CN202018961U - Compound wafer light emitting diode and wire rack structure thereof - Google Patents
Compound wafer light emitting diode and wire rack structure thereof Download PDFInfo
- Publication number
- CN202018961U CN202018961U CN2011200443406U CN201120044340U CN202018961U CN 202018961 U CN202018961 U CN 202018961U CN 2011200443406 U CN2011200443406 U CN 2011200443406U CN 201120044340 U CN201120044340 U CN 201120044340U CN 202018961 U CN202018961 U CN 202018961U
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- Prior art keywords
- insulating barrier
- emitting diode
- sheet light
- compound crystal
- crystal sheet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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Abstract
The utility model relates to a compound wafer light emitting diode, which utilizes a unique wire rack structure and bears a plurality of wafers in a serial-connection and parallel-connection mode so as to generate a unique compound type light source for illumination or display. The wire rack structure at least comprises a metal substrate, a plurality of wafer fixing areas, a conductive circuit module and a packaging frame. Conductive and insulation structures among the metal substrate, the wafer fixing areas and the conductive circuit module are made of heat conduction materials so as to bear the wafers for lead connection, and after packaging is filled in the conductive and insulation structures, single compound wafer light emitting diodes with excellent radiating property are formed and are further connected with a radiating module, a lamp or a display device.
Description
Technical field
The utility model relates to the structure technology of a kind of light-emitting diode and coil holder thereof, can present better radiating effect with the light-emitting diode of sacrificial vessel compound crystal sheet.
Background technology
Problems such as heat dissipation problem and lighting angle, brightness and colour temperature, the subject matter of desiring to overcome when always being light-emitting diode (LED) development, especially work as light-emitting diode and be different from general traditional fluorescent lamp, tungsten lamp or commercially available Electricity-saving lamp bulb, therefore its light source characteristic is comparatively special, must pass through the leaded light of certain degree or the measure of covering and just can make light source applications that light-emitting diode produces on general lighting.
Because the variety of problems that light-emitting diode is faced on the implementation, the designer researches and develops and improves at light-emitting diode structure, and then design the compound crystal sheet light-emitting diode of a plurality of wafers of a kind of suitable lift-launch, and the unique wire frame structure of utilization, produce unique compound light source and supply the usefulness of illumination or demonstration, and make compound crystal sheet light-emitting diode have better heat radiating effect concurrently.
Summary of the invention
Main purpose of the present utility model is to provide a kind of compound crystal sheet light-emitting diode, except producing unique compound light source, and can also present preferable radiating effect, in order to further using for being connected on radiating module, light fixture or the display unit.
For reaching above-mentioned purpose, the utility model compound crystal sheet light-emitting diode comprises at least: a metal substrate, its end face have one first insulating barrier; A plurality of crystal bonding areas are arranged on first insulating barrier; A plurality of wafers are arranged on aforementioned a plurality of crystal bonding area, and are provided with a conductive and heat-conductive layer between each wafer and the crystal bonding area; One conducting channel module, be arranged on first insulating barrier, and be provided with two routing districts corresponding to each crystal bonding area, be provided with one second insulating barrier between each the routing district and first insulating barrier, be provided with a lead between the set wafer on each routing district and the corresponding crystal bonding area; And a package frame, be arranged on first insulating barrier, and aforementioned crystal bonding area of mask and routing district; And a packaging body, be filled in the package frame.Make compound crystal sheet light-emitting diode can present unique area source by this, but not the point-source of light that general traditional light-emitting diode only can present.
Described metal substrate be aluminium and copper material one of them so that metal substrate has splendid heat-conducting effect, and can supply the follow-up usefulness that directly is installed on outside radiating module.
Described first insulating barrier is that the metal substrate end face forms through anode treatment, second insulating barrier is made of insulating heat-conductive glue, so that first the insulation, two insulating barriers except the effect that can present insulation, more have good heat-conducting effect concurrently so that the radiating effect of compound crystal sheet light-emitting diode more promotes.
Described packaging body can comprise two by encapsulation block that different package material constituted when implementing, to utilize different package material to produce different translucent effects, even can insert different fluorescent agents in package material, to adjust the light source that compound crystal sheet light-emitting diode presents compound colour temperature.
Described packaging body edge is provided with heat-conducting glue, makes having better heat-conducting effect between packaging body and package frame, the metal substrate.
In addition, the utility model compound crystal sheet light-emitting diode can further comprise lens that are fixed on the package frame when implementing, the light source that is produced is concentrated or spread guiding.
Described conductive and heat-conductive layer is made of conductive silver glue, makes between wafer and the crystal bonding area and can produce favorable conductive and heat-conducting effect, dispels the heat and help the thermal source that wafer produces.
Another purpose of the present utility model is to provide a kind of compound crystal sheet light-emitting diode wire frame structure, in order to industry carry out compound crystal sheet light-emitting diode modularization, produce stage by stage; For reaching this purpose, the utility model compound crystal sheet light-emitting diode wire frame structure comprises at least: a metal substrate, its end face have one first insulating barrier; A plurality of crystal bonding areas are arranged on first insulating barrier; One conducting channel module is arranged on first insulating barrier, and is provided with two routing districts corresponding to each crystal bonding area, is provided with one second insulating barrier between each the routing district and first insulating barrier; And a package frame, be arranged on first insulating barrier, and aforementioned crystal bonding area of mask and routing district.By this, in order to the follow-up operation of carrying out solid crystalline substance, routing and encapsulation of industry, and carry out producing of compound crystal sheet light-emitting diode.
Described metal substrate be aluminium and copper material one of them so that compound crystal sheet light-emitting diode wire frame structure has better heat radiating effect, and can supply the follow-up usefulness that directly is installed on outside radiating module.
Described first insulating barrier is that the metal substrate end face forms through anode treatment, second insulating barrier is made of insulating heat-conductive glue, so that first the insulation, second insulating barrier except the effect that can present insulation, more have good heat-conducting effect concurrently so that the radiating effect of compound crystal sheet light-emitting diode wire frame structure more promotes.
Compared with prior art, the utility model compound crystal sheet light-emitting diode and wire frame structure thereof can make a plurality of wafer rack be located in the same packaging body, except producing the compound light source that is different from traditional light-emitting diode, and can provide wafer splendid radiating effect, make applying in the lighting that compound crystal sheet light-emitting diode can be more general.
Description of drawings
Fig. 1 is the utility model compound crystal sheet light-emitting diodes Pipe frame stereo appearance figure;
Fig. 2 is the utility model compound crystal sheet light-emitting diodes Pipe frame three-dimensional exploded view;
Fig. 3 is the cutaway view of the utility model compound crystal sheet light-emitting diodes Pipe frame;
Fig. 4 is the vertical view of the utility model compound crystal sheet light-emitting diodes Pipe frame;
Fig. 5 is the local amplification view of the utility model compound crystal sheet light-emitting diodes Pipe frame;
Fig. 6 carries out solid crystalline substance, routing schematic diagram for the utility model compound crystal sheet light-emitting diodes Pipe frame;
Fig. 7 is the cutaway view of the utility model compound crystal sheet light-emitting diode;
Fig. 8 is the stereo appearance figure of the utility model compound crystal sheet light-emitting diode;
Fig. 9 is another encapsulation embodiment schematic diagram of the utility model compound crystal sheet light-emitting diode;
Figure 10 is provided with the lens schematic diagram for the utility model compound crystal sheet light-emitting diode.
Description of reference numerals: 10 metal substrates; 11 first insulating barriers; 12 crystal bonding areas; 13 conducting channel modules; 14 routing districts; 15 second insulating barriers; 20 package frame; 30 wafers; 31 conductive and heat-conductive layers; 32 leads; 40 packaging bodies; 41 heat-conducting glues; 40a, 40b encapsulate block; 50 lens.
Embodiment
See also Figure 1 and Figure 2, be the utility model compound crystal sheet light-emitting diodes Pipe frame stereo appearance figure, three-dimensional exploded view, disclosing compound crystal sheet light-emitting diode wire frame structure among the figure is mainly involuted by a metal substrate 10 and a package frame 20, to form a stacked flaky texture, metal substrate be aluminium and copper material one of them, so that compound crystal sheet light-emitting diode wire frame structure has better heat radiating effect, and can supply the follow-up usefulness that directly is installed on outside radiating module; Package frame 20 is located on the metal substrate 10 to form frame that a follow-up packaging operation carries out around the zone, and its material can select for use the material of the anti-combustion grade of FR-4 to implement, or with glass fibre, aluminium as enforcement.
Fig. 3 is to shown in Figure 5, be cutaway view, vertical view and the local amplification view of the utility model compound crystal sheet light-emitting diodes Pipe frame, metal substrate 10 its end faces have one first insulating barrier 11 through anode treatment, and on first insulating barrier 11 to electroplate or other means are provided with the crystal bonding area 12 of a plurality of adjacent arrangements, this crystal bonding area 12 can be made of the Copper Foil material, so that crystal bonding area 12 has splendid conduction and heat-conducting effect.
Be provided with a conducting channel module 13 (as shown in Figure 4) on first insulating barrier in addition, and this conducting channel module 13 is provided with two routing districts 14 corresponding to each crystal bonding area 12, and this conducting channel module 13 and each crystal bonding area 12 electric binding; Secondly, be provided with one second insulating barrier 15 (as shown in Figure 5) between each the routing district 14 and first insulating barrier 11, this second insulating barrier 15 is made of insulating heat-conductive glue, so that routing district 14 can see through the dual obstruct of first insulating barrier 11, second insulating barrier 15 and really insulate with metal substrate 10, and reach good heat conduction, radiating effect.
See also shown in Figure 6, be that the utility model compound crystal sheet light-emitting diodes Pipe frame carries out solid crystalline substance, the routing schematic diagram, desire when producing compound crystal sheet light-emitting diode, before encapsulation, carry out the operation of solid crystalline substance and routing earlier, earlier a wafer 30 is set on crystal bonding area 12 at each, this wafer 30 is the semiconductor light emitting core of light-emitting diode, be provided with a conductive and heat-conductive layer 31 between aforementioned each wafer 30 and the crystal bonding area 11, conductive and heat-conductive layer 31 is made of conductive silver glue, make between wafer 30 and the crystal bonding area 11 and can produce favorable conductive and heat-conducting effect, dispel the heat and help the thermal source that wafer 30 produced.
Two the routing districts 14 corresponding with crystal bonding area 12 are located at the both sides of this crystal bonding area 12, are provided with a lead 32 between the set wafer 30 on each routing district 14 and the corresponding crystal bonding area 12, treat that lead 32 is provided with can carry out follow-up packaging operation after finishing.
See also Fig. 7 and shown in Figure 8, be the cutaway view and the stereo appearance figure of the utility model compound crystal sheet light-emitting diode, body 40 to be packaged is inserted in the package frame 20 after crystal bonding area 12 and routing district 14 and wafer 30, the solid shape of lead 32 encapsulation, can obtain the product of finishing of a compound crystal sheet light-emitting diode monomer.Wherein, these packaging body 40 edges are provided with heat-conducting glue 41, make between packaging body 40 and package frame 20, the metal substrate 10 having better heat-conducting effect.
See also shown in Figure 9, it is another encapsulation embodiment schematic diagram of the utility model compound crystal sheet light-emitting diode, this embodiment packaging body 40 comprises two by encapsulation block 40a, 40b that different package material constituted, two encapsulation block 40a, 40b utilize different package material to produce different translucent effects respectively, package material can insert different fluorescent agents even, to adjust the light source that compound crystal sheet light-emitting diode presents compound colour temperature.
See also shown in Figure 10, be the utility model compound crystal sheet light-emitting diode the lens schematic diagram is set, this embodiment is provided with lens 50 on package frame 20, these lens can be has spotlight effect or astigmatic effect person, the light source that is produced is concentrated or is spread guiding, the light source that makes compound crystal sheet light-emitting diode be produced meets the demand of setting up environment, presents the gentleer uniform lighting effect that closes in the time of for example making compound crystal sheet light-emitting diode be installed on the light fixture.
Above implementation and graphic shown in, illustrate preferred embodiment person of the present invention, be not to limit to the utility model with this; Such as approximate with structure of the present utility model, feature etc. or identical mutually person all should belong to of the present invention founding within purpose and the claim, solemnly states.
Claims (10)
1. compound crystal sheet light-emitting diode is characterized in that it comprises:
One metal substrate, its end face have one first insulating barrier;
A plurality of crystal bonding areas are arranged on first insulating barrier;
A plurality of wafers are arranged on aforementioned a plurality of crystal bonding area, and are provided with a conductive and heat-conductive layer between each wafer and the crystal bonding area;
One conducting channel module, be arranged on described first insulating barrier, this conducting channel module is provided with two routing districts corresponding to each crystal bonding area, is provided with one second insulating barrier between each the routing district and first insulating barrier, is provided with a lead between the set wafer on each routing district and the corresponding crystal bonding area; And
One package frame is arranged on described first insulating barrier, and aforementioned crystal bonding area of mask and routing district; And
One packaging body is filled in the described package frame.
2. compound crystal sheet light-emitting diode according to claim 1 is characterized in that, metal substrate be aluminium and copper material one of them.
3. compound crystal sheet light-emitting diode as claimed in claim 1 is characterized in that, this first insulating barrier is that the metal substrate end face forms through anode treatment, and this second insulating barrier is made of insulating heat-conductive glue.
4. compound crystal sheet light-emitting diode as claimed in claim 1 is characterized in that, packaging body comprises two by encapsulation block that different package material constituted.
5. compound crystal sheet light-emitting diode as claimed in claim 1 is characterized in that the packaging body edge is provided with heat-conducting glue.
6. compound crystal sheet light-emitting diode as claimed in claim 1 is characterized in that it comprises lens that are fixed on the package frame.
7. compound crystal sheet light-emitting diode as claimed in claim 1 is characterized in that the conductive and heat-conductive layer is made of conductive silver glue.
8. compound crystal sheet light-emitting diode wire frame structure is characterized in that it comprises:
One metal substrate, its end face have one first insulating barrier;
A plurality of crystal bonding areas are arranged on first insulating barrier;
One conducting channel module is arranged on first insulating barrier, and this conducting channel module is provided with two routing districts corresponding to each crystal bonding area, is provided with one second insulating barrier between each the routing district and first insulating barrier; And
One package frame is arranged on first insulating barrier, and aforementioned crystal bonding area of mask and routing district.
9. as claim 8 a described compound crystal sheet light-emitting diode wire frame structure, it is characterized in that, metal substrate be aluminium and copper material one of them.
10. compound crystal sheet light-emitting diode wire frame structure as claimed in claim 8 is characterized in that first insulating barrier is that the metal substrate end face forms through anode treatment, and second insulating barrier is made of insulating heat-conductive glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200443406U CN202018961U (en) | 2011-02-22 | 2011-02-22 | Compound wafer light emitting diode and wire rack structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200443406U CN202018961U (en) | 2011-02-22 | 2011-02-22 | Compound wafer light emitting diode and wire rack structure thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202018961U true CN202018961U (en) | 2011-10-26 |
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ID=44812629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200443406U Expired - Fee Related CN202018961U (en) | 2011-02-22 | 2011-02-22 | Compound wafer light emitting diode and wire rack structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202018961U (en) |
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2011
- 2011-02-22 CN CN2011200443406U patent/CN202018961U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111026 Termination date: 20130222 |