CN204516755U - A kind of fingerprint design encapsulating structure utilizing gluing process - Google Patents
A kind of fingerprint design encapsulating structure utilizing gluing process Download PDFInfo
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- CN204516755U CN204516755U CN201420866964.XU CN201420866964U CN204516755U CN 204516755 U CN204516755 U CN 204516755U CN 201420866964 U CN201420866964 U CN 201420866964U CN 204516755 U CN204516755 U CN 204516755U
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- glue
- gold thread
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- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3201—Structure
- H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
- H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses a kind of fingerprint design encapsulating structure utilizing gluing process, described encapsulating structure is primarily of data memory chip, substrate, silicon material cushion block, bonding die glue, function algorithm wafer, protecting glue, gold thread, high-k plastic packaging material, induction chip composition; Described substrate is connected with data memory chip, function algorithm wafer and silicon material cushion block, gold thread connection data memory chip, function algorithm wafer and substrate; Described silicon material cushion block there is bonding die glue, protecting glue parcel gold thread, data memory chip and function algorithm wafer; Described bonding die glue and protecting glue upper surface have induction chip, and gold thread connects induction chip and substrate; Described high-k plastic packaging material parcel induction chip, gold thread and protecting glue.This utility model is by adding silicon material cushion block and adopting gluing process, and carry out routing than wafer common in the market doing trench extraction RDL pad, and then the solution putting glue or local plastic packaging protection gold thread is more economical, technique is simpler.
Description
Technical field
The utility model relates to the technology such as microelectronic packaging technology, sensor technology and chip interconnect, specifically a kind of fingerprint design encapsulating structure utilizing gluing process.
Background technology
Along with the intelligence degree of end product improves constantly, various sensor chip emerges in an endless stream.Sensing chip extends the application of the product such as smart mobile phone, panel computer, and such as, the appearance of fingerprint recognition chip just substantially increases the fail safe of the said goods.
Typical fingerprint Identification sensor chip at present, comprise semiconductor chip, it is formed with arrays of sensor elements for sensing as induction region, its maximum feature is that the induction region of its chip surface and user point and has an effect, and produces the signal of telecommunication that chip can sense.In order to the sensing function of fingerprint Identification sensor can be realized, also need the storage chip for storing sensing signal, as Flash chip, and for the treatment of the dedicated IC chip of signal, i.e. asic chip.Current fingerprint Identification sensor part needs much discrete number of assembling steps, wherein fingerprint Identification sensor chip, storage chip and dedicated IC chip are independent element separately, put together in the assembling or encapsulation process of senser element, that is, together with identification sensor chip, storage chip are not encapsulated into dedicated IC chip.
Utility model content
For above-mentioned prior art Problems existing; the utility model provides a kind of fingerprint design encapsulating structure utilizing gluing process; by adding silicon material cushion block (SPACER) and adopting gluing process; routing is carried out than wafer common in the market doing trench extraction RDL pad; and then the solution putting glue or local plastic packaging protection gold thread is more economical, technique is simpler.
Utilize a fingerprint design encapsulating structure for gluing process, described encapsulating structure is primarily of data memory chip, substrate, silicon material cushion block, bonding die glue, function algorithm wafer, protecting glue, gold thread, high-k plastic packaging material, induction chip composition; Described substrate is connected with data memory chip and function algorithm wafer, gold thread connection data memory chip and substrate, and gold thread is linkage function algorithm wafer and substrate also, described substrate has silicon material cushion block; Described silicon material cushion block has bonding die glue, protecting glue parcel gold thread and data memory chip, protecting glue also wraps up gold thread and function algorithm wafer; Described bonding die glue and protecting glue upper surface have induction chip, and gold thread connects induction chip and substrate; Described high-k plastic packaging material parcel induction chip, gold thread and protecting glue.
Described silicon material cushion block is higher than the ceiling for accumulation arc of gold thread on data memory chip and function algorithm wafer.
Described bonding die glue and protecting glue upper surface are at same plane.
The distance on high-k plastic packaging material surface is arrived at about 100um in described induction chip surface.
The dielectric constant of described high-k plastic packaging material is greater than 7, plastic packaging particle size average 5-7um, and the largest particles is less than 20um, can ensure to fill completely and fingerprint collecting imaging effect.
Utilize a preparation method for the fingerprint design encapsulating structure of gluing process, specifically carry out according to following steps:
Step one: mount data memory chip, function algorithm wafer and silicon material cushion block on substrate, silicon material cushion block exceeds ceiling for accumulation arc 50um on two wafers, then complete routing, i.e. gold thread 7 connection data memory chip and substrate, gold thread is linkage function algorithm wafer and substrate also;
Step 2: use protecting glue point glue parcel gold thread, data memory chip and function algorithm wafer, protecting glue exceeds 20-30um than silicon material cushion block, and protecting glue does not toast and directly mounts induction chip, and then toasts, and protecting glue is epoxy resin glue;
During attachment induction chip, protecting glue is driven plain, and has both played the effect of protection gold thread, data memory chip and function algorithm wafer after baking, serves again extension that is fixing and support induction chip, firm without rocking during guarantee induction chip extension routing.
Step 3: gold thread connects induction chip and substrate; high-k plastic packaging material parcel induction chip, gold thread and protecting glue; induction chip adopts RSSB routing; reduce loop height to 50-60um; the height on high-k plastic packaging material surface is arrived at about 100um in induction chip surface, does not occur line ball when ensureing plastic packaging.
Accompanying drawing explanation
Fig. 1 is substrate figure;
Fig. 2 is attachment routing figure;
Fig. 3 is a glue figure;
Fig. 4 is for pasting chip routing figure;
Fig. 5 is plastic packaging figure.
In figure, 1 is data memory chip, and 2 is substrate, and 3 is silicon material cushion block, and 4 is bonding die glue, and 5 is function algorithm wafer, and 6 is protecting glue, and 7 is gold thread, and 8 is high-k plastic packaging material, and 9 is induction chip.
Embodiment
Below in conjunction with accompanying drawing, a detailed description is done to the utility model.
As shown in Figure 5, utilize a fingerprint design encapsulating structure for gluing process, described encapsulating structure forms primarily of data memory chip 1, substrate 2, silicon material cushion block 3, bonding die glue 4, function algorithm wafer 5, protecting glue 6, gold thread 7, high-k plastic packaging material 8, induction chip 9; Described substrate 2 is connected with data memory chip 1 and function algorithm wafer 5, gold thread 7 connection data memory chip 1 and substrate 2, and gold thread 7 is linkage function algorithm wafer 5 and substrate 2 also, described substrate 2 has silicon material cushion block 3; Described silicon material cushion block 3 has bonding die glue 4, and protecting glue 6 wraps up gold thread 7 and data memory chip 1, and protecting glue 6 also wraps up gold thread 7 and function algorithm wafer 5; Described bonding die glue 4 and protecting glue 6 upper surface have induction chip 9, and gold thread 7 connects induction chip 9 and substrate 2; Described high-k plastic packaging material 8 wraps up induction chip 9, gold thread 7 and protecting glue 6.
Described silicon material cushion block 3 is higher than the ceiling for accumulation arc of gold thread 7 on data memory chip 1 and function algorithm wafer 5.
Described bonding die glue 4 and protecting glue 6 upper surface are at same plane.
The distance on high-k plastic packaging material 8 surface is arrived at about 100um in described induction chip 9 surface.
The dielectric constant of described high-k plastic packaging material 8 is greater than 7, plastic packaging particle size average 5-7um, and the largest particles is less than 20um, can ensure to fill completely and fingerprint collecting imaging effect.
Utilize a preparation method for the fingerprint design encapsulating structure of gluing process, specifically carry out according to following steps:
Step one: mount data memory chip 1, function algorithm wafer 5 and silicon material cushion block 3 on a substrate 2, silicon material cushion block 3 exceeds ceiling for accumulation arc 50um on two wafers, then routing is completed, i.e. gold thread 7 connection data memory chip 1 and substrate 2, gold thread 7 is linkage function algorithm wafer 5 and substrate 2 also, as depicted in figs. 1 and 2;
Step 2: use protecting glue glue parcel gold thread 7, data memory chip 1 and function algorithm wafers 5 at 6, protecting glue 6 exceeds 20-30um than silicon material cushion block 3, and protecting glue 6 does not toast directly attachment induction chip 9, and then toasts, protecting glue 6 is epoxy resin glue, as shown in Figure 3 and Figure 4;
During attachment induction chip 9, protecting glue 6 is driven plain; both the effect of protection gold thread 7, data memory chip 1 and function algorithm wafer 5 had been played after baking; serve again extension that is fixing and support induction chip 9, firm without rocking during guarantee induction chip 9 extension routing.
Step 3: gold thread 7 connects induction chip 9 and substrate 2; high-k plastic packaging material 8 wraps up induction chip 9, gold thread 7 and protecting glue 6; induction chip 9 adopts RSSB routing; reduce loop height to 50-60um; the height on high-k plastic packaging material 8 surface is arrived at about 100um in induction chip 9 surface; line ball is there is not, as shown in Figure 4 and Figure 5 when ensureing plastic packaging.
This structure can reduce SIP design size, realize the normal routing of induction chip and avoid induction chip to do trench and RDL pad routing again, adopting the product simple grain of this Structure and energy flow process to become through investigation and will dig trench extraction RDL pad routing again with the product of common plastic packaging material plastic packaging lower than induction chip.
Claims (6)
1. one kind utilizes the fingerprint design encapsulating structure of gluing process, it is characterized in that, described encapsulating structure is primarily of data memory chip (1), substrate (2), silicon material cushion block (3), bonding die glue (4), function algorithm wafer (5), protecting glue (6), gold thread (7), high-k plastic packaging material (8), induction chip (9) composition; Described substrate (2) is connected with data memory chip (1) and function algorithm wafer (5), gold thread (7) connection data memory chip (1) and substrate (2), gold thread (7) is linkage function algorithm wafer (5) and substrate (2) also, described substrate (2) has silicon material cushion block (3); Described silicon material cushion block (3) there is bonding die glue (4), protecting glue (6) parcel gold thread (7) and data memory chip (1), protecting glue (6) also wraps up gold thread (7) and function algorithm wafer (5); Described bonding die glue (4) and protecting glue (6) upper surface have induction chip (9), and gold thread (7) connects induction chip (9) and substrate (2); Described high-k plastic packaging material (8) parcel induction chip (9), gold thread (7) and protecting glue (6).
2. a kind of fingerprint design encapsulating structure utilizing gluing process according to claim 1, it is characterized in that, described silicon material cushion block (3) is higher than the ceiling for accumulation arc of gold thread (7) on data memory chip (1) and function algorithm wafer (5).
3. a kind of fingerprint design encapsulating structure utilizing gluing process according to claim 1, it is characterized in that, described bonding die glue (4) and protecting glue (6) upper surface are at same plane.
4. a kind of fingerprint design encapsulating structure utilizing gluing process according to claim 1, it is characterized in that, the distance on high-k plastic packaging material (8) surface is arrived at about 100um in described induction chip (9) surface.
5. a kind of fingerprint design encapsulating structure utilizing gluing process according to claim 1, it is characterized in that, the dielectric constant of described high-k plastic packaging material (8) is greater than 7, and plastic packaging particle size average 5-7um, the largest particles is less than 20um.
6. a kind of fingerprint design encapsulating structure utilizing gluing process according to claim 1, it is characterized in that, protecting glue (6) is epoxy resin glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420866964.XU CN204516755U (en) | 2014-12-31 | 2014-12-31 | A kind of fingerprint design encapsulating structure utilizing gluing process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420866964.XU CN204516755U (en) | 2014-12-31 | 2014-12-31 | A kind of fingerprint design encapsulating structure utilizing gluing process |
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| Publication Number | Publication Date |
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| CN204516755U true CN204516755U (en) | 2015-07-29 |
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| CN201420866964.XU Active CN204516755U (en) | 2014-12-31 | 2014-12-31 | A kind of fingerprint design encapsulating structure utilizing gluing process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576594A (en) * | 2014-12-31 | 2015-04-29 | 华天科技（西安）有限公司 | Fingerprint design packaging structure through dispensing technology and preparation method thereof |
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2014
- 2014-12-31 CN CN201420866964.XU patent/CN204516755U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576594A (en) * | 2014-12-31 | 2015-04-29 | 华天科技（西安）有限公司 | Fingerprint design packaging structure through dispensing technology and preparation method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190618 Address after: 211805 No. 29 Buyue Road, Qiaolin Street, Pukou District, Nanjing City, Jiangsu Province, 12-324 Patentee after: Huatian Science and Technology (Nanjing) Co., Ltd. Address before: 710018 No. 105 Fengcheng Five Road, Xi'an Economic and Technological Development Zone, Xi'an City, Shaanxi Province Patentee before: Huatian Technology (Xi'an) Co., Ltd. |
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| TR01 | Transfer of patent right |