, disposably completes three kinds of processes.
2) one ACF of the utility model setting attaches mechanism, a precompressed mechanism, three this press mechanisms, from pre- flattening bench
The LCD removed is sequentially placed to this pressure is carried out on three this press mechanisms, is solved the problems, such as that this pressure time is long, is improved work
Make efficiency.
3) the utility model attaches ACF automatically, automatic to detect, and IC and LCD look for MARK point automatically, and automatic aligning is removed automatically
LCD, automatic sucking IC are transported, a series of automation movements such as auto-stitching save cost of labor, improve product quality and production
Product qualification rate.
Detailed description of the invention
The structural schematic diagram of Fig. 1 the utility model Full-automatic COG bonding machine；
In figure: 1-ACF pressure head, 2-ACF platform, the pre- pressure head of 3-, the pre- flattening bench of 4-, the first manipulator of 5-, 6-CCD adjust machine
Structure, the second manipulator of 7-, 8-IC charging tray platform, 9-IC amendment platform, 10-IC picking manipulator, 11-IC transfer robot,
12-CCD positioning mechanism, this flattening bench of 13-, this pressure head of 14-, this flattening bench of 15-, this pressure head of 16-, this flattening bench of 17-, 18- sheet
Pressure head, 19- third manipulator, the 4th manipulator of 20-.
Specific embodiment
The present invention will be further described with reference to the accompanying drawing.
As shown in Figure 1, a kind of Full-automatic COG bonding machine, it includes that ACF attaches mechanism, precompressed mechanism and this press mechanism, institute
It includes the ACF pressure head 1 on top and the ACF platform 2 of lower part that the ACF stated, which attaches mechanism, and the precompressed mechanism includes the pre- of top
The pre- flattening bench 4 of pressure head 3 and lower part；This described press mechanism includes three this flattening benchs 13,15,17, on each flattening bench
Portion is correspondingly arranged this pressure head 14,16,18；It is equipped in the side of ACF platform 2 and removes LCD to the first machine on ACF platform 2
The CCD regulating mechanism 6 of tool hand 5 and the amendment position LCD；It is equipped with LCD in the side of ACF platform 2 and pre- flattening bench 4 from ACF
Platform 2 is removed to the second manipulator 7 on pre- flattening bench 4；In the side of precompressed mechanism, one IC feed mechanism is set, it is described
IC feed mechanism includes IC charging tray platform 8, IC amendment platform 9, IC is removed from IC charging tray platform 8 to the IC that IC corrects platform 9 and is picked up
It takes manipulator 10, IC is corrected into the IC transfer robot 11 that platform 9 transfers on pre- pressure head 3 from IC, pre- pressure head 3 is equipped with will
The CCD para-position mechanism 12 precisely aligned between IC and LCD；The one of pre- flattening bench 4 and three this flattening benchs 13,15,17
Side is equipped with and successively removes LCD to the third manipulator 19 on three this flattening benchs 13,15,17 from pre- flattening bench 4；In three this pressures
The side of platform 13,15,17 is equipped with the 4th manipulator 20 from three 13,15,17 loading and unloading of this flattening bench.
Finally it should be noted that the above specific embodiment is only to illustrate the technical solution of the utility model, rather than
Limitation to scope of protection of the utility model, the letter that those skilled in the art carry out the technical solution of the utility model
Single modification or equivalent replacement, all without departing from the spirit and scope of technical solutions of the utility model.
Claims (1)
1. a kind of Full-automatic COG bonding machine, it is characterised in that: it includes that ACF attaches mechanism, precompressed mechanism and this press mechanism；Institute
It includes the ACF pressure head on top and the ACF platform of lower part that the ACF stated, which attaches mechanism, and the precompressed mechanism includes the precompressed on top
The pre- flattening bench of head and lower part, this described press mechanism include three this flattening benchs, and each flattening bench top is correspondingly arranged one
This pressure head；The CCD of the first manipulator removed LCD on ACF platform and the amendment position LCD is equipped in the side of ACF platform
Regulating mechanism；It is equipped in the side of ACF platform and pre- flattening bench and removes LCD to the second machinery on pre- flattening bench from ACF platform
Hand；One IC feed mechanism is set in the side of precompressed mechanism, the IC feed mechanism includes that IC charging tray platform, IC amendment are flat
Platform, by IC from IC charging tray platform remove to IC amendment platform IC picking manipulator, by IC from IC amendment platform transfer to pre- pressure head
On IC transfer robot, pre- pressure head is equipped with the CCD para-position mechanism that will precisely be aligned between IC and LCD；It is flattening in advance
The side of platform and three this flattening benchs is equipped with and successively removes LCD to the third manipulator on three this flattening benchs from pre- flattening bench；
The 4th manipulator from three this flattening bench loading and unloading is equipped in the side of three this flattening benchs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820985782.2U CN208705606U (en) | 2018-06-17 | 2018-06-17 | A kind of Full-automatic COG bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820985782.2U CN208705606U (en) | 2018-06-17 | 2018-06-17 | A kind of Full-automatic COG bonding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208705606U true CN208705606U (en) | 2019-04-05 |
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ID=65937168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820985782.2U Active CN208705606U (en) | 2018-06-17 | 2018-06-17 | A kind of Full-automatic COG bonding machine |
Country Status (1)
| Country | Link |
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| CN (1) | CN208705606U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108873403A (en) * | 2018-06-17 | 2018-11-23 | 赤峰埃晶电子科技有限公司 | A kind of Full-automatic COG bonding machine |
-
2018
- 2018-06-17 CN CN201820985782.2U patent/CN208705606U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108873403A (en) * | 2018-06-17 | 2018-11-23 | 赤峰埃晶电子科技有限公司 | A kind of Full-automatic COG bonding machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 024000 Building 1, Hongshan high tech Industrial Park, Chifeng City, Inner Mongolia Autonomous Region Patentee after: Chifeng Guangding Technology Co.,Ltd. Patentee after: INNER MONGOLIA ZHONGSEN INTELLIGENT TERMINAL TECHNOLOGY RESEARCH AND DEVELOPMENT CO.,LTD. Address before: 024000 Hongshan Economic Development Zone, Chifeng City, Hongshan District, Chifeng City, Inner Mongolia Autonomous Region Patentee before: CHIFENG AIJING ELECTRONIC TECHNOLOGY CO.,LTD. Patentee before: INNER MONGOLIA ZHONGSEN INTELLIGENT TERMINAL TECHNOLOGY RESEARCH AND DEVELOPMENT CO.,LTD. |
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| CP03 | Change of name, title or address |