CN204554744U - A kind of new radiation mechanism of high-power LED lamp - Google Patents

Abstract

The utility model discloses a kind of new radiation mechanism of high-power LED lamp, copper base is stacked gradually by base copper (5) from bottom to top, insulating barrier (3), copper foil layer (2) and solder mask (1) and forms; Copper base is provided with depressed part, and the bottom of depressed part manifests base copper; LED is welded in described depression, and the base of LED is connected with base copper by soldering-tin layer (4); The periphery at depressed part top manifests described copper foil layer (2); The positive pole of LED is connected with the printed wire on copper foil layer with negative pole.The bottom surface of described depressed part is between the end face and bottom surface of base copper.The new radiation mechanism good heat dissipation effect of this high-power LED lamp, easy to implement.

Description

A kind of new radiation mechanism of high-power LED lamp

Technical field

The utility model relates to a kind of new radiation mechanism of high-power LED lamp.

Background technology

Light emitting diode, as solid state light emitter of new generation, has the many merits such as life-span long, energy-efficient, environmental protection; Be widely applied to display! The heat energy that LED produces, this heat energy produces huge side effect to light fixture, if can not efficiently radiates heat, LED internal temperature can be made constantly to raise, and temperature is higher, and the luminous efficiency of LED is lower, and the life-span of LED is shorter, under serious conditions, LED wafer can be caused to lose efficacy at once, so heat radiation is the huge obstacle of great power LED application.High-power LED lamp refers to the light fixture of single LED lamp at more than 0.5W.

Existing LED, directly welding in wiring board copper foil layer on, this structure radiating effect is poor, therefore, be necessary design a kind of brand-new cooling mechanism.

Utility model content

Technical problem to be solved in the utility model is to provide a kind of new radiation mechanism of high-power LED lamp, the new radiation mechanism good heat dissipation effect of this high-power LED lamp, easy to implement.

The technical solution of utility model is as follows:

A new radiation mechanism for high-power LED lamp, copper base is stacked gradually by base copper (5) from bottom to top, insulating barrier (3), copper foil layer (2) and solder mask (1) and forms; Copper base is provided with depressed part, and the bottom of depressed part manifests base copper; LED is welded in described depression, and the base of LED is connected with base copper by soldering-tin layer (4);

The periphery at depressed part top manifests described copper foil layer (2); The positive pole of LED is connected with the printed wire on copper foil layer with negative pole.

The bottom surface of described depressed part is between the end face and bottom surface of base copper.

Beneficial effect:

The new radiation mechanism of high-power LED lamp of the present utility model, the heat that the PN junction of LED sends distributes in air through LED base → soldering-tin layer → base copper, and the temperature of LED lamp each point is tested at the same terms, under new cooling mechanism, the temperature of the LED base in LED lamp obviously have dropped 5 to 6 degrees Celsius, serve good radiating effect, greatly can increase the stable of LED lamp and life-span.

Accompanying drawing explanation

Fig. 1 is the general structure schematic diagram of the new radiation mechanism of high-power LED lamp of the present utility model.

Label declaration: 1-solder mask, 2-copper foil layer, 3-insulating barrier, 4-soldering-tin layer, 5-base copper, 6-LED lamp.

Detailed description of the invention

Below with reference to the drawings and specific embodiments, the utility model is described in further details:

Embodiment 1:

As shown in Figure 1, a kind of new radiation mechanism of high-power LED lamp, copper base is stacked gradually by base copper 5 from bottom to top, insulating barrier 4, copper foil layer 2 and solder mask 1 and forms; Copper base is provided with depressed part, and the bottom of depressed part manifests base copper; LED 4 is welded in described depression, and the base of LED is connected with base copper by soldering-tin layer 3;

The periphery at depressed part top manifests described copper foil layer 2; The positive pole of LED is connected with the printed wire on copper foil layer with negative pole.

The bottom surface of described depressed part is between the end face and bottom surface of base copper.

Described insulating barrier is PP layer.

During concrete enforcement, position under the former LED base of copper base, solder mask, layers of copper and insulating barrier are removed in boring, exposed copper base, copper base sprays tin or turmeric, can make surface treatment strong adhesion, thermal conductivity is good, after such process, LED base directly can be welded on base copper, heat just can directly import in base copper thus radiating rate promotes greatly.

Claims (2)

1. a new radiation mechanism for high-power LED lamp, is characterized in that, copper base is stacked gradually by base copper (5) from bottom to top, insulating barrier (3), copper foil layer (2) and solder mask (1) and forms; Copper base is provided with depressed part, and the bottom of depressed part manifests base copper; LED is welded in described depression, and the base of LED is connected with base copper by soldering-tin layer (4);

The periphery at depressed part top manifests described copper foil layer (2); The positive pole of LED is connected with the printed wire on copper foil layer with negative pole.

2. the new radiation mechanism of high-power LED lamp according to claim 1, is characterized in that, the bottom surface of described depressed part is between the end face and bottom surface of base copper.