CN205828351U - 用于化学处理半导体衬底的装置 - Google Patents
用于化学处理半导体衬底的装置 Download PDFInfo
- Publication number
- CN205828351U CN205828351U CN201620228808.XU CN201620228808U CN205828351U CN 205828351 U CN205828351 U CN 205828351U CN 201620228808 U CN201620228808 U CN 201620228808U CN 205828351 U CN205828351 U CN 205828351U
- Authority
- CN
- China
- Prior art keywords
- substrate
- fluid
- semiconductor substrate
- pretreatment
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015205437.3A DE102015205437A1 (de) | 2015-03-25 | 2015-03-25 | Vorrichtung und Verfahren zur chemischen Behandlung eines Halbleiter-Substrats |
DE102015205437.3 | 2015-03-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205828351U true CN205828351U (zh) | 2016-12-21 |
Family
ID=55542657
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610169935.1A Pending CN106024614A (zh) | 2015-03-25 | 2016-03-23 | 用于化学处理半导体衬底的装置和方法 |
CN201620228808.XU Active CN205828351U (zh) | 2015-03-25 | 2016-03-23 | 用于化学处理半导体衬底的装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610169935.1A Pending CN106024614A (zh) | 2015-03-25 | 2016-03-23 | 用于化学处理半导体衬底的装置和方法 |
Country Status (4)
Country | Link |
---|---|
CN (2) | CN106024614A (de) |
DE (1) | DE102015205437A1 (de) |
TW (1) | TW201703131A (de) |
WO (1) | WO2016150788A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015223227A1 (de) * | 2015-11-24 | 2017-05-24 | Rct Solutions Gmbh | Vorrichtung und Verfahren zur chemischen Behandlung eines Halbleiter-Substrats |
CN207993803U (zh) * | 2017-04-13 | 2018-10-19 | Rct解决方法有限责任公司 | 用于化学处理带有被锯割形成的表面结构的半导体衬底的设备 |
CN108735595A (zh) * | 2017-04-13 | 2018-11-02 | Rct解决方法有限责任公司 | 用于化学处理半导体衬底的方法和设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4423326A1 (de) * | 1994-07-02 | 1996-01-04 | Bosch Gmbh Robert | Verfahren und Vorrichtung zum Rückseitenätzen einer Silicium-Waferstruktur |
DE102007063202A1 (de) * | 2007-12-19 | 2009-06-25 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Behandlung von Silizium-Wafern |
CN102714134B (zh) * | 2009-09-22 | 2016-01-13 | 雷纳有限公司 | 用于回蚀半导体层的方法和装置 |
DE102009050845A1 (de) * | 2009-10-19 | 2011-04-21 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Behandlung einer Substratoberfläche eines Substrats |
DE102012107372B4 (de) * | 2012-08-10 | 2017-03-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Alkalischer Ätzprozess und Vorrichtung zur Durchführung des Verfahrens |
CN103618020A (zh) * | 2013-10-18 | 2014-03-05 | 浙江晶科能源有限公司 | 一种硅太阳能电池生产中的湿刻蚀方法 |
-
2015
- 2015-03-25 DE DE102015205437.3A patent/DE102015205437A1/de not_active Withdrawn
-
2016
- 2016-03-16 WO PCT/EP2016/055668 patent/WO2016150788A1/de active Application Filing
- 2016-03-23 CN CN201610169935.1A patent/CN106024614A/zh active Pending
- 2016-03-23 CN CN201620228808.XU patent/CN205828351U/zh active Active
- 2016-03-24 TW TW105109198A patent/TW201703131A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW201703131A (zh) | 2017-01-16 |
WO2016150788A1 (de) | 2016-09-29 |
CN106024614A (zh) | 2016-10-12 |
DE102015205437A1 (de) | 2016-09-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |