CN204143462U - There is the fingerprint sensor of scratch resistant function - Google Patents
There is the fingerprint sensor of scratch resistant function Download PDFInfo
- Publication number
- CN204143462U CN204143462U CN201420600419.6U CN201420600419U CN204143462U CN 204143462 U CN204143462 U CN 204143462U CN 201420600419 U CN201420600419 U CN 201420600419U CN 204143462 U CN204143462 U CN 204143462U
- Authority
- CN
- China
- Prior art keywords
- substrate
- fingerprint sensor
- weld pad
- sensor chip
- scratch resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003678 scratch resistant effect Effects 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 238000009413 insulation Methods 0.000 claims abstract description 31
- 230000001681 protective effect Effects 0.000 claims abstract description 22
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 9
- 229910052593 corundum Inorganic materials 0.000 claims description 8
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 8
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 8
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 8
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 7
- -1 polyethylene terephthalate Polymers 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 241000218202 Coptis Species 0.000 claims description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000006112 glass ceramic composition Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 210000004087 cornea Anatomy 0.000 description 1
- 210000002615 epidermis Anatomy 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
There is a fingerprint sensor for scratch resistant function, comprising: substrate, sensor chip, multiple weld pad, many wires, insulation course and protective seams.Sensor chip arranges on substrate, on the surface of substrate and the surface of sensor chip be provided with multiple weld pad.Many wires are electrically connected between multiple weld pad.Insulation course is located on substrate, sensor chip, weld pad and wire.Protective seam is located on the surface of insulation course, to prevent the surface of fingerprint sensor from producing scratch, and guarantees that the color on fingerprint sensor surface can not be destroyed, and makes the hydrophobicity on fingerprint sensor surface good.
Description
Technical field
The utility model relates to a kind of sensor, particularly relates to a kind of fingerprint sensor with scratch resistant function.
Background technology
In high-tech society, the clearance password of many electronic equipments or network is all carry out identification with numeral, word or pattern, clearance password due to these all subjects to other people and cracks, so both increase some biological identification conditions on many clearance passwords, with the face of identification biology, cornea, tooth or fingerprint, in these biological identification conditions, be widely used most with identification of fingerprint.
Refer to Fig. 1, Fig. 1 is the schematic diagram of traditional fingerprint sensor.Fingerprint sensor 1 comprises substrate 10, sensor chip 11, multiple weld pad 12a ~ 12d, multiple wires 13a, 13b and insulation course 14, sensor chip 11 is arranged at above substrate 10, multiple weld pad 12a ~ 12d is arranged at above substrate 10 and sensor chip 11 respectively, first end 131a, 131b of many wires 13a, 13b are electrically connected multiple weld pad 12a, 12b of being positioned at above substrate 10, and second end 132a, 132b of many wires 13a, 13b is then electrically connected plural weld pad 12c, 12d of being positioned at above sensor chip 11.After substrate 10, sensor chip 11, multiple weld pad 12a ~ 12d and many wires 13a, 13b are provided with insulation course 14, to form fingerprint sensor 1.
When fingerprint sensor 1 carries out fingerprint sensing, finger can directly be contacted with on the surperficial 14a of insulation course 14 by user, and slip over specific direction (as from top to bottom), sensor chip 11 is allowed to detect line peak and the line paddy of finger print, make sensor chip 11 completely can detect the fingerprint pattern of user, to confirm the identity of user.But the surperficial 14a of insulation course 14 of traditional fingerprint sensor 1, outside being exposed to, is subject to foreign object scratch.Therefore, when the surperficial 14a of traditional fingerprint sensor 1 is by foreign object scratch, can leave scratch at surperficial 14a, this scratch can destroy the color of the surperficial 14a of fingerprint sensor 1, and causes traditional fingerprint sensor 1 outward appearance unsightly.In addition, traditional fingerprint sensor 1 hydrophobicity is not good, and the easy ponding of scratch on the surperficial 14a of insulation course 14, causes and accurately cannot read finger print information.
Utility model content
Fundamental purpose of the present utility model is to provide a kind of fingerprint sensor with scratch resistant function, to prevent the surface of fingerprint sensor from producing scratch, to guarantee that the surface color of fingerprint sensor is not destroyed, and makes the hydrophobicity on fingerprint sensor surface good.
For reaching above-mentioned object, the utility model provides a kind of fingerprint sensor with scratch resistant function to comprise, substrate, sensor chip, multiple weld pad, many wires, insulation course, protective seams.Sensor chip is arranged on substrate.On the surface that multiple weld pad is arranged at substrate and on the surface of sensor chip.Many wires are electrically connected the weld pad that is positioned on substrate surface and are positioned on the weld pad on sensor chip surface.Insulation course is located on substrate, sensor chip, weld pad and wire.Protective seam is arranged on the surface of insulation course.In an embodiment of the present utility model, substrate is plastic material, glass fibre or ceramic material.
In an embodiment of the present utility model, plastic material is tygon, polyethylene terephthalate, polymethylmethacrylate.
In an embodiment of the present utility model, those weld pads are copper product.
In an embodiment of the present utility model, those wires have first end and the second end, the first end of wire is electrically connected the weld pad be positioned on substrate surface, and the second end of wire is then electrically connected on the weld pad that is positioned on sensor chip surface.
In an embodiment of the present utility model, this wire is gold thread.
In an embodiment of the present utility model, insulation course is epoxy resin.
In an embodiment of the present utility model, protective seam is alundum (Al2O3).
In an embodiment of the present utility model, the thickness of this protective seam is 5 ~ 10 μm.
In order to technology, method and effect that the utility model is taked for reaching set object further can be understood, refer to following relevant detailed description of the present utility model, accompanying drawing, believe the purpose of this utility model, feature and feature, when being goed deep into thus and concrete understanding, but appended accompanying drawing and annex only provide with reference to and use is described, be not used for the utility model in addition limitr.
Accompanying drawing explanation
Fig. 1 is traditional fingerprint sensor structural representation.
Fig. 2 is the fingerprint sensor package schematic flow sheet with scratch resistant function of the utility model.
Fig. 3 is exterior substrate schematic diagram of the present utility model.
Fig. 4 is the utility model affixed sensor chip schematic diagram on substrate.
To be the utility model make weld pad schematic diagram to Fig. 5 on the surface of substrate and sensor chip.
To be the utility model make wire bond schematic diagram to Fig. 6 on the weld pad of substrate and sensor chip.
Fig. 7 is the utility model packaging insulating layer schematic diagram on substrate, sensor chip, weld pad and wire.
Fig. 8 is that the utility model makes protective seam schematic diagram on the insulation course of fingerprint sensor.
Fig. 9 is the fingerprint sensor using state schematic diagram with scratch resistant function of the present utility model.
Wherein Reference numeral:
1,2: fingerprint sensor
10,20: substrate
11,21: sensor chip
12,22a ~ 22d: weld pad
13,23a, 23b: wire
131,231a, 232a: first end
132, the 231b, 232b: second end
14,24: insulation course
25: protective seam
S100 ~ S110 is method step
Embodiment
The technical content and a detailed description of the utility model, now coordinate accompanying drawing to be described as follows:
Referring to Fig. 2 and Fig. 3-8, is of the present utility modelly have the fingerprint sensor package flow process of scratch resistant function and the structural representation of corresponding each step respectively.As shown in Figure 2, the fingerprint sensor 2 with scratch resistant function of the present utility model is when encapsulating, as step S100, have a substrate 20 (as shown in Figure 3), substrate 20 is the tygon (Polyethylene of plastic material, PE), polyethylene terephthalate (PolyethyleneTerephthalate, PET), polymethylmethacrylate (Polymethyl methacrylate, PMMA) substrate or glass fibre material or ceramic material substrate.
Step S102, die bond makes, and the surface lying in substrate 1 is coated with one deck crystal-bonding adhesive (figure does not look), with the affixed sensor chip 21 of crystal-bonding adhesive, makes sensor chip 21 die bond (as shown in Figure 4) on the surface of substrate 20.In this accompanying drawing, crystal-bonding adhesive is elargol.
Step S104, weld pad makes, and after above-mentioned sensor chip 21 is fixed in the surface of substrate 20, then is made on the surface of substrate 20 and sensor chip 21 with metal material, to form weld pad 22a ~ 22d (as shown in Figure 5).In this accompanying drawing, weld pad 22a ~ 22d is copper product.
Step S106, routing makes, and after above-mentioned weld pad 22a ~ 22d completes, with wire bonder, first end 231a, 231b of wire 23a, 23b is electrically connected weld pad 22a, 22b of being positioned on substrate 20 surface.In addition, second end 232a, 232b of wire 23a, 23b is then electrically connected weld pad 22c, 22d (as shown in Figure 6) of being positioned on sensor chip 21 surface.In this accompanying drawing, wire 23a, 23b are gold thread.
Step S108, insulation course makes, above-mentioned complete routing after, with a glue or coating method, insulating gel is formed on substrate 20, sensor chip 21, weld pad 22a ~ 22d and wire 23a ~ 23b, make insulating gel seal substrate 20, sensor chip 21, weld pad 22a ~ 22d and wire 23a ~ 23b to form the insulation course 24 (as shown in Figure 7) that has the surface 241 of sensing.In this accompanying drawing, insulation course 24 is epoxy resin.
Step S110, protective seam makes, in the mode of plated film (as technology such as spraying, sputter or chemical vapor deposition CVD) by alundum (Al2O3) (Al
2o
3) take shape on the surface 241 of insulation course 24, make alundum (Al2O3) (Al
2o
3) form a protective seam 25, due to alundum (Al2O3) (Al
2o
3) Mohs value reach 9, make the surface 241 of insulation course 24 have good scratch resistant wearing quality.In addition, due to alundum (Al2O3) (Al
2o
3) there is hydrophobic characteristic, make the surface 241 of insulation course 24 have the characteristic of waterproof.Briefly, as alundum (Al2O3) (Al
2o
3) when the surface 241 of insulation course 24 forms protective seam 25, this protective seam 25 not only can protect primary colour (as shown in Figure 8), can also have the effect of waterproof.In this accompanying drawing, the thickness of protective seam 25 is 5 ~ 10 μm.
Refer to Fig. 8, the fingerprint sensor schematic diagram with scratch resistant function of the present utility model.The fingerprint sensor 2 with scratch resistant function of the present utility model at least comprises substrate 20, sensor chip 21, multiple weld pad 22, many wires 23, insulation course 24 and protective seams 25.
Substrate 20, in order to die bond sensor chip 21, in this accompanying drawing, substrate 20 is plastic material, glass fibre material or ceramic material, plastic material is tygon (Polyethylene, PE), polyethylene terephthalate (Polyethylene Terephthalate, PET), polymethylmethacrylate (Polymethylmethacrylate, PMMA).
Sensor chip 21, is arranged on substrate 20, for sensing finger close to information, as the line peak of finger and the information of line paddy and the close information, particularly distance of sensor chip 21, comprehensively these close information, the pattern of hand fingerprint peaks and line paddy can be obtained, the fingerprint pattern be namely generally called.
Weld pad 22a ~ 22d, on the surface being located at substrate 20 respectively and on the surface of sensor chip 21, the quantity of weld pad 22a ~ 22d is not limited especially, as long as can reach good signal transmission.In this accompanying drawing, weld pad 22a ~ 22d is copper product.
Wire 23a, 23b have first end 231a, 231b and second end 232a, 232b respectively, and first end 231a, 231b of wire 23a, 23b are electrically connected weld pad 22a, 22b of being positioned on substrate 20 surface.Second end 232a, 232b of wire 23a, 23b is then electrically connected weld pad 22c, 22d of being positioned on sensor chip 21 surface.Those wires 23a, 23b are used for transmitting power supply or electric signal between substrate 20 and sensor chip 21.The routing technology of wire 23a, 23b can adopt existing technology, and in wire-bonding package process, wire 23a, 23b and weld pad 22a ~ 22d also can be formed simultaneously.In this accompanying drawing, wire 23a, 23b are gold thread.
Insulation course 24, is located on substrate 20, sensor chip 21, weld pad 22a ~ 22d and wire 23a, 23b, and substrate 20, sensor chip 21, weld pad 22a ~ 22d and wire 23a, 23b are not damaged by foreign object affects.In this accompanying drawing, insulation course 24 is transparent or semitransparent epoxy resin.
Protective seam 25, is located on the surface 241 of insulation course 24, makes the surface 241 of insulation course 24 have effect that is scratch resistant, waterproof, surface 241 color of insulation course 24 can be protected not to be destroyed simultaneously.Moreover protective seam 25 can increase fingerprint sensor 2 operating surface flatness, make sensor chip 21 identification more accurate.In this accompanying drawing, protective seam 25 is alundum (Al2O3) (Al
2o
3).
Refer to Fig. 9, the fingerprint sensor using state schematic diagram with scratch resistant function of the present utility model.When the finger 3 of user touches the protective seam 25 of fingerprint sensor; the square wave that fingerprint sensor 2 is launched can point 3 by directive; and the energy of square wave can through pointing 3 epidermis lines reflections, and this energy can penetrate insulation course 24 and protective seam 25 via the contact between the finger 3 of user and fingerprint sensor 2.When the energy of square wave is after finger 3 reflection, initiatively can be received by sensor chip 21.After sensor chip 21 senses the square wave of reflection, get final product information or the energy of the square wave that computational reflect returns, and obtain the grain pattern of finger 3 fingerprint of user.After sensor chip 21 receives the grain pattern of finger 3 fingerprint of user, the grain pattern of finger 3 fingerprint can be passed to electron process chip (non-icon), carry out the functions such as identity identification, data encryption, data storing, financial function, Electronic Signature for electron process chip.
The foregoing is only preferred embodiment of the present utility model; be not intended to limit to scope of patent protection of the present utility model; therefore the equivalence change of such as using the utility model instructions or accompanying drawing content to do, be all in like manner all contained within the scope of rights protection of the present utility model, stated.
Claims (9)
1. there is a fingerprint sensor for scratch resistant function, it is characterized in that, comprising:
One substrate;
One sensor chip, is arranged on this substrate;
Multiple weld pad, on the surface being located at this substrate respectively and on the surface of this sensor chip;
Many wires, are electrically connected the weld pad that is positioned on this substrate surface and are positioned on the weld pad on this sensor chip surface; And,
One insulation course, is located on this substrate, this sensor chip, this weld pad and this wire; And,
One protective seam, is located on the surface of this insulation course.
2. have the fingerprint sensor of scratch resistant function as claimed in claim 1, it is characterized in that, this substrate is plastic material, glass fibre or ceramic material.
3. have the fingerprint sensor of scratch resistant function as claimed in claim 2, it is characterized in that, this plastic material is tygon, polyethylene terephthalate, polymethylmethacrylate.
4. have the fingerprint sensor of scratch resistant function as claimed in claim 1, it is characterized in that, those weld pads are copper product.
5. there is the fingerprint sensor of scratch resistant function as claimed in claim 1, it is characterized in that, those wires have a first end and one second end, the first end of this wire is electrically connected the weld pad be positioned on this substrate surface, and the second end of this wire is then electrically connected on the weld pad that is positioned on this sensor chip surface.
6. have the fingerprint sensor of scratch resistant function as claimed in claim 5, it is characterized in that, this wire is gold thread.
7. have the fingerprint sensor of scratch resistant function as claimed in claim 1, it is characterized in that, this insulation course is epoxy resin.
8. have the fingerprint sensor of scratch resistant function as claimed in claim 1, it is characterized in that, this protective seam is alundum (Al2O3).
9. have the fingerprint sensor of scratch resistant function as claimed in claim 1, it is characterized in that, the thickness of this protective seam is 5 ~ 10 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420600419.6U CN204143462U (en) | 2014-10-17 | 2014-10-17 | There is the fingerprint sensor of scratch resistant function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420600419.6U CN204143462U (en) | 2014-10-17 | 2014-10-17 | There is the fingerprint sensor of scratch resistant function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204143462U true CN204143462U (en) | 2015-02-04 |
Family
ID=52420135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420600419.6U Expired - Fee Related CN204143462U (en) | 2014-10-17 | 2014-10-17 | There is the fingerprint sensor of scratch resistant function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204143462U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105512634A (en) * | 2015-12-14 | 2016-04-20 | 联想(北京)有限公司 | Induction device and electronic equipment |
| CN106206481A (en) * | 2016-05-05 | 2016-12-07 | 深圳信炜科技有限公司 | Bio-identification module and preparation method thereof, electronic equipment |
| CN106505044A (en) * | 2015-09-07 | 2017-03-15 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
| CN107977595A (en) * | 2016-10-25 | 2018-05-01 | 致伸科技股份有限公司 | Identification of fingerprint module |
| CN108630556A (en) * | 2017-03-23 | 2018-10-09 | 南茂科技股份有限公司 | Fingerprint identification packaging structure and manufacturing method thereof |
| CN114854320A (en) * | 2022-07-06 | 2022-08-05 | 武汉市三选科技有限公司 | Chip protective film, preparation method thereof and chip |
-
2014
- 2014-10-17 CN CN201420600419.6U patent/CN204143462U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106505044A (en) * | 2015-09-07 | 2017-03-15 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
| CN105512634A (en) * | 2015-12-14 | 2016-04-20 | 联想(北京)有限公司 | Induction device and electronic equipment |
| CN105512634B (en) * | 2015-12-14 | 2019-01-15 | 联想(北京)有限公司 | A kind of sensing device and a kind of electronic equipment |
| CN106206481A (en) * | 2016-05-05 | 2016-12-07 | 深圳信炜科技有限公司 | Bio-identification module and preparation method thereof, electronic equipment |
| CN107977595A (en) * | 2016-10-25 | 2018-05-01 | 致伸科技股份有限公司 | Identification of fingerprint module |
| CN108630556A (en) * | 2017-03-23 | 2018-10-09 | 南茂科技股份有限公司 | Fingerprint identification packaging structure and manufacturing method thereof |
| CN114854320A (en) * | 2022-07-06 | 2022-08-05 | 武汉市三选科技有限公司 | Chip protective film, preparation method thereof and chip |
| CN114854320B (en) * | 2022-07-06 | 2022-09-23 | 武汉市三选科技有限公司 | Chip protective film, preparation method thereof and chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150204 |