Utility model content
The utility model is intended to solve one of technical matters in correlation technique at least to a certain extent.
The utility model completes based on the following discovery of inventor:
Sapphire, owing to having excellent hardness and toughness, is applied in mobile phone screen, camera and fingerprint recognition system, so that using sapphire electronic equipment and electronic unit to resist better collides with, born and scuffing.But, because sapphire introducing adds preparation cost, and also higher to the refraction of light, the electronic equipment in use brightness adopting the cover plate materials such as sapphire is reduced.Therefore, under guarantee electronic equipment and electron device have the prerequisite of certain anti-performance of colliding with and scratch, need the production cost of reduction electronic equipment and electronic unit further and simplify procedure for producing.
In view of this, in first aspect of the present utility model, the utility model proposes a kind of fingerprint recognition module.Optionally, this module comprises: flexible print circuit board; Background Grid array packages body, described Background Grid array packages body is arranged on the upper surface of described flexible print circuit board, and described Background Grid array packages body is electrically connected with described flexible print circuit board; Becket, described becket is arranged on the upper surface of described flexible print circuit board, and described becket is electrically connected with described flexible print circuit board; And ink layer, described ink layer is arranged on the upper surface of described Background Grid array packages body.Thus, by the use of cover plate materials in fingerprint recognition module such as replacing sapphire that arrange of ink layer, thus production cost can have been saved, and then improve cost performance and the result of use of this fingerprint recognition module.
Optionally, this fingerprint recognition module have further following additional technical feature one of at least:
Optionally, fingerprint Identification sensor is contained in described Background Grid array packages body.Thus, identification and the sensing conversion of fingerprint can be completed by the Background Grid array packages body with higher position reason speed, and then improve the result of use of this fingerprint recognition module.
Optionally, described Background Grid array packages body is electrically connected with described flexible print circuit board by tin cream.Thus, on the basis ensureing the degree of reliability that Background Grid array packages body is electrically connected with flexible print circuit board, production cost can be reduced further, and then improves cost performance and the result of use of this fingerprint recognition module.
Optionally, described becket is around described Background Grid array packages body and described ink layer.Thus, by becket for Background Grid array packages body and ink layer provide extra protection, and then the result of use of fingerprint recognition module can be improved.
Optionally, described becket is electrically connected with described flexible print circuit board by tin cream.Thus, by this electrical connection, the electrical functions of becket can be realized, and then strengthen fingerprint recognition bed sensor to the recognition capability of fingerprint, and improve the result of use of this fingerprint recognition module.
Optionally, described becket has signal emission function.Thus, by the transmitting of signal, the electrical functions of this becket can be realized, strengthen fingerprint Identification sensor to the recognition capability of fingerprint, improve the result of use of this fingerprint recognition module.
Optionally, described ink layer is formed by the mode of spraying or serigraphy.Thus, this ink layer can be formed in position easily, thus simplify the procedure for producing of this fingerprint recognition module, and reduce the production cost of this fingerprint recognition module.
In second aspect of the present utility model, the utility model proposes a kind of electronic equipment.Optionally, this electronic equipment comprises the previously described fingerprint recognition module according to any one embodiment of the present utility model.Thus, can by previously described fingerprint recognition module for this electronic equipment provide the module had compared with high performance-price ratio and good result of use, thus improve the result of use of this electronic equipment and expand the using function of this electronic equipment.
Optionally, described electronic equipment comprises mobile phone, panel computer or portable computer.Thus, the range of application of this electronic equipment can be expanded.
Embodiment
Be described below in detail embodiment of the present utility model, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the embodiment be described with reference to the drawings, only for explaining the utility model, and can not being interpreted as restriction of the present utility model.
In first aspect of the present utility model, the utility model proposes a kind of fingerprint recognition module.According to embodiment of the present utility model, with reference to figure 1, this fingerprint recognition module comprises: flexible print circuit board 100, Background Grid array packages body 200, becket 300 and ink layer 400.Wherein, according to embodiment of the present utility model, Background Grid array packages body 200 is arranged on the upper surface of flexible print circuit board 100, is electrically connected with flexible print circuit board 100, to complete fingerprint identification function; Becket 300 is arranged on the upper surface of flexible circuit board 100, and is electrically connected with flexible print circuit board 100; Ink layer 400 is arranged on the upper surface of Background Grid array packages body 200, for Background Grid array packages body 200 provides protection.Thus, the effect of the cover plate materials such as sapphire in conventional fingerprint identification module is replaced by ink layer 400, and then the production cost reduced according to the fingerprint recognition module of the utility model embodiment, simplify the procedure for producing of this module, and then improve the result of use according to the module of the utility model embodiment.
Below formation is described in detail according to all parts of the fingerprint recognition module of the utility model embodiment.
According to embodiment of the present utility model, with reference to figure 2, containing fingerprint Identification sensor 210 in Background Grid array packages body 200, to complete fingerprint recognition and signal conversion.Wherein, it will be understood by those skilled in the art that the particular type of fingerprint Identification sensor 210 is not particularly limited.Those skilled in the art can according to the actual requirements and the concrete structure of flexible PCB 100, select suitable sensor as fingerprint Identification sensor 210.Such as, according to embodiment of the present utility model, fingerprint Identification sensor 210 can be push type capacitive transducer.In addition, according to embodiment of the present utility model, Background Grid array packages body 200 adopts Background Grid array packages structure, there is contact encapsulating structure, and then the signal noise that needle-like pin brings can be reduced, and for providing the sensor contact point of more crypto set according to the fingerprint recognition module of the utility model embodiment, thus precision and the recognition speed of fingerprint recognition can be improved.Thus, the result of use of the fingerprint recognition module according to the utility model embodiment can be improved further.
According to embodiment of the present utility model, by tin cream, above-mentioned Background Grid array packages body 200 is fixed on the upper surface of flexible print circuit board 100.Thus, the position spot printing tin cream forming electrical connection can be needed conveniently by flexible print circuit board 100, Background Grid array packages body 200 is fixed on the upper surface of flexible print circuit board 100, and formed between flexible print circuit board 100 with Background Grid array packages body 200 and be electrically connected, to complete the electric function of Background Grid array packages body 200.Thus, there is lower cost by above-mentioned and be easy to realize the mode of mass automatic production, complete the electrical connection of Background Grid array packages body 200 and flexible print circuit board 100, and then the production cost of the fingerprint recognition module according to the utility model embodiment can be reduced.
According to embodiment of the present utility model, ink layer 400 can pass through the mode of spraying or serigraphy, is arranged on the upper surface of Background Grid array packages body 200.In addition, according to embodiments more of the present utility model, with reference to figure 3, ink layer 400 can have following structure: undercoat 410, color layers 420 and protective seam 430.Wherein, according to embodiment of the present utility model, the lower surface of undercoat 410 is arranged on the upper surface of Background Grid array packages body 200, for improving the combination degree of color layers 420 and protective seam 430 and Background Grid array packages body 200; Color layers 420 is arranged on the upper surface of undercoat 410, and can multiple color be had, opaque for making according to the fingerprint recognition module of the utility model embodiment, sensor construction in Background Grid array packages body 200 and circuit invisible for user, to make according to the fingerprint recognition module of the utility model embodiment more attractive in appearance; Protective seam 430 is arranged on the upper surface of color layers 420, for providing protection to said structure, and then prevents from use causing scratch, and this fingerprint recognition module collided with and born etc. clash into time, for this module provides protection.Owing to can be arranged on the upper surface of Background Grid array packages body 200 by simple spraying or serigraphy according to the ink layer 400 of the utility model embodiment; therefore with have higher price and compared with complicated production processing procedure the cover sheet such as sapphire compared with, there is feature with low cost, easy to prepare.Meanwhile, also the protections such as anti-scratch can be provided for this fingerprint recognition module according to the ink layer 400 of the utility model embodiment.
Optionally, according to embodiment of the present utility model, ink layer 400 can also be made up of one deck ink with metallic luster.Thus, the outward appearance with metal-like can be provided for the fingerprint recognition module according to the utility model embodiment.And then the position can installed according to this fingerprint recognition module in practical application is different, select the ink layer 400 with different colours and texture, and then improve the result of use according to the fingerprint recognition module of the utility model embodiment further.
According to embodiment of the present utility model, becket 300 can have electromagnetic screen effect, and then can for providing the effect of Capacitor apart or electromagnetic isolation according to the fingerprint recognition module of the utility model embodiment, thus the fingerprint recognition precision improved according to the fingerprint recognition module of the utility model embodiment and result of use.In addition, according to embodiment of the present utility model, becket 300 for finger contact and to finger emitting radio frequency signal, increases the electric capacity intensity that produces of fingerprint Identification sensor 210 after finger and fingerprint recognition module contact with this, be convenient to the ridge and the paddy that identify finger, finally realize fingerprint recognition.Thus, the fingerprint capacity of the fingerprint recognition module according to the utility model embodiment can be improved by becket 300, and then improve the result of use of this fingerprint recognition module.
According to embodiment of the present utility model, becket 300 is arranged on the upper surface of flexible print circuit board 100, and is electrically connected with flexible print circuit board 100.Such as, according to an embodiment of the present utility model, becket 300 can be electrically connected with flexible print circuit board 100 by tin cream, to realize the electrical functions of becket 300 easily.In addition, those skilled in the art can understand, becket 300 also can complete the electrical connection with flexible print circuit board by other means, such as, according to embodiment of the present utility model, the upper surface that becket 300 can be fixed on flexible print circuit board 100 by conducting resinl realizes electrical connection.
Particularly, with reference to figure 4, according to embodiment of the present utility model, becket 300 can around Background Grid array packages body 200 (not shown) and ink layer 400.Thus, by becket 300 for Background Grid array packages body 200 and ink layer 400 provide extra protection, and then the result of use according to the fingerprint recognition module of the utility model embodiment can be improved.Optionally, with reference to figure 5, according to embodiment of the present utility model, becket 300 while around Background Grid array packages body 200 and ink layer 400, can also exceed the upper surface of ink layer 400.Thus, by the difference in height between becket 300 and ink layer 400, better finger can be guided in the region of Background Grid array packages body 200, and then the fingerprint recognition effect of the fingerprint recognition module according to the utility model embodiment can be increased.Preferably, according to another embodiment of the present utility model, with reference to figure 6, becket 300 can also cover a part for ink layer 400 upper surface.According to another embodiment of the present utility model, with reference to figure 7, becket 300 also can higher than ink layer 400 and around Background Grid array packages body 200 and ink layer 400, chamfering in simultaneously being formed to ink layer 400.Thus; can by the interior chamfering structure of becket 300; for the marginal portion of ink layer 400 provides Additional Protection, and finger is guided to the region can carrying out fingerprint recognition, and then improve the result of use according to the fingerprint recognition module of the utility model embodiment further.
In addition, it will be appreciated by those skilled in the art that under the prerequisite not paying creative work, protection domain of the present utility model is also belonged to the relevant change carried out according to the fingerprint recognition module of the utility model embodiment and optimization.Such as, according to embodiments more of the present utility model, with reference to figure 8, this fingerprint recognition module can also have following structure: dottle pin 500, sealing 600, silicagel pad 700 and sense of touch type switch 800.
According to embodiment of the present utility model, dottle pin 500 is arranged on the upper surface of flexible print circuit board 100, around the sidewall away from Background Grid array packages body 200 side of becket 300, and is reserved with sealing space between dottle pin 500 and flexible print circuit board.Sealing 600 is filled in this sealing space, and dottle pin 500 and sealing 600 limit spatial accommodation at the upper surface of flexible print circuit board 100, and Background Grid array packages body 200 and ink layer 300 is limited in this restriceted envelope.Thus, by dottle pin 500 and sealing 600, Background Grid array packages body 200 closely can be limited on the upper surface of flexible print circuit board 100, and provide extra protection for Background Grid array packages body 200 and ink layer 300.Thus, the structural stability of the fingerprint recognition module according to the utility model embodiment can be improved, and then improve the result of use of this fingerprint recognition module.
In addition, according to another embodiment of the present utility model, this fingerprint recognition module can also arrange silicagel pad 700 and sense of touch type switch 800 at the lower surface of flexible print circuit board.Silicagel pad 700 and sense of touch type switch 800 when user uses the fingerprint recognition module according to the utility model embodiment for user provides good tactile feedback, and then can improve the result of use of the fingerprint recognition module according to the utility model embodiment further.
In second aspect of the present utility model, the utility model proposes a kind of electronic equipment.According to embodiment of the present utility model, with reference to figure 9, electronic equipment 2000 comprises fingerprint recognition module 1000.Particularly, this fingerprint recognition module 1000 is the previously described fingerprint recognition module according to any one embodiment of the utility model.Thus, by the previously described fingerprint recognition module according to any one embodiment of the utility model for this electronic equipment provides preparation easy, with low cost and the fingerprint recognition module of dependable performance, and then the result of use according to the electronic equipment of the utility model embodiment can be improved.
Particularly, according to embodiment of the present utility model, this electronic equipment 2000 can comprise mobile phone, panel computer or portable computer.Thus, the range of application of the electronic equipment according to the utility model embodiment can be expanded.
In addition, because this electronic equipment have employed the previously described fingerprint recognition module according to any one embodiment of the utility model, therefore this electronic equipment has feature and the advantage of the previously described fingerprint recognition module according to any one embodiment of the utility model, does not repeat them here.
In description of the present utility model, term " interior ", " outward ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", the orientation of the instruction such as " end " or position relationship be based on orientation shown in the drawings or position relationship, it is only the utility model instead of require that the utility model with specific azimuth configuration and operation, therefore can not must be interpreted as restriction of the present utility model for convenience of description.
In the utility model, unless otherwise clearly defined and limited, term " is connected ", " connection ", " combination ", the term such as " laminating " should be interpreted broadly, and such as, can be directly be connected, also indirectly can be connected by intermediate member.For the ordinary skill in the art, the concrete meaning of above-mentioned term in the utility model can be understood as the case may be, as long as meet according to the annexation between all parts of the utility model embodiment.
In the description of this instructions, specific features, structure, material or feature that the description of reference term " embodiment ", " another embodiment " etc. means to describe in conjunction with this embodiment are contained at least one embodiment of the present utility model.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this instructions or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Although illustrate and described embodiment of the present utility model above, be understandable that, above-described embodiment is exemplary, can not be interpreted as restriction of the present utility model, those of ordinary skill in the art can change above-described embodiment, revises, replace and modification in scope of the present utility model.