CN110896585A - Embedded copper-based printed circuit board and manufacturing method thereof - Google Patents
Embedded copper-based printed circuit board and manufacturing method thereof Download PDFInfo
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- CN110896585A CN110896585A CN201910643237.4A CN201910643237A CN110896585A CN 110896585 A CN110896585 A CN 110896585A CN 201910643237 A CN201910643237 A CN 201910643237A CN 110896585 A CN110896585 A CN 110896585A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention relates to an embedded copper-based printed circuit board machine preparation method, which comprises an upper PP board and a lower PP board, wherein at least two layers of core boards are arranged between the upper PP board and the lower PP board, a middle PP board is arranged between two adjacent layers of core boards, through holes are arranged on the at least two layers of core boards and the middle PP board, heat-conducting copper blocks are embedded in the through holes, and copper foils are respectively attached to the outer sides of the upper PP board and the lower PP board. The embedded copper-based printed circuit board solves the problem of rapid heat dissipation of the printed circuit board, improves the working stability of equipment, and can embed the copper block penetrating through the core board and the middle PP board in the corresponding preparation method, thereby preparing the circuit board with high heat dissipation performance, having small occupied space, being convenient for production and not enlarging the volume of the circuit board.
Description
Technical Field
The invention relates to the technical field of printed circuit board processing, in particular to an embedded copper-based printed circuit board and a manufacturing method thereof.
Background
The new energy automobile enters the lives of people, along with the progress of science and technology, the new energy automobile is widely put into the market, the requirement of the automobile battery for long-term power consumption on heat dissipation is high, the new energy automobile serving as a main control circuit board can meet the requirement of the automobile battery for heat dissipation, and the traditional printed circuit board cannot meet the requirement, so that the circuit board is easy to damage under the condition of long-term work, and the normal work of the automobile is influenced.
Disclosure of Invention
The invention aims to provide an embedded copper-based printed circuit board, which solves the problem of rapid heat dissipation of the printed circuit board and improves the working stability of equipment.
Furthermore, the method for manufacturing the embedded copper-based printed circuit board is provided, and the copper block penetrating through the core board and the middle PP board can be embedded in the core board and the middle PP board, so that the circuit board with high heat dissipation performance is manufactured, the occupied space is small, the production is convenient, and the size of the circuit board cannot be enlarged.
In order to achieve the purpose, the invention adopts the technical scheme that:
the invention provides an embedded copper-based printed circuit board which comprises an upper PP board and a lower PP board, wherein at least one layer of core board is arranged between the upper PP board and the lower PP board, a through hole is formed in the core board, a heat conduction copper block is embedded in the through hole, and copper foils are respectively attached to the outer sides of the upper PP board and the lower PP board.
Furthermore, at least two layers of core plates are arranged between the upper PP plate and the lower PP plate, a middle PP plate is arranged between the two adjacent layers of core plates, through holes are formed in the at least two layers of core plates and the middle PP plate, heat conduction copper blocks are embedded in the through holes, and copper foils are respectively attached to the outer sides of the upper PP plate and the lower PP plate.
Particularly, the invention also provides a manufacturing method of the embedded copper-based printed circuit board, which comprises the following steps:
processing a core plate, namely drilling a first through hole on the core plate by using a milling cutter;
processing a middle PP plate, namely drilling and milling a second through hole with the same shape as the first through hole on the middle PP plate corresponding to the first through hole;
browning lamination, wherein the processed core plates and the middle PP plate are subjected to browning lamination, the middle PP plate is arranged between two adjacent layers of core plates, and the first through holes and the second through holes are overlapped;
installing a copper block, and processing the copper block to enable the copper block to be in clearance fit with the through hole, wherein the copper block is inserted into the first through hole and the second through hole;
pressing, namely, adhering an upper PP plate above the top core plate, adhering a lower PP plate below the bottom core plate, and pressing a layer of copper foil on the outer sides of the upper and lower PP plates respectively; and
and post-processing, drilling, depth-controlled milling and etching forming.
Further, when the browning lamination is carried out, the core plate and the middle PP plate are riveted through rivets.
Furthermore, when installing the copper billet, bore at the center of copper billet and be equipped with the blind hole, the blind hole diameter is 1~2mm, and the degree of depth is 0.2~0.5 mm.
Furthermore, the size of the copper block is 0.15-0.25 mm smaller than that of the second through hole; the size of the first through hole is 0.8-0.15 mm smaller than that of the second through hole.
Further, when the core plate and the middle PP plate are milled with through holes, the holes are milled in the same direction.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
according to the embedded copper-based printed circuit board, the metal copper blocks with good heat conductivity are embedded into the core board and the middle PP board in the printed circuit board, and then the PP boards and the copper foils are pasted on the top and the bottom of the core board, so that the heat dissipation performance of the printed circuit board is improved, the volume change of the printed circuit board is small, the heat dissipation effect is tens of times of that of a common PCB, the heat dissipation problem is well solved, and the overall performance of the printed circuit board is guaranteed.
