CN205961566U - A copper billet for burying copper billet board - Google Patents
A copper billet for burying copper billet board Download PDFInfo
- Publication number
- CN205961566U CN205961566U CN201620850602.0U CN201620850602U CN205961566U CN 205961566 U CN205961566 U CN 205961566U CN 201620850602 U CN201620850602 U CN 201620850602U CN 205961566 U CN205961566 U CN 205961566U
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- copper billet
- glue groove
- leads
- burying
- lead
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Abstract
The utility model discloses a copper billet for burying copper billet board, including the copper billet body, the left side wall of copper billet body and right side wall symmetry respectively are provided with that first lead gluey groove and gluey groove is led to the second, firstly lead gluey groove and span the left side wall of copper billet body, the second is led gluey groove and is spaned the right side wall of copper billet body, the anterior wall of copper billet body and back wall symmetry respectively are provided with that gluey groove is led to the third and gluey groove is led to the fourth, the third is led gluey groove and is spaned the anterior wall of copper billet body, the fourth is led gluey groove and is spaned the back wall of copper billet body, first lead gluey groove the third lead gluey groove the second lead gluey groove with gluey groove end to end is in proper order led to the fourth, and all is located same horizontal plane. This copper billet is provided with leads gluey groove, leads the flow space that gluey groove can increase the resin, solves and buries copper billet inboard layer bending problem.
Description
Technical field
This utility model is related to pcb board technical field, more particularly, to a kind of copper billet for burying copper billet plate.
Background technology
Electronic product volume is less and less, and power density is increasing, and current electronics industry design needs developing more preferably
Radiating and construction design method.Burying copper coin block is exactly a kind of design therein, and burying copper coin block is exactly locally to imbed copper billet on PCB
PCB, heating element is directly mounted on above copper billet, and heat is conducted by copper billet.
The Making programme burying copper coin block is typically as follows：(internal layer sawing sheet internal layer circuit internal layer etches gong groove to central layer
Brown) prepreg fluting copper billet pre-treatment pressing boring sink copper plate electric line pattern plating etching
Welding resistance surface treatment molding electrical measurement inspection shipment.Wherein, prepreg is also known as PP piece, mainly by resin and enhancing
Material forms.
As shown in figure 1, so that the signal transmission burying copper billet plate is more unimpeded, it usually needs in L11/12 layer and L13/
The high frequency PP piece of no mobility is set between 14 layers, and the PP piece with mobility can be set between other layers.But, in layer
During pressure, because the flow channel between central layer and copper billet is too small, the PP piece with mobility cannot flow to L11/12 layer
Space and L13/14 layer between, leads to bury copper billet plate after pressing plate, L11/12 layer central layer easily buckling problem, leads to produce
Product are scrapped.
Utility model content
In order to overcome the deficiencies in the prior art, the purpose of this utility model is to provide a kind of copper for burying copper billet plate
Block, this copper billet is provided with leads glue groove, leads the flow spaces that glue groove can increase resin, solves to bury copper billet inner cord buckling problem.
The purpose of this utility model employs the following technical solutions realization：
A kind of copper billet for burying copper billet plate, including copper billet body；The left side wall of described copper billet body and right side wall
It is respectively symmetrically to be provided with first and lead glue groove and second and leads glue groove, described first leads the left side wall across described copper billet body for the glue groove
Face, described second leads the right side wall across described copper billet body for the glue groove；The anterior wall of described copper billet body and back wall
It is respectively symmetrically to be provided with the 3rd and lead glue groove and the 4th and leads glue groove, the described 3rd leads the front walls across described copper billet body for the glue groove
Face, the described 4th leads the back wall across described copper billet body for the glue groove；Described first leads glue groove, the described 3rd leads glue groove, institute
State second to lead glue groove and the described 4th to lead glue groove end to end successively, and be respectively positioned on same horizontal plane.
Preferably, described first lead glue groove, described second lead glue groove, the described 3rd lead glue groove and the described 4th and lead glue groove
Shape is all consistent with structure.
Preferably, described first roof leading glue groove is the first plane diagonally downward, and its diapire is tilting upward
Two planes, described first plane and described second plane originally intersect so that described first leads the shape of glue groove in vivo in described copper billet
Shape is rendered as triangular prism.
Preferably, described first plane and described second plane are symmetrical above and below and set.
