CN204331746U - Fingerprint identification device and electronic equipment - Google Patents
Fingerprint identification device and electronic equipment Download PDFInfo
- Publication number
- CN204331746U CN204331746U CN201420732570.5U CN201420732570U CN204331746U CN 204331746 U CN204331746 U CN 204331746U CN 201420732570 U CN201420732570 U CN 201420732570U CN 204331746 U CN204331746 U CN 204331746U
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- glass substrate
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- sensing chip
- fingerprint sensing
- identification device
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Abstract
The utility model discloses a kind of fingerprint identification device; it comprises substrate, cover sheet, glass substrate and fingerprint sensing chip; cover sheet and this glass substrate are oppositely arranged; glass substrate comprise first surface and with opposing second of first surface; first surface is towards cover sheet; glass substrate offers the accepting hole running through first surface and second; first surface is provided with conductive layer along accepting hole periphery; fingerprint sensing chip is arranged in accepting hole, and glass substrate and fingerprint sensing chip are arranged in substrate.Above-mentioned fingerprint identification device; cover sheet can be used as electronic equipment; as the cover sheet (front panel of mobile phone) of the display screen of mobile phone; meet the screen integration demand of present large-screen mobile phone; structure is elegant in appearance, and fingerprint sensing chip is below the cover sheet of screen, is not easy to enter dust; also can waterproof, there will not be the Independent keys problem that repeatedly pressing keys is malfunctioning.The utility model also discloses a kind of electronic equipment.
Description
Technical field
The utility model relates to fingerprint recognition field, especially relates to a kind of fingerprint identification device and a kind of electronic equipment with this fingerprint identification device.
Background technology
Along with the requirement of people to information security is more and more higher, traditional numerical ciphers or nine grids password can not meet the requirement of people to information security.Bio-identification is widely used in the electronic equipment of a new generation, and the stability that fingerprint has and uniqueness, make the application of fingerprint identification device widely.Along with fingerprint identification technology is applied to mobile terminal by certain scientific & technical corporation, as on mobile phone, fingerprint identification device is applied on the mobile terminals such as mobile phone more and more widely.The position that current fingerprint identification device is applied to mobile phone is all on the mobile phone back side or mobile phone home key.
Meanwhile, the development trend of present mobile phone hardware is giant-screen, ultra-thin, and existing fingerprint identification device is all with the form of independent button, makes mobile phone screen and fingerprint device to be integrated like this, thus makes the structural design of mobile phone have limitation.Mobile phone screen is increasing, fingerprint identification device is at the mobile phone back side, use very inconvenient, and be placed on the position of home key as independently button, repeatedly press and easily cause home key malfunctioning and cause fingerprint recognition to lose efficacy, also easily enter simultaneously dust, can not waterproof, the requirement of mobile phone screen integration can not be met, attractive in appearance not.
Utility model content
The utility model is intended at least to solve one of technical matters existed in prior art.For this reason, the utility model needs to provide a kind of fingerprint identification device and a kind of electronic equipment.
A kind of fingerprint identification device; comprise substrate, cover sheet, glass substrate and fingerprint sensing chip; this cover sheet and this glass substrate are oppositely arranged; this glass substrate comprise first surface and with opposing second of this first surface; this first surface is towards this cover sheet; this glass substrate offers and runs through this first surface and this accepting hole of second; this first surface is provided with conductive layer along this accepting hole periphery; this fingerprint sensing chip is arranged in this accepting hole, and this glass substrate and this fingerprint sensing chip are arranged on this substrate.
Above-mentioned fingerprint identification device; cover sheet can be used as electronic equipment; as the cover sheet (front panel of mobile phone) of the display screen of mobile phone; meet the screen integration demand of present large-screen mobile phone; structure is elegant in appearance, and fingerprint sensing chip is below the cover sheet of screen, is not easy to enter dust; also can waterproof, there will not be the Independent keys problem that repeatedly pressing keys is malfunctioning.
In one embodiment, this conductive layer is ITO conductive layer.
In one embodiment, this accepting hole is rectangular-shaped and is square at the opening that this first surface is formed, and this conductive layer is frame-shaped.
In one embodiment, have certain gap between this fingerprint sensing chip and hole wall of this accepting hole, the surface of this fingerprint sensing chip flushes with this first surface.
In one embodiment, this cover sheet and this glass substrate are by optical clear glue laminating.
A kind of electronic equipment, comprise fingerprint identification device, this fingerprint identification device comprises substrate, cover sheet, glass substrate and fingerprint sensing chip, this cover sheet and this glass substrate are oppositely arranged, this glass substrate comprise first surface and with opposing second of this first surface, this first surface is towards this cover sheet, this glass substrate offers and runs through this first surface and this accepting hole of second, this first surface is provided with conductive layer along this accepting hole periphery, this fingerprint sensing chip is arranged in this accepting hole, this glass substrate and this fingerprint sensing chip are arranged on this substrate.
In one embodiment, this conductive layer is ITO conductive layer.
In one embodiment, this accepting hole is rectangular-shaped and is square at the opening that this first surface is formed, and this conductive layer is frame-shaped.
In one embodiment, have certain gap between this fingerprint sensing chip and hole wall of this accepting hole, the surface of this fingerprint sensing chip flushes with this first surface.
This cover sheet and this glass substrate are by optical clear glue laminating.
Additional aspect of the present utility model and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present utility model.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present utility model and advantage will become obvious and easy understand from accompanying drawing below combining to the description of embodiment, wherein:
Fig. 1 is the structural representation of the fingerprint identification device of the utility model better embodiment.
Fig. 2 is another structural representation of the fingerprint identification device of the utility model better embodiment.
Fig. 3 is the structural representation of the electronic equipment of the utility model better embodiment.
Embodiment
Be described below in detail embodiment of the present utility model, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the embodiment be described with reference to the drawings, only for explaining the utility model, and can not being interpreted as restriction of the present utility model.
In description of the present utility model, it is to be appreciated that term " first ", " second " only for describing object, and can not be interpreted as that instruction or hint relative importance or hidden conjunction indicate the quantity of indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or hidden conjunction comprise one or more described features.In description of the present utility model, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In description of the present utility model, it should be noted that, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrically connected or can intercom mutually; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements.For the ordinary skill in the art, the concrete meaning of above-mentioned term in the utility model can be understood as the case may be.
Disclosing hereafter provides many different embodiments or example is used for realizing different structure of the present utility model.Of the present utility model open in order to simplify, hereinafter the parts of specific examples and setting are described.Certainly, they are only example, and object does not lie in restriction the utility model.In addition, the utility model can in different example repeat reference numerals and/or reference letter, this repetition is to simplify and clearly object, itself does not indicate discussed various embodiment and/or relation between setting.In addition, the various specific technique that the utility model provides and the example of material, but those of ordinary skill in the art can recognize the application of other techniques and/or the use of other materials.
Please refer to the drawing 1 ~ Fig. 2, the fingerprint identification device 10 of the utility model better embodiment comprises substrate 101, cover sheet 102, glass substrate 104 and fingerprint sensing chip 106.Glass substrate 104 and fingerprint sensing chip 106 are arranged in substrate 101.Substrate 101 can be the circuit board be electrically connected with fingerprint sensing chip 106.
This cover sheet 102 is oppositely arranged with this glass substrate 104.If this fingerprint identification device 10 is applied to the electronics with touch screen when arranging, cover sheet 102 can be the cover sheet of touch screen (as capacitance plate).The materials such as the material selectable from glass of this cover sheet 102 or sapphire.The shape of cover sheet 102 can require according to the front panel design of applied electronic equipment and determine; as cover sheet 102 is roughly rectangle shape; four angles adopt fillet design; make four angles of cover sheet 102 during assembling be not easy to break and be not easy to hurt sb.'s feelings, but also improve the attractive in appearance of electronic equipment.
This glass substrate 104 can be have the glass substrate of touch screen as the touch screen of the electronic equipment of capacitance plate.This glass substrate 104 comprises first surface 108 and second face 110 opposing with this first surface 108, and this first surface 108 is towards this cover sheet 102.
This glass substrate 104 offers the accepting hole 112 running through this first surface 108 and this second face 110, and this first surface 108 is provided with conductive layer 114 along this accepting hole 112 periphery.In present embodiment, this accepting hole 112 is in rectangular-shaped, and the opening 116 formed at first surface 108 is square, and adopts the accepting hole 112 of this shape easily to manufacture.Be appreciated that, in other embodiments, the shape of accepting hole 112 can be other according to the size of fingerprint sensing chip 106 and the suitable shape of shape, as long as can accommodate fingerprint sensing chip 106 and the hole wall of accepting hole 112 and fingerprint sensing chip 106 can retain certain gap.
Preferably, this cover sheet 102 is fitted by Optical transparent adhesive (optical clearadhesive, OCA) with this glass substrate 104, and make both laminating tight ness ratings high, the loss that signal transmits is between the two few.
This fingerprint sensing chip 106 is arranged in this accepting hole 112.Preferably, the surface of this fingerprint sensing chip 106 flushes with the first surface 108 of glass substrate 104, and fingerprint sensing chip 106 can be made like this to be embedded in inside glass substrate 104, can not be outstanding.Fingerprint sensing chip 106 and glass substrate 104 insulate, and leave certain gap 118 between the hole wall of fingerprint sensing chip 106 and accepting hole 112.
Fingerprint sensing chip 106 can be positioned over the position below fingerprint sensing chip 106 with the peripheral components be connected between electronic equipment, i.e. the second side, face 110 of glass substrate 104, fingerprint sensing chip 106 is also positioned over the position below fingerprint sensing chip 106 with the cabling of the connection of peripheral circuit.
The square aperture 116 that conductive layer 114 is formed around accepting hole 112 at first surface 108 is arranged, and conductive layer 114 is in frame-shaped, and in present embodiment, conductive layer 114 is in the square frame-like around square aperture 116.Conductive layer 114 is for providing pulse signal for fingerprint sensing chip 106.The conductive layer 114 of square frame-like can improve the intensity transmitted, and adds the sensitivity of fingerprint identification device 10.
Preferably, this conductive layer 114 is ITO (tin indium oxide) conductive layer.Adopt ITO conductive layer, the formation process of conductive layer 114 is simple, reduces the manufacturing cost of fingerprint identification device 10.The connecting line of conductive layer 114 and peripheral circuit can be positioned between the gap 118 between accepting hole 112 hole wall of glass substrate 104 and fingerprint sensing chip 106.Be appreciated that the connecting line that the large palpulus in gap 118 meets conductive layer 114 and external circuit can be positioned between this gap 118, and and fingerprint sensing chip 106 between insulate.
When fingerprint identification device 10 works, after conductive layer 114 make pulse electric signal, the outside exomonental electromagnetic induction ripple 30 of conductive layer 114.The electromagnetic induction ripple 30 of the pulse that conductive layer 114 produces arrives fingerprint sensing chip 106 through the cover sheet 102 penetrating upper strata for twice; the detection panel of fingerprint sensing chip 106 is distributed by the detecting electrode of array arrangement to form, composition two-dimensional detection matrix as the pole plate of a during fingerprint detection.When carrying out finger print and detecting, the cover sheet 102 of the finger contact the superiors, due to the electric speciality of finger, can form another pole plate relative with fingerprint sensing chip 106, just forms an electric capacity like this between finger and fingerprint sensing chip 106.The line peak of fingerprint and the close together of fingerprint sensing chip 106, corresponding polar plate spacing is from little, and the capacitive sensing electric capacity of formation is comparatively large, and the line paddy of fingerprint is then contrary.So the inductance capacitance size one_to_one corresponding that the surface characteristics of fingerprint is formed with finger and fingerprint sensing chip 106, by detecting this inductance capacitance, just finger surface features can be determined.
Above-mentioned fingerprint identification device 10; cover sheet 102 can be used as the cover sheet (front panel of mobile phone) of electronic equipment as the display screen of mobile phone; meet the screen integration demand of present large-screen mobile phone; structure is elegant in appearance; and fingerprint sensing chip 106 is below the cover sheet 102 of screen; be not easy to enter dust, also can waterproof, there will not be the Independent keys problem that repeatedly pressing keys is malfunctioning.Further; above-mentioned fingerprint identification device 10 is without the need to one deck dielectric material on fingerprint detection panel; the detection panel of fingerprint sensing chip 106 is directly covered by the cover sheet 102 of mobile phone screen; the method utilizing ITO to launch electric radio magnetic induction ripple 30 as conductive can improve signal to noise ratio (S/N ratio), can realize fingerprint identification device 10 under glass scheme on an electronic device.
Please refer to the drawing 3, the electronic equipment 20 of the utility model better embodiment comprises fingerprint identification device 10.This cover sheet 102 is generally the front panel of this electronic equipment 20, is namely the protective seam of the screen of electronic equipment 20, such as mobile phone screen, the protective seam of the screens such as audio/video player.This electronic equipment 20 can be mobile phone, panel computer, the electronic equipment such as audio player or video player.
In embodiments; fingerprint identification device 10 employs the cover sheet 102 of the screen of electronic equipment 20; meet electronic equipment 20; particularly there is the screen integration demand of the electronic equipment 20 of touch screen; structure is elegant in appearance, and fingerprint sensing chip 106 is below the cover sheet 102 of screen, is not easy to enter dust; also can waterproof, there will not be the Independent keys problem that repeatedly pressing keys is malfunctioning.
In the description of this instructions, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " exemplary embodiment ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with described embodiment or example are contained at least one embodiment of the present utility model or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Although illustrate and described embodiment of the present utility model, those having ordinary skill in the art will appreciate that: can carry out multiple change, amendment, replacement and modification to these embodiments when not departing from principle of the present utility model and aim, scope of the present utility model is by claim and equivalents thereof.
Claims (10)
1. a fingerprint identification device; it is characterized in that; comprise substrate, cover sheet, glass substrate and fingerprint sensing chip; this cover sheet and this glass substrate are oppositely arranged; this glass substrate comprise first surface and with opposing second of this first surface; this first surface is towards this cover sheet; this glass substrate offers and runs through this first surface and this accepting hole of second; this first surface is provided with conductive layer along this accepting hole periphery; this fingerprint sensing chip is arranged in this accepting hole, and this glass substrate and this fingerprint sensing chip are arranged on this substrate.
2. fingerprint identification device according to claim 1, is characterized in that, this conductive layer is ITO conductive layer.
3. fingerprint identification device according to claim 1, is characterized in that, this accepting hole is rectangular-shaped, and is square at the opening that this first surface is formed, and this conductive layer is frame-shaped.
4. fingerprint identification device according to claim 1, is characterized in that, has certain gap between this fingerprint sensing chip and hole wall of this accepting hole, and the surface of this fingerprint sensing chip flushes with this first surface.
5. fingerprint identification device according to claim 1, is characterized in that, this cover sheet and this glass substrate are by optical clear glue laminating.
6. an electronic equipment, it is characterized in that, comprise fingerprint identification device, this fingerprint identification device comprises substrate, cover sheet, glass substrate and fingerprint sensing chip, this cover sheet and this glass substrate are oppositely arranged, this glass substrate comprise first surface and with opposing second of this first surface, this first surface is towards this cover sheet, this glass substrate offers and runs through this first surface and this accepting hole of second, this first surface is provided with conductive layer along this accepting hole periphery, this fingerprint sensing chip is arranged in this accepting hole, this glass substrate and this fingerprint sensing chip are arranged on this substrate.
7. electronic equipment according to claim 6, is characterized in that, this conductive layer is ITO conductive layer.
8. electronic equipment according to claim 6, is characterized in that, this accepting hole is rectangular-shaped and is square at the opening that this first surface is formed, and this conductive layer is frame-shaped.
9. electronic equipment according to claim 6, is characterized in that, gap certain between this fingerprint sensing chip and hole wall of this accepting hole, and the surface of this fingerprint sensing chip flushes with this first surface.
10. electronic equipment according to claim 6, is characterized in that, this cover sheet and this glass substrate are by optical clear glue laminating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420732570.5U CN204331746U (en) | 2014-11-27 | 2014-11-27 | Fingerprint identification device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420732570.5U CN204331746U (en) | 2014-11-27 | 2014-11-27 | Fingerprint identification device and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN204331746U true CN204331746U (en) | 2015-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420732570.5U Active CN204331746U (en) | 2014-11-27 | 2014-11-27 | Fingerprint identification device and electronic equipment |
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| CN (1) | CN204331746U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105447486A (en) * | 2016-01-18 | 2016-03-30 | 宸盛光电有限公司 | A fingerprint identification apparatus and an electronic apparatus having the fingerprint identification apparatus |
| CN106096492A (en) * | 2016-04-07 | 2016-11-09 | 深圳市天宇华瑞科技开发有限公司 | A kind of fingerprint identification device |
| WO2016184346A1 (en) * | 2015-05-19 | 2016-11-24 | 华为技术有限公司 | Fingerprint recognition device and terminal |
| CN106558572A (en) * | 2015-09-30 | 2017-04-05 | 茂丞科技股份有限公司 | Fingerprint sensing package module and its manufacture method |
| CN107527002A (en) * | 2016-06-22 | 2017-12-29 | 致伸科技股份有限公司 | Capacitance type fingerprint identification module |
| CN108460315A (en) * | 2017-02-20 | 2018-08-28 | 上海箩箕技术有限公司 | Cover sheet and forming method thereof, electronic equipment |
| CN109460693A (en) * | 2017-09-06 | 2019-03-12 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor and terminal device |
| CN110515493A (en) * | 2019-08-28 | 2019-11-29 | 京东方科技集团股份有限公司 | Capacitance type fingerprint identifies structure and preparation method thereof, display device |
| US10942580B2 (en) | 2016-04-11 | 2021-03-09 | Beijing Xiaomi Mobile Software Co., Ltd. | Input circuitry, terminal, and touch response method and device |
-
2014
- 2014-11-27 CN CN201420732570.5U patent/CN204331746U/en active Active
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016184346A1 (en) * | 2015-05-19 | 2016-11-24 | 华为技术有限公司 | Fingerprint recognition device and terminal |
| CN106558572A (en) * | 2015-09-30 | 2017-04-05 | 茂丞科技股份有限公司 | Fingerprint sensing package module and its manufacture method |
| CN105447486A (en) * | 2016-01-18 | 2016-03-30 | 宸盛光电有限公司 | A fingerprint identification apparatus and an electronic apparatus having the fingerprint identification apparatus |
| CN105447486B (en) * | 2016-01-18 | 2019-11-05 | 宸盛光电有限公司 | A kind of fingerprint identification device and the electronic equipment with the fingerprint identification device |
| CN106096492A (en) * | 2016-04-07 | 2016-11-09 | 深圳市天宇华瑞科技开发有限公司 | A kind of fingerprint identification device |
| US10942580B2 (en) | 2016-04-11 | 2021-03-09 | Beijing Xiaomi Mobile Software Co., Ltd. | Input circuitry, terminal, and touch response method and device |
| CN107527002A (en) * | 2016-06-22 | 2017-12-29 | 致伸科技股份有限公司 | Capacitance type fingerprint identification module |
| CN107527002B (en) * | 2016-06-22 | 2021-01-05 | 致伸科技股份有限公司 | Capacitive fingerprint identification module |
| CN108460315A (en) * | 2017-02-20 | 2018-08-28 | 上海箩箕技术有限公司 | Cover sheet and forming method thereof, electronic equipment |
| CN109460693A (en) * | 2017-09-06 | 2019-03-12 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor and terminal device |
| CN110515493A (en) * | 2019-08-28 | 2019-11-29 | 京东方科技集团股份有限公司 | Capacitance type fingerprint identifies structure and preparation method thereof, display device |
| CN110515493B (en) * | 2019-08-28 | 2023-09-01 | 京东方科技集团股份有限公司 | Capacitive fingerprint identification structure, preparation method thereof and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Assignor: BYD Co.,Ltd. Contract record no.: 2015440020385 Denomination of utility model: Fingerprint identification apparatus and electronic device Granted publication date: 20150513 License type: Exclusive License Record date: 20151229 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191226 Address after: 518119 1 Yanan Road, Kwai Chung street, Dapeng New District, Shenzhen, Guangdong Patentee after: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address before: BYD 518118 Shenzhen Road, Guangdong province Pingshan New District No. 3009 Patentee before: BYD Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: BYD Semiconductor Co.,Ltd. |