Furthermore, the manufacturing method can adapt to the characteristics of each processing step according to the structural characteristics of the printed circuit board, and restrict the size of the aperture of the open hole in the copper block and the core plate/PP plate, so that the copper block is ensured to be in good contact with the core plate and the like, and the heat dissipation effect is ensured.
Furthermore, the blind holes formed in the top of the copper block can supplement the whole body when the expansion and contraction of the extruded core plate or the extruded PP plate are inconsistent, and the PP plate can be flatly filled to the positions of the blind holes when being heated and melted, so that the printed circuit board at the final preparation position has a better expansion and contraction ratio.
Drawings
Some specific embodiments of the invention will be described in detail hereinafter, by way of illustration and not limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:
fig. 1 is a schematic view of a layered structure of a printed wiring board according to an embodiment of the present invention;
fig. 2 is a schematic process flow diagram of a printed wiring board manufacturing method according to another embodiment of the present invention.
Wherein the reference numerals are as follows:
1. copper foil, 2, upper PP plate, 3, lower PP plate, 4, core plate, 5, middle PP plate, 6 and copper block.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1:
the embodiment provides an embedded copper base printed wiring board, including last PP board 2 and lower PP board 3 go up PP board 2 and be provided with one deck core 4 down between the PP board 3 the through-hole has been seted up on core 4 heat conduction copper billet 6 has been buried underground in the through-hole the outside of going up PP board 2 and lower PP board 3 has laminated copper foil 1 respectively.
For the preparation of a printed circuit board with two or more layers of core boards 4, as shown in fig. 1, two layers of core boards 4 are arranged between an upper PP board 2 and a lower PP board 3, a middle PP board 5 is arranged between two adjacent layers of core boards 4, through holes are arranged on the two layers of core boards 4 and the middle PP board 5, heat-conducting copper blocks 6 are embedded in the through holes, and copper foils 1 are respectively attached to the outer sides of the upper PP board 2 and the lower PP board 3.
In this embodiment, the thicknesses of the upper PP plate 2, the lower PP plate 3 and the middle PP plate 5 are all 0.2mm, and the thickness of the core plate 4 is 1.15 mm. The height of the corresponding copper block 6 is 2.5 mm.
According to the embedded copper-based printed circuit board, the metal copper block 6 with good heat conductivity is embedded into the core board 4 and the middle PP board 5 in the printed circuit board, and then the PP boards and the copper foils 1 are pasted on the top and the bottom, so that the heat dissipation performance of the printed circuit board is improved, the volume change of the printed circuit board is small, the heat dissipation effect is tens of times of that of a common PCB, the heat dissipation problem is well solved, and the overall performance of the printed circuit board is guaranteed.
Example 2:
the invention also provides a manufacturing method of the embedded copper-based printed circuit board, which comprises the following steps:
processing a core plate, namely drilling a first through hole on the core plate by using a milling cutter;
processing a middle PP plate, namely drilling and milling a second through hole with the same shape as the first through hole on the middle PP plate corresponding to the first through hole;
browning lamination, wherein the processed core plates and the middle PP plate are subjected to browning lamination, the middle PP plate is arranged between two adjacent layers of core plates, and the first through holes and the second through holes are overlapped;
installing a copper block, and processing the copper block to enable the copper block to be in clearance fit with the through hole, wherein the copper block is inserted into the first through hole and the second through hole;
pressing, namely, adhering an upper PP plate above the top core plate, adhering a lower PP plate below the bottom core plate, and pressing a layer of copper foil on the outer sides of the upper and lower PP plates respectively; and
and post-processing, drilling, depth-controlled milling and etching forming.
Further, when the browning lamination is carried out, the core plate and the middle PP plate are riveted through rivets.
Furthermore, when installing the copper billet, bore at the center of copper billet and be equipped with the blind hole, the accessible presets circular pad at the center of copper billet, can adopt when the board breathing of extrusion is inconsistent to target and beat the circular pad on the copper billet to form an above-mentioned blind hole, the blind hole is whole to be the annular groove, so can carry out the trompil selectively, the effective ring diameter of the blind hole that sets up is 1mm, and the degree of depth is 0.3 mm.
In addition, the sizes of the copper block and the core plate need to be strictly controlled, the tightness of the copper block placed in the core plate needs to be proper, the copper block is not filled with glue when the copper block is placed in the core plate too loosely, the copper block is not filled with glue when the copper block is placed in the core plate too tightly, the copper block and the core plate are not firmly combined, the copper block and the core plate are prone to fracture, the expansion and shrinkage are inconsistent, the designed size of the copper block is confirmed to be 0.2mm smaller than the size of the second through hole, the size of the first through hole in the core plate is confirmed to be optimal when the first through hole in the core plate is 0.1mm smaller than.
Furthermore, when the core plate and the middle PP plate are milled with through holes, holes are milled in the same direction, and therefore the number of burrs in the milling process can be reduced.
It can be understood that the manufacturing method of the invention can adapt to the characteristics of each processing step according to the structural characteristics of the printed circuit board, and restrict the size of the aperture of the open hole in the copper block and the core plate/PP plate, thereby ensuring that the copper block and the core plate have good contact and ensuring the heat dissipation effect.
Furthermore, the blind holes formed in the top of the copper block can supplement the whole body when the expansion and contraction of the extruded core plate or the extruded PP plate are inconsistent, and the PP plate can be flatly filled to the positions of the blind holes when being heated and melted, so that the printed circuit board at the final preparation position has a better expansion and contraction ratio.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present invention and implement the invention, and not to limit the scope of the invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the scope of the present invention.
Claims (8)
1. The embedded copper-based printed circuit board is characterized in that a through hole is formed in the core board, a heat conduction copper block is embedded in the through hole, and copper foils are respectively attached to the outer sides of the upper PP board and the lower PP board.
2. The embedded copper-based printed wiring board according to claim 1, wherein at least two core boards are disposed between the upper PP board and the lower PP board, and an intermediate PP board is disposed between two adjacent core boards, wherein through holes are disposed in the at least two core boards and the intermediate PP board, heat conductive copper blocks are embedded in the through holes, and copper foils are respectively bonded to outer sides of the upper PP board and the lower PP board.
3. A manufacturing method of an embedded copper-based printed circuit board is characterized by comprising the following steps:
processing a core plate, namely drilling a first through hole on the core plate by using a milling cutter;
processing a middle PP plate, namely drilling and milling a second through hole with the same shape as the first through hole on the middle PP plate corresponding to the first through hole;
browning lamination, wherein the processed core plates and the middle PP plate are subjected to browning lamination, the middle PP plate is arranged between two adjacent layers of core plates, and the first through holes and the second through holes are overlapped;
installing a copper block, and processing the copper block to enable the copper block to be in clearance fit with the through hole, wherein the copper block is inserted into the first through hole and the second through hole;
pressing, namely, adhering an upper PP plate above the top core plate, adhering a lower PP plate below the bottom core plate, and pressing a layer of copper foil on the outer sides of the upper and lower PP plates respectively; and
and post-processing, drilling, depth-controlled milling and etching forming.
4. The method for manufacturing the embedded copper-based printed wiring board according to claim 3, wherein the core board and the middle PP board are riveted by a rivet during the browning lamination.
5. The method for manufacturing the embedded copper-based printed circuit board according to claim 3, wherein a blind hole is drilled in the center of the copper block when the copper block is installed, and the blind hole has a diameter of 1-2 mm and a depth of 0.2-0.5 mm.
6. The method for manufacturing the embedded copper-based printed circuit board according to claim 3 or 5, wherein the size of the copper block is 0.15-0.25 mm smaller than that of the second through hole.
7. The method for manufacturing the embedded copper-based printed circuit board according to claim 3, wherein the size of the first through hole is 0.8-0.15 mm smaller than that of the second through hole.
8. The method for manufacturing the embedded copper-based printed circuit board according to claim 3, wherein the holes are milled in a straight-down manner when the core board and the middle PP board are milled for the through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910643237.4A CN110896585A (en) | 2019-07-17 | 2019-07-17 | Embedded copper-based printed circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910643237.4A CN110896585A (en) | 2019-07-17 | 2019-07-17 | Embedded copper-based printed circuit board and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN110896585A true CN110896585A (en) | 2020-03-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910643237.4A Pending CN110896585A (en) | 2019-07-17 | 2019-07-17 | Embedded copper-based printed circuit board and manufacturing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102123560A (en) * | 2011-03-01 | 2011-07-13 | 梅州博敏电子有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
| CN106255350A (en) * | 2016-08-18 | 2016-12-21 | 东莞市五株电子科技有限公司 | Bury copper coin manufacture method |
| CN205961566U (en) * | 2016-08-08 | 2017-02-15 | 广州美维电子有限公司 | A copper billet for burying copper billet board |
| CN108882538A (en) * | 2018-07-17 | 2018-11-23 | 乐健科技（珠海）有限公司 | Circuit board and preparation method thereof |
-
2019
- 2019-07-17 CN CN201910643237.4A patent/CN110896585A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102123560A (en) * | 2011-03-01 | 2011-07-13 | 梅州博敏电子有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
| CN205961566U (en) * | 2016-08-08 | 2017-02-15 | 广州美维电子有限公司 | A copper billet for burying copper billet board |
| CN106255350A (en) * | 2016-08-18 | 2016-12-21 | 东莞市五株电子科技有限公司 | Bury copper coin manufacture method |
| CN108882538A (en) * | 2018-07-17 | 2018-11-23 | 乐健科技（珠海）有限公司 | Circuit board and preparation method thereof |
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Application publication date: 20200320 |