CN205582903U - Device is put to automatic getting of wafer ring - Google Patents
Device is put to automatic getting of wafer ring Download PDFInfo
- Publication number
- CN205582903U CN205582903U CN201620400305.6U CN201620400305U CN205582903U CN 205582903 U CN205582903 U CN 205582903U CN 201620400305 U CN201620400305 U CN 201620400305U CN 205582903 U CN205582903 U CN 205582903U
- Authority
- CN
- China
- Prior art keywords
- wafer ring
- conveyer belt
- material loading
- platform
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a device is put to automatic getting of wafer ring, including material loading subassembly, frame, the material loading subassembly includes three reference column, locating platform, material loading platform, material loading power component at least, the inscribed circle and the annular adaptation of describing of wafer of reference column three at least, the reference column is fixed on the locating platform, the appearance of material loading platform is less than the appearance of wafer ring, be equipped with on the locating platform with the through -hole of material loading platform shape adaptation, the material loading platform is worn to locate in the through -hole of locating platform, material loading power component drives the material loading platform reciprocates, the locating platform is fixed in the frame. The wafer ring is little with the area of contact of reference column, and the material loading platform can reciprocate for the locating platform, realizes wafer ring automatic feeding and improves production quality.
Description
Technical field
This utility model relates to wafer transfer device technical field, particularly to a kind of wafer ring automatic clamping and placing dress
Put.
Background technology
Bonder is the key equipment in LED packing producing line, and its die bond process is: point glue equipment is first at base
On the die bond station of plate put glue, then by swing arm (also referred to as crystal taking arm) by wafer (LED chip) from wafer
Take out on ring, then be transferred on die bond station the most for dispensing glue.When acceptable wafers all on wafer ring all by
Taking out, wafer ring just takes off from wafer station, and again puts a wafer ring, has proofreaded angle, then has opened
Beginning die bond.Before die bond, wafer ring expands and is placed on material frame, puts by manually taking out from material frame during use
It is placed on wafer table and has calibrated angle and fixed by fixture, after wafer is finished, then by artificial by wafer
Wafer ring on workbench takes out the wafer ring renewed.It is all manual operation owing to taking, putting wafer ring, compares
Time-consuming, and there is operative employee and change wafer ring the most in time, cause equipment to quit work, produce waste.
Utility model content
Technical problem to be solved in the utility model is: provide a kind of production efficiency height, the measured wafer of matter
Ring automatic pick-and-place apparatus.
In order to solve above-mentioned technical problem, the technical solution adopted in the utility model is:
A kind of wafer ring automatic pick-and-place apparatus, including loading assemblies, frame, described loading assemblies includes at least
The locating dowel of three, locating platform, material loading platform, feeding Power Component, the locating dowel of at least three interior
The circle of contact is adaptive with wafer ring-shaped, and described locating dowel is fixed on described locating platform, described material loading platform
Profile is less than the profile of wafer ring, and described locating platform is provided with and the through hole of described material loading platform shape adaptation,
Described material loading platform is arranged in the through hole of described locating platform, and described feeding Power Component drives described feeding
Platform moves up and down, and described locating platform is fixed in described frame.
Further, described feeding Power Component include the first conveyer belt, the first belt wheel, the first motor,
One guidance set, the first fixed block, described first conveyer belt coordinates with described first belt wheel, described first electricity
Machine drives described first belt wheel and the first conveyer belt to rotate, described first guidance set and described first conveyer belt
Be arrangeding in parallel, described first fixed block is connected with described first conveyer belt and described first guidance set, described
First conveyer belt is vertically arranged, and described material loading platform is fixed on described first fixed block.
Further, described first guidance set is line slideway assembly.
