CN205508812U - A FPBGA package substrate for radio frequency electrical apparatus - Google Patents
A FPBGA package substrate for radio frequency electrical apparatus Download PDFInfo
- Publication number
- CN205508812U CN205508812U CN201620332792.7U CN201620332792U CN205508812U CN 205508812 U CN205508812 U CN 205508812U CN 201620332792 U CN201620332792 U CN 201620332792U CN 205508812 U CN205508812 U CN 205508812U
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- ground connection
- base plate
- radio frequency
- frequency electrical
- fpbga
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Abstract
The utility model discloses a FPBGA package substrate for radio frequency electrical apparatus, including the base plate body, marking off a plurality of ground connection pad areas of interval distribution on the base plate body, being equipped with a plurality of interval distribution's ground connection solder ball in every ground connection pad area, a plurality of signal solder balls distribute at the edge and the central part of base plate body, the ground connection solder ball is 1 with the proportion of signal solder ball: 1.6. The ground connection pad area is equipped with 4, and the signal solder ball at the edge of base plate body is 104, and the signal solder ball of establishing at the central part of base plate body is 12. The utility model discloses the most apparent advantage lies in providing a large amount of IOs and large tracts of land metal ground connection pad to a requirement of ground connection pad by a large scale can be satisfied to preceding the encapsulation through use LGA and MCM, but the IOs of these encapsulation is than less. This encapsulation to the design has high integration features is very helpful, and its antenna semiconductor industry the inside of developing forward in today has the orientation directive function.
Description
Technical field
This utility model relates to a kind of FPBGA base plate for packaging for radio frequency electrical equipment.
Background technology
The radio frequency electric application product in advanced forward position needs substantial amounts of I/Os and large-area metal pad to realize excellent circuit performance.Although traditional BGA package provides abundant I/Os, but on large-area metal pad this respect, Performance comparision is short of.In the past, LGA and MCM package be frequently used to provide limited signal pad and one in a package between the big metal pad of rectangle, signal pad is only at the edge of encapsulation.As the encapsulation of this limited I/Os quantity of LGA and MCM is particularly useful in highly integrated encapsulation design, it is equally to a certain degree
On limit circuit performance, it is impossible to realize a large amount of I/Os and large area ground pad simultaneously.
Utility model content
In order to solve the deficiency that prior art exists, the purpose of this utility model is to provide a kind of FPBGA base plate for packaging for radio frequency electrical equipment that can simultaneously realize a large amount of I/Os and large area ground pad.
For achieving the above object, this utility model be the technical scheme is that
FPBGA base plate for packaging for radio frequency electrical equipment, including substrate body, marking off multiple ground pad region spaced apart in described substrate body, be provided with multiple ground connection soldered ball spaced apart in each ground pad region, multiple signal solder balls are distributed in edge and the central part of substrate body；Described ground connection soldered ball is 1:1.6 with the ratio of signal solder balls.
Further, being provided with the ground connection soldered ball of 2*2 matrix in described ground pad region, isolation height is 108 microns.
Further, being provided with the ground connection soldered ball of 3*3 matrix in described ground pad region, isolation height is 88 microns.
Further, being provided with the ground connection soldered ball of 4*4 matrix in described ground pad region, isolation height is 78 microns.
Further, described ground pad region is provided with 4, and the signal solder balls at the edge of substrate body is 104, and the signal solder balls of the central part being located at substrate body is 12.
Further, in the ground connection soldered ball of described 4*4 matrix, when Reflow Soldering, the ground connection soldered ball of 2*2 matrix forms single uniform large volume scolding tin, forms 4 large volume scolding tin in each ground pad region.
The beneficial effects of the utility model:
This utility model obvious advantage is that most and is provided that substantial amounts of I/Os and large-area metal ground pad, and in the past by using LGA and MCM package to disclosure satisfy that the requirement of a large area ground pad, but I/Os of these encapsulation are fewer.This encapsulation having highly integrated function for design is the most helpful, and it has direction directive function inside the antenna semiconductor industry that today advances。
Accompanying drawing explanation
With detailed description of the invention, this utility model is described in further detail below in conjunction with the accompanying drawings:
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the structural representation after Reflow Soldering shown in Fig. 1.
In figure: 1, substrate body；2, ground pad region；3, ground connection soldered ball；4, signal solder balls；5, large volume scolding tin.
Detailed description of the invention
As shown in Figure 1, FPBGA base plate for packaging for radio frequency electrical equipment, including substrate body 1, multiple ground pad region 2 spaced apart are marked off in described substrate body 1, being provided with multiple ground connection soldered ball 3 spaced apart in each ground pad region 2, multiple signal solder balls 4 are distributed in edge and the central part of substrate body 1；Described ground connection soldered ball 3 is 1:1.6 with the ratio of signal solder balls 4.
Specifically, being provided with the ground connection soldered ball of 4*4 matrix in described ground pad region 2, isolation height is 78 microns.Described ground pad region 2 is provided with 4, and the signal solder balls at the edge of substrate body 1 is 104, and the signal solder balls of the central part being located at substrate body is 12.
In the ground connection soldered ball of described 4*4 matrix, when Reflow Soldering, the ground connection soldered ball of 2*2 matrix forms single uniform large volume scolding tin 5, forms 4 large volume scolding tin in each ground pad region.
The above is preferred implementation of the present utility model; certainly the interest field of this utility model can not be limited with this; should be understood that; for those skilled in the art; the technical solution of the utility model is modified or equivalent, without departure from the protection domain of technical solutions of the utility model.
Claims (6)
1. the FPBGA base plate for packaging for radio frequency electrical equipment, including substrate body, it is characterized in that: in described substrate body, mark off multiple ground pad region spaced apart, being provided with multiple ground connection soldered ball spaced apart in each ground pad region, multiple signal solder balls are distributed in edge and the central part of substrate body；Described ground connection soldered ball is 1:1.6 with the ratio of signal solder balls.
FPBGA base plate for packaging for radio frequency electrical equipment the most according to claim 1, it is characterised in that: being provided with the ground connection soldered ball of 2*2 matrix in described ground pad region, isolation height is 108 microns.
FPBGA base plate for packaging for radio frequency electrical equipment the most according to claim 1, it is characterised in that: being provided with the ground connection soldered ball of 3*3 matrix in described ground pad region, isolation height is 88 microns.
FPBGA base plate for packaging for radio frequency electrical equipment the most according to claim 1, it is characterised in that: being provided with the ground connection soldered ball of 4*4 matrix in described ground pad region, isolation height is 78 microns.
FPBGA base plate for packaging for radio frequency electrical equipment the most according to claim 4, it is characterised in that: described ground pad region is provided with 4, and the signal solder balls at the edge of substrate body is 104, and the signal solder balls of the central part being located at substrate body is 12.
FPBGA base plate for packaging for radio frequency electrical equipment the most according to claim 5, it is characterized in that: in the ground connection soldered ball of described 4*4 matrix, when Reflow Soldering, the ground connection soldered ball of 2*2 matrix forms single uniform large volume scolding tin, forms 4 large volume scolding tin in each ground pad region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620332792.7U CN205508812U (en) | 2016-04-20 | 2016-04-20 | A FPBGA package substrate for radio frequency electrical apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620332792.7U CN205508812U (en) | 2016-04-20 | 2016-04-20 | A FPBGA package substrate for radio frequency electrical apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205508812U true CN205508812U (en) | 2016-08-24 |
Family
ID=56705638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620332792.7U Expired - Fee Related CN205508812U (en) | 2016-04-20 | 2016-04-20 | A FPBGA package substrate for radio frequency electrical apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205508812U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789175A (en) * | 2016-04-20 | 2016-07-20 | 广东工业大学 | FPBGA packaging substrate for radio frequency electric appliance |
-
2016
- 2016-04-20 CN CN201620332792.7U patent/CN205508812U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789175A (en) * | 2016-04-20 | 2016-07-20 | 广东工业大学 | FPBGA packaging substrate for radio frequency electric appliance |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160824 Termination date: 20170420 |