Preferably, the height of described copper billet body is 2.28-2.3mm；Described first leads between the roof of glue groove and diapire
Ultimate range be 0.4mm；Minimum range between described first roof leading glue groove and described copper billet body roof is
0.3mm；Minimum range between described first diapire leading glue groove and described copper billet body diapire is 1.59mm.
Preferably, the described first depth capacity leading glue groove is 0.15-0.25mm.
Preferably, the height of described copper billet body is 2.29mm.
Preferably, the described first depth capacity leading glue groove is 0.2mm.
Compared to existing technology, the beneficial effects of the utility model are：
Copper billet for burying copper billet plate provided by the utility model, around side wall be provided with to be provided with and lead glue groove,
After pressing plate, cut sections for microscopic examination copper billet and substrate position no buckling phenomenon, effectively increase the quality burying copper billet plate, can obtain company
Leader and the favorable comment of client.And the copper billet (no leading glue groove) with respect to prior art, after pressing plate, L11/12 layer central layer easily goes out
Existing buckling problem.Additionally, the side wall burying copper coin copper billet of the present invention lead glue groove design it is adaptable to all similar designs bury copper billet
Product.
Brief description
Fig. 1 is the schematic diagram of pcb board after prior art center platen；
The sectional drawing of the copper billet that Fig. 2 is provided by this utility model embodiment；
The left view of the copper billet that Fig. 3 is provided by this utility model embodiment；
Fig. 4 is flow graph at L11/12 layer central layer for resin during prior art center platen；
The copper billet that Fig. 5 is provided by application this utility model embodiment, stream at L11/12 layer central layer for resin during pressing plate
Xiang Tu；
In figure：10th, copper billet body；11st, first lead glue groove；12nd, second lead glue groove；
H：The height of copper billet body；
h1:Minimum range between first diapire leading glue groove and copper billet body diapire；
h2:Minimum range between first roof leading glue groove and copper billet body roof；
h3:First leads the ultimate range between the roof of glue groove and diapire；
h4:First depth capacity leading glue groove.
Specific embodiment
Below, in conjunction with accompanying drawing and specific embodiment, this utility model is described further：
As shown in figure 1, bury the structural representation of copper billet plate for prior art.So that burying the signal transmission of copper billet plate more
Plus unimpeded, it usually needs the high frequency PP piece of no mobility is set between L11/12 layer and L13/14 layer, remembers the 2nd PP piece；And
The PP piece with mobility can be set between other layers, be designated as a PP piece.But, this structure bury copper billet plate pressing plate
Afterwards, easily buckling problem in L11/12 layer central layer, thus leading to product rejection.
As Figure 2-3, a kind of copper billet for burying copper billet plate being provided by this utility model embodiment, including copper billet
Body 10；The left side wall of copper billet body 10 and right side wall are respectively symmetrically to be provided with first and lead glue groove 11 and second leads glue groove
12, first leads the left side wall across copper billet body 10 for the glue groove 11, and second leads the right side wall across copper billet body 10 for the glue groove 12；
The anterior wall of copper billet body 10 and back wall are respectively symmetrically to be provided with the 3rd and lead glue groove and the 4th leads glue groove, and the described 3rd leads
Across the anterior wall of copper billet body 10, the described 4th leads the back wall across copper billet body 10 for the glue groove to glue groove；First leads glue
Groove 11, the described 3rd lead glue groove, second lead glue groove 12 and the described 4th to lead glue groove end to end successively, and being respectively positioned on same water
In plane.
Below, the set-up mode of this copper billet is further described.
First leads glue groove 11, the described 3rd leads glue groove, second leads shape and the structure that glue groove 12 and the described 4th leads glue groove
All could be arranged to consistent.Below, so that first leads glue groove 11 as a example, it is specifically described.
First roof leading glue groove 11 is the first plane diagonally downward, and its diapire is the second plane tilting upward, institute
State the first plane and described second plane to intersect so that the first shape leading glue groove 11 is rendered as Rhizoma Sparganii in copper billet body 10
Post.
In addition, described first plane and described second plane can be symmetrical above and below and set.
More specifically, the height H of copper billet body 10 is 2.28-2.3mm, preferably 2.29mm；First top leading glue groove 11
Ultimate range h between wall and diapire3For 0.4mm；Minimum between first roof leading glue groove 11 and copper billet body 10 roof
Apart from h2For 0.3mm；Minimum range h between first diapire leading glue groove 11 and copper billet body 10 diapire1For 1.59mm；First
Lead depth capacity h of glue groove 114For 0.15-0.25mm, preferably 0.2mm.
