CN204614815U - A kind of with heat abstractor high-power LED chip - Google Patents
A kind of with heat abstractor high-power LED chip Download PDFInfo
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- CN204614815U CN204614815U CN201520319785.9U CN201520319785U CN204614815U CN 204614815 U CN204614815 U CN 204614815U CN 201520319785 U CN201520319785 U CN 201520319785U CN 204614815 U CN204614815 U CN 204614815U
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- heat
- radiating fin
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- led chip
- metal substrate
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Abstract
The utility model relates to a kind of high-power LED chip with heat abstractor, comprise metal substrate, LED chip, end liner, heat dissipating layer and heat abstractor, described LED chip, end liner and heat dissipating layer are set in turn on metal substrate, the center of described heat dissipating layer has hollow-out parts to form open tubular column shape, described heat dissipating layer is provided with heat radiating fin, described heat radiating fin comprises plural first heat radiating fin and plural second heat radiating fin, described heat abstractor is arranged at the one side of metal substrate away from LED chip, described heat abstractor comprises heat pipe and plural radiating fin, described heat pipe is arranged on metal substrate, plural described radiating fin is arranged along heat pipe circumference.High-power LED chip with heat abstractor of the present utility model has that perfect heat-dissipating, heat transfer efficiency are high, compact conformation and the little beneficial effect of thermal resistance.
Description
Technical field
The utility model relates to LED technology field, and particularly one is with heat abstractor high-power LED chip.
Background technology
A kind of solid-state semiconductor device of LED chip, LED chip, also referred to as LED luminescence chip, is the core component of LED.Great power LED refers to the light-emitting diode having large rated operational current.Common LED power is generally 0.05W, operating current is 20mA, and great power LED can reach 1W, 2W, even tens of watts, operating current can be tens milliamperes to hundreds of milliampere not etc.Great power LED has the advantages such as volume is little, power consumption is little, it is little to generate heat, life-span length, fast response time, safety low-voltage, good weatherability, good directionality as lighting source.But due to the restriction of current great power LED in heat radiation, luminous flux, conversion efficiency and cost etc., therefore determine the illumination of large power white light LED application in a short time mainly some special dimensions, medium-term and long-term target is only general illumination.
The problem that high-power LED chip ubiquity heat dispersion of the prior art is not good.
Utility model content
Technical problem to be solved in the utility model is: provide a kind of perfect heat-dissipating with heat abstractor high-power LED chip.
In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is:
A kind of high-power LED chip with heat abstractor, comprise metal substrate, LED chip, end liner, heat dissipating layer and heat abstractor, described LED chip, end liner and heat dissipating layer are set in turn on metal substrate, the center of described heat dissipating layer has hollow-out parts to form open tubular column shape, described heat dissipating layer is provided with heat radiating fin, described heat radiating fin comprises plural first heat radiating fin and plural second heat radiating fin, be arranged in parallel between plural described first heat radiating fin, plural described first heat radiating fin along hollow-out parts week along arrange and with the central axis of open tubular column, vertically arrange between plural described second heat radiating fin, the central axis of plural described second heat radiating fin and open tubular column, described heat abstractor is arranged at the one side of metal substrate away from LED chip, described heat abstractor comprises heat pipe and plural radiating fin, described heat pipe is arranged on metal substrate, plural described radiating fin is arranged along heat pipe circumference, described radiating fin comprises base portion and is arranged at the afterbody on base portion, described base portion is vertically installed on heat pipe side face, V-shaped setting between the afterbody of plural described radiating fin.
Further, the type of described heat pipe is the combination of copper and water, and the material of described heat radiating fin and radiating fin is respectively aluminium.
Further, the height of described radiating fin is 7mm-9mm, and the width of described base portion is 5mm-8mm, and the angle of described V-arrangement is 35 °-45 °.
Further, the height of described radiating fin is 8mm, and the width of described base portion is 6mm, and the angle of described V-arrangement is 42 °.
Further, the number of described heat pipe is two or more, and plural described heat pipe is evenly arranged on metal substrate.
The beneficial effects of the utility model are:
(1) by the structural design of hollow-out parts, the first heat radiating fin and the second heat radiating fin, because multiple first heat radiating fin and the second heat radiating fin can realize the intercommunication of all directions all around, at utmost optimize ventilation effect, thus improve heat dispersion;
(2) heat abstractor adopts the mode that heat pipe and radiating fin combine, and heat pipe has the effect of quick conductive, and the heat imported by heat pipe can distribute by radiating fin in time, has that heat transfer efficiency is high, compact conformation and a little beneficial effect of thermal resistance.
Accompanying drawing explanation
Fig. 1 is the overall structure figure of the high-power LED chip with heat abstractor of the utility model embodiment;
Fig. 2 is the structure chart of the heat dissipating layer of the high-power LED chip with heat abstractor of the utility model embodiment.
Label declaration:
1, metal substrate; 2, LED chip; 3, end liner; 4, heat dissipating layer; 41, hollow-out parts; 42, the first heat radiating fin; 43, the second heat radiating fin; 5, heat abstractor; 51, heat pipe; 52, radiating fin.
Embodiment
By describing technology contents of the present utility model in detail, realized object and effect, accompanying drawing is coordinated to be explained below in conjunction with execution mode.
The design of the utility model most critical is: by comprising the structural design of metal substrate, LED chip, end liner, heat dissipating layer and heat abstractor, thus effectively improves the heat dispersion of LED chip.
Please refer to Fig. 1 and Fig. 2, a kind of high-power LED chip with heat abstractor, comprise metal substrate 1, LED chip 2, end liner 3, heat dissipating layer 4 and heat abstractor 5, described LED chip 2, end liner 3 and heat dissipating layer 4 are set in turn on metal substrate 1, the center of described heat dissipating layer 4 has hollow-out parts 41 to form open tubular column shape, described heat dissipating layer 4 is provided with heat radiating fin, described heat radiating fin comprises plural first heat radiating fin 42 and plural second heat radiating fin 43, be arranged in parallel between plural described first heat radiating fin 42, plural described first heat radiating fin 42 along hollow-out parts week along arrange and with the central axis of open tubular column, vertically arrange between plural described second heat radiating fin 43, the central axis of plural described second heat radiating fin 43 and open tubular column, described heat abstractor 5 is arranged at the one side of metal substrate 1 away from LED chip 2, described heat abstractor 5 comprises heat pipe 51 and plural radiating fin 52, described heat pipe 51 is arranged on metal substrate 1, plural described radiating fin 52 is arranged along heat pipe 51 circumference, described radiating fin 52 comprises base portion and is arranged at the afterbody on base portion, described base portion is vertically installed on heat pipe 51 side face, V-shaped setting between the afterbody of plural described radiating fin 52.
From foregoing description, the beneficial effects of the utility model are:
(1) by the structural design of hollow-out parts, the first heat radiating fin and the second heat radiating fin, because multiple first heat radiating fin and the second heat radiating fin can realize the intercommunication of all directions all around, at utmost optimize ventilation effect, thus improve heat dispersion;
(2) heat abstractor adopts the mode that heat pipe and radiating fin combine, and heat pipe has the effect of quick conductive, and the heat imported by heat pipe can distribute by radiating fin in time, has that heat transfer efficiency is high, compact conformation and a little beneficial effect of thermal resistance.
Further, the type of described heat pipe 51 is the combination of copper and water, and the material of described heat radiating fin and radiating fin 52 is respectively aluminium.
Seen from the above description, the type of heat pipe is preferably the combination for copper and water, and the material of described heat radiating fin and radiating fin is preferably aluminium.
Further, the height of described radiating fin 52 is 7mm-9mm, and the width of described base portion is 5mm-8mm, and the angle of described V-arrangement is 35 °-45 °.
Seen from the above description, when the height of radiating fin be 7mm-9mm, the width of base portion is 5mm-8mm, the angle of V-arrangement is 35 °-45 ° time, the radiating efficiency of radiating fin can be improved further.
Further, the height of described radiating fin 52 is 8mm, and the width of described base portion is 6mm, and the angle of described V-arrangement is 42 °.
Seen from the above description, the height of radiating fin is 8mm, the width of base portion is 6mm, the angle of V-arrangement be 42 ° for preferred radiation fin structure, better radiating efficiency can be obtained.
Further, the number of described heat pipe 51 is two or more, and plural described heat pipe 51 is evenly arranged on metal substrate 1.
Seen from the above description, the setting of multiple heat pipe has the advantage increasing heat-transfer rate.
Please refer to Fig. 1 and Fig. 2, embodiment one of the present utility model is:
The high-power LED chip with heat abstractor of the present embodiment, comprise metal substrate 1, LED chip 2, end liner 3, heat dissipating layer 4 and heat abstractor 5, described LED chip 2, end liner 3 and heat dissipating layer 4 are set in turn on metal substrate 1, the center of described heat dissipating layer 4 has hollow-out parts 41 to form open tubular column shape, described heat dissipating layer 4 is provided with heat radiating fin, described heat radiating fin comprises plural first heat radiating fin 42 and plural second heat radiating fin 43, be arranged in parallel between described plural first heat radiating fin 42, plural described first heat radiating fin 42 along hollow-out parts week along arrange and with the central axis of open tubular column, vertically arrange between plural described second heat radiating fin 43, the central axis of plural described second heat radiating fin 43 and open tubular column, described heat abstractor 5 is arranged at the one side of metal substrate 1 away from LED chip 2, described heat abstractor 5 comprises heat pipe 51 and plural radiating fin 52, described heat pipe 51 is arranged on metal substrate 1, plural described radiating fin 52 is arranged along heat pipe 51 circumference, described radiating fin 52 comprises base portion and is arranged at the afterbody on base portion, described base portion is vertically installed on heat pipe 51 side face, V-shaped setting between the afterbody of plural described radiating fin 52.The type of described heat pipe 51 is the combination of copper and water, and the material of described heat radiating fin and radiating fin 52 is respectively aluminium.The height of described radiating fin 52 is 7mm-9mm, and the width of described base portion is 5mm-8mm, and the angle of described V-arrangement is 35 °-45 °.The height of described radiating fin 52 is 8mm, and the width of described base portion is 6mm, and the angle of described V-arrangement is 42 °.The number of described heat pipe 51 is two or more, and plural described heat pipe 51 is evenly arranged on metal substrate 1.
In sum, the high-power LED chip with heat abstractor that the utility model provides has that perfect heat-dissipating, heat transfer efficiency are high, compact conformation and the little beneficial effect of thermal resistance.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every equivalents utilizing the utility model specification and accompanying drawing content to do; or be directly or indirectly used in relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (5)
1. the high-power LED chip with heat abstractor, it is characterized in that, comprise metal substrate, LED chip, end liner, heat dissipating layer and heat abstractor, described LED chip, end liner and heat dissipating layer are set in turn on metal substrate, the center of described heat dissipating layer has hollow-out parts to form open tubular column shape, described heat dissipating layer is provided with heat radiating fin, described heat radiating fin comprises plural first heat radiating fin and plural second heat radiating fin, be arranged in parallel between plural described first heat radiating fin, plural described first heat radiating fin along hollow-out parts week along arrange and with the central axis of open tubular column, vertically arrange between plural described second heat radiating fin, the central axis of plural described second heat radiating fin and open tubular column, described heat abstractor is arranged at the one side of metal substrate away from LED chip, described heat abstractor comprises heat pipe and plural radiating fin, described heat pipe is arranged on metal substrate, plural described radiating fin is arranged along heat pipe circumference, described radiating fin comprises base portion and is arranged at the afterbody on base portion, described base portion is vertically installed on heat pipe side face, V-shaped setting between the afterbody of plural described radiating fin.
2. a kind of high-power LED chip with heat abstractor according to claim 1, is characterized in that, the type of described heat pipe is the combination of copper and water, and the material of described heat radiating fin and radiating fin is respectively aluminium.
3. a kind of high-power LED chip with heat abstractor according to claim 1, is characterized in that, the height of described radiating fin is 7mm-9mm, and the width of described base portion is 5mm-8mm, and the angle of described V-arrangement is 35 °-45 °.
4. a kind of high-power LED chip with heat abstractor according to claim 2, is characterized in that, the height of described radiating fin is 8mm, and the width of described base portion is 6mm, and the angle of described V-arrangement is 42 °.
5. a kind of high-power LED chip with heat abstractor according to claim 1, is characterized in that, the number of described heat pipe is two or more, and plural described heat pipe is evenly arranged on metal substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520319785.9U CN204614815U (en) | 2015-05-18 | 2015-05-18 | A kind of with heat abstractor high-power LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520319785.9U CN204614815U (en) | 2015-05-18 | 2015-05-18 | A kind of with heat abstractor high-power LED chip |
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| Publication Number | Publication Date |
|---|---|
| CN204614815U true CN204614815U (en) | 2015-09-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520319785.9U Expired - Fee Related CN204614815U (en) | 2015-05-18 | 2015-05-18 | A kind of with heat abstractor high-power LED chip |
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| CN (1) | CN204614815U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714442A (en) * | 2015-11-13 | 2017-05-24 | 建业科技电子（惠州）有限公司 | Multilayer circuit board heat radiating structure |
-
2015
- 2015-05-18 CN CN201520319785.9U patent/CN204614815U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714442A (en) * | 2015-11-13 | 2017-05-24 | 建业科技电子（惠州）有限公司 | Multilayer circuit board heat radiating structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150902 Termination date: 20200518 |