CN204720475U

CN204720475U - The LED encapsulation piece of all-round daylighting

Info

Publication number: CN204720475U
Application number: CN201520395605.5U
Authority: CN
Inventors: 郑榕彬
Original assignee: Individual
Current assignee: Individual
Priority date: 2015-06-10
Filing date: 2015-06-10
Publication date: 2015-10-21
Anticipated expiration: 2025-06-10

Abstract

The utility model relates to a kind of LED encapsulation piece of all-round daylighting.The utility model processes perforate on aluminum bracket, and in perforate, fill up transparent silica gel and solidification, then transparent crystal-bonding adhesive is utilized to be reinforced by LED chip on the silica gel of solidification, and utilize bonding wire to realize the electrical connection of the electrode on LED chip and aluminum bracket, finally the aluminum bracket with LED chip is uprightly fixed in transparent vessel.When diode is energized, the front of the LED chip on upstanding transparent support can normal luminous, and the bottom of LED chip also can pass through transparent silica gel sends brighter light.The utility model can improve radiating efficiency while increase light-emitting diode light emission rate, and avoids the complicated processing technique on glass material, reduces production cost thus.

Description

The LED encapsulation piece of all-round daylighting

Technical field

The encapsulation technology of the utility model relate generally to light-emitting diode and LED.More specifically, LED encapsulation piece made on the solidification silica gel that the utility model relates to by using transparent crystal-bonding adhesive to be fixed on by LED chip to be embedded on aluminum base circuit board.

Background technology

Light-emitting diode (LED) is a kind of light-emitting display device that be made up of semi-conducting material, that directly converting electric energy can be become luminous energy, it has the advantage of low power consumption, high brightness, is therefore widely used in the equipment such as various electronic circuit, household electrical appliances, instrument as indicator light and display panel.Further, compared with ordinary incandescent lamp, light-emitting diode has the advantages such as volume is little, caloric value is low, power consumption is little, the life-span is long, reaction speed is fast, environmental protection, therefore also can be widely used in illumination.

Existing light-emitting diode is attached on a transparent silicon chip with the wafer of the thick 0.12mm of an agreement that contracts a film or TV play to an actor or actress to make, and its light source is divided into front and bottom surface, does not print current supply line block because of bottom surface, therefore the brightness in the brightness ratio front of bottom surface exceeds about 20%.In the conventional technology, all LED chips are all keep flat to be fixed in a flat sheet, and on LED chip, print supply line figure, make great efforts to design various reflective technology simultaneously, the light reflection that chip bottom sends is gone to the front.But owing to there is printing current supply line, no matter how good reflection technology is, and the light of its reflection all can be printed current supply line and block, thus affects light emission rate.

Chinese patent application 200810220159.9 (publication number CN101442098) discloses a kind of power type light-emitting diode, it comprises the LED chip be vertically mounted in reflection shield, and the positive electrode of LED chip and negative electrode are fixedly connected with negative electrode support with positive electrode support respectively.Although this structure can improve the light emission rate of LED chip to a certain extent, because positive and negative electrode support has relatively large width, still can stop a part of light, therefore thoroughly not solve foregoing problems.In addition, in the prior art, LED chip is fixed in reflection shield by epoxy resin, and its heat sent not easily dissipates, and the aging light emission rate that also can reduce this light-emitting diode further of the overheated epoxy resin caused.

Chinese patent CN102130239B proposes a kind of light-emitting diode packaging technology of all-round daylighting, the transparent rack being wherein fixed with LED chip, electrode and bonding wire is uprightly arranged in transparent vessel, thus the front of light-emitting diode and bottom surface can both normal luminous and not being blocked completely on the main optical path perpendicular to front and bottom surface, drastically increase the light emission rate of light-emitting diode thus.

But such scheme still has some limitations and therefore there is the space of improvement.Specifically, such scheme needs LED chip and electrode all to adhere on the transparent rack of such as glass material, and LED chip operationally will produce heat, and glass is not good heat carrier, therefore, when using the LED chip of higher-wattage (such as 1W or higher wattage), serious heat accumulation problem will be there is.

Utility model content

In view of this, according to an aspect of the present utility model, provide a kind of LED encapsulation method of all-round daylighting, it comprises: on aluminum bracket, process perforate, and in perforate, fills up transparent silica gel and solidification; Transparent crystal-bonding adhesive is utilized to be reinforced by LED chip on the silica gel of solidification; Bonding wire is utilized to realize the electrical connection of the electrode on LED chip and aluminum bracket; Aluminum bracket with LED chip, electrode and bonding wire is uprightly fixed in transparent vessel.The main body of this aluminum bracket can be aluminum base circuit board, and above-mentioned electrode can be a part for the electronic circuit trace on this aluminum base circuit board surface.

In a preferred embodiment, the shape of described perforate can be square or circular, or its shape can be designed so that the silica gel that solidifies and aluminum bracket present the configuration of interlocking, comes off from aluminium sheet to prevent silica gel.

In further execution mode, aluminum bracket can uprightly be arranged on the pedestal in transparent vessel.Such as, the upright installation of aluminum bracket can be realized with snap fit by following steps: by power line and pedestal integrally formed, wherein power line one end embed pedestal; In the middle part of pedestal, form groove to expose power line, the size of this groove be set to can closely clamping with the aluminum bracket of electrode; And aluminum bracket is inserted groove, make to be formed between electrode with power line to be electrically connected.

In further execution mode, can by embedding in transparent vessel and curing transparent material uprightly fixes aluminum bracket.

In further execution mode, insulation transparent liquid can be filled in transparent vessel, to accelerate the heat distributing LED chip generation.In addition, can also in the inner surface coating layer of fluorescent powder of transparent vessel, the heat produced to prevent chip is directly conducted to fluorescent material, avoiding fluorescent material to decompose because being heated with aging, accordingly avoid light decay and aberration.

In further execution mode, the thickness of aluminum bracket can be about 0.4mm to 5mm, and bonding wire can be gold thread or alloy current supply line, and transparent vessel can be circular or square container.

In further execution mode, aluminum bracket can comprise into three plane branches of Y shape, and the angle between adjacent plane branch is preferably 120 degree.

In further execution mode, aluminum bracket can comprise four plane branches of across, and the angle between adjacent plane branch is preferably 90 degree.

According to another aspect of the present utility model, provide a kind of LED body of all-round daylighting, it comprises: aluminum bracket, and it has the opening and electrode in its surface that hold solidification silica gel; The LED chip on solidification silica gel is reinforced by transparent crystal-bonding adhesive; Bonding wire, for realizing the electrical connection of LED chip and electrode; And transparent vessel; Aluminum bracket wherein with LED chip, electrode and bonding wire is uprightly fixed in transparent vessel.

In further execution mode, this LED body can also comprise the pedestal being positioned at transparent vessel.In this embodiment, aluminum bracket uprightly can be arranged on pedestal with snap fit.

In further execution mode, this LED body can also comprise the insulation transparent liquid be filled in transparent vessel, and/or is coated in the layer of fluorescent powder of inner surface of transparent vessel.

In further execution mode, aluminum bracket can comprise into three plane branches of Y shape, and the angle between adjacent plane branch is preferably 120 degree.Further preferably, the LED chip of equal number is set in the same side of each plane branch.

In further execution mode, aluminum bracket can comprise four plane branches of across, and the angle between adjacent plane branch is preferably 90 degree.Further preferably, the LED chip of equal number is set in the same side of each plane branch.

The utility model has the advantage of, the heat that LED chip is operationally produced, thus can to conduct than having much better thermal conductivity with glassy phase by the aluminium matter main body of aluminum bracket fast, prevents the useful life of reducing LED chip because of the accumulation of heat.Therefore, the utility model is specially adapted to the LED chip of higher-wattage.In addition, one deck electronic circuit trace (comprising the electrode for bonding bonding wire) can be set on the surface of this aluminum base circuit board, this processing technology is conventional technology in LED field, the materials such as glass then need more complicated processing technology, therefore technique of the present utility model is simpler, and has obvious cost advantage.

Accompanying drawing explanation

Fig. 1 schematically shows the aluminum bracket according to the utility model first embodiment.

Fig. 2 schematically shows the sectional view of the LED encapsulation piece according to the utility model first embodiment.

Fig. 3 schematically shows the stereogram of the LED encapsulation piece of the present utility model of Fig. 2, and wherein partial containers is cut with show internal structure.

Fig. 4 schematically shows preferred opening shape, and wherein (a) is circular open, (b) opening for making solidification silica gel and aluminum bracket present interlocked configuration.

Fig. 5 schematically shows the aluminum bracket vertical view according to the utility model second embodiment.

Fig. 6 schematically shows the aluminum bracket vertical view according to the utility model the 3rd embodiment.

Embodiment

Below with reference to the accompanying drawings the utility model is described in detail.First with reference to figure 1, it schematically illustrates the aluminum bracket according to the first embodiment of the present utility model.As shown in Figure 1, the main body of this aluminum bracket 4 is one or more pieces aluminum base circuit boards, and it arranges one deck electronic circuit trace (comprising the one or more electrodes 3 for bonding bonding wire) on the surface, and its thickness is about 0.4mm to 5mm.Aluminum bracket 4 processes the perforate of suitable size, then in perforate, fills up transparent silica gel 9 and solidified.One or more LED chip 2 is fixed on the side of the transparent silica gel of having solidified by transparent crystal-bonding adhesive 1.Realize electricity by bonding wire 5 between chip and chip and between chip and electrode interconnected, this bonding wire is preferably conventional bonding gold thread, can certainly be other metal or alloy current supply lines.Should be appreciated that, although illustrate the LED chip of two series connection, the utility model is not limited thereto, and the execution mode of the LED chip of such as one chip and two or more serial or parallel connections is also among expection.By this execution mode, on the one hand, the two-sided of LED chip all can realize unobstructed luminescence, thus obtains the light emission rate of intimate 100%; On the other hand, the heat that LED chip is operationally produced can be moved away rapidly by aluminum bracket, thus avoids the thermal accumlation of chip region to affect its performance and used life.

Fig. 2 and Fig. 3 illustrates a kind of execution mode of light emission diode package member of the present utility model.With conventional levels mounting means unlike, herein the aluminum bracket 4 being fixed with LED chip 2, positive and negative electrode 3 and bonding wire 5 is uprightly arranged on the pedestal 8 in transparent vessel 7, make positive and negative electrode 3 respectively with positive-negative power line 6 close contact.When diode is energized, the front of the LED chip on up-right support can normal luminous, and the bottom of LED chip also can pass through transparent silica gel sends brighter light, improves the light emission rate of light-emitting diode thus.

The upright installation of aluminum bracket can be realized by snap fit, such as power line and pedestal are formed as one, and in the middle part of pedestal, form groove to expose the side of power line, the size of this groove be set to can closely clamping with the aluminum bracket of electrode, thus when inserting support, between electrode and power line, firm electrical connection can be formed.In this way, support and pedestal can utilize standard technology batch to be formed respectively, and can rapid-assembling.It should be noted that aforementioned pedestal is not that the utility model is necessary, anyly means support uprightly can be fixed in transparent vessel can to use.Such as, can by embedding in transparent vessel and curing transparent material come upright fixed support.

As selection, insulated light transmission liquid can be filled in transparent vessel 7, to accelerate the heat distributing LED chip generation.In addition, according to the luminous needs of reality, in the inner surface coating layer of fluorescent powder of transparent vessel 7, thus the light-emitting diode of different colours can be made.By being coated in by fluorescent material on transparent vessel instead of being directly coated on LED chip, the heat that can prevent chip from producing is directly conducted to fluorescent material, avoiding fluorescent material to decompose because being heated with aging, accordingly avoid light decay and aberration.

Although show circular non-opaque container in Fig. 3, should be appreciated that, transparent vessel that is square or other shapes is also applicable.In addition, this transparent vessel can use the material such as transparent plastic or glass to make.

Fig. 4 schematically shows preferred opening shape.The processing technology used according to reality and the quantity of chip, opening on aluminium sheet can be rendered as the rectangle shown in Fig. 1 for multiple LED chip side by side, or corresponding square openings can be formed for each LED chip, the circular open also or as shown in (a) part in Fig. 4.Certainly, actual opening shape used is not limited thereto, and such as it can be ellipse, round rectangle etc., as long as be convenient to process.In addition, because the transparent silica gel of solidification is equivalent to be embedded in the opening of aluminum bracket, therefore in order to strengthen firm combination therebetween, the certain openings shape as shown in (b) part in Fig. 4 can be designed, wherein go out two dovetail grooves in the two ends additional processing of rectangular aperture, thus, silica gel and the aluminium sheet of solidification form the interlocked configuration be mutually engaged, and can prevent silica gel from coming off from aluminium sheet.Will be appreciated that, the interlocked configuration of silica gel and aluminium sheet is not limited to illustrated shape, and any solidification silica gel opening shape that is mutually nested with aluminium sheet or clamping that makes all can adopt, such as, the edge of opening can be formed barb or zigzag etc. and realize interlocking.By this design, solidification of silicon blob of viscose with can independently to process with the aluminium sheet of opening and subsequently as puzzle type carries out assembled, thus to enhance productivity.

Fig. 5 schematically illustrates the aluminum bracket according to the second embodiment of the present utility model.Be that single flat board is different from the first embodiment medium-height trestle, the support 4 in this embodiment comprises three the plane branches forming Y-shaped structure.These three plane branches are preferably uniformly distributed around center, and namely angle is each other 120 °, but other execution modes of symmetrical or angled asymmetric distribution are also foreseeable.Each plane branch utilize transparent crystal-bonding adhesive to be fixed with one or more LED chip, and each LED chip is arranged on the same side of each plane branch, that the light that each chip front side sends can send with another chip back, to intersect through the light of transparent material and supplement, and can not to be blocked by adjacent chips perpendicular to the main optical path of chip surface.Therefore, compared with the bidirectional luminescence in the first embodiment, this embodiment can realize the luminescence of six direction, and the Light distribation obtained is more even, and can obtain the light emission rate of maximum possible equally.

Fig. 6 schematically illustrates the aluminum bracket according to the 3rd embodiment of the present utility model.Be that Y shape three branched structure is different from the second embodiment medium-height trestle, the transparent rack in this embodiment comprises four the plane branches forming decussate texture.These four plane branches are preferably uniformly distributed around center, and namely angle is each other 90 °, but other execution modes of symmetrical or angled asymmetric distribution are also foreseeable.Each plane branch utilize transparent crystal-bonding adhesive to be fixed with one or more LED chip, and each LED chip is arranged on the same side of each plane branch, that the light that each chip front side sends can send with another chip back, to intersect through the light of transparent material and supplement, and can not to be blocked by adjacent chips perpendicular to the main optical path of chip surface.Therefore, similar to luminescence with six in the second embodiment, this embodiment can realize the even Light distribation of four direction, and can obtain the light emission rate of maximum possible equally.

Although specifically describe in detail the utility model with reference to the execution mode of accompanying drawing, those skilled in the art understand other execution mode can obtain identical result.Change of the present utility model and amendment will be apparent for those skilled in the art, and be included in the scope of the application.

Claims

1. a LED body for all-round daylighting, it comprises:

Aluminum bracket, it has the opening and electrode in its surface that hold solidification silica gel;

The LED chip on solidification silica gel is reinforced by transparent crystal-bonding adhesive;

Bonding wire, for realizing the electrical connection of LED chip and electrode; And

Transparent vessel;

Aluminum bracket wherein with LED chip, electrode and bonding wire is uprightly fixed in transparent vessel.

2. LED body as claimed in claim 1, it also comprises the pedestal being positioned at described transparent vessel.

3. LED body as claimed in claim 2, wherein said aluminum bracket is uprightly arranged on described pedestal with snap fit.

4. LED body as claimed in claim 1, wherein by embedding in described transparent vessel and described aluminum bracket uprightly fixed by curing transparent material.

5. the LED body according to any one of claim 1-4, the thickness of wherein said aluminum bracket is about 0.4mm to 5mm.

6. the LED body according to any one of claim 1-4, wherein said aluminum bracket comprises into three plane branches of Y shape, and the angle between adjacent plane branch is 120 degree.

7. the LED body according to any one of claim 1-4, wherein said aluminum bracket comprises four plane branches of across, and the angle between adjacent plane branch is 90 degree.