Further, also include translating assembly and take-off assembly, described translation assembly include the second conveyer belt,
Second belt wheel, the second motor, the second guidance set, the second fixed block, described second conveyer belt and described the
Two belt wheels coordinate, and the second belt wheel described in described second driven by motor and the second conveyer belt rotate, and described second leads
It is arranged in parallel with described second conveyer belt to assembly, described second fixed block and described second conveyer belt and second
Guidance set connects, and described second conveyer belt is horizontally disposed with；Described take-off assembly include suction nozzle, material taking piece and
Feeding cylinder, described suction nozzle is fixed on the piston rod of described feeding cylinder by described material taking piece；Described take
Material cylinder is fixed on described second fixed block.
Further, described second guidance set is line slideway assembly.
Further, the quantity of described suction nozzle is at least three.
Further, described take-off assembly also includes that sensor, described sensor are fixed on the second fixed block,
And induction zone is down, it is used for detecting whether suction nozzle is drawn onto wafer ring.
Further, what described second fixed block slided on described second conveyer belt and the second guidance set has
Effect length is more than the wafer ring diameter of at least one.
Further, also including rewinding box, the upper surface of described rewinding box opens wide, the inner chamber of described rewinding box
Adaptive with described wafer ring-shaped, described rewinding box is arranged with described locating platform word order.
Further, the bottom of described rewinding box is provided with a feeding breach.
The beneficial effects of the utility model are: locating platform is fixed in frame, and locating dowel is fixed on location
On platform, the profile being realized wafer ring by the locating dowel of at least three is positioned, simple and reliable for structure, with crystalline substance
The contact area of loop is little, and collision is the fewest, and the damage to wafer ring is little, improves the matter of wafer ring course of conveying
Amount stability；The height of locating dowel, determines the number of the wafer ring that the locating platform last time can place, on
Material platform is arranged in the through hole of locating platform, and feeding Power Component drives material loading platform to move up and down, can be real
Now from the bottom of wafer ring by wafer ring jack-up, i.e. realize the automatic charging of wafer ring, rational in infrastructure, operation
Convenient, improve work efficiency.
Accompanying drawing explanation
Fig. 1 is the installation diagram of the wafer ring automatic pick-and-place apparatus of this utility model embodiment；
Fig. 2 is the explosive view of the loading assemblies of this utility model embodiment；
Fig. 3 is the installation diagram of the loading assemblies of this utility model embodiment；
Fig. 4 is translation assembly and the explosive view of take-off assembly of this utility model embodiment；
Fig. 5 is translation assembly and the installation diagram of take-off assembly of this utility model embodiment.
Label declaration:
1, loading assemblies；2, frame；3, translation assembly；4, take-off assembly；5, rewinding box；6, brilliant
Loop；
11, locating dowel；12, locating platform；121, through hole；13, material loading platform；14, feeding power packages
Part；141, the first conveyer belt；142, the first belt wheel；143, the first motor；144, the first guidance set；
145, the first fixed block；
31, the second conveyer belt；32, the second belt wheel；33, the second motor；34, the second guidance set；35、
Second fixed block；
41, suction nozzle；42, material taking piece；43, feeding cylinder；44, sensor；
51, feeding breach.
Detailed description of the invention
By describing technology contents of the present utility model in detail, being realized purpose and effect, below in conjunction with embodiment party
Formula also coordinates accompanying drawing to be explained.
The design of this utility model most critical is: position wafer ring by the locating dowel of at least three, fixed
Position post is little with the contact area of wafer ring, and the collision between wafer ring is few, it is ensured that wafer ring feeding process
Quality.
Refer to Fig. 1 to Fig. 5, this utility model provides a kind of wafer ring automatic pick-and-place apparatus, including feeding
Assembly 1, frame 2, described loading assemblies 1 include the locating dowel 11 of at least three, locating platform 12, on
Material platform 13, feeding Power Component 14, the inscribed circle of the locating dowel 11 of at least three and wafer ring 6 shape
Adaptation, described locating dowel 11 is fixed on described locating platform 12, and the profile of described material loading platform 13 is less than
The profile of wafer ring 6, described locating platform 12 is provided with and the through hole of described material loading platform 13 shape adaptation
121, described material loading platform 13 is arranged in the through hole 121 of described locating platform 12, described feeding power packages
Part 14 drives described material loading platform 13 to move up and down, and described locating platform 12 is fixed in described frame 2.
Further, described feeding Power Component 14 include first conveyer belt the 141, first belt wheel 142,
One motor the 143, first guidance set the 144, first fixed block 145, described first conveyer belt 141 is with described
First belt wheel 142 coordinates, and described first motor 143 drives described first belt wheel 142 and the first conveyer belt 141
Rotating, described first guidance set 144 be arranged in parallel with described first conveyer belt 141, and described first fixes
Block 145 is connected with described first conveyer belt 141 and described first guidance set 144, described first conveyer belt
141 are vertically arranged, and described material loading platform 13 is fixed on described first fixed block 145.
Seen from the above description, the first motor 143 rotates and drives the first belt wheel 142 and the first conveyer belt 141
Rotating, and then drive the first fixed block 145 to move back and forth up and down, the first guidance set 144 is fixed first
Block 145 moving process play the guiding role, moving up and down on drive material loading platform 13 of the first fixed block 145
Lower movement, it is achieved material loading platform 13 is by wafer ring 6 jack-up from locating platform 12, and single wafer ring 6
Feeding, rational in infrastructure, simple operation.
Further, described first guidance set 144 is line slideway assembly.
Seen from the above description, the first guidance set 144 is line slideway assembly, have kinematic accuracy high,
Service life length advantage, motion stabilization, it is convenient to safeguard.
Further, also including translating assembly 3 and take-off assembly 4, described translation assembly 3 includes the second transmission
Band 31, second belt wheel the 32, second motor the 33, second guidance set the 34, second fixed block 35, described the
Two conveyer belts 31 coordinate with described second belt wheel 32, and described second motor 33 drives described second belt wheel 32
Rotating with the second conveyer belt 31, described second guidance set 34 be arranged in parallel with described second conveyer belt 31,
Described second fixed block 35 is connected with described second conveyer belt 31 and the second guidance set 34, and described second passes
Band 31 is sent to be horizontally disposed with；Described take-off assembly 4 includes suction nozzle 41, material taking piece 42 and feeding cylinder 43, institute
State suction nozzle 41 to be fixed on the piston rod of described feeding cylinder 43 by described material taking piece 42；Described feeding gas
Cylinder 43 is fixed on described second fixed block 35.
Seen from the above description, the second motor 33 rotates and drives the second belt wheel 32 and the second conveyer belt 31 to rotate,
And then driving the second fixed block 35 horizontal reciprocating to move, the second guidance set 34 is in the second fixed block 35 level
Playing the guiding role in moving process, described translation assembly 3 is rational in infrastructure firm, simple operation；Pass through suction nozzle
41 draw wafer ring 6, and the damage to wafer ring 6 is little；The stretching motion of the piston rod of feeding cylinder 43 converts
For material taking piece 42 and the up and down motion of suction nozzle 41, and then it is converted into the upper-lower position variation of wafer ring 6, can
Realize feeding and the blowing action of wafer ring 6；Wafer ring 6 can be realized by translation assembly 3 and take-off assembly 4
The absorption of two positions, movement and put down in horizontal plane.
Further, described second guidance set 34 is line slideway assembly.
Seen from the above description, the second guidance set 34 is line slideway assembly, has kinematic accuracy height, makes
With the advantage of life-span length, motion stabilization, it is convenient to safeguard.
Further, the quantity of described suction nozzle 41 is at least three.
Seen from the above description, the quantity of suction nozzle 41 is at least three, and suction nozzle 41 can be made to draw wafer ring 6
Action consolidate, prevent wafer ring 6 from dropping, it is ensured that the stationarity in wafer ring 6 transportation.
