CN204168707U - Self-adhesive high-thermal-conductivity absorbing material - Google Patents
Self-adhesive high-thermal-conductivity absorbing material Download PDFInfo
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- CN204168707U CN204168707U CN201420664658.8U CN201420664658U CN204168707U CN 204168707 U CN204168707 U CN 204168707U CN 201420664658 U CN201420664658 U CN 201420664658U CN 204168707 U CN204168707 U CN 204168707U
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Abstract
A kind of Self-adhesive high-thermal-conductivity absorbing material, comprise two solidification silicone oil composite beds, described solidification silicone oil composite bed is respectively basic unit and top layer, top layer is attached in basic unit, be filled with equally distributed thermal conductive ceramic particle in described basic unit, in described top layer, be filled with laterally alternatively distributed soft magnetic material particle and thermal conductive ceramic particle.Self-adhesive high-thermal-conductivity absorbing material utilizes the solidification silicone oil composite bed with tack, and in solidification silicone oil composite bed, fill soft magnetic material particle respectively and thermal conductive ceramic particle carries out suction ripple and heat conduction, while realizing inhaling wave energy, also achieve the effect of heat radiation, and without the need to arranging adhesive tape, only need the viscosity of solidifying silicone oil composite bed self can be bonded on electronic component, reduce production cost, simplified production process.
Description
Technical field
The utility model relates to a kind of absorbing material, specifically, is a kind of high heat conduction absorbing material with tack.
Background technology
Instantly along with the rapid advances of science and technology, electronic equipment and mobile device are just quick to miniaturization, intelligent development, along with the raising of semiconductor process technology, in a small space, utilize the chip of high integration that electronic equipment can be made to realize several functions, the speed of service of electronic equipment also causes more electromagenetic wave radiation more and more sooner, realize the various channels that several functions can use different frequency range in a single device, the operating frequency difference of different chip also can to the electromagnetic wave noise of radiation different frequency range in environment, if electromagnetic wave noise frequency is just at a certain communication frequency band, the quality of communication and the reliability of system can be affected like this, if a certain Electromagnetic Interference is coupled in the circuit of equipment, amplifies through oversampling circuit, the normal operation of equipment can be interfered with.The heat radiation of miniaturization to electronic equipment of high performance chips simultaneously it is also proposed higher requirement.
The mode of current solution electromagnetic interference uses absorbing material, traditional absorbing material soft magnetic powder is distributed to be similar in chlorinated polyethylene rubber, be prepared into rubber tabular, on the interference source attaching to electronic equipment or on the transmission line of interference transmission, play the effect of electromagnetic wave absorption interference.But traditional absorbing material adds man-hour requirement sticks adhesive tape, absorbing material just can be made to be bonded on electronic component, add production cost and operation, and the conductive coefficient of absorbing material is lower, is attached on electronic component and is unfavorable for that it dispels the heat, cause chip hyperthermia and superheating, and the electronic component that temperature raises can accelerate the aging of adhesive tape, reduces its adhesive property, causes coming off of absorbing material, electro-magnetic wave absorption effect is disappeared, allows whole equipment fluctuation of service.
Utility model content
The utility model needs to be fixed by adhesive tape for current absorbing material, and cost is high, and operation is many, be unfavorable for heat radiation, easily cause hyperthermia and superheating, adhesive tape aging speed is fast, easily cause and come off, make the deficiencies such as equipment instability, devise a kind of Self-adhesive high-thermal-conductivity absorbing material.
Self-adhesive high-thermal-conductivity absorbing material of the present utility model, comprise two solidification silicone oil composite beds, described solidification silicone oil composite bed is respectively basic unit and top layer, top layer is attached in basic unit, be filled with equally distributed thermal conductive ceramic particle in described basic unit, in described top layer, be filled with laterally alternatively distributed soft magnetic material particle and thermal conductive ceramic particle.
Preferably, the thermal conductive ceramic particle in described basic unit is all positioned in horizontal same aspect.
Preferably, the minimum diameter of the thermal conductive ceramic particle in described basic unit is greater than 50 microns.
Preferably, adjacent thermal conductive ceramic particle contacts with each other.
Preferably, the soft magnetic material particle in described top layer is sheet, is divided into multiple granulation mass, in the interval that the thermal conductive ceramic particle in top layer is all arranged between adjacent particle heap.
Preferably, the longitudinal stacked arrangement of the soft magnetic material particle in granulation mass.
The beneficial effects of the utility model are: Self-adhesive high-thermal-conductivity absorbing material utilizes the solidification silicone oil composite bed with tack, and in solidification silicone oil composite bed, fill soft magnetic material particle respectively and thermal conductive ceramic particle carries out suction ripple and heat conduction, while realizing inhaling wave energy, also achieve the effect of heat radiation, and without the need to arranging adhesive tape, only need the viscosity of solidifying silicone oil composite bed self can be bonded on electronic component, reduce production cost, simplified production process.Thermal conductive ceramic uniform particles distribution in basic unit, the heat making basic unit can absorb electronic component uniformly to send, improves radiating rate; And soft magnetic material particle in top layer and thermal conductive ceramic particle are arranged alternately, while making top layer have suction wave energy, allow the thermal conductive ceramic particle on top layer and the thermal conductive ceramic particle of basic unit form a heat dissipation channel, heat is transmitted out rapidly, plays good radiating effect.
Thermal conductive ceramic particle in basic unit is all positioned at same aspect, adjacent thermal conductive ceramic particle all contacts with each other, make thermal conductive ceramic distribution of particles area larger, and the volume of each thermal conductive ceramic particle is also larger, heat is planar scattered, allow heat be passed to top layer faster, and between adjacent thermal conductive ceramic particle, heat transfer rate is also very fast, further increases radiating effect.
Soft magnetic material particle in top layer is divided into multiple granulation mass, and the longitudinal stacked arrangement of the soft magnetic material particle in granulation mass, improves the application band of material, and longitudinally have certain thickness and the number of plies, ensure that wave-absorbing effect.
Accompanying drawing explanation
Accompanying drawing 1 is the structure chart of this Self-adhesive high-thermal-conductivity absorbing material.
Embodiment
Self-adhesive high-thermal-conductivity absorbing material of the present utility model, as shown in Figure 1, comprise two solidification silicone oil composite beds, solidification silicone oil composite bed for base material, adds the filler such as alundum (Al2O3), boron nitride with the silicone oil of liquid state, adjusts its molecular weight and is solidified and make.Because the base material of solidification silicone oil composite bed is silicone oil, therefore it has certain tack.
Two solidification silicone oil composite beds are respectively basic unit 1 and top layer 2, and top layer 2 is attached in basic unit 1.
Be provided with equally distributed thermal conductive ceramic particle 3 in basic unit 1, thermal conductive ceramic particle 3 is all positioned in horizontal same aspect, and adjacent thermal conductive ceramic particle 3 contacts with each other, and the minimum diameter of thermal conductive ceramic particle 3 is greater than 50 microns.
Soft magnetic material particle 4 and thermal conductive ceramic particle 3 is provided with in top layer 2, soft magnetic material particle 4 is sheet, be divided into multiple granulation mass 5, and the longitudinal stacked arrangement of soft magnetic material particle 4 of sheet in granulation mass 5, it is made longitudinally to have certain thickness, in the interval that thermal conductive ceramic particle 3 is all arranged between adjacent particle heap 5, thus form the distribution laterally replaced.
During use, be attached on electronic component by basic unit 1, the heat sent during electronic component work is delivered in the thermal conductive ceramic particle 3 in basic unit 1, then is delivered to the thermal conductive ceramic particle 3 on top layer 2, finally distributes, and realizes the function of heat radiation.The thermal conductive ceramic particle 3 on top layer 2, between the granulation mass 5 of soft magnetic material particle 4, makes it be connected with the thermal conductive ceramic particle 3 of basic unit 1 in the external world, forms a heat dissipation channel, reach stronger heat conduction and heat radiation effect.
The longitudinal stacked arrangement of soft magnetic material particle 4 of sheet in granulation mass 5, holds thermal conductive ceramic particle 3 in the gap of simultaneously granulation mass 5, improves the electric-breakdown resistance energy of material while ensuring better heat-conducting effect.
According to above-mentioned working method, finally make Self-adhesive high-thermal-conductivity absorbing material realize inhaling the function of ripple and heat radiation simultaneously.
Claims (6)
1. a Self-adhesive high-thermal-conductivity absorbing material, it is characterized in that, comprise two solidification silicone oil composite beds, described solidification silicone oil composite bed is respectively basic unit (1) and top layer (2), top layer (2) is attached in basic unit (1), be filled with equally distributed thermal conductive ceramic particle (3) in described basic unit (1), in described top layer (2), be filled with laterally alternatively distributed soft magnetic material particle (4) and thermal conductive ceramic particle (3).
2. Self-adhesive high-thermal-conductivity absorbing material according to claim 1, is characterized in that, the thermal conductive ceramic particle (3) in described basic unit (1) is all positioned in horizontal same aspect.
3. Self-adhesive high-thermal-conductivity absorbing material according to claim 1, is characterized in that, the minimum diameter of the thermal conductive ceramic particle (3) in described basic unit (1) is greater than 50 microns.
4. the Self-adhesive high-thermal-conductivity absorbing material according to Claims 2 or 3, is characterized in that, adjacent thermal conductive ceramic particle (3) contacts with each other.
5. Self-adhesive high-thermal-conductivity absorbing material according to claim 1, it is characterized in that, soft magnetic material particle (4) in described top layer (2) is sheet, be divided into multiple granulation mass (5), the thermal conductive ceramic particle (3) in top layer (2) is all arranged in the interval arranged between adjacent particle heap (5).
6. Self-adhesive high-thermal-conductivity absorbing material according to claim 5, is characterized in that, soft magnetic material particle (4) the longitudinal stacked arrangement in granulation mass (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420664658.8U CN204168707U (en) | 2014-11-07 | 2014-11-07 | Self-adhesive high-thermal-conductivity absorbing material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420664658.8U CN204168707U (en) | 2014-11-07 | 2014-11-07 | Self-adhesive high-thermal-conductivity absorbing material |
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| Publication Number | Publication Date |
|---|---|
| CN204168707U true CN204168707U (en) | 2015-02-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420664658.8U Expired - Fee Related CN204168707U (en) | 2014-11-07 | 2014-11-07 | Self-adhesive high-thermal-conductivity absorbing material |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107134657A (en) * | 2017-04-18 | 2017-09-05 | 电子科技大学 | A kind of confocal waveguide medium ceramic ring microwave absorbing device of period profile |
| CN107546449A (en) * | 2017-08-18 | 2018-01-05 | 电子科技大学 | A kind of novel high-power microwave and millimeter wave Wind-cooling type conical structure absorbs dry load |
| WO2023024571A1 (en) * | 2021-08-26 | 2023-03-02 | 华为技术有限公司 | Composite heat conductive material and electronic device |
-
2014
- 2014-11-07 CN CN201420664658.8U patent/CN204168707U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107134657A (en) * | 2017-04-18 | 2017-09-05 | 电子科技大学 | A kind of confocal waveguide medium ceramic ring microwave absorbing device of period profile |
| CN107134657B (en) * | 2017-04-18 | 2020-01-10 | 电子科技大学 | Microwave absorbing device for periodically distributed confocal waveguide dielectric ceramic rings |
| CN107546449A (en) * | 2017-08-18 | 2018-01-05 | 电子科技大学 | A kind of novel high-power microwave and millimeter wave Wind-cooling type conical structure absorbs dry load |
| CN107546449B (en) * | 2017-08-18 | 2020-09-25 | 电子科技大学 | Novel high-power microwave millimeter wave air-cooled cone structure absorption dry load |
| WO2023024571A1 (en) * | 2021-08-26 | 2023-03-02 | 华为技术有限公司 | Composite heat conductive material and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: Three road 266200 Jimo City Tianshan Daxin Town, Shandong province Qingdao City No. 50 Patentee after: Qingdao Zhuo Ying Polytron Technologies Inc Address before: 266200 No. three, No. 50 Tianshan Road, Jimo, Shandong, Qingdao Patentee before: QingDao Joinset Science & Technology Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150218 Termination date: 20191107 |