CN205789929U - 装备有散热器的电子设备 - Google Patents
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Abstract
本公开提供装备有散热器的电子设备。电子设备包括支撑板,其中集成电路芯片被固定到支撑板上。散热器被安装到支撑板。电连接接线被提供有电连接到散热器的一个端部、和电连接到设置在支撑板上的电触头的另一端部。
Description
技术领域
本实用新型涉及电子设备领域。
背景技术
电子设备可以包括(例如BGA类型的)安装在封装中的集成电路芯片,芯片被固定到支撑板的前侧面上。散热器(一般由金属制成)可以采用碗的形式并且包括在芯片上方延伸的前板。外围基体连接到这一前板并且被固定在支撑板的前侧面上方。包封块被设置在支撑板的前侧面上方,其中芯片和散热器被以如下方式内嵌,使得这一散热器的前板的前侧面未被覆盖。
在惯例方式中,散热器的基体借助于在支撑板的前侧面的电触头之上延伸的导电粘合剂被固定到支撑板上,以便将散热器连接到地。
实用新型内容
在通过在模具的腔体中的注塑成型来生产包封块期间,这一腔体的面牢固地支撑散热器的前板。这一支撑引起散热器的变形,使得导电粘合剂脱离电触头,以至于不可能确定散热器保持正确地连接到地。
在本领域中需要补救这一缺点。
提出了如下电子设备,其包括支撑板、被固定到支撑板上的集成电路芯片、散热器、以及电连接接线,电连接接线具有被固定到散热器上的一个端部、和被固定到设置在支撑板上的电触头上的另一端部。
根据一些实施例,电子设备进一步包括在所述支撑板上方的包封块,所述集成电路芯片和所述散热器被包封在所述包封块中,其中所述电连接接线被内嵌在所述包封块中。
根据一些实施例,散热器包括在所述集成电路芯片上方延伸的前板、和连接到所述前板并且被固定在所述支撑板上方的外围凸缘。
根据一些实施例,外围凸缘具有被安装到所述支撑板的底部表面、和与所述底部表面相反的顶部表面,其中所述电连接接线被固定到所述顶部表面。
根据一些实施例,散热器的所述前板未被所述包封块覆盖。
根据一些实施例,包封块的顶部表面与所述前板的顶部表面共面。
根据一些实施例,支撑板包括电连接网络,其中所述集成电路芯片被固定到所述支撑板的前侧面上,其中所述散热器包括在所述集成电路芯片上方延伸的前板、和连接到所述前板并且被固定到所述支撑板的所述前侧面的外围凸缘。
根据一些实施例,电子设备进一步包括在所述支撑板的所述前侧面上方的包封块,所述包封块包封所述集成电路芯片和所述散热器,使得所述前板的前侧面至少部分地未被覆盖,并且其中所述电连接接线被内嵌在所述包封块中。
根据一些实施例,电连接接线的一个端部被固定到所述散热器的所述外围凸缘上,并且所述电连接接线的另一端部被固定到所述电连接网络的电触头上。
根据一些实施例,包封块具有与所述散热器的所述前板的所述前侧面位于相同的平面内的一个前侧面。
根据一些实施例,散热器由金属制成。
以这一方式,散热器的电连接独立于散热器到支撑板上的固定。
电子设备可以包括在支撑板上方的包封块,芯片和散热器被包封在包封块中,电连接接线被内嵌在这一包封块中。
散热器可以包括在芯片上方延伸的前板、和连接到这一前板并且被固定在支撑板上方的外围基体。
散热器的前板可以至少部分地未被覆盖。
支撑板可以装备有电连接网络,集成电路芯片可以被固定到支撑板的前侧面上,并且散热器可以包括在芯片上方延伸的前板、和连接到这一前板并且被固定在支撑板的前侧面上方的外围基体。
包封块可以被设置在支撑板的前侧面上方,芯片和散热器被包封在该块中,使得散热器的前板的前侧面至少部分地未被覆盖,电连接接线被内嵌在所述包封块中,并且具有被固定到散热器的所述基体上的一个端部、和被固定到所述网络的设置在支撑板的前侧面上的电触头上的另一端部。
包封块可以具有与散热器的前板的前侧面位于相同的平面内的一个前侧面。
附图说明
散热器可以由金属制成。现在将作为由附图图示的示例性实施例来描述电子设备和制造方法,其中:
-图1示出了没有包封块的电子设备的顶视图;并且
-图2示出了沿着图1中的II-II的具有其包封块的截面。
具体实施方式
图1和图2所示的电子设备1包括:并入电连接网络3的支撑板2;和借助于粘合剂6的层被固定到支撑板的前侧面5上(基本上在其中间)的集成电路芯片4。
芯片4借助于多个电连接接线7电连接到网络3,电连接接线的一个端部被焊接到芯片4的前侧面9的电触头8上,并且另一端部被焊接到网络3的前电触头10上,该触头被设置在支撑板2的前侧面5上、远离芯片4的外围。
根据变体实施例,芯片4可以借助于电连接元件(诸如球)被安装在支撑板2上。在这一情形下,电接线7可以被省略。