Further, described take-off assembly 4 also includes that sensor 44, described sensor 44 are fixed on second admittedly
Determine on block 35, and induction zone is down, be used for detecting whether suction nozzle 41 is drawn onto wafer ring 6.
Seen from the above description, by sensor 44, take-off assembly 4 senses whether suction nozzle 41 is drawn to crystalline substance
Loop 6, it is ensured that accuracy of action is drawn and put down to wafer ring 6, and rational in infrastructure, motion stabilization is reliable.
Further, described second fixed block 35 is on described second conveyer belt 31 and the second guidance set 34
The effective length slided is more than wafer ring 6 diameter of at least one.
Seen from the above description, the second fixed block 35 is sliding on the second conveyer belt 31 and the second guidance set 34
Dynamic effective length is more than wafer ring 6 diameter of at least one, then the shift motion of take-off assembly 4 is at least
Wafer ring 6 diameter of one, then wafer ring 6 can be moved on a most adjacent position, wafer ring 6
The number of the position moved and distance can be arranged according to actual needs, and flexible structure is convenient.
Further, also including rewinding box 5, the upper surface of described rewinding box 5 opens wide, described rewinding box 5
Inner chamber and described wafer ring 6 shape adaptation, described rewinding box 5 is arranged with described locating platform 12 word order.
Seen from the above description, rewinding box 5 upper surface opens wide, then wafer ring 6 puts into rewinding box 5 from top to bottom
In, the motion with take-off assembly 4 is combined, it is achieved the collection of the wafer ring 6 after use.
Further, the bottom of described rewinding box 5 is provided with a feeding breach 51.
Seen from the above description, wafer ring 6 can be realized from rewinding box 5 bottom up top by feeding breach 51
Rise, facilitate wafer ring 6 to take out from rewinding box 5.
Refer to Fig. 1 to Fig. 5, embodiment one of the present utility model is:
A kind of wafer ring automatic pick-and-place apparatus, including loading assemblies 1, frame 2, translation assembly 3, feeding group
Part 4, rewinding box 5, described loading assemblies 1 include the locating dowel 11 of at least three, locating platform 12, on
Material platform 13, feeding Power Component 14, described feeding Power Component 14 includes the first conveyer belt 141, first
Belt wheel the 142, first motor the 143, first guidance set the 144, first fixed block 145, determining of at least three
The inscribed circle of position post 11 and wafer ring 6 shape adaptation, described locating dowel 11 is fixed on described locating platform 12
On, the profile of described material loading platform 13 less than the profile of wafer ring 6, described locating platform 12 be provided with
The through hole 121 of described material loading platform 13 shape adaptation, described material loading platform 13 is arranged in described locating platform
In the through hole 121 of 12, described feeding Power Component 14 drives described material loading platform 13 to move up and down, described
Locating platform 12 is fixed in described frame 2, and described first guidance set 144 is line slideway assembly, institute
Stating the first conveyer belt 141 to coordinate with described first belt wheel 142, described first motor 143 drives described first
Belt wheel 142 and the first conveyer belt 141 rotate, described first guidance set 144 and described first conveyer belt 141
It is arranged in parallel, described first fixed block 145 and described first conveyer belt 141 and described first guidance set 144
Connecting, described first conveyer belt 141 is vertically arranged, and described material loading platform 13 is fixed on described first fixed block
On 145；
Described translation assembly 3 includes that second conveyer belt the 31, second belt wheel the 32, second motor 33, second guides
Assembly the 34, second fixed block 35, described second conveyer belt 31 coordinates with described second belt wheel 32, and described
Two motors 33 drive described second belt wheel 32 and the second conveyer belt 31 to rotate, described second guidance set 34
It is arranged in parallel with described second conveyer belt 31, described second fixed block 35 and described second conveyer belt 31 and the
Two guidance sets 34 connect, and described second guidance set 34 is line slideway assembly, described second conveyer belt
31 are horizontally disposed with；
Described take-off assembly 4 includes suction nozzle 41, material taking piece 42, feeding cylinder 43, sensor 44, described
The quantity of suction nozzle 41 is at least three, and described suction nozzle 41 is fixed on described feeding gas by described material taking piece 42
On the piston rod of cylinder 43；Described feeding cylinder 43 is fixed on described second fixed block 35, described sensor
44 are fixed on the second fixed block 35, and induction zone is down, are used for detecting whether suction nozzle 41 is drawn onto wafer ring
6, it is effective that described second fixed block 35 slides on described second conveyer belt 31 and the second guidance set 34
Length is more than wafer ring 6 diameter of at least one；
The upper surface of described rewinding box 5 opens wide, and the inner chamber of described rewinding box 5 is fitted with described wafer ring 6 shape
Joining, described rewinding box 5 is arranged with described locating platform 12 word order, and the bottom of described rewinding box 5 is provided with
One feeding breach 51.
