CN108460315A - Cover sheet and forming method thereof, electronic equipment - Google Patents
Cover sheet and forming method thereof, electronic equipment Download PDFInfo
- Publication number
- CN108460315A CN108460315A CN201710091497.6A CN201710091497A CN108460315A CN 108460315 A CN108460315 A CN 108460315A CN 201710091497 A CN201710091497 A CN 201710091497A CN 108460315 A CN108460315 A CN 108460315A
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- China
- Prior art keywords
- fibre faceplate
- cover board
- cover sheet
- hole
- initial
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1341—Sensing with light passing through the finger
Abstract
A kind of cover sheet and forming method thereof, electronic equipment, the forming method include：Initial cover board is provided, the initial cover board includes through hole area and non-through porose area；Through-hole is formed in the through hole area of the initial cover board；The fibre faceplate being adapted with the through-hole is provided and inserts the fibre faceplate in the through-hole；Fusion connection layer is formed between the fibre faceplate and the initial cover board of the non-through porose area.In technical solution of the present invention, by forming fusion connection layer between fibre faceplate and initial cover board, the connection between the fibre faceplate and the initial cover board is realized with the fusion connection layer, to form cover sheet.Since fibre faceplate is formed by optical fiber fusion pressure; therefore fibre faceplate has higher optical transmission efficiency high; optically has the characteristics that zero thickness, so the use of the fibre faceplate can make the cover sheet have the function of leaded light, to be conducive to the expansion of the cover sheet function.
Description
Technical field
The present invention relates to sensor field, more particularly to a kind of cover sheet and forming method thereof, electronic equipment.
Background technology
Electronic equipment refers to being made of electronic components such as integrated circuit, transistor, electron tubes, application electric technology software
The equipment to play a role.When being equipped with fingerprint imaging module, electronic equipment can realize the function of fingerprint sensing.
The hardware such as integrated circuit, transistor, sensor in electronic equipment are often more fragile, external environment variation or
Impact, can affect to the performance of electronic equipment hardware.Therefore the hardware of electronic equipment is often assembled in protection
The lower section of cover board, so that hardware is isolated with external environment, to play the role of protection.
But cover sheet in the prior art is usually only capable of playing the role of isolation, protection, there is asking of having a single function
Topic.
Invention content
Problems solved by the invention is to provide a kind of cover sheet and forming method thereof, electronic equipment, to expand protection cap
The function of plate.
To solve the above problems, the present invention provides a kind of forming method of cover sheet, including：
Initial cover board is provided, the initial cover board includes through hole area and non-through porose area；In the through hole area of the initial cover board
Form through-hole；The fibre faceplate being adapted with the through-hole is provided and inserts the fibre faceplate in the through-hole；Described
Fusion connection layer is formed between fibre faceplate and the initial cover board of the non-through porose area.
Optionally, include the step of formation fusion connection layer between the fibre faceplate and the initial cover board：To institute
It states and fills integrating materials between fibre faceplate and the initial cover board；It is described to be formed that curing process is carried out to the integrating materials
Fusion connection layer.
Optionally, the integrating materials are silica gel, glass powder or optics shadowless glue.
Optionally, when the integrating materials are silica gel, curing process is carried out to the integrating materials to form described melt
Close articulamentum the step of include：Curing process is carried out to be formed to the integrating materials by way of thermmohardening or moisture-curable
The fusion connection layer.
Optionally, when the integrating materials are glass powder, curing process is carried out to be formed to the integrating materials
The step of stating fusion connection layer include：It is described to be formed that curing process is carried out to the integrating materials by way of laser curing
Fusion connection layer.
Optionally, between the fibre faceplate and the initial cover board fill integrating materials the step of include：To fusion
Pigment is added in material to form the coloured integrating materials of tool.
Optionally, the fibre faceplate has towards the side of the initial cover board and the vertical side and sets opposite to each other
There is pattern at least one face in the first face and the second face set, first face or the second face.
Optionally, the shape of the through-hole is round, oblong or rectangular.
Optionally, when the shape of the through-hole is round, the diameter of the circular through hole is more than 2mm；The shape of the through-hole
When shape is oblong, the oblong through-hole is wider than 2mm；When the shape of the through-hole is rectangular, the square through hole
The length of side is more than 2mm.
Optionally, the gap between the side wall of the fibre faceplate and the initial cover board of non-through porose area is arrived in 0.05mm
Within the scope of 1.5mm.
Optionally, the difference of the fibre faceplate thickness and the non-through initial cover sheet thickness of porose area is arrived in -0.5mm
Within the scope of 0.5mm.
