CN204669313U - A kind of GaAs and LDMOS/GaN hybrid integrated microwave amplifier based on PCB technology - Google Patents
A kind of GaAs and LDMOS/GaN hybrid integrated microwave amplifier based on PCB technology Download PDFInfo
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- CN204669313U CN204669313U CN201520430315.XU CN201520430315U CN204669313U CN 204669313 U CN204669313 U CN 204669313U CN 201520430315 U CN201520430315 U CN 201520430315U CN 204669313 U CN204669313 U CN 204669313U
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Abstract
The utility model discloses the hybrid integrated microwave power amplifier of a kind of GaAs and LDMOS/GaN based on PCB technology, comprising: metal base plate; The upper surface of described metal base plate is provided with pcb board and heat sink; Described pcb board is provided with the first power amplifier; Described heat sink on be provided with the second power amplifier; The input of described second power amplifier is connected with the output of described first power amplifier; Wherein, described first power amplifier is GaAs power amplifier, and described second power amplifier is LDMOS power amplifier or GaN power amplifier.Described GaAs and LDMOS/GaN hybrid integrated microwave power amplifier, in conjunction with the advantage of GaAs and LDMOS/GaN two kinds of devices, the integrated circuit of described GaAs and LDMOS/GaN hybrid integrated microwave power amplifier is made to have the features such as high frequency, high-gain, high linearity, high-power, high efficiency, and integrated level is high, packaging cost is low, applies more convenient.
Description
Technical field
The utility model relates to microwave amplifier field, particularly relates to a kind of GaAs and LDMOS/GaN hybrid integrated microwave amplifier based on PCB technology.
Background technology
Microwave power amplifier has a very wide range of applications in fields such as radio communication, electronic countermeasures, testers, and its conventional method is based on monolithic or hybrid integrated circuit technique.Monolithic integrated circuit technique is all integrated in same Semiconductor substrate by all active elements and passive component, and this mode can obtain less overall circuit size, but its development cost is very high, is not also suitable for the integrated of various substrates device.The Basic practice of hybrid integrated circuit is that active device uses the separation tube core do not encapsulated, passive circuit ceramic membrane circuit or some discrete passive components are formed, use spun gold or gold ribbon bonding technology complete the electrical interconnection between active circuit and passive circuit, although its integrated level is not as single-chip integration, but the technical advantage of different semiconductor technology can be given full play to, make design have more flexibility, and there is lower design and production cost.
Design a high efficiency microwave power amplifier, selecting of semiconductor device is also one of very important condition.At present, ripe for the GaAs device technology designing power amplifier, there is the features such as high frequency, high-gain, high linearity, but power output is not enough; LDMOS device has high-power, the characteristic such as high linearity, high working voltage, and be suitable as very much power output stage, but its gain is low, efficiency is not high, and packaging cost is high; The third generation semi-conducting material GaN device being described as Si and GaAs that continue later has the characteristics such as broad stopband, high breakdown field strength, high saturated electrons mobility, is specially adapted to high temperature, high frequency, high power applications, but its complex process, and cost is higher.Therefore, design a kind of GaAs and LDMOS/GaN hybrid integrated microwave power amplifier, less size and more excellent performance can be obtained.
In prior art, GaAs and LDMOS/GaN hybrid integrated has two difficulties: one is that LDMOS/GaN powerful nude film power output is very high, therefore good heat radiation is needed, and printed circuit board (PCB) or copper, thermal coefficient of expansion that aluminum is heat sink are larger, the nude film of power chip is directly welded on above material, power chip can be caused to rupture due to the thermal expansion problem of heat sink or PCB while heat radiation; Two is that the input and output impedance of LDMOS/GaN device is very little, so match circuit is complicated, system integration application is more difficult.
Utility model content
The purpose of this utility model is to provide a kind of GaAs and LDMOS/GaN hybrid integrated microwave power amplifier based on PCB technology, there is the features such as high frequency, high-gain, high linearity, high-power, high efficiency, and integrated level is high, packaging cost is low, applies more convenient.
For solving the problems of the technologies described above, the utility model embodiment provides the hybrid integrated microwave power amplifier of a kind of GaAs and LDMOS/GaN based on PCB technology, comprising:
Metal base plate;
The upper surface of described metal base plate is provided with pcb board and heat sink;
Described pcb board is provided with the first power amplifier;
Described heat sink on be provided with the second power amplifier;
The input of described second power amplifier is connected with the output of described first power amplifier;
Wherein, described first power amplifier is GaAs power amplifier, and described second power amplifier is LDMOS power amplifier or GaN power amplifier.
Preferably, described second power amplifier by silver slurry weldering or eutectic weldering mode be fixed on described heat sink on.
Preferably, described metal base plate also has groove, the shape of described groove is identical with described heat sink shape of cross section, described heat sink bottom nested enter the groove of described metal base plate.
Preferably, described pcb board also has through hole, the shape of cross section of described through hole is identical with described heat sink shape of cross section, described heat sink through described through hole nested enter the groove of described metal base plate.
Preferably, the degree of depth of described groove equals the difference of the thickness of described heat sink thickness and described pcb board.
Preferably, described heat sink be described heat sink for molybdenum copper heat sink.
Preferably, described molybdenum copper is heat sink is that copper-molybdenum-copper is heat sink
Preferably, also comprise intervalve matching circuit, described intervalve matching circuit is arranged on described pcb board, and input is connected with the output of described first power amplifier, and output is connected with the input of described second power amplifier.
Preferably, also comprise output matching circuit, the input of described output matching circuit is connected with the output of described second power amplifier.
Preferably, described intervalve matching circuit or described output matching circuit are made up of discrete component and spun gold wiring.
The hybrid integrated microwave power amplifier of GaAs and LDMOS/GaN based on PCB technology that the utility model embodiment provides, compared with prior art, has the following advantages:
The hybrid integrated microwave power amplifier of GaAs and LDMOS/GaN based on PCB technology that the utility model embodiment provides, comprising: metal base plate; The upper surface of described metal base plate is provided with pcb board and heat sink; Described pcb board is provided with the first power amplifier; Described heat sink on be provided with the second power amplifier; The input of described second power amplifier is connected with the output of described first power amplifier; Wherein, described first power amplifier is GaAs power amplifier, and described second power amplifier is LDMOS power amplifier or GaN power amplifier.
Because the first power amplifier and GaAs power amplifier and the second power amplifier and LDMOS power amplifier or GaN power amplifier are integrated on described metal base plate by described hybrid integrated microwave power amplifier, described GaAs power amplifier is integrated on described pcb board, described LDMOS power amplifier or GaN power amplifier be set to described heat sink on, be connected with described GaAs power amplifier, there is while making described hybrid integrated microwave power amplifier the advantage of GaAs and LDMOS or GaN two kinds of devices, integrated circuit has high frequency, high-gain, high linearity, high-power, the features such as high efficiency, and integrated level is high, packaging cost is low, apply more convenient.
Directly be not integrated on described pcb board because described LDMOS power amplifier or GaN power amplifier are set to described heat sink going up, and the described heat sink very low thermal coefficient of expansion that has, in situation of being heated, deformation is less likely to occur, the chip of described LDMOS power amplifier or GaN power amplifier can not be ruptured.In addition, described heat sinkly also have the very strong capacity of heat transmission, drastically increases the heat-sinking capability to described LDMOS power amplifier or GaN power amplifier; Described GaAs power amplifier is set on described pcb board, and described pcb board and be describedly heat sinkly integrated on described metal base plate, described metal base plate has the very strong capacity of heat transmission, make described pcb board and described heat sink temperature difference less, the temperature difference of the diverse location of described pcb board is less, not easily ruptures.
Input impedance due to the output impedance of described GaAs power-amplifier stage and described LDMOS power amplifier or GaN power amplifier is all only have the low-resistance of several ohm, therefore can no longer with conventional by the method for input and output impedance matching to 50 Ω, without the need to carrying out pre-matching in conventional LDMOS/GaN encapsulation, circuit structure is simpler.
In sum, the hybrid integrated microwave power amplifier of GaAs and LDMOS/GaN based on PCB technology that the utility model embodiment provides, have the features such as high frequency, high-gain, high linearity, high-power, high efficiency, and integrated level is high, packaging cost is low, applies more convenient.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 for the utility model embodiment provide described in based on the electrical block diagram of a kind of embodiment of GaAs and the LDMOS/GaN hybrid integrated microwave power amplifier of PCB technology;
Intervalve matching circuit schematic diagram between the GaAs power amplifier that Fig. 2 provides for the utility model embodiment and described LDMOS/GaN power amplifier;
The structural representation of a kind of embodiment of GaAs and the LDMOS/GaN hybrid integrated microwave power amplifier based on PCB technology that Fig. 3 provides for the utility model embodiment.
Embodiment
Just as described in the background section, GaAs and LDMOS/GaN hybrid integrated of the prior art has two difficulties: one is that LDMOS/GaN powerful nude film power output is very high, therefore good heat radiation is needed, and printed circuit board (PCB) or copper, thermal coefficient of expansion that aluminum is heat sink are larger, the nude film of power chip is directly welded on above material, power chip can be caused to rupture due to the thermal expansion problem of heat sink or PCB while heat radiation; Two is that the input and output impedance of LDMOS/GaN device is very little, so match circuit is complicated, system integration application is more difficult.
Based on this, the utility model embodiment provides the hybrid integrated microwave power amplifier of GaAs and LDMOS/GaN based on PCB technology, comprising: metal base plate; The upper surface of described metal base plate is provided with pcb board and heat sink; Described pcb board is provided with the first power amplifier; Described heat sink on be provided with the second power amplifier; The input of described second power amplifier is connected with the output of described first power amplifier; Wherein, described first power amplifier is GaAs power amplifier, and described second power amplifier is LDMOS power amplifier or GaN power amplifier.
It should be noted that, in following discourse process of the present utility model, described first power amplifier just refers to GaAs power amplifier, and described second power amplifier just refers to LDMOS power amplifier or GaN power amplifier.
Described GaAs and the LDMOS/GaN hybrid integrated microwave power amplifier based on PCB technology, circuit structure as shown in Figure 1, on by dual-stage amplifier A1, A2, interstage matched M1 and output matching M2 cascade composition, the input of amplifier A1 and the output of amplifier A2 have electric capacity C1, C2 stopping direct current.Described interstage matched M1, output matching M2, electric capacity C1, C2 are made up of discrete component and spun gold wiring.Described amplifier A1 is GaAs power amplifier chip, is the nude film of un-encapsulated.Described amplifier A2 is LDMOS power amplifier or GaN power amplifier, is the nude film of un-encapsulated.And generally biasing circuit and decoupling circuit is also provided with between amplifier A1 and A2.
As Fig. 2 be as described in GaAs power amplifier and as described in intervalve matching circuit between LDMOS power amplifier or GaN power amplifier, the one termination prime GaAs of the 3rd electric capacity C3 drives the output of power amplifier chips 1, the other end of the 3rd electric capacity C3 meets the 4th electric capacity C4 and the 5th electric capacity C5 respectively, the other end ground connection of the 4th electric capacity C4, the other end of the 5th electric capacity C5 is connected with the first inductance L 1, and this first inductance L 1 is connected with rear class LDMOS power amplifier or GaN power amplifier input.
In sum, described hybrid integrated microwave power amplifier is by being integrated on described metal base plate by described first power amplifier and GaAs power amplifier and described second power amplifier and LDMOS power amplifier or GaN power amplifier, described GaAs power amplifier is integrated on described pcb board, described LDMOS power amplifier or GaN power amplifier be set to described heat sink on, be connected with described GaAs power amplifier, there is while making described hybrid integrated microwave power amplifier the advantage of GaAs and LDMOS power amplifier or GaN two kinds of devices, integrated circuit has high frequency, high-gain, high linearity, high-power, the features such as high efficiency, and integrated level is high, packaging cost is low, apply more convenient.Described LDMOS power amplifier or GaN power amplifier are set to described heat sink going up and are not integrated on described pcb board, described heat sinkly have very low thermal coefficient of expansion, in situation of being heated, deformation is less likely to occur, the chip of described LDMOS power amplifier or GaN power amplifier can not be ruptured; Described heat sinkly have the very strong capacity of heat transmission, drastically increases the heat-sinking capability to described LDMOS power amplifier or GaN power amplifier; Described GaAs power amplifier is set on described pcb board, and described pcb board and be describedly heat sinkly integrated on described metal base plate, described metal base plate has the very strong capacity of heat transmission, make described pcb board and described heat sink temperature difference less, the temperature difference of described pcb board each several part is less, can not rupture.Because the output impedance of described GaAs power amplifier and described LDMOS power amplifier or GaN power amplifier input impedance are all only have the low-resistance of several ohm, therefore can no longer with conventional by the method for input and output impedance matching to 50 Ω, directly prime output impedance is matched rear class input impedance, without the need to carrying out pre-matching in conventional LDMOS power amplifier or GaN power amplifier encapsulation, circuit structure is simpler.
In order to make those skilled in the art person understand the utility model scheme better, below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
The structural representation of a kind of embodiment of GaAs and the LDMOS/GaN hybrid integrated microwave power amplifier based on PCB technology provided for the utility model embodiment with reference to figure 3, Fig. 3.
In the concrete mode of one, described GaAs and the LDMOS/GaN hybrid integrated microwave power amplifier based on PCB technology, comprising: metal base plate 4; The upper surface of described metal base plate 4 is provided with pcb board 3 and heat sink 5; Described pcb board 3 is provided with the first power amplifier 1; The second power amplifier 2 is provided with on described heat sink 5; The input of described second power amplifier 2 is connected with the output of described first power amplifier 1; Wherein, described first power amplifier 1 is GaAs power amplifier, and described second power amplifier 2 is LDMOS power amplifier or GaN power amplifier.
Preferably, described second power amplifier 2 is fixed on described heat sink 5 by the mode of the weldering of silver slurry or eutectic weldering, and firm welding, there is not the situation of rosin joint, welding temperature is low, and welding efficiency is high.Eutectic weldering is also known as low-melting alloy welding, and the basic characteristics of eutectic alloy are: two kinds of different metals can form alloy according to constant weight ratio under far below respective melting temperature.When adopting eutectic welding, welding temperature is lower than the fusing point of each component, and the difficulty of welding procedure is reduced greatly, and welding temperature reduces greatly, greatly can improve welding efficiency.It should be noted that, the utility model can also adopt other mode to be fixed on described heat sink 5 by described LDMOS power amplifier or GaN power amplifier, just above-mentioned two kinds of welding manners are conventional welding manners, good fixing effect, process costs is low, and the utility model is not specifically limited the fixed form that described LDMOS power amplifier or GaN power amplifier are fixed on described heat sink 5.
On the basis of above-described embodiment, in a kind of embodiment of the present utility model, described metal base plate 4 also has groove, the shape of described groove is identical with the described shape of cross section of heat sink 5, the described bottom of heat sink 5 nested enter the groove of described metal base plate 4.Described groove generally processes with milling machine.Described metal base plate 4 has the groove identical with the described shape of cross section of heat sink 5, after being fixed to described groove by described heat sink 5, increase the contact area of described heat sink 5 and described metal base plate 4 on the one hand, increase the heat trnasfer between described heat sink 5 and described metal base plate 4, on the other hand, described heat sink 5 are fixed in described groove, make the connection between described heat sink 5 and described metal base plate 4 more firm.
On the basis of above-described embodiment, in a kind of embodiment of the present utility model, described pcb board 3 also has through hole, and the shape of cross section of described through hole is identical with the described shape of cross section of heat sink 5, described heat sink 5 through described through hole nested enter the groove of described metal base plate 4.Described heat sink 5 through the through hole of described pcb board 3 nested enter the groove of described metal base plate 4, make described pcb board 3, described heat sink 5 and described metal base plate 4 one-tenth be integrated, the set of three is more firm, described through hole can be arranged on the optional position of described pcb board 3, makes the circuit design of described pcb board 3 more free.
On the basis of above-described embodiment, in a kind of embodiment of the present utility model, the degree of depth of described groove equals the difference of the thickness of the described thickness of heat sink 5 and described pcb board 3.The degree of depth of described groove equals the difference of the thickness of the described thickness of heat sink 5 and described pcb board 3, makes the upper surface of described pcb board 3 and the described upper surface of heat sink 5 be in same plane, directly adopts original PCB technology when printed circuit, reduces process costs.
And in hybrid integrated microwave power amplifier described in the utility model, described heat sink 5 to be generally molybdenum copper heat sink.Molybdenum copper product belongs to metal ground plane lamellar composite type electronic package material, the thermal conductivity of this material is high, thermal coefficient of expansion is low and adjustable, resistance to elevated temperatures is excellent, be the important electronic package material of domestic and international high-power electronic component, be widely used in the industries such as microwave, communication, Aero-Space, power electronics, high power semiconductor lasers, medical treatment.In addition, in microwave packaging and radio frequency package field, this material is also adopted to do heat sink.The described molybdenum copper made with molybdenum copper product is heat sink, have that thermal conductivity is high, thermal coefficient of expansion is low, resistance to elevated temperatures is good, heat-sinking capability is good, the amount of heat that described LDMOS power amplifier or GaN power amplifier are produced in running can be passed away in time, greatly reduce the speed that temperature rises, the more important thing is that thermal coefficient of expansion is little, making the deformation at each diverse location place in the described heat sink process dispelling the heat little, improve the safety and reliability of operation.It should be noted that, can also use other heat sink 5 in the utility model, the utility model does not do concrete restriction to this.
On the basis of above-described embodiment, in a kind of embodiment of the present utility model, described molybdenum copper is heat sink is that copper-molybdenum-copper alloy is heat sink.Described molybdenum copper is heat sink is adopted as the copper-molybdenum-copper composite material of similar " sandwich " structure, the structure of this material is stacked, generally be divided into three layers, intermediate layer is low-expansion material layer, both sides are the material layer of electric-conductivity heat-conductivity high, and described low bulk core is metal M o, and two-sided electric-conductivity heat-conductivity high material is fine copper, described material has high strength, high heat conductance, low-expansion coefficient and can the feature such as punch forming, and the performances such as its coefficient of expansion also have designability.In described LDMOS power amplifier or the high-power output of GaN power amplifier, when described heat sink 5 temperature raise, described heat sink 5 can not there is alice, the chip of described LDMOS power amplifier or GaN power amplifier can not rupture, and described heat sink 5 also can not weaken with the fixed effect of described metal base plate 4.It should be noted that, the molybdenum copper of other structure can also be used in the utility model heat sink, improve described heat sink heat-sinking capability as long as be beneficial to, the utility model does not do concrete restriction to this.
In described hybrid integrated microwave power amplifier of the present utility model, also intervalve matching circuit is provided with between described first power amplifier 1 and the second power amplifier 2, described intervalve matching circuit is arranged on described pcb board, input is connected with the output of described first power amplifier 1, and output is connected with the input of described second power amplifier 2.
In addition, also comprise output matching circuit during described hybrid integrated microwave power amplifier is general, the input of described output matching circuit is connected with the output of described LDMOS power amplifier or GaN power amplifier.
Described intervalve matching circuit 10 or described output matching circuit are made up of discrete component 9 and spun gold wiring 8.Described discrete component 9 mainly patch capacitor, described spun gold wiring 8 has the distributed inductance with chip capacity impedance matching, is equivalent to the inductance of intervalve matching circuit.The pin 6 of described second power amplifier 2 is by spun gold wiring 8 bonding and described pcb board 3 pad 7 realize various electrical connection.
Because the output impedance of described first power amplifier 1 and the input impedance of described second power amplifier 2 are all only have the low-resistance of several ohm, therefore can no longer with conventional by the method for input and output impedance matching to 50 Ω, but by described spun gold wiring and described discrete component on described pcb board 3, directly prime output impedance is matched rear class input impedance, and it is conventional by pre-matching in described second power amplifier package without the need to carrying out, the impedance between described first power amplifier 1 and described second power amplifier 2 is made to be very easy to coupling, and intervalve matching circuit 10 structure is therebetween simple, respond well.
In sum, described hybrid integrated microwave power amplifier is by being integrated on described metal base plate by described first power amplifier and described second power amplifier, described first power amplifier is integrated on described pcb board, described second power amplifier be set to described heat sink on, be connected with described first power amplifier, there is while making described hybrid integrated microwave power amplifier the advantage of GaAs and LDMOS/GaN two kinds of devices, integrated circuit has high frequency, high-gain, high linearity, high-power, the features such as high efficiency, and integrated level is high, packaging cost is low, apply more convenient.Described LDMOS power amplifier or GaN power amplifier are set to described heat sink going up and are not integrated on described pcb board, described heat sinkly have very low thermal coefficient of expansion, in situation of being heated, deformation is less likely to occur, the chip of described LDMOS/GaN power amplifier can not be ruptured; Described heat sinkly have the very strong capacity of heat transmission, drastically increases the heat-sinking capability to described LDMOS power amplifier GaN power amplifier; Described GaAs power amplifier is set on described pcb board, and described pcb board and be describedly heat sinkly integrated on described metal base plate, described metal base plate has the very strong capacity of heat transmission, make described pcb board and described heat sink temperature difference less, the temperature difference of described pcb board each several part is less, can not rupture.In addition, because the output impedance of described GaAs power amplifier and described LDMOS power amplifier or GaN power amplifier input impedance are all only have the low-resistance of several ohm, therefore can no longer with conventional by the method for input and output impedance matching to 50 Ω, but directly by discrete component and spun gold wiring, prime output impedance is matched rear class input impedance on described pcb board, and without the need to carrying out pre-matching in conventional LDMOS power amplifier or GaN power amplifier encapsulation, circuit structure is simpler, respond well.
Above GaAs and the LDMOS/GaN hybrid integrated microwave power amplifier based on PCB technology provided by the utility model is described in detail.Apply specific case herein to set forth principle of the present utility model and execution mode, the explanation of above embodiment just understands method of the present utility model and core concept thereof for helping.Should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model principle, can also carry out some improvement and modification to the utility model, these improve and modify and also fall in the protection range of the utility model claim.
Claims (10)
1., based on a hybrid integrated microwave power amplifier of GaAs and LDMOS/GaN of PCB technology, it is characterized in that, comprising:
Metal base plate;
The upper surface of described metal base plate is provided with pcb board and heat sink;
Described pcb board is provided with the first power amplifier;
Described heat sink on be provided with the second power amplifier;
The input of described second power amplifier is connected with the output of described first power amplifier;
Wherein, described first power amplifier is GaAs power amplifier, and described second power amplifier is LDMOS power amplifier or GaN power amplifier.
2. hybrid integrated microwave power amplifier as claimed in claim 1, is characterized in that, described second power amplifier by the mode that the weldering of silver slurry or eutectic are welded be fixed on described heat sink on.
3. hybrid integrated microwave power amplifier as claimed in claim 2, it is characterized in that described metal base plate also has groove, the shape of described groove is identical with described heat sink shape of cross section, described heat sink bottom nested enter the groove of described metal base plate.
4. hybrid integrated microwave power amplifier as claimed in claim 3, it is characterized in that, described pcb board also has through hole, and the shape of cross section of described through hole is identical with described heat sink shape of cross section, described heat sink through described through hole nested enter the groove of described metal base plate.
5. hybrid integrated microwave power amplifier as claimed in claim 4, it is characterized in that, the degree of depth of described groove equals the difference of the thickness of described heat sink thickness and described pcb board.
6. the hybrid integrated microwave power amplifier as described in any one of claim 1-5, is characterized in that, described heat sink be that molybdenum copper is heat sink.
7. hybrid integrated microwave power amplifier as claimed in claim 6, it is characterized in that, described molybdenum copper is heat sink is that copper-molybdenum-copper is heat sink.
8. hybrid integrated microwave power amplifier as claimed in claim 1, it is characterized in that, also comprise intervalve matching circuit, described intervalve matching circuit is arranged on described pcb board, input is connected with the output of described first power amplifier, and output is connected with the input of described second power amplifier.
9. hybrid integrated microwave power amplifier as claimed in claim 8, it is characterized in that, also comprise output matching circuit, the input of described output matching circuit is connected with the output of described second power amplifier.
10. hybrid integrated microwave power amplifier as claimed in claim 9, it is characterized in that, described intervalve matching circuit or described output matching circuit are made up of discrete component and spun gold wiring.
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| CN201520430315.XU CN204669313U (en) | 2015-06-19 | 2015-06-19 | A kind of GaAs and LDMOS/GaN hybrid integrated microwave amplifier based on PCB technology |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104883133A (en) * | 2015-06-19 | 2015-09-02 | 苏州英诺迅科技股份有限公司 | GaAs and LDMOS/GaN mixed integrated microwave amplifier based on PCB process |
| CN107546131A (en) * | 2017-08-09 | 2018-01-05 | 合肥圣达电子科技实业有限公司 | A kind of preparation method for being used to encapsulate the metal shell of electronic building brick |
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2015
- 2015-06-19 CN CN201520430315.XU patent/CN204669313U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104883133A (en) * | 2015-06-19 | 2015-09-02 | 苏州英诺迅科技股份有限公司 | GaAs and LDMOS/GaN mixed integrated microwave amplifier based on PCB process |
| CN107546131A (en) * | 2017-08-09 | 2018-01-05 | 合肥圣达电子科技实业有限公司 | A kind of preparation method for being used to encapsulate the metal shell of electronic building brick |
| CN107546131B (en) * | 2017-08-09 | 2019-11-15 | 合肥圣达电子科技实业有限公司 | A kind of production method for encapsulating the metal shell of electronic building brick |
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