电设备1包括由金属制成的散热器11,其包括:在芯片4的前侧面9和电接线7上方并且远离它们延伸的前板12;在支撑板2的前侧面5上方、远离电触头10并且在电触头10外侧延伸的外围凸缘13;以及倾斜环形连接部分14,使得散热器11采用碗的形式,芯片4和电接线7位于碗的内侧。
外围凸缘13借助于粘合剂15的层被固定到支撑板2的前侧面5的面上。
散热器11具有被外围设置在外围凸缘13和环形连接部分14之间的连接区域中的访问开口16。
电子设备1还包括电连接接线17,电连接接线17的端部在点18处被焊接到凸缘13上,并且电连接接线17的另一端部被焊接到网络3的被设置在支撑板2的前侧面5上、远离凸缘13的外围的前电触头19上,以便将散热器11连接到地。可以设置其它电接线16。
电子设备1还包括被形成在支撑板2的前侧面5上方的包封块20,芯片4、电接线7、散热器、以及电接线17被包封在该块中,使得散热器11的前板12的前侧面21未被覆盖。
包封块20填充了散热器11的内部空间,从而内嵌了芯片4和电接线7,使得包封块20延伸到芯片4的前侧面9和在芯片外围和支撑板2的前侧面5的对应区域上的环形连接部分14之间的芯片4周围之间的空间中。
包封块20还在散热器11的环形部分14周围、在散热器11的凸缘13上方、并且在支撑板的前侧面5的对应区域上方延伸,直到支撑板2的外围边缘,使得散热器11的前板12的前侧面21未被覆盖。包封块20具有在与散热器11的前板12的前侧面21相同的平面内延伸的前侧面22,这一平面平行于支撑板2。
前述内容的结果是,独立于散热器11借助于粘合剂15的层被固定到支撑板2上之外,散热器11借助于电接线17连接到电连接网络3。
电子设备1可以按以下方式制造。
芯片4被固定到支撑板2上。
将电接线7放置到位。
凭借粘合剂15的层固定散热器11。
将电接线17放置到位。
包封块20在注塑模具中生产,模具的内腔体具有与散热器11的前板12的前侧面21接触的平坦表面。有利地,散热器11的这一前侧面21的外围可以具有稍微向前突起与模具的腔体的所述表面接触的环形部分。
凭借穿过散热器11的访问开口16,被注入的材料渗透散热器11的内部以便填充散热器和芯片4之间的自由空间。
在这之后,外部电连接元件23(诸如球)可以在电连接网络3的后电触头上被放置到位,该触头被设置在支撑板2的后面上。
电子设备1可以集体地被制造在共用支撑晶片上,之后是通过如微电子领域中已知的锯切进行单个化。
Claims (11)
1.一种电子设备,其特征在于,包括:
支撑板,
集成电路芯片,被固定到所述支撑板上,
散热器,以及
电连接接线,具有被固定到所述散热器上的一个端部、以及被固定到设置在所述支撑板上的电触头上的另一端部。
2.根据权利要求1所述的设备,其特征在于,进一步包括在所述支撑板上方的包封块,所述集成电路芯片和所述散热器被包封在所述包封块中,其中所述电连接接线被内嵌在所述包封块中。
3.根据权利要求2所述的设备,其特征在于,其中所述散热器包括在所述集成电路芯片上方延伸的前板、和连接到所述前板并且被固定在所述支撑板上方的外围凸缘。
4.根据权利要求3所述的设备,其特征在于,其中所述外围凸缘具有被安装到所述支撑板的底部表面、和与所述底部表面相反的顶部表面,其中所述电连接接线被固定到所述顶部表面。
5.根据权利要求3所述的设备,其特征在于,其中所述散热器的所述前板未被所述包封块覆盖。
6.根据权利要求5所述的设备,其特征在于,其中所述包封块的顶部表面与所述前板的顶部表面共面。
7.根据权利要求1所述的设备,其特征在于,其中所述支撑板包括电连接网络,其中所述集成电路芯片被固定到所述支撑板的前侧面上,其中所述散热器包括在所述集成电路芯片上方延伸的前板、和连接到所述前板并且被固定到所述支撑板的所述前侧面的外围凸缘。
8.根据权利要求7所述的设备,其特征在于,进一步包括在所述支撑板的所述前侧面上方的包封块,所述包封块包封所述集成电路芯片和所述散热器,使得所述前板的前侧面至少部分地未被覆盖,并且其中所述电连接接线被内嵌在所述包封块中。
9.根据权利要求8所述的设备,其特征在于,其中所述电连接接线的一个端部被固定到所述散热器的所述外围凸缘上,并且所述电连接接线的另一端部被固定到所述电连接网络的电触头上。
10.根据权利要求9所述的设备,其特征在于,其中所述包封块具有与所述散热器的所述前板的所述前侧面位于相同的平面内的一个前侧面。
11.根据权利要求1所述的设备,其特征在于,其中所述散热器由金属制成。
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CN106653710A (zh) * | 2015-10-28 | 2017-05-10 | 意法半导体(格勒诺布尔2)公司 | 装备有散热器的电子设备 |
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FR3061629A1 (fr) * | 2017-01-03 | 2018-07-06 | Stmicroelectronics (Grenoble 2) Sas | Procede de fabrication d'un capot pour boitier electronique et boitier electronique comprenant un capot |
FR3061628A1 (fr) | 2017-01-03 | 2018-07-06 | Stmicroelectronics (Grenoble 2) Sas | Procede de fabrication d'un capot d'encapsulation pour boitier electronique et boitier electronique comprenant un capot |
FR3061630B1 (fr) | 2017-01-03 | 2021-07-09 | St Microelectronics Grenoble 2 | Procede de fabrication d'un capot pour boitier electronique et boitier electronique comprenant un capot |
KR102025906B1 (ko) * | 2017-12-06 | 2019-11-04 | 삼성전자주식회사 | 안테나 모듈 |
CN107993991B (zh) | 2017-12-20 | 2024-10-01 | 合肥矽迈微电子科技有限公司 | 一种芯片封装结构及其制造方法 |
US10923786B2 (en) | 2018-08-31 | 2021-02-16 | Dana Automotive Systems Group, Llc | Housing assembly for one or more electro chemical cells |
US11974419B1 (en) * | 2023-06-13 | 2024-04-30 | Stmicroelectronics International N.V. | Method, systems, and apparatuses for electromagnetic shielding |
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US6414847B1 (en) * | 2001-04-09 | 2002-07-02 | Agilent Technologies, Inc. | Integral dielectric heatspreader |
US7196415B2 (en) * | 2002-03-22 | 2007-03-27 | Broadcom Corporation | Low voltage drop and high thermal performance ball grid array package |
US6933602B1 (en) * | 2003-07-14 | 2005-08-23 | Lsi Logic Corporation | Semiconductor package having a thermally and electrically connected heatspreader |
US7205651B2 (en) * | 2004-04-16 | 2007-04-17 | St Assembly Test Services Ltd. | Thermally enhanced stacked die package and fabrication method |
JP5017977B2 (ja) * | 2006-09-14 | 2012-09-05 | 富士通セミコンダクター株式会社 | 半導体装置およびその製造方法 |
TWI419270B (zh) * | 2011-03-24 | 2013-12-11 | Chipmos Technologies Inc | 封裝堆疊結構 |
US20170127567A1 (en) * | 2015-10-28 | 2017-05-04 | Stmicroelectronics (Grenoble 2) Sas | Electronic device equipped with a heat sink |
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