Described wafer ring 6 automatic pick-and-place apparatus is provided with feeding station, rewinding station and uses station, Qi Zhongshang
Material assembly 1 is positioned at feeding station, and rewinding box 5 is positioned at rewinding station, and using station is on wafer ring 6
The station of the removed use of wafer.During work, operator fold wafer ring 6 by use in advance one and are placed on
On material loading platform 13, and being limited between the locating dowel 11 of at least three, the second motor 33 drives the second band
Wheel 32 and the second conveyer belt 31 rotate, and then drive the second fixed block 35 to move along the second guidance set 34
Moving the top to locating platform 12, the piston rod of feeding cylinder 43 stretches out, and suction nozzle 41 starts to draw feeding puts down
Wafer ring 6 on platform 13, sensor 44 detects that suction nozzle 41 has been drawn to wafer ring 6, then feeding gas
The piston rod of cylinder 43 is retracted；Second motor 33 rotates and drives the second fixed block 35 along the second guidance set 34
The mobile use station to wafer ring 6, the piston rod of feeding cylinder 43 stretches out, and suction nozzle 41 starts to decontrol crystalline substance
Loop 6, sensor 44 detects that suction nozzle 41 has decontroled wafer ring 6, the then contracting of feeding cylinder 43 piston rod
Return；Second motor 33 rotates and drives the second fixed block 35 to move the top to rewinding box 5, is using station
On, the wafer on wafer ring 6 is removed；After using the wafer of wafer ring 6 on station removed, second
Motor 33 drives the second fixed block 35 to move to using on station, and the piston rod of feeding cylinder 43 stretches out, and passes
After sensor 44 detects that suction nozzle 41 is drawn to wafer ring 6, the piston rod of feeding cylinder 43 is retracted, the second electricity
Machine 33 drives the second fixed block 35 to move above rewinding box 5, and the piston rod of feeding cylinder 43 stretches out, and passes
After sensor 44 detects that suction nozzle 41 unclamps wafer ring 6, the piston rod of feeding cylinder 43 stretches out, and has used
Wafer ring 6 is placed in rewinding box 5；First motor 143 drives the first belt wheel 142 and first to transmit
Band 141 rotation, and then drive the thickness moving a wafer ring 6 on the first fixed block 145, i.e. material loading platform
The thickness of a wafer ring 6 is moved, it is achieved the automatic charging of wafer ring 6, the second motor 33 drives second on 13
Fixed block 35 moves the top to material loading platform 13, repeats above-mentioned steps.
In sum, the wafer ring automatic pick-and-place apparatus that this utility model provides, by the location of at least three
Post 11 realizes the profile location of wafer ring 6, is realized the accumulation of wafer ring 6 by loading assemblies 1, by taking
Material assembly 4 realizes the absorption of wafer ring 6 and puts down, and realizes wafer ring 6 at horizontal plane by translation assembly 3
Interior movement, collects the wafer ring 6 after having used, structure by being provided with the rewinding box 5 of feeding breach 51
Rationally, simple operation, the damage to wafer ring 6 is little, it is achieved that the automatic operation that wafer ring 6 picks and places, work
Make that efficiency is high and to pick and place quality good.
The foregoing is only embodiment of the present utility model, not thereby limit the scope of the claims of the present utility model,
Every equivalents utilizing this utility model description and accompanying drawing content to be made, or be directly or indirectly used in
Relevant technical field, is the most in like manner included in scope of patent protection of the present utility model.
Claims (10)
1. a wafer ring automatic pick-and-place apparatus, it is characterised in that include loading assemblies, frame, described on
Material assembly includes the locating dowel of at least three, locating platform, material loading platform, feeding Power Component, at least three
The inscribed circle of individual locating dowel is adaptive with wafer ring-shaped, and described locating dowel is fixed on described locating platform,
The profile of described material loading platform is less than the profile of wafer ring, and described locating platform is provided with and described material loading platform
The through hole of shape adaptation, described material loading platform is arranged in the through hole of described locating platform, described feeding power
Assembly drives described material loading platform to move up and down, and described locating platform is fixed in described frame.
Wafer ring automatic pick-and-place apparatus the most according to claim 1, it is characterised in that described feeding moves
Power assembly includes the first conveyer belt, the first belt wheel, the first motor, the first guidance set, the first fixed block,
Described first conveyer belt coordinates with described first belt wheel, the first belt wheel and first described in described first driven by motor
Conveyer belt rotates, and described first guidance set be arranged in parallel with described first conveyer belt, described first fixed block
Being connected with described first conveyer belt and described first guidance set, described first conveyer belt is vertically arranged, described
Material loading platform is fixed on described first fixed block.
Wafer ring automatic pick-and-place apparatus the most according to claim 2, it is characterised in that described first leads
It is line slideway assembly to assembly.
Wafer ring automatic pick-and-place apparatus the most according to claim 1, it is characterised in that also include translation
Assembly and take-off assembly, described translation assembly include the second conveyer belt, the second belt wheel, the second motor, second
Guidance set, the second fixed block, described second conveyer belt coordinates with described second belt wheel, described second motor
Driving described second belt wheel and the second conveyer belt to rotate, described second guidance set is put down with described second conveyer belt
Row is arranged, and described second fixed block is connected with described second conveyer belt and the second guidance set, and described second passes
Band is sent to be horizontally disposed with；Described take-off assembly includes suction nozzle, material taking piece and feeding cylinder, and described suction nozzle passes through institute
State material taking piece to be fixed on the piston rod of described feeding cylinder；Described feeding cylinder is fixed on described second and fixes
On block.
Wafer ring automatic pick-and-place apparatus the most according to claim 4, it is characterised in that described second leads
It is line slideway assembly to assembly.
Wafer ring automatic pick-and-place apparatus the most according to claim 4, it is characterised in that described suction nozzle
Quantity is at least three.
Wafer ring automatic pick-and-place apparatus the most according to claim 4, it is characterised in that described feeding group
Part also includes that sensor, described sensor are fixed on the second fixed block, and induction zone is down, is used for detecting
Whether suction nozzle is drawn onto wafer ring.
Wafer ring automatic pick-and-place apparatus the most according to claim 4, it is characterised in that described second is solid
Determine effective length that block slides on described second conveyer belt and the second guidance set wafer more than at least one
Ring diameter.
Wafer ring automatic pick-and-place apparatus the most according to claim 1, it is characterised in that also include rewinding
Box, the upper surface of described rewinding box opens wide, and the inner chamber of described rewinding box is adaptive with described wafer ring-shaped, institute
State rewinding box to arrange with described locating platform word order.
Wafer ring automatic pick-and-place apparatus the most according to claim 9, it is characterised in that described rewinding
The bottom of box is provided with a feeding breach.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620400305.6U CN205582903U (en) | 2016-05-05 | 2016-05-05 | Device is put to automatic getting of wafer ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620400305.6U CN205582903U (en) | 2016-05-05 | 2016-05-05 | Device is put to automatic getting of wafer ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205582903U true CN205582903U (en) | 2016-09-14 |
Family
ID=56856108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620400305.6U Active CN205582903U (en) | 2016-05-05 | 2016-05-05 | Device is put to automatic getting of wafer ring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205582903U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109545726A (en) * | 2018-11-07 | 2019-03-29 | Tcl王牌电器(惠州)有限公司 | A kind of material traversing taking device and material packing producing line |
| CN109879043A (en) * | 2019-03-05 | 2019-06-14 | 上海爵企电子科技有限公司 | A kind of epitaxial residual film automatic collecting device |
| CN110473825A (en) * | 2019-07-24 | 2019-11-19 | 烟台职业学院 | A kind of Music Clip processing crystal solidifying apparatus and its application method of music player |
-
2016
- 2016-05-05 CN CN201620400305.6U patent/CN205582903U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109545726A (en) * | 2018-11-07 | 2019-03-29 | Tcl王牌电器(惠州)有限公司 | A kind of material traversing taking device and material packing producing line |
| CN109545726B (en) * | 2018-11-07 | 2021-08-24 | Tcl王牌电器(惠州)有限公司 | Material moving and taking device and material packaging production line |
| CN109879043A (en) * | 2019-03-05 | 2019-06-14 | 上海爵企电子科技有限公司 | A kind of epitaxial residual film automatic collecting device |
| CN110473825A (en) * | 2019-07-24 | 2019-11-19 | 烟台职业学院 | A kind of Music Clip processing crystal solidifying apparatus and its application method of music player |
| CN110473825B (en) * | 2019-07-24 | 2021-07-27 | 烟台职业学院 | Die bonding device for processing music chip of music player and using method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110586416B (en) | Automatic dispensing pressure maintaining equipment | |
| CN210995034U (en) | Automatic dispensing pressure maintaining equipment | |
| CN205582903U (en) | Device is put to automatic getting of wafer ring | |
| CN107655897B (en) | Product appearance automatic checkout device | |
| CN203876390U (en) | Label laser marking pneumatic automatic feeder | |
| CN105397462B (en) | A kind of accurate retarding machine bearing assembling device | |
| CN206341497U (en) | The substrate transport mechanism of chip mounter | |
| CN209266371U (en) | A kind of semiconductor load all-in-one machine | |
| CN106181311A (en) | A kind of unmanned automatic production line of NOTE | |
| CN209119049U (en) | Die-filling group of group of a kind of automatic gland equipment of chip | |
| CN209119052U (en) | A kind of pressing module of the automatic gland equipment of chip | |
| CN106179983B (en) | A kind of main button case ring automatic detecting machine of mobile phone | |
| CN110789792A (en) | Inductance test packagine machine | |
| CN209021440U (en) | A kind of laser processing two dimensional code cutting on line mark detection automated package production line | |
| CN106241299B (en) | A kind of automatic oil edge machine and its feed mechanism and charging method | |
| CN205437715U (en) | Accurate reducer shaft holds assembly device | |
| CN208613071U (en) | Bidirectional feed detection device | |
| CN208483674U (en) | A kind of grinding device for iron flask production | |
| CN106828998A (en) | Plating medium auto-filling oscillating uniform device | |
| CN203127752U (en) | Automatic material swinging device with supporting lug workpiece | |
| CN208712601U (en) | A kind of battery channelling machine | |
| CN209119051U (en) | A kind of overturning transplanting mould group of the automatic gland equipment of chip | |
| CN209299092U (en) | ABS rotor eccentric shaft press-loading apparatus | |
| CN208601947U (en) | A kind of automation gum cover mounting device | |
| CN110285150A (en) | A kind of automatic ball-loading device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |