CN106299078A - The LED encapsulation method of all-round daylighting and LED encapsulation piece - Google Patents
The LED encapsulation method of all-round daylighting and LED encapsulation piece Download PDFInfo
- Publication number
- CN106299078A CN106299078A CN201510315282.9A CN201510315282A CN106299078A CN 106299078 A CN106299078 A CN 106299078A CN 201510315282 A CN201510315282 A CN 201510315282A CN 106299078 A CN106299078 A CN 106299078A
- Authority
- CN
- China
- Prior art keywords
- aluminum bracket
- led
- transparent
- led chip
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Abstract
The present invention relates to LED encapsulation method and the LED encapsulation piece of a kind of all-round daylighting.The present invention processes perforate on aluminum bracket, and in perforate, fill up transparent silica gel and solidification, then transparent crystal-bonding adhesive is utilized LED chip to be reinforced on the silica gel of solidification, and utilize bonding wire to realize the electrical connection of the electrode on LED chip and aluminum bracket, finally the aluminum bracket with LED chip is uprightly fixed in transparent vessel.When diode is energized, the front of the LED chip on upstanding transparent support can normal luminous, and the bottom of LED chip also can pass through transparent silica gel and sends brighter light.The present invention can improve radiating efficiency while increasing light emitting diode light emission rate, and avoids the complicated processing technique on glass material, thus reduces production cost.
Description
Technical field
This invention relates generally to the light emitting diode i.e. encapsulation technology of LED.More specifically, the present invention relates to
And by using transparent crystal-bonding adhesive LED chip to be fixed on the solidification silica gel being embedded on aluminum base circuit board
Method for packing, and use the LED encapsulation piece made of the method.
Background technology
Light emitting diode (LED) be a kind of that be made up of semi-conducting material, can directly convert electric energy into
The light-emitting display device of luminous energy, it has the advantage of low power consumption, high brightness, is therefore widely used in various electricity
As display lamp and display panel in the equipment such as electronic circuit, household electrical appliances, instrument.Further, with ordinary incandescent lamp phase
Ratio, light emitting diode has that volume is little, caloric value is low, power consumption is little, life-span length, response speed are fast,
The advantages such as environmental protection, therefore can be also widely applied to illumination.
Existing light emitting diode is to be attached to a transparent silicon chip with the wafer of agreement that contracts a film or TV play to an actor or actress thickness 0.12mm
On make, its light source is divided into front and bottom surface, do not print current supply line because of bottom surface and block, therefore bottom surface
The brightness in brightness ratio front exceed about 20%.In the conventional technology, all of LED chip all keeps flat
It is fixed in a flat sheet, and in LED chip, prints supply line's figure, make great efforts to design various simultaneously
Reflective technology, the light that chip bottom is sent reflection is gone to the front.But owing to there is printing for conductance
Line, no matter how good reflection technology is, and the light of its reflection all can be printed current supply line and block, thus affects
Light emission rate.
Chinese patent application 200810220159.9 (publication number CN101442098) discloses a kind of power
Type light emitting diode, it includes the LED chip being vertically mounted in reflection shield, and the positive electricity of LED chip
Pole and negative electrode are fixing with anelectrode support and negative electrode support respectively to be connected.Although this structure is necessarily
The light emission rate of LED chip can be improved in degree, but owing to positive and negative electrode support has relatively large width
Degree, still can stop a part of light, therefore the most thoroughly solve foregoing problems.It addition, in the prior art
In, LED chip is fixed in reflection shield by epoxy resin, and its heat sent is difficult to dissipate,
And the overheated aging light emission rate that also can reduce this light emitting diode further of the epoxy resin caused.
Chinese patent CN102130239B proposes the light-emitting diode packaging technology of a kind of all-round daylighting,
The transparent rack being wherein fixed with LED chip, electrode and bonding wire is uprightly arranged in transparent vessel, thus
The front of light emitting diode and bottom surface can normal luminous and on the main optical path being perpendicular to front and bottom surface
It is not blocked, thus drastically increases the light emission rate of light emitting diode.
But, such scheme yet suffers from certain limitation and therefore there is the space of improvement.Concrete next
Saying, such scheme needs all to adhere on the transparent rack of such as glass material by LED chip and electrode,
And LED chip operationally will produce heat, and glass is not good heat carrier, therefore works as use
During the LED chip of higher-wattage (such as 1W or higher wattage), ask there is serious heat accumulation
Topic.
Summary of the invention
In view of this, according to an aspect of the present invention, it is provided that the LED encapsulation side of a kind of all-round daylighting
Method, comprising: process perforate on aluminum bracket, and fills up transparent silica gel and solidification in perforate；
Transparent crystal-bonding adhesive is utilized LED chip to be reinforced on the silica gel of solidification；Utilize bonding wire realize LED chip and
The electrical connection of the electrode on aluminum bracket；By upright for the aluminum bracket with LED chip, electrode and bonding wire
It is fixed in transparent vessel.The main body of this aluminum bracket can be aluminum base circuit board, and above-mentioned electrode is permissible
It it is a part for electronic circuit trace on this aluminum base circuit board surface.
In a preferred embodiment, the shape of described perforate can be square or circular, or its shape
Can be designed so that the silica gel of solidification and aluminum bracket present the configuration of interlocking, to prevent silica gel from aluminium sheet
On come off.
In further embodiment, aluminum bracket can uprightly be arranged on the pedestal in transparent vessel.
For example, it is possible to realized the upright installation of aluminum bracket with snap fit by following steps: by power line with
Pedestal is integrally formed, and wherein one end of power line embeds pedestal；Groove is formed to expose in the middle part of pedestal
Power line, this groove be dimensioned to can closely clamping with the aluminum bracket of electrode；And
Aluminum bracket is inserted groove, makes to be formed between electrode with power line to electrically connect.
In further embodiment, can be by embedding in transparent vessel and solidify transparent material
Upright fixing aluminum bracket.
In further embodiment, insulation transparent liquid can be filled in transparent vessel, to accelerate
Distribute the heat that LED chip produces.Further, it is also possible to the inner surface at transparent vessel coats one layer of fluorescence
Powder, is directly conducted to fluorescent material with the heat preventing chip from producing, it is to avoid fluorescent material decompose because being heated and
Aging, accordingly avoid light decay and aberration.
In further embodiment, the thickness of aluminum bracket can be about 0.4mm to 5mm, bonding wire
Can be gold thread or alloy current supply line, and transparent vessel can be circular or square container.
In further embodiment, aluminum bracket can include into three plane branches of Y shape, phase
Angle between adjacent plane branch is preferably 120 degree.
In further embodiment, aluminum bracket can include four plane branches of across,
Angle between adjacent plane branch is preferably 90 degree.
According to another aspect of the present invention, it is provided that the LED package of a kind of all-round daylighting, comprising:
Aluminum bracket, it has opening and the electrode in its surface accommodating solidification silica gel；By transparent solid
The LED chip on solidification silica gel reinforced by brilliant glue；Bonding wire, for realizing being electrically connected of LED chip and electrode
Connect；And transparent vessel；Wherein the aluminum bracket with LED chip, electrode and bonding wire is uprightly fixed
In transparent vessel.
In further embodiment, this LED package can also include the base being positioned at transparent vessel
Seat.In this embodiment, aluminum bracket uprightly can be arranged on pedestal with snap fit.
In further embodiment, can be by embedding in transparent vessel and solidify transparent material
Upright fixing aluminum bracket.
In further embodiment, this LED package can also include being filled in transparent vessel
Insulation transparent liquid, and/or it is coated in the layer of fluorescent powder of the inner surface of transparent vessel.
In further embodiment, the thickness of aluminum bracket can be about 0.4mm to 5mm, bonding wire
Can be gold thread or alloy current supply line, and transparent vessel can be circular or square container.
In further embodiment, aluminum bracket can include into three plane branches of Y shape, phase
Angle between adjacent plane branch is preferably 120 degree.It is further preferred that same in each plane branch
Side arranges the LED chip of equal number.
In further embodiment, aluminum bracket can include four plane branches of across,
Angle between adjacent plane branch is preferably 90 degree.It is further preferred that same in each plane branch
Side arranges the LED chip of equal number.
It is an advantage of the current invention that the aluminum matter main body of aluminum bracket has much better heat conduction compared with glass
Property such that it is able to LED chip operationally produced heat is quickly conducted, prevents because of heat
Accumulation and reduce the service life of LED chip.Therefore, the present invention is especially suitable for the LED of higher-wattage
Chip.(include using furthermore it is possible to arrange one layer of electronic circuit trace on the surface of this aluminum base circuit board
Electrode in bonding bonding wire), this processing technique is conventional technology in LED field, and at glass etc.
Then needing more complicated processing technique in material, therefore the technique of the present invention is simpler, and has significantly
Cost advantage.
Accompanying drawing explanation
Fig. 1 schematically shows aluminum bracket according to a first embodiment of the present invention.
Fig. 2 schematically shows the sectional view of LED encapsulation piece according to a first embodiment of the present invention.
Fig. 3 schematically shows the axonometric chart of the LED encapsulation piece of the present invention of Fig. 2, wherein partial containers quilt
Excision is to show internal structure.
Fig. 4 schematically shows preferred opening shape, and wherein (a) is circular open, and (b) is solid for making
SiClx glue and aluminum bracket present the opening of interlocked configuration.
Fig. 5 schematically shows aluminum bracket top view according to a second embodiment of the present invention.
Fig. 6 schematically shows aluminum bracket top view according to a third embodiment of the present invention.
Detailed description of the invention
Below with reference to the accompanying drawings the present invention is described in detail.With reference first to Fig. 1, it schematically illustrates
Aluminum bracket according to the first embodiment of the present invention.As it is shown in figure 1, the main body of this aluminum bracket 4 is
One or more pieces aluminum base circuit boards, its surface arrange one layer of electronic circuit trace and (include for being bonded weldering
One or more electrodes 3 of line), and its thickness is about 0.4mm to 5mm.Aluminum bracket 4 adds
Work goes out appropriately sized perforate, then fills up transparent silica gel 9 in perforate and is solidified.One or many
Individual LED chip 2 is fixed on the side of cured transparent silica gel by transparent crystal-bonding adhesive 1.Chip with
Realizing electricity interconnection by bonding wire 5 between chip and between chip and electrode, this bonding wire is preferably conventional key
Alloy wire, naturally it is also possible to be other metal or alloy current supply lines.Should be appreciated that, although illustrate two
The LED chip of individual series connection, but the invention is not limited in this, such as one chip and two or more
The embodiment of the LED chip of individual serial or parallel connection is the most in the expected.By this embodiment, one
Aspect, the two-sided of LED chip all can realize unobstructed luminescence, thus obtain being close to the light emission rate of 100%；
On the other hand, LED chip operationally produced heat can be moved away rapidly by aluminum bracket,
Thus avoid the thermal accumlation of chip region to affect its performance and used life.
Fig. 2 and Fig. 3 illustrates a kind of embodiment of the light emission diode package member of the present invention.With
Unlike conventional levels mounting means, will be fixed with herein LED chip 2, positive and negative electrode 3 and
The aluminum bracket 4 of bonding wire 5 is uprightly arranged on the pedestal 8 in transparent vessel 7, makes positive and negative electrode 3 points
It is not in close contact with positive-negative power line 6.When diode is energized, the LED chip on up-right support is just
Face can normal luminous, and the bottom of LED chip also can pass through transparent silica gel and sends brighter light, thus
Improve the light emission rate of light emitting diode.
The upright installation of aluminum bracket can be realized by snap fit, such as, power line is formed with pedestal
Being integrated, and formation groove is to expose the side of power line in the middle part of pedestal, the size of this groove is set
Be set to can closely clamping with the aluminum bracket of electrode, thus when insert support time, electrode and power supply
Firm electrical connection can be formed between line.In this way, support and pedestal can be utilized respectively mark
Quasi-process lot is formed, and can quickly assemble.It should be noted that aforementioned pedestal is not that the present invention is musted
Needing, any means that can be uprightly fixed on by support in transparent vessel can use.For example, it is possible to
By embedding in transparent vessel and solidify the upright fixed support of transparent material.
As selection, insulated light transmission liquid can be filled in transparent vessel 7, to accelerate to distribute LED core
The heat that sheet produces.It addition, according to actual luminous needs, can coat at the inner surface of transparent vessel 7
Layer of fluorescent powder, thus make the light emitting diode of different colours.By fluorescent material being coated in transparent appearance
On device rather than be applied directly in LED chip, the heat being possible to prevent chip to produce is directly conducted to glimmering
Light powder, it is to avoid fluorescent material decomposes because being heated with aging, accordingly avoid light decay and aberration.
Although Fig. 3 shows circular non-opaque container, it is to be understood that square or other shapes is transparent
Container is also applicable.It addition, this transparent vessel can use the material such as transparent plastic or glass to make.
Fig. 4 schematically shows preferred opening shape.According to actually used processing technique and chip
Quantity, the opening on aluminium sheet can be rendered as the rectangle shown in Fig. 1 for multiple LED core side by side
Sheet, or can form corresponding square openings for each LED chip, also or as in Fig. 4
Circular open shown in (a) part.Certainly, actually used opening shape is not limited thereto, such as
It can be ellipse, round rectangle etc., as long as being easy to process.Further, since solidification is transparent
Silica gel is equivalent to be embedded in the opening of aluminum bracket, therefore to strengthen firm combination therebetween,
The certain openings shape as shown in (b) part in Fig. 4 can be designed, wherein at the two ends of rectangular aperture
Additional processing goes out two dovetail grooves, consequently, it is possible to the silica gel of solidification forms, with aluminium sheet, the interlocking being mutually twisted
Configuration, is possible to prevent silica gel to come off from aluminium sheet.It should be appreciated that the interlocked configuration of silica gel and aluminium sheet is also
It is not limited to the shape of diagram, any makes to solidify that silica gel is mutually nested with aluminium sheet or the opening shape of clamping
All can use, such as, the edge of opening can be formed barb or zigzag etc. and realize interlocking.By this
Planting design, solidification silica gel block can independently be processed with the aluminium sheet with opening and subsequently as puzzle type enters
Row assembly, thus improve production efficiency.
Fig. 5 schematically illustrates aluminum bracket according to the second embodiment of the present invention.With first embodiment
Medium-height trestle is that single flat board is different, and the support 4 in this embodiment includes three planes forming Y-shaped structure
Branch.These three plane branch is uniformly distributed preferably about center, and angle the most each other is 120 °,
But other embodiments of symmetrical or angled asymmetric distribution are also foreseeable.At each
Transparent crystal-bonding adhesive is utilized to be fixed with one or more LED chip, and each LED chip quilt in plane branch
Being arranged on the same side of each plane branch, the light that each chip front side sends can be with another chip
Light that the back side sends, through transparent material intersects supplementary, and is perpendicular to the main optical path of chip surface
Will not be blocked by adjacent chips.Therefore, compared with the bidirectional luminescence in first embodiment, this embodiment can
To realize the luminescence of six direction, the light distribution obtained is more uniform, and same available maximum possible
Light emission rate.
Fig. 6 schematically illustrates aluminum bracket according to the third embodiment of the invention.With the second embodiment
Medium-height trestle is that Y shape three branched structure is different, and the transparent rack in this embodiment includes forming decussate texture
Four plane branches.These four plane branches are uniformly distributed preferably about center, folder the most each other
Angle is 90 °, but other embodiments of symmetrical or angled asymmetric distribution are also foreseeable.
Each plane branch utilize transparent crystal-bonding adhesive to be fixed with one or more LED chip, and each
LED chip is arranged on the same side of each plane branch, and the light that each chip front side sends can be with
Light that another chip back sends, through transparent material intersects supplementary, and is perpendicular to chip list
The main optical path in face will not be blocked by adjacent chips.It is therefore, similar to luminescence with six in the second embodiment,
This embodiment can realize the homogeneous light distribution of four direction, and the light emission rate of same available maximum possible.
The although embodiment with specific reference to accompanying drawing describe in detail the present invention, but this area skill
Art personnel understand that other embodiment can obtain identical result.The present invention changes and modifications for this
Skilled person will be apparent from, and is included in scope of the present application.
Claims (14)
1. a LED encapsulation method for all-round daylighting, comprising:
Aluminum bracket processes perforate, and in perforate, fills up transparent silica gel and solidification；
Transparent crystal-bonding adhesive is utilized LED chip to be reinforced on the silica gel of solidification；
Bonding wire is utilized to realize the electrical connection of the electrode on LED chip and aluminum bracket；And
Aluminum bracket with LED chip, electrode and bonding wire is uprightly fixed in transparent vessel.
2. LED encapsulation method as claimed in claim 1, wherein said aluminum bracket is uprightly arranged on described
On pedestal in transparent vessel.
3. LED encapsulation method as claimed in claim 2, is wherein realized with snap fit by following steps
The upright installation of described aluminum bracket:
By integrally formed with described pedestal for power line, one end of wherein said power line embeds described pedestal；
Formation groove in portion's is to expose described power line in the susceptor, and being dimensioned to of this groove can
Closely clamping is with the described aluminum bracket of described electrode；And
Described aluminum bracket is inserted described groove, makes to be formed between described electrode with described power line to electrically connect.
4. LED encapsulation method as claimed in claim 1, wherein by embedding in described transparent vessel also
Described aluminum bracket uprightly fixed by solidification transparent material.
5. the LED encapsulation method as according to any one of claim 1-4, the thickness of wherein said aluminum bracket
Degree is about 0.4mm to 5mm.
6. the LED encapsulation method as according to any one of claim 1-4, wherein said aluminum bracket includes
Becoming three plane branches of Y shape, the angle between adjacent plane branch is 120 degree.
7. the LED encapsulation method as according to any one of claim 1-4, wherein said aluminum bracket includes
Four plane branches of across, the angle between adjacent plane branch is 90 degree.
8. a LED package for all-round daylighting, comprising:
Aluminum bracket, it has opening and the electrode in its surface accommodating solidification silica gel；
The LED chip on solidification silica gel is reinforced by transparent crystal-bonding adhesive；
Bonding wire, for realizing the electrical connection of LED chip and electrode；And
Transparent vessel；
Wherein the aluminum bracket with LED chip, electrode and bonding wire is uprightly fixed in transparent vessel.
9. LED package as claimed in claim 8, its pedestal also including being positioned at described transparent vessel.
10. LED package as claimed in claim 9, wherein said aluminum bracket is upright with snap fit
It is arranged on described pedestal.
11. LED package as claimed in claim 8, wherein by embedding in described transparent vessel also
Described aluminum bracket uprightly fixed by solidification transparent material.
12. LED package as according to any one of claim 8-11, the thickness of wherein said aluminum bracket
Degree is about 0.4mm to 5mm.
13. LED package as according to any one of claim 8-11, wherein said aluminum bracket includes
Becoming three plane branches of Y shape, the angle between adjacent plane branch is 120 degree.
14. LED package as according to any one of claim 8-11, wherein said aluminum bracket includes
Four plane branches of across, the angle between adjacent plane branch is 90 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510315282.9A CN106299078B (en) | 2015-06-10 | 2015-06-10 | LED packaging method and LED packaging part capable of achieving all-dimensional lighting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510315282.9A CN106299078B (en) | 2015-06-10 | 2015-06-10 | LED packaging method and LED packaging part capable of achieving all-dimensional lighting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106299078A true CN106299078A (en) | 2017-01-04 |
| CN106299078B CN106299078B (en) | 2020-05-22 |
Family
ID=57659101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510315282.9A Expired - Fee Related CN106299078B (en) | 2015-06-10 | 2015-06-10 | LED packaging method and LED packaging part capable of achieving all-dimensional lighting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106299078B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101442098A (en) * | 2008-12-19 | 2009-05-27 | 华南师范大学 | Power light-emitting diode |
| CN102130239A (en) * | 2011-01-31 | 2011-07-20 | 郑榕彬 | Omnibearing lighting LED (light-emitting diode) packaging method and LED packaging part |
| CN204720475U (en) * | 2015-06-10 | 2015-10-21 | 郑榕彬 | The LED encapsulation piece of all-round daylighting |
-
2015
- 2015-06-10 CN CN201510315282.9A patent/CN106299078B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101442098A (en) * | 2008-12-19 | 2009-05-27 | 华南师范大学 | Power light-emitting diode |
| CN102130239A (en) * | 2011-01-31 | 2011-07-20 | 郑榕彬 | Omnibearing lighting LED (light-emitting diode) packaging method and LED packaging part |
| CN204720475U (en) * | 2015-06-10 | 2015-10-21 | 郑榕彬 | The LED encapsulation piece of all-round daylighting |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106299078B (en) | 2020-05-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102130239B (en) | Omnibearing lighting LED (light-emitting diode) packaging method and LED packaging part | |
| JP6209874B2 (en) | Light emitting device and manufacturing method thereof | |
| CN204611579U (en) | Light-emitting device and Vehicular illumination device | |
| CN110071205A (en) | Light-emitting diode component and production method | |
| EP2397745A2 (en) | Light-emitting device and luminaire | |
| CN102709278A (en) | Plane thin sheet type LED (Light-Emitting Diode) array light source of fluorescent thin film | |
| JP6616088B2 (en) | LED assembly and LED bulb using the LED assembly | |
| US20100327303A1 (en) | Light-emitting diode lamp with uniform resin coating | |
| CN204720475U (en) | The LED encapsulation piece of all-round daylighting | |
| CN104282671B (en) | Light-emitting diode component and production method | |
| CN106299078A (en) | The LED encapsulation method of all-round daylighting and LED encapsulation piece | |
| JP6409928B2 (en) | Light emitting device and manufacturing method thereof | |
| CN208738300U (en) | LED support and LED with circuit | |
| CN104282817B (en) | Light-emitting diode component and production method | |
| CN208142172U (en) | A kind of small spacing lamp bead encapsulating structure based on SMD technology | |
| CN102720956A (en) | Light emitting diode (LED) lamp based on fluorescent lamp cover | |
| CN102997074A (en) | Three-dimensional heat-dissipating light-emitting diode (LED) lighting device | |
| CN208797032U (en) | Novel LED support and LED | |
| CN208738293U (en) | Multipurpose LED support and LED | |
| CN203707186U (en) | Led packaging structure | |
| CN202018961U (en) | Compound wafer light emitting diode and wire rack structure thereof | |
| TWM337846U (en) | Light source structure | |
| CN102820406B (en) | Manufacturing method of LED (light emitting diode) packaging structure | |
| CN102723326A (en) | Plane slice type LED array light source with double fluorescent films | |
| CN102800788A (en) | Light-emitting diode (LED) packaging structure and silver plating substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200522 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |