CN107977595A - Identification of fingerprint module - Google Patents
Identification of fingerprint module Download PDFInfo
- Publication number
- CN107977595A CN107977595A CN201610939122.6A CN201610939122A CN107977595A CN 107977595 A CN107977595 A CN 107977595A CN 201610939122 A CN201610939122 A CN 201610939122A CN 107977595 A CN107977595 A CN 107977595A
- Authority
- CN
- China
- Prior art keywords
- identification
- fingerprint
- sensing element
- fingerprint module
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The present invention relates to a kind of identification of fingerprint module, it includes identification of fingerprint sensing element, film plating layer and circuit board.Identification of fingerprint sensing element is arranged on circuit board, and film plating layer is arranged on identification of fingerprint sensing element.The insulation glue-line of film plating layer is arranged on the upper surface of identification of fingerprint sensing element, to prevent electrostatic charge from entering in identification of fingerprint sensing element.In other words, identification of fingerprint module of the present invention substitutes traditional becket to prevent electrostatic effect with film plating layer, it can not only save the material cost of identification of fingerprint module, can also reduce the thickness of identification of fingerprint module.
Description
Technical field
The present invention relates to a kind of identity identification element, more particularly to a kind of fingerprint by identification of fingerprint user's identity to distinguish
Know module.
Background technology
In recent years, identification of fingerprint technology is applied in various electronic products, makes user to input the fingerprint of oneself in electricity
In sub- product and electronic product is allowed to achieve, user can input the fingerprint of oneself by identification of fingerprint module afterwards, to carry out electricity
The unlock of sub- product.The unlocking manner of password is manually entered than ever faster to unlock electronic product using identification of fingerprint technology
It is fast, more convenient, therefore favored be subject to user, and the demand of identification of fingerprint module also increases therewith.
The structure of existing identification of fingerprint module will be illustrated next.Referring to Fig. 1, it is the structure of existing identification of fingerprint module
Decomposition diagram.Existing identification of fingerprint module 1 includes identification of fingerprint sensing element 10, film plating layer 11, circuit board 12 and metal
Ring 13.Identification of fingerprint sensing element 10 is arranged on circuit board 11 and is electrically connected and can obtain electric power, its function is sense
Answer the finger of user and capture its finger print information.Film plating layer 11 is to be arranged at identification of fingerprint sensing element 10 with coating technique
Upper surface, its function can more provide the color being consistent with electronic product in addition to it can protect identification of fingerprint sensing element 10, or
The required particular color of person.Becket 13 is sheathed on identification of fingerprint sensing element 10, to conduct on the finger of user
Electric charge or external electric charge, and static discharge (Electrostatic Discharge, ESD) effect can be avoided to occur.
In order to avoid static discharge effect, existing identification of fingerprint module 1 be by setting becket 13 to solve the problems, such as it,
Simultaneously as setting becket 13, it not only increases material and assembly cost, further increases the thickness of identification of fingerprint module.
It there is low thickness and can prevent the identification of fingerprint module of static discharge effect therefore, it is necessary to a kind of.
The content of the invention
It is a primary object of the present invention to provide a kind of to have low thickness and can prevent the identification of fingerprint of static discharge effect
Module.
In a preferred embodiment, the present invention provides a kind of identification of fingerprint module, including an identification of fingerprint sensing element, one
Film plating layer and a circuit board.The identification of fingerprint sensing element is detecting a fingermark image of a finger.The film plating layer is set
In on a upper surface of the identification of fingerprint sensing element, which includes an insulation glue-line and a protective layer.The insulating cement
Layer is arranged on the upper surface of the identification of fingerprint sensing element, to prevent an electrostatic charge from entering identification of fingerprint sensing member
In part.The protective layer is arranged at the top of the insulation glue-line, to protect the insulation glue-line.The circuit board is located at the identification of fingerprint
The lower section of sensing element and the identification of fingerprint sensing element is electrically connected at, wherein, the thickness of the insulation glue-line is 5~11 microns
(μm)。
The advantages of identification of fingerprint module provided by the invention and beneficial effect are：In short, identification of fingerprint mould of the present invention
Block in film plating layer by increasing insulation glue-line, to substitute traditional becket to carry out electrostatic isolation electric charge.And the thickness for the glue-line that insulate
Spend for 5~11 microns, therefore will not substantially increase the thickness of identification of fingerprint module.Due to being not required to set becket in wherein, not only
The material cost of becket can be saved, can also subtract the thickness of becket, to reduce the thickness of identification of fingerprint module, and can be realized
The volume of identification of fingerprint module is lightening.
Brief description of the drawings
Fig. 1 is the structural decomposition diagram of existing identification of fingerprint module.
Fig. 2 is structural decomposition diagram of the identification of fingerprint module of the present invention in the first preferred embodiment.
Fig. 3 is structure diagram of the identification of fingerprint module of the present invention in the first preferred embodiment.
Fig. 4 is the structure diagram at identification of fingerprint module another visual angle in the first preferred embodiment of the present invention.
Fig. 5 is structural profile illustration of the film plating layer of identification of fingerprint module of the present invention in the first preferred embodiment.
Fig. 6 is structure diagram of the identification of fingerprint module of the present invention in the second preferred embodiment.
Description of reference numerals：
1st, 2 identification of fingerprint modules 10,20 identification of fingerprint sensing elements
11st, 21 film plating layers 12,22 circuit boards
13 becket, 23 support plate
24 first waterproofing elements, 25 adhesion coating
26 connector, 27 wire support plate
28 electronic component, 29 second waterproofing elements
30 protective film, 31 foam
211 insulation 212 prime coats of glue-line
213 color layer, 214 protective layer
221 plate body, 222 wire portion
The second surface of 2222 wire portion of first surface of 2221 wire portions
Embodiment
The present invention provides a kind of identification of fingerprint module for solving prior art problem.Please refer to Fig. 2~Fig. 4, Fig. 2
For structural decomposition diagram of the identification of fingerprint module in the first preferred embodiment, Fig. 3 is identification of fingerprint module of the present invention in the
Structure diagram in one preferred embodiment, and Fig. 4 regards for identification of fingerprint module of the present invention is another in the first preferred embodiment
The structure diagram at angle.Fig. 2 shows each element of identification of fingerprint module 2, it includes identification of fingerprint sensing element 20, film plating layer
21st, circuit board 22, support plate 23, the first waterproofing elements 24, adhesion coating 25, connector 26 (refer to Fig. 4), wire support plate
27th, multiple electronic components 28, the second waterproofing elements 29.The function of identification of fingerprint sensing element 20 is the finger of detection user
The fingermark image of (not shown in the figures), and film plating layer 21 is the upper table that identification of fingerprint sensing element 20 is arranged in a manner of plated film
On face.Circuit board 22 is located at the lower section of identification of fingerprint sensing element 20 and is electrically connected at identification of fingerprint sensing element 20, it can
Power supply give identification of fingerprint sensing element 20, and can receive and transmission fingerprint identification sensing element 20 caused by electronic signal.Electricity
Road plate 22 includes plate body 221 and wire portion 222, and plate body 221 can carry electronic component 28 and adhesion coating 25, and wire portion
222 be to be extended by plate body 221 and formed.Wherein, its length of the shape of wire portion 222 can arbitrarily change according to demand, rather than with
It is limited shown in figure.In this preferred embodiment, identification of fingerprint sensing element 20 be with grid array (Land Grid Array,
LGA) mode or ball grid array (Ball Grid Array, BGA) mode and encapsulate it, and flexible circuit can be selected in circuit board 22
Plate (FPC) or soft-hard composite board.
Support plate 23 is arranged at the lower section of circuit board 22, it can strengthen the structure of support plate 22.First waterproofing elements 24 are set
It is placed on circuit board 22 and around identification of fingerprint sensing element 20, its function is isolation foreign liquid by identification of fingerprint sensing element
Gap between circuit board 22 enters identification of fingerprint sensing element 20, to provide water-proof function.Adhesion coating 25 is arranged at support
Between plate 23 and circuit board 22, it can combine support plate 23 and circuit board 22.In this preferred embodiment, the first water repellent element
Part 24 is waterproof sealing.
Connector 26 is arranged on the first surface 2221 of wire portion 222, it, which can be established, is electrically connected plate body 221 and outer
Carry out electronic component (not shown in the figures), wherein, foreign electron element is, for example, the electronic product of accommodating identification of fingerprint module 2
Connecting portion, to establish the electric connection between identification of fingerprint module 2 and electronic product.Wire support plate 27 is arranged at wire portion
On 222 second surface 2222, that is, the back side of the part of connector 26 is set, it can strengthen the structure of wire portion 222, with firm
The setting of connector 26.Multiple electronic components 28 are arranged on plate body 221, it can produce specific function, and the second water repellent element
Part 29 covers multiple electronic components 28 on plate body 221, is entered with completely cutting off foreign liquid in multiple electronic components 28.Each element knot
Close and form identification of fingerprint module 2, its bonding state is as shown in Figure 3 and 4.In this preferred embodiment, multiple electronics members
Part 28 can use capacitance, diode or processor etc., and the second waterproofing elements 29 are waterproof sealing.
The structure of film plating layer 21 will be illustrated next.Referring to Fig. 5, its for identification of fingerprint module of the present invention film plating layer in the
Structural profile illustration in one preferred embodiment.Film plating layer 21 include insulation glue-line 211, prime coat 212, color layer 213 with
And protective layer 214.Insulation glue-line 211, which is set, to be arranged in a manner of plated film on the upper surface of identification of fingerprint sensing element 20, its function
To prevent electrostatic charge from entering in identification of fingerprint sensing element 20, wherein, the thickness of insulation glue-line 211 is 5~11 microns (μm).
Prime coat 212 is arranged in a manner of plated film on the upper surface of insulation glue-line 211, it is used as bottoming.Color layer 213 is with plated film
Mode is arranged on the upper surface of prime coat 212, and color layer 213 is made of colored paint, so that film plating layer 21 shows institute
The color needed.In this preferred embodiment, insulation glue-line 211 is to insulate made by Resin materials, and protective layer 214 is with UV
Made by paint material, and the glue-line 211 that insulate, prime coat 212, color layer 213 and protective layer 214 respectively in a manner of plated film into
Type.
Specifically three, first, film plating layer 21 of the invention is in prime coat 212, color layer 213 and protective layer
214 lower section additionally sets insulation glue-line 211, and by the 211 electrostatic isolation electric charge of glue-line that insulate, to prevent static discharge from imitating
Should.Wherein, if the thickness of insulation glue-line 211 is excessive, it will influence identification of fingerprint sensing element 20, cause identification of fingerprint sensing member
The induction sensitivity of part 20 declines.Conversely, if the thickness of insulation glue-line 211 is too small, the isolation effect of its electrostatic charge is bad.
By experiment test repeatedly, identification of fingerprint sensing element can be had concurrently at the same time using the insulation glue-line 211 that its thickness is 5~11 microns
20 induction sensitivity and the isolation effect of electrostatic charge.
Second, after identification of fingerprint module 2 is completed, more protective film can be set in the upper surface of film plating layer 21
30, to protect identification of fingerprint module 2.Its protective film 30 only provides temporary protection, when identification of fingerprint module 2 is intended to be assembled in
Before in electronic product, then it must go to remove it, to influence the running of identification of fingerprint sensing element 20.
3rd, tested repeatedly by many experiments, identification of fingerprint module of the present invention, can after being assembled in electronic product
Sequentially by static gun respectively with 4 kilovolts of ﹣ (KV)~4 kilovolts of ﹢, 6 kilovolts of ﹣~﹢, 6 kilovolts and 8 kilovolts of ﹣~﹢ 8
The contact discharge test of kilovolt level.In addition, the identification of fingerprint module being assembled in electronic product also can be sequentially by quiet
The contactless discharge test of electric rifle, its voltage layer level are respectively 10 kilovolts of 8 kilovolts of ﹣~﹢, 8 kilovolts, 10 kilovolts of ﹣~﹢
Special, 15 kilovolt of 12 kilovolts of ﹣~﹢, 12 kilovolts and 15 kilovolts of ﹣~﹢.Therefore, identification of fingerprint module of the present invention can pass through
The electrostatic discharge testing of high standard.
In addition, the present invention also provides one second preferred embodiment.Referring to Fig. 6, its for identification of fingerprint module of the present invention in
Structure diagram in second preferred embodiment.In this preferred embodiment, identification of fingerprint module of the present invention more sets foam 31
The top of circuit board, and set in a manner of around the first waterproofing elements, it can be with accommodating identification of fingerprint module in electricity therein
Sub- product contact, shockproof function is provided to absorb vibrations.It is only that illustration is used, rather than as limit.In another preferably real
Apply in example, can more setting foam, it can equally provide shockproof function in the lower section of support plate.
As described above, identification of fingerprint module of the present invention by film plating layer increase insulation glue-line, to substitute tradition
Becket carry out electrostatic isolation electric charge.And the thickness for the glue-line that insulate is 5~11 microns, therefore it will not substantially increase identification of fingerprint module
Thickness.Due to being not required to set becket not only to save the material cost of becket in wherein, can also subtract the thickness of becket
Degree, to reduce the thickness of identification of fingerprint module, and can realize that the volume of identification of fingerprint module is lightening.
The foregoing is merely presently preferred embodiments of the present invention, be not limited to protection scope of the present invention, thus it is all its
It is intended to be limited solely by claim of the invention without departing from the lower equivalent change or modification completed of spirit disclosed in this invention
In book.
Claims (10)
1. a kind of identification of fingerprint module, including：
One identification of fingerprint sensing element, to detect a fingermark image of a finger；
One film plating layer, is arranged on a upper surface of the identification of fingerprint sensing element, which includes：
One insulation glue-line, is arranged on the upper surface of the identification of fingerprint sensing element, to prevent the electrostatic charge from entering should
In identification of fingerprint sensing element；And
One protective layer, is arranged at the top of the insulation glue-line, to protect the insulation glue-line；
One circuit board, positioned at the lower section of the identification of fingerprint sensing element and is electrically connected at the identification of fingerprint sensing element；Wherein,
The thickness of the insulation glue-line is 5~11 microns.
2. identification of fingerprint module as claimed in claim 1, the wherein film plating layer further include：
One prime coat, is arranged on a upper surface of the insulation glue-line；And
One color layer, is arranged on a upper surface of the prime coat, so that the film plating layer shows a color.
3. identification of fingerprint module as claimed in claim 2, wherein the insulation glue-line, the prime coat, the color layer and this is anti-
Sheath is molded in a manner of plated film.
4. identification of fingerprint module as claimed in claim 1, further includes：
One support plate, is arranged at the lower section of the circuit board, to strengthen the structure of the support plate；
One waterproofing elements, are arranged on the circuit board and around the identification of fingerprint sensing element, to completely cut off a foreign liquid into
Enter the identification of fingerprint sensing element；And
One adhesion coating, is arranged between the support plate and the circuit board, to combine the support plate and the circuit board.
5. identification of fingerprint module as claimed in claim 4, the wherein circuit board include：
One plate body, to carry the electronic component and the adhesion coating；And
One wire portion, is extended by the plate body and is formed.
6. identification of fingerprint module as claimed in claim 5, further includes：
A connector, is arranged on a first surface of the wire portion, is for electrically connecting to the plate body and foreign electron member
Part；
One wire support plate, is arranged on a second surface of the wire portion, to strengthen the structure of the wire portion；
One electronic component, is arranged on the plate body；And
One another waterproofing elements, cover the electronic component on the plate body, enter the electronic component to completely cut off the foreign liquid.
7. identification of fingerprint module as claimed in claim 1, wherein the insulation glue-line are to insulate made by Resin materials.
8. identification of fingerprint module as claimed in claim 1, the wherein circuit board are flexible PCBs.
9. identification of fingerprint module as claimed in claim 1, further includes a protective film, the upper surface of the film plating layer is covered in,
To protect the identification of fingerprint module.
10. identification of fingerprint module as claimed in claim 1, further includes a foam, it is arranged on the circuit board and refers to around this
Line recognizes sensing element, or is arranged at the lower section of the circuit board, to absorb vibrations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610939122.6A CN107977595A (en) | 2016-10-25 | 2016-10-25 | Identification of fingerprint module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610939122.6A CN107977595A (en) | 2016-10-25 | 2016-10-25 | Identification of fingerprint module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107977595A true CN107977595A (en) | 2018-05-01 |
Family
ID=62005182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610939122.6A Pending CN107977595A (en) | 2016-10-25 | 2016-10-25 | Identification of fingerprint module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107977595A (en) |
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| US20080069413A1 (en) * | 2004-06-18 | 2008-03-20 | Fingerprint Cards Ab | Fingerprint Sensor Equipment |
| TW201306650A (en) * | 2011-07-18 | 2013-02-01 | Fih Hong Kong Ltd | Method for forming pattern on substrate and product thereof |
| CN104182746A (en) * | 2014-08-26 | 2014-12-03 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and manufacturing method thereof |
| CN204143462U (en) * | 2014-10-17 | 2015-02-04 | 茂丞科技股份有限公司 | There is the fingerprint sensor of scratch resistant function |
| CN104965613A (en) * | 2015-07-13 | 2015-10-07 | 伯恩光学(惠州)有限公司 | Touch screen |
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| CN204808352U (en) * | 2015-04-23 | 2015-11-25 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module |
| CN105183221A (en) * | 2015-08-27 | 2015-12-23 | 上海箩箕技术有限公司 | Touch awakening fingerprint imaging module group and touch awakening apparatus thereof |
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| CN105205470A (en) * | 2015-09-29 | 2015-12-30 | 上海箩箕技术有限公司 | Fingerprint imaging module |
| CN105718843A (en) * | 2014-12-03 | 2016-06-29 | 关键应用科技股份有限公司 | Fingerprint recognition device and manufacturing method thereof |
| TW201626289A (en) * | 2015-01-05 | 2016-07-16 | 致伸科技股份有限公司 | Sensing device |
| TW201627915A (en) * | 2015-01-19 | 2016-08-01 | 致伸科技股份有限公司 | A method of producing sensing device |
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2016
- 2016-10-25 CN CN201610939122.6A patent/CN107977595A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080069413A1 (en) * | 2004-06-18 | 2008-03-20 | Fingerprint Cards Ab | Fingerprint Sensor Equipment |
| TW201306650A (en) * | 2011-07-18 | 2013-02-01 | Fih Hong Kong Ltd | Method for forming pattern on substrate and product thereof |
| CN104182746A (en) * | 2014-08-26 | 2014-12-03 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and manufacturing method thereof |
| CN204143462U (en) * | 2014-10-17 | 2015-02-04 | 茂丞科技股份有限公司 | There is the fingerprint sensor of scratch resistant function |
| CN105718843A (en) * | 2014-12-03 | 2016-06-29 | 关键应用科技股份有限公司 | Fingerprint recognition device and manufacturing method thereof |
| TW201626289A (en) * | 2015-01-05 | 2016-07-16 | 致伸科技股份有限公司 | Sensing device |
| TW201627915A (en) * | 2015-01-19 | 2016-08-01 | 致伸科技股份有限公司 | A method of producing sensing device |
| CN204719770U (en) * | 2015-04-17 | 2015-10-21 | 江苏正桥影像科技股份有限公司 | A kind of fingerprint recognition assembly |
| CN204808352U (en) * | 2015-04-23 | 2015-11-25 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module |
| CN104965613A (en) * | 2015-07-13 | 2015-10-07 | 伯恩光学(惠州)有限公司 | Touch screen |
| CN204904293U (en) * | 2015-08-07 | 2015-12-23 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and electronic equipment |
| CN105183221A (en) * | 2015-08-27 | 2015-12-23 | 上海箩箕技术有限公司 | Touch awakening fingerprint imaging module group and touch awakening apparatus thereof |
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| PB01 | Publication | ||
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Application publication date: 20180501 |