Optionally, the material of the initial cover board is tempered glass.
Optionally, include the step of forming through-hole on the initial cover board：By way of etching or being machined
The through-hole is formed on the initial cover board.
Correspondingly, the present invention also provides a kind of cover sheets, including：
Initial cover board；Through the fibre faceplate of the initial cover board；Positioned at the fibre faceplate and the initial cover board it
Between fusion connection layer.
Optionally, the material of the fusion connection layer is silica gel, glass or optics shadowless glue.
Optionally, the fusion connection layer is to have coloured fusion connection layer, and the material of the fusion connection layer also wraps
Include pigment.
Optionally, the thickness of the fusion connection layer is in 0.05mm to 1.5mm ranges.
Optionally, the fibre faceplate has towards the side of the initial cover board and the vertical side and sets opposite to each other
There is pattern at least one face in the first face and the second face set, first face or the second face.
Optionally, the shape of the fibre faceplate is round, oblong or rectangular.
Optionally, when the shape of the fibre faceplate is round, the diameter of the round fiber panel is greater than or equal to
2mm；When the shape of the fibre faceplate is oblong, the oblong fibre faceplate is wider than or is equal to 2mm；The optical fiber
When the shape of panel is rectangular, the length of side of the rectangular fibre faceplate is greater than or equal to 2mm.
Optionally, the thickness of the fibre faceplate is identical as the thickness of initial cover board.
Optionally, the material of the initial cover board is tempered glass.
In addition, the present invention also provides a kind of electronic equipment, including：
Light source, for generating incident light；Cover sheet, the cover sheet is cover sheet of the present invention, described
Fibre faceplate is for transmiting the incident light；Sensing face, the incident light for transmiting the fibre faceplate occur instead in the sensing face
It penetrates, forms the reflected light for carrying finger print information；Imaging sensor, for acquiring the reflected light to obtain fingerprint image.
Optionally, the light source is located at the side of described image sensor, and the light source and described image sensor are used for
Constitute fingerprint imaging module；On the direction on the vertical cover sheet surface, the size of the fingerprint imaging module is more than or waits
In the thickness of the light source.
Optionally, on the direction on the vertical cover sheet surface, the thickness of the fingerprint imaging module is arrived in 0.010mm
1.200mm in range.
Optionally, described image sensor is located at the corresponding position of the fibre faceplate.
Optionally, the fibre faceplate have towards the first face of the side of the initial cover board and the vertical side with
And second face opposite with first face；There is pattern on first face；Described first facing towards described image sensor；
Second face is the sensing face.
Compared with prior art, technical scheme of the present invention has the following advantages：
In technical solution of the present invention, by forming fusion connection layer between fibre faceplate and initial cover board, melted with described
It closes articulamentum and realizes the connection between the fibre faceplate and the initial cover board, to form cover sheet.Due to fiber facet
Plate is to be formed by optical fiber fusion pressure, therefore fibre faceplate has higher optical transmission efficiency high, optically has the characteristics that zero thickness,
So the use of the fibre faceplate can make the cover sheet have the function of leaded light, to be conducive to the cover sheet
The expansion of function.
In alternative of the present invention, the difference of the fibre faceplate thickness and the non-through initial cover sheet thickness of porose area-
In 0.5mm to 0.5mm ranges, compared with using the technical solution of half-blind hole, between the fibre faceplate and the initial cover board
Thickness difference is smaller, can effectively reduce stress between the fibre faceplate and the initial cover board, enhance the cover sheet
Intensity, be conducive to extend the service life and stability of the cover sheet；In addition, the fusion connection layer be filled in it is described
Between fibre faceplate and the initial cover board, avoid gap, Neng Gouyou occur between the fibre faceplate and the initial cover board
The appearance of the reduction drainage of effect is conducive to the water resistance for improving the cover sheet.
In alternative of the present invention, by forming the through-hole through the initial cover board on the initial cover board；Institute
It states filling fibre faceplate in through-hole and forms fusion connection layer in the panel and the through-hole side wall.The wherein described through-hole passes through
The mode of etching or mechanical processing is formed on the initial cover board, and the technology difficulty for forming the through-hole is relatively low, is conducive to drop
Low process costs improve process yields.
The present invention also provides a kind of electronic equipment, the electronic equipment cover sheet using the present invention, what light source generated
Initial light, the transmission through the fibre faceplate form incident light, and the incident light carries the anti-of finger print information through reflecting to form
Penetrate light.Since fibre faceplate is formed by optical fiber fusion pressure, fibre faceplate has the initial light when transmiting the initial light
There is collimation, incident light collimation performance is preferable, and the angle of divergence is smaller so being formed by, and is formed instead to be conducive to reduce
The angle of divergence for penetrating light reduces fingerprint image and the probability of deformation problems occurs the problem of being conducive to improve fingerprint image amplification, to
Be conducive to improve the quality of the obtained fingerprint image of the electronic equipment.
Description of the drawings
Fig. 1 is a kind of cross-sectional view of the electronic equipment with fingerprint imaging function；
Fig. 2 is the cross-sectional view of another electronic equipment with fingerprint imaging function；
Fig. 3 is the cross-sectional view of another electronic equipment with fingerprint imaging function；
Fig. 4 to Fig. 9 is the corresponding structural schematic diagram of each step of one embodiment of cover sheet forming method of the present invention；
Figure 10 is the cross-sectional view of one embodiment of electronic equipment of the present invention.
Specific implementation mode
By background technology it is found that cover sheet in the prior art there are problems that having a single function.And in some electronics
In equipment, the setting of cover sheet can also influence certain functions of electronic equipment.
Fingerprint image acquisition can be carried out by optical mode by being equipped with the electronic equipment of optical finger print imaging modules, into
And fingerprint identification function may be implemented.Protection cap is described in detail with reference to the structure of the electronic equipment with fingerprint imaging function
The problem of plate has a single function.
With reference to figure 1, a kind of cross-sectional view of the electronic equipment with fingerprint imaging function is shown.
The electronic equipment includes：Cover sheet 13, the hardware for the electronic equipment to be isolated and external environment, to rise
To protective effect；Fingerprint imaging module (not indicated in figure) positioned at 13 lower section of the cover sheet, for acquiring fingerprint image,
The wherein described fingerprint imaging module includes：Light source 10, for generating incident light；The incident light is projected to finger surface, handles
Refer to surface reflection and forms the reflected light for carrying finger print information；Imaging sensor 12 positioned at 10 side of the light source, for adopting
Collect the reflected light, and the optical signal of the reflected light is converted into electric signal, to obtain fingerprint image.
Fingerprint imaging module is set to 13 lower section of cover sheet, therefore incident light needs before being projected to finger described in transmission
Cover sheet 13 can be protected the effect of reflection or the refraction of cover board 13；And in order to coordinate the appearance of the electronic equipment
Design, the cover sheet 13 is towards often forming color layers in the one side of described image sensor 12.So incident light in addition to
It needs to transmit the cover sheet 13 and also needs to transmitted colors layer.
Cover sheet 13 is usually glass cover-plate, and color layers are usually ink layer, therefore incident light is in cover sheet 13
When with color layers, different degrees of energy loss is had, consequently, it is possible to causing formed reflected light light intensity weaker, and then is influenced
The quality of obtained fingerprint image.
And with the raising of electronic device integrated level, the integrated level of electronic equipment is also higher and higher, fingerprint imaging module
Volume reduce therewith.In order to make the fingerprint imaging module have smaller volume, the light source 10 is using small volume
Point light source, and point light source is set to the side of described image sensor 12.That is, being passed using described image is set to
The point light source of 12 side of sensor generates incident light.
Since light source 10 is point light source, the incident light that light source 10 generates is diverging light, has certain angle of divergence.By
In incident light have the angle of divergence, therefore incident light be it is oblique be incident upon on the cover sheet 13, thus transmit the protection cap
The reflected light that plate 13 is projected to finger surface and is formed also has certain angle of divergence.The reflected light with the angle of divergence is acquired to be obtained
The fingerprint image obtained has a degree of amplification, so as to cause fingerprint image compared with the fingerprint image on actual finger surface
The problem of deformation.The appearance of fingerprint image deformation can influence the identification to fingerprint image, to influence the reality of fingerprint identification function
It is existing.
The problem of in order to improve fingerprint image amplification, fingerprint image deformation, as shown in Fig. 2, a kind of technical solution is in institute
It states and forms through-hole on cover sheet 20, exposed out of described through-hole by the fingerprint capturer 21 including light source and imaging sensor,
The acquisition of fingerprint image is carried out by the fingerprint capturer 21.But in this technical solution, the problem of due to machining accuracy,
There are gaps 24 between fingerprint capturer 21 and cover sheet 20.The presence in gap 24, the problem of leak can be caused；And it is this
In technical solution, the thickness of the fingerprint capturer 21 is larger, is unfavorable for the raising of integrated level.
As shown in figure 3, another technical solution be opened up in one side in cover sheet 30 towards fingerprint capturer 31 it is blind
Hole 35, the fingerprint capturer 31 are located in the blind hole 35.In this technical solution, since blind hole 35 only runs through the protection
The segment thickness of cover board 30, the cover sheet 30 is interior to be not present gap, therefore can improve leak in technical solution shown in Fig. 2
The problem of；But in the technical solution, due to the thickness of cover sheet 30 on fingerprint capturer 31 and other position cover sheets
30 thickness is different, therefore at the link position of 35 side wall of blind hole and bottom (in Fig. 4 centre circles 33 shown in structure), cover sheet
There are larger stress in 30；The presence of larger stress in cover sheet 30 can influence the intensity of the cover sheet 30, protection
Cover board 30 is easy to rupture；And blind hole 35 only runs through the segment thickness of the cover sheet 30, therefore the blind hole 35
Formation process difficulty it is larger, yield is relatively low.
To solve the technical problem, the present invention provides a kind of forming method of cover sheet, by fibre faceplate and
Fusion connection layer is formed between initial cover board, to realize the connection between the fibre faceplate and the initial cover board, to shape
At cover sheet.Since fibre faceplate is formed by optical fiber fusion pressure, technical solution of the present invention is formed by cover sheet tool
There is guide-lighting function, to be conducive to the expansion of the cover sheet function.
To make the above purposes, features and advantages of the invention more obvious and understandable, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.
With reference to figure 4 to Fig. 9, show that the corresponding structure of each step of one embodiment of cover sheet forming method of the present invention is shown
It is intended to.
It should be noted that in the present embodiment, formed cover sheet is applied to the electronics with fingerprint imaging function and sets
In standby.But this is only an example, the formed cover sheet of the present invention can also be applied to the electronics with display function and set
In the other kinds of electronic equipment such as standby.
With reference to figure 4, initial cover board 100 is provided, the initial cover board 100 includes through hole area (not indicated in figure) and non through hole
Area (does not indicate) in figure.
The initial cover board 100 is used to form cover sheet, for providing technological operation basis；The through hole area it is described
Extended meeting is removed after initial cover board 100, to form the through-hole being located in initial cover board 100.
In the present embodiment, the cover sheet is used to form the hand-set lid with fingerprint imaging function, so described first
Beginning cover board 100 is the cover-plate glass of mobile phone, the part for constituting hand-set lid, with protect covered by the hand-set lid it is hard
Part equipment.
Specifically, in order to improve the protective capability of formed cover sheet, reduces and be located at hardware below the cover sheet
The damage of equipment, in the present embodiment, the material of the initial cover board 100 is tempered glass, make the hardness of the cover sheet compared with
Greatly.
With reference to figure 5 and Fig. 6, through-hole 110 is formed in the through hole area of the initial cover board 100.Wherein Fig. 6 is in Fig. 5 along AA
The schematic cross-sectional view of line.
Some materials of the step of the forming through-hole 110 for removing the initial cover board 100, technique is provided for subsequent technique
Basis.
Specifically, including the step of forming through-hole 110 on the initial cover board 100：Pass through what is etched or be machined
Mode forms the through-hole 110 on the initial cover board 100.Specifically, forming the through-hole 110 by way of etching
Step includes：It is realized by way of hydrogen fluoride (HF) etching；The step of through-hole 110 is formed by way of mechanical processing
Including：It is realized by way of numerically-controlled machine tool (Computer numerical Control) mechanical processing.
As shown in figure 5, in the present embodiment, the shape of the through-hole 110 is oblong.In other embodiments of the invention, institute
It may be the other shapes such as round or rectangular to state shape of through holes.The specific appearance of the shape of the through-hole and the cover sheet
Design is related, related to the integrated appearance of cover sheet electronic equipment.
It should be noted that the size of the through-hole 110 and the size for being subsequently filled in fibre faceplate in the through-hole 110
Correlation, can influence the cover sheet can realize the size of light-guiding function range, so the size of the through-hole 110 should not be too
It is small.
Specifically, if the size of the through-hole 110 is too small, it is filled in the size of 110 inner fiber panel of the through-hole
It is smaller, therefore can realize that the range of light-guiding function is too small, is unfavorable for opening up for the cover sheet function in the cover sheet
Exhibition.
In the present embodiment, the cover sheet is applied in the electronic equipment with fingerprint imaging function, the through-hole 110
Shape be oblong, so the wide D of the oblong through-hole 110 be more than 2mm.
In other embodiments of the invention, the through-hole may be other shapes.When the shape of the through-hole is circle, institute
The diameter for stating circular through hole is more than 2mm；The shape of the through-hole is rectangular, and the length of side of the square through hole is more than 2mm.
In conjunction with reference to figure 7, providing and adaptable fibre faceplate (the Fiber Optic (as shown in Figure 5) of the through-hole 110
Plate, FOP) 120 and the fibre faceplate 120 is inserted in the through-hole 110.Wherein Fig. 7 shows with sectional structure shown in Fig. 6
It is intended to corresponding.
The fibre faceplate 120 for filling the through-hole 110 to form cover sheet, also use by the fibre faceplate 120
It is guide-lighting in realizing, make formed cover sheet that there is light-guiding function, to extend the function of formed cover sheet.
Fibre faceplate is regularly arranged by a large amount of optical fiber and formed, thus it is big with numerical aperture, interstage coupling loss is small,
The features such as high resolution, zero optical thickness, can transmit HD image without distortions.Optical fiber of the fibre faceplate 120 to transmission
Performance with collimation, and have the characteristics that higher optical transmission efficiency and zero optical thickness, therefore the fibre faceplate 120
Setting formed cover sheet can be made to have the function of leaded light, to be conducive to the expansion of the cover sheet function.
In the electronic equipment that the cover sheet is applied to fingerprint imaging function, the fibre faceplate 120 is led
Light function can play collimation to the light for transmiting the cover sheet, so as to effectively reduce the transmission guarantor
The angle of divergence of protecting cover plate incident light is conducive to obtain the reflection light compared with small divergence angle, is conducive to improve fingerprint image amplification
Problem.
It should be noted that in the present embodiment, the initial cover board of 120 thickness of the fibre faceplate and the non-through porose area 110
Thickness is suitable.It, can using the way for filling the through-hole 110 with the comparable fibre faceplate of 110 thickness of initial cover board 120
The uniformity for improving formed cover sheet thickness, to be conducive to reduce the stress inside the cover sheet, especially institute
The stress between initial cover board 100 and the fibre faceplate 120 is stated, the intensity and durability that improve the cover sheet are conducive to
Energy.
Specifically, the difference of 120 thickness of the fibre faceplate and non-through initial 110 thickness of cover board of porose area is in -0.5mm
Into 0.5mm, that is to say, that the difference of 120 thickness of the fibre faceplate and non-through initial 110 thickness of cover board of porose area is not
It is no more than more than 0.5mm or initial 110 thickness of cover board of the non-through porose area and the difference of 120 thickness of the fibre faceplate
0.5mm.If 120 thickness of the fibre faceplate and the difference of non-through initial 110 thickness of cover board of porose area are too big, it is unfavorable for
The reduction of the cover sheet internal stress, is unfavorable for the enhancing of intensity and durable performance.
Since the fibre faceplate 120 needs to be filled in the through-hole 110, so the fibre faceplate 120 is described
The projection of shape on initial 100 surface of cover board is similar to the shape of the through-hole 110.
In the present embodiment, the shape of the through-hole 110 is oblong, so the shape of the fibre faceplate 120 is also length
It is round.In other embodiments of the invention, when the shape of the through-hole is round, the shape of the corresponding fibre faceplate is also circle
Shape；When the shape of the through-hole is rectangular, the shape of the fibre faceplate is also rectangular.
It should be noted that the through-hole 110 is shaped to oblong, circle or the closed figures such as rectangular and is made
The fibre faceplate 120 is set as shape identical with the through-hole 110, and this way can make 120 mould of the fibre faceplate
The shape of quasi- button, so as to effectively improve the appearance of the cover sheet.
In addition, in order to reduce technology difficulty, operating space is provided also for subsequent technique, in the present embodiment, the optical fiber
The size that is dimensioned slightly smaller than the through-hole 110 of the panel 120 in 100 surface projection of initial cover board.That is, the light
There are gaps between 110 side wall of the side wall of fine panel 120 and the through-hole.But the side wall of the fibre faceplate 120 with it is described
Gap between 110 side wall of through-hole should not it is too big also should not be too small.
If the gap between 110 side wall of the side wall of the fibre faceplate 120 and the through-hole is too small, it is unfavorable for described
Fibre faceplate 120 is inserted in the through-hole 110, and the too small problem in follow-up filled layer formation process space is will also result in, to meeting
Influence the bonding strength between the fibre faceplate 120 and the initial cover board 100, and gap is too small can also increase formation and fill out
The technology difficulty for filling layer is unfavorable for being sufficient filling with for filled layer；The side wall of the fibre faceplate 120 and 110 side wall of the through-hole
If gap between is