As shown in figure 5, when copper billet plate is buried in making, the copper billet being provided using this utility model embodiment, process during pressing plate
The flow process passage of middle resin increases, and can be prevented effectively from the bending of L11/12 layer central layer, improve the quality burying copper billet plate.And Fig. 4 institute
Show, when burying copper billet plate using copper billet (no the leading glue groove) making of prior art, in sheeting process, the flow process passage of resin is too small,
Easily buckling phenomenon (as shown in Figure 1) in L11/12 layer central layer, ultimately results in whole product rejection.
It will be apparent to those skilled in the art that can technical scheme as described above and design, make other various
Corresponding change and deformation, and all these change and deformation all should belong to the protection of this utility model claim
Within the scope of.
Claims (8)
1. a kind of copper billet for burying copper billet plate is it is characterised in that include copper billet body；The left side wall of described copper billet body and
Right side wall is respectively symmetrically to be provided with first and lead glue groove and second leads glue groove, and described first leads glue groove across described copper billet body
Left side wall, described second leads the right side wall across described copper billet body for the glue groove；
The anterior wall of described copper billet body and back wall are respectively symmetrically to be provided with the 3rd and lead glue groove and the 4th leads glue groove, described
3rd leads the anterior wall across described copper billet body for the glue groove, and the described 4th leads the back wall across described copper billet body for the glue groove
Face；
Described first leads glue groove, the described 3rd leads glue groove, described second leads glue groove and the described 4th to lead glue groove end to end successively,
And be respectively positioned on same horizontal plane.
2. the copper billet for burying copper billet plate according to claim 1 it is characterised in that described first lead glue groove, described
Two lead glue groove, the described 3rd to lead glue groove all consistent with structure with the described 4th shape leading glue groove.
3. the copper billet for burying copper billet plate according to claim 1 and 2 is it is characterised in that described first leads the top of glue groove
Wall is the first plane diagonally downward, and its diapire is the second plane tilting upward, described first plane and described second plane
Originally intersect so that described first shape leading glue groove is rendered as triangular prism in vivo in described copper billet.
4. the copper billet for burying copper billet plate according to claim 3 is it is characterised in that described first plane and described second
Plane is symmetrical above and below and sets.
5. the copper billet for burying copper billet plate according to claim 3 is it is characterised in that the height of described copper billet body is
2.28-2.3mm；Described first ultimate range leading between the roof of glue groove and diapire is 0.4mm；Described first top leading glue groove
Minimum range between wall and described copper billet body roof is 0.3mm；Described first diapire leading glue groove and described copper billet body
Minimum range between diapire is 1.59mm.
6. the copper billet for burying copper billet plate according to claim 2 is it is characterised in that described first leads the maximum deep of glue groove
Spend for 0.15-0.25mm.
7. the copper billet for burying copper billet plate according to claim 5 is it is characterised in that the height of described copper billet body is
2.29mm.
8. the copper billet for burying copper billet plate according to claim 6 is it is characterised in that described first leads the maximum deep of glue groove
Spend for 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620850602.0U CN205961566U (en) | 2016-08-08 | 2016-08-08 | A copper billet for burying copper billet board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620850602.0U CN205961566U (en) | 2016-08-08 | 2016-08-08 | A copper billet for burying copper billet board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205961566U true CN205961566U (en) | 2017-02-15 |
Family
ID=57973063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620850602.0U Active CN205961566U (en) | 2016-08-08 | 2016-08-08 | A copper billet for burying copper billet board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205961566U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110896585A (en) * | 2019-07-17 | 2020-03-20 | 江西弘高科技有限公司 | Embedded copper-based printed circuit board and manufacturing method thereof |
| CN114867186A (en) * | 2022-03-22 | 2022-08-05 | 胜宏科技（惠州）股份有限公司 | Method for avoiding surface salient points of copper block embedding plate |
-
2016
- 2016-08-08 CN CN201620850602.0U patent/CN205961566U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110896585A (en) * | 2019-07-17 | 2020-03-20 | 江西弘高科技有限公司 | Embedded copper-based printed circuit board and manufacturing method thereof |
| CN114867186A (en) * | 2022-03-22 | 2022-08-05 | 胜宏科技（惠州）股份有限公司 | Method for avoiding surface salient points of copper block embedding plate |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |