CN212182305U - 电子设备 - Google Patents

电子设备 Download PDF

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CN212182305U
CN212182305U CN202020978628.XU CN202020978628U CN212182305U CN 212182305 U CN212182305 U CN 212182305U CN 202020978628 U CN202020978628 U CN 202020978628U CN 212182305 U CN212182305 U CN 212182305U
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heat transfer
metal heat
support substrate
electronic device
chip
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D·坎波斯
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STMicroelectronics Grenoble 2 SAS
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Abstract

本公开的实施例涉及电子设备。电子设备包括支撑衬底，具有安装面；电子集成电路IC芯片，具有通过粘合材料层固定到支撑衬底的安装面的背面；其中支撑衬底在安装面处包括金属传热层，金属传热层包括多个孔；以及多个金属传热元件，被设置在金属传热层的多个孔中，金属传热元件延伸，以相对于支撑衬底的安装面突出到粘合材料层中。通过使用根据本公开的实施例，例如可以改进散热。

Description

电子设备
技术领域
本实用新型涉及包括在支撑衬底上安装的集成电路(IC)芯片的电子设备的领域。
背景技术
在IC芯片产生热量的情况下，将所产生的热量的一部分传递到支撑衬底是有利的。
实用新型内容
鉴于上述问题，本公开的实施例旨在解决上述问题的至少一部分。
根据本公开的第一方面，提供一种电子设备。电子设备包括支撑衬底，具有安装面；电子集成电路IC芯片，具有通过粘合材料层固定到支撑衬底的安装面的背面；其中支撑衬底在安装面处包括金属传热层，金属传热层包括多个孔；以及多个金属传热元件，被设置在金属传热层的多个孔中，金属传热元件延伸，以相对于支撑衬底的安装面突出到粘合材料层中。
根据本公开的第二方面，提供一种电子设备。电子设备包括：支撑衬底，具有正面，正面具有电连接焊盘；金属传热层，在支撑衬底中，其中金属传热层具有与正面共面的安装面并且还包括多个孔，多个孔从安装面延伸穿过金属传热层至金属传热层的背面；以及多个金属传热元件，被安装在金属传热层的多个孔内，每个金属传热元件包括第二部分和被设置在孔中的第一部分，第二部分从孔中延伸出，以突出到金属传热层的安装面之上。
通过使用根据本公开的实施例，可以至少部分地解决前述问题的至少一部分并且实现相应的技术效果。例如，可以改进散热。
附图说明
现在将通过非限制性示例性实施例来描述由附图示出的电子设备，在附图中：
图1示出了电子设备的截面；
图2示出了图1的电子设备的制造步骤；
图3示出了图1的电子设备的后续制造步骤；
图4示出了图1的电子设备的后续制造步骤；
图5示出了图1的电子设备的后续制造步骤；
图6示出了图1的电子设备的后续制造步骤；以及
图7示出了图1的电子设备的后续制造步骤。
具体实施方式
根据一个实施例，提出了电子设备。电子设备包括具有对向安装面的支撑衬底和电子芯片，电子芯片的背面经由粘合材料层(例如，胶粘剂)固定到支撑衬底的对向的安装面上。
支撑衬底在其安装面与芯片相对并具有多个孔的一侧上包括金属传热层。
电子设备还包括多个金属传热元件，多个金属传热元件设置在支撑衬底的金属层的孔中，并且相对于支撑衬底的安装面延伸，突出到粘合材料层中。
因此，增加了芯片与支撑衬底之间的热传递。
支撑衬底和芯片可以有利地不具有经由金属传热层和金属传热元件的电连接。
传热元件可以与芯片的背面相距一定距离。
支撑衬底可以包括电连接的集成网络，电连接的集成网络在支撑衬底的对向安装面的侧面上具有前部电连接块，电连接装置将芯片和支撑衬底的电连接网络的前部块链接。
金属传热层和前部电连接块可以设置在支撑衬底的同一金属层级中。
电连接装置可以包括金属线，金属线将支撑衬底的前部块和芯片的前表面的前部块链接。
设备可以包括在支撑衬底的对向面的顶部上的封装块，芯片和电连接装置被嵌入封装块中。
还提出了用于制造电子设备的方法，方法包括以下步骤：获得具有安装面并且在该安装面的侧面上包括金属传热层的支撑衬底；在金属传热层中产生孔；将金属传热元件放置在金属传热层的孔中，金属传热元件相对于支撑衬底的安装面突出地延伸；在金属传热层的孔中对金属传热元件执行钎焊热处理；在支撑衬底的安装面的顶部上沉积粘合材料层，其中传热元件相对于支撑衬底的安装面突出的突出部分被嵌入粘合材料层中；以及将电子集成电路(IC)芯片放置在粘合材料层的顶部上，以将芯片固定在支撑衬底的顶部上。
方法可以包括以下后续步骤：将连接线放置在IC芯片和支撑衬底之间。
方法可以包括以下后续步骤：在支撑衬底的顶部上制造封装块，在封装块中嵌入IC芯片。
图1所示的电子设备1包括：具有安装面3和背面4的支撑衬底2；以及具有背面6的电子集成电路(IC)芯片5，背面6经由粘合材料层7(例如，胶粘剂)固定到支撑衬底的安装面3上。
支撑衬底2被提供有金属传热层8，金属传热层8在支撑衬底2的安装面3的侧面上附接到支撑衬底2，并与IC芯片5的背面6的至少一部分相对地延伸，并且可以延伸超出IC芯片5的外围边缘的至少一部分。有利地，金属传热层与IC芯片5的整个背面6相对地延伸并且延伸超出IC芯片5的整个外围。
支撑衬底2的安装面处的金属层8具有多个孔9，多个孔9与IC芯片5的背面6的侧面相对，并且对其开放。孔9可以被制造为仅部分地延伸穿过金属层8的厚度或完全(全部)延伸穿过金属层8的厚度。
电子设备1包括近似球形的多个金属传热元件10，多个金属传热元件10装配到金属层8的孔9中，并且包括相对于支撑衬底2的对向面3突出的部分，使得传热元件的突出部分在金属层的上表面之上延伸并嵌入在粘合材料层7中。
传热元件10包括至少部分地填充孔9并且通过钎焊链接(附接)至金属层8的部分。有利地，传热元件10的顶表面(在一个实施例中呈现圆顶形表面形状)与IC芯片5的背面6间隔一定距离。
支撑衬底2和IC芯片5不具有经由金属传热层8和金属传热元件10的电连接。传热元件10因此在IC芯片5和支撑衬底2之间不具有电连接功能。
由IC芯片5产生的一部分热量经由粘合材料层7传递至支撑衬底2。由于存在金属传热层8和金属传热元件10，因此在IC芯片5和支撑衬底2之间的热流显著增加。
在IC芯片5中产生最多热量的一个或多个区域中，孔9以及因此金属传热元件10可以均匀地分布或者可以更致密。
支撑衬底2被提供有电连接集成网络11，电连接集成网络11通过电连接装置12(例如，以键合线的形式提供)链接到IC芯片5。
一方面的金属传热层8和金属传热元件10以及另一方面的电连接集成网络11和电连接装置12是不同的。
根据一个变型实施例，电连接集成网络11在支撑衬底2的对向面3的侧面上包括前部电连接块13。前部块形成为超出IC芯片5的外围边缘并且与IC芯片5的外围边缘间隔一定距离并且与金属传热层8间隔一定距离。
电连接装置12包括电线14，电线14将前部电连接块13与IC芯片5的正面16的前部电连接块15链接。
电连接集成网络11在支撑衬底2的背面4的侧面上包括背部电连接块17，以将IC芯片5连接到外部。
有利地，金属传热层8和前部电连接块13形成在支撑衬底2的同一金属层级中。在该配置中，金属传热层8和前部电连接块13的顶表面可以与衬底2的表面3共面。金属传热元件10在该共面表面之上延伸。
上面的结果是，根据IC芯片5在支撑衬底2上的安装以及在IC芯片5与支撑衬底2之间的电连接装置12，金属层8和元件10构成附加的专用的面向热传递的装置。
电子设备1还包括在支撑衬底的对向面3的顶部上的封装块18，芯片5和电线14被嵌入在封装块18中。
电子设备1可以如下制造。
如图2所示，获得具有金属传热层8和电连接网络11的支撑衬底2。
在图3所示的制造步骤中，通过钻孔或蚀刻，在金属传热层8中产生孔9。
在图4所示的后续制造步骤中，将金属传热元件10放置在孔9中。
在图5所示的后续制造步骤中，例如在烘烤炉中执行热处理，以通过钎焊将金属传热元件10固定到金属传热层8。响应于热处理，形成金属传热元件10的材料蠕变(creep)，以有利地提供填充孔9的部分并且提供从孔突出的另一部分。
在图6所示的后续制造步骤中，沉积粘合材料层7(例如，胶粘剂)，然后将金属传热元件10的突出部分嵌入粘合材料层7中。
在图7所示的后续制造步骤中，将IC芯片5放置在粘合材料层7的顶部上，并且将粘合材料硬化，以将IC芯片5固定在支撑衬底2的顶部上。电连接线14被放置在适当的位置。
最终，形成封装块18。
然后获得电子设备1。

Claims (17)

1.一种电子设备，其特征在于，包括：
支撑衬底，具有安装面；
电子集成电路IC芯片，具有通过粘合材料层固定到所述支撑衬底的所述安装面的背面；
其中所述支撑衬底在所述安装面处包括金属传热层，所述金属传热层包括多个孔；以及
多个金属传热元件，被设置在所述金属传热层的所述多个孔中，所述金属传热元件延伸，以相对于所述支撑衬底的所述安装面突出到所述粘合材料层中。
2.根据权利要求1所述的电子设备，其特征在于，所述支撑衬底包括电连接集成网络，并且所述IC芯片不经由所述金属传热层和所述金属传热元件电连接到所述电连接集成网络。
3.根据权利要求1所述的电子设备，其特征在于，所述金属传热元件的表面与所述IC芯片的所述背面间隔一定距离。
4.根据权利要求1所述的电子设备，其特征在于，所述支撑衬底包括电连接集成网络，所述电连接集成网络在所述支撑衬底的所述安装面处具有前部电连接块。
5.根据权利要求4所述的电子设备，其特征在于，所述金属传热层和所述前部电连接块与所述支撑衬底处于相同的金属层级。
6.根据权利要求4所述的电子设备，其特征在于，还包括电连接装置，所述电连接装置将所述IC芯片和所述前部电连接块链接。
7.根据权利要求6所述的电子设备，其特征在于，所述电连接装置包括金属线，所述金属线将所述前部电连接块链接至所述IC芯片的正面的前部块。
8.根据权利要求6所述的电子设备，其特征在于，还包括在所述支撑衬底的所述安装面的顶部上的封装块，所述IC芯片和所述电连接装置被嵌入在所述封装块中。
9.根据权利要求4所述的电子设备，其特征在于，所述前部电连接块和所述金属传热层的顶表面与所述支撑衬底的所述安装面共面。
10.根据权利要求1所述的电子设备，其特征在于，所述多个孔完全延伸穿过所述金属传热层。
11.根据权利要求1所述的电子设备，其特征在于，所述粘合材料是胶粘剂。
12.一种电子设备，其特征在于，包括：
支撑衬底，具有正面，所述正面具有电连接焊盘；
金属传热层，在所述支撑衬底中，其中所述金属传热层具有与所述正面共面的安装面并且还包括多个孔，所述多个孔从所述安装面延伸穿过所述金属传热层至所述金属传热层的背面；以及
多个金属传热元件，被安装在所述金属传热层的所述多个孔内，每个金属传热元件包括第二部分和被设置在所述孔中的第一部分，所述第二部分从所述孔中延伸出，以突出到所述金属传热层的所述安装面之上。
13.根据权利要求12所述的电子设备，其特征在于，还包括电子集成电路IC芯片，所述IC芯片的背面通过粘合材料层附接到所述支撑衬底的所述安装面，其中每个金属传热元件的所述第二部分突出到所述粘合材料层中。
14.根据权利要求13所述的电子设备，其特征在于，每个金属传热元件的外表面与所述IC芯片的所述背面间隔一定距离，并且其中所述粘合材料填充所述距离。
15.根据权利要求13所述的电子设备，其特征在于，还包括键合线，所述键合线将所述IC芯片电连接到所述支撑衬底的所述正面处的所述电连接焊盘。
16.根据权利要求13所述的电子设备，其特征在于，还包括在所述支撑衬底的所述安装面的顶部上的封装块，其中所述封装块将所述IC芯片封装。
17.根据权利要求12所述的电子设备，其特征在于，所述第二部分具有呈圆顶形状的外表面。
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