CN107172809A - A kind of BGA welding methods - Google Patents

A kind of BGA welding methods Download PDF

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Publication number
CN107172809A
CN107172809A CN201710425893.8A CN201710425893A CN107172809A CN 107172809 A CN107172809 A CN 107172809A CN 201710425893 A CN201710425893 A CN 201710425893A CN 107172809 A CN107172809 A CN 107172809A
Authority
CN
China
Prior art keywords
bga
pad
hole
welding
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710425893.8A
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Chinese (zh)
Inventor
冯俊谊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201710425893.8A priority Critical patent/CN107172809A/en
Publication of CN107172809A publication Critical patent/CN107172809A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array

Abstract

The present invention relates to electronic circuit surface installation technique field, more particularly to a kind of BGA pad designs method, a kind of BGA pad designs method, it is characterized in that being provided with a through hole in PCB each BGA solder ball pads, diameter≤0.2mm of through hole, the beneficial effects of the invention are as follows, so in BGA welding processes, the gas produced between BGA soldered balls and pad is discharged in through hole, BGA soldered balls are made equably to be welded on pad, avoid after welding empty problem in soldered ball, it is ensured that its quality, also ensure that the welding standard of Surface Mount component is combined IPC610 requirements.

Description

A kind of BGA welding methods
Technical field
The present invention relates to electronic circuit surface installation technique field, more particularly to a kind of BGA welding methods.
Background technology
1990s, chip integration was improved constantly with advances in technology, and I/O number of pins is sharply increased, power consumption Also increase therewith, the requirement to integrated antenna package is also more strict, and the need for meeting development, BGA package starts to be answered For producing, BGA is English Ball Array Package abbreviation, i.e. BGA Package, and it is that integrated circuit use has A kind of package method of airborne plate, being compared it with other packing forms has advantages below：1. package area is small, and 2. function is increased, Number of pins increases, and 3. reliability is high, 4. good electrical property, and 5. holistic cost is low.
But often there is BGA soldered balls and pad solder in SMT (electronic circuit surface installation technique) welding process in it During the gas row that produces of scaling powder in tin cream do not go out and cause the bubble for forming gas bag in soldered ball, cause It is empty in BGA balls, so ultimately result in soldering reliability and decline and failure welding.
The content of the invention
The present invention provides a kind of pad design method of BGA welding, solves in welding process between BGA soldered balls and pad The problem of bubble encased causes empty in BGA balls.
To solve the above problems, the present invention is adopted the technical scheme that：A kind of BGA pad designs method, it is characterised in that A through hole, diameter≤0.2mm of through hole are provided with PCB each BGA solder ball pads center, the length of through hole is PCB thickness Thickness of the degree plus pad.
The beneficial effects of the invention are as follows be provided with a through hole, so in BGA welding processes in PCB each BGA pad In, the gas produced between BGA soldered balls and pad is discharged in through hole, the BGA soldered balls is equably welded on pad, it is to avoid weldering Connect reliability decrease and bad, it is ensured that its quality, also ensure that the welding standard of Surface Mount component is combined IPC610 requirements.
Embodiment
For the ease of the understanding of those skilled in the art, below in conjunction with specific embodiment to one kind of the present invention BGA welding methods are described in further detail.
A kind of BGA welding methods, it is characterised in that be designed with a through hole, through hole in PCB each BGA solder ball pads Diameter≤0.2mm, the length of through hole adds the thickness of pad, so in BGA welding processes, BGA soldered balls for PCB thickness The gas produced between pad is discharged in through hole, the BGA soldered balls is equably welded on pad, it is to avoid empty in soldered ball Problem, it is ensured that its quality, also ensures that the welding standard of Surface Mount component is combined IPC610 requirements.

Claims (1)

1. a kind of BGA welding methods, it is characterised in that be provided with a through hole at PCB each BGA solder ball pads center, through hole Diameter≤0.2mm, the length of through hole adds the thickness of pad for PCB thickness.
CN201710425893.8A 2017-06-08 2017-06-08 A kind of BGA welding methods Pending CN107172809A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710425893.8A CN107172809A (en) 2017-06-08 2017-06-08 A kind of BGA welding methods

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710425893.8A CN107172809A (en) 2017-06-08 2017-06-08 A kind of BGA welding methods

Publications (1)

Publication Number Publication Date
CN107172809A true CN107172809A (en) 2017-09-15

Family

ID=59824854

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710425893.8A Pending CN107172809A (en) 2017-06-08 2017-06-08 A kind of BGA welding methods

Country Status (1)

Country Link
CN (1) CN107172809A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108021733A (en) * 2017-10-27 2018-05-11 努比亚技术有限公司 A kind of integration module and its design method, mobile terminal
CN111970824A (en) * 2020-08-21 2020-11-20 苏州浪潮智能科技有限公司 PCB and pad structure suitable for BGA chip thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187907A (en) * 1997-09-11 1999-03-30 Sharp Corp Soldering mounting method for mounting component
CN1484934A (en) * 2000-12-29 2004-03-24 ض� Via-in-pad with off-center geometry and method of manufacture
CN1561655A (en) * 2001-09-28 2005-01-05 英特尔公司 Vented vias for via in pad technology assembly process yield improvements
CN1946268A (en) * 2006-08-23 2007-04-11 无锡凯尔科技有限公司 Through hole welding technology for mobile phone camera module image sensor
CN202262042U (en) * 2011-09-21 2012-05-30 台达电子企业管理（上海）有限公司 Circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187907A (en) * 1997-09-11 1999-03-30 Sharp Corp Soldering mounting method for mounting component
CN1484934A (en) * 2000-12-29 2004-03-24 ض� Via-in-pad with off-center geometry and method of manufacture
CN1561655A (en) * 2001-09-28 2005-01-05 英特尔公司 Vented vias for via in pad technology assembly process yield improvements
CN1946268A (en) * 2006-08-23 2007-04-11 无锡凯尔科技有限公司 Through hole welding technology for mobile phone camera module image sensor
CN202262042U (en) * 2011-09-21 2012-05-30 台达电子企业管理（上海）有限公司 Circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108021733A (en) * 2017-10-27 2018-05-11 努比亚技术有限公司 A kind of integration module and its design method, mobile terminal
CN111970824A (en) * 2020-08-21 2020-11-20 苏州浪潮智能科技有限公司 PCB and pad structure suitable for BGA chip thereof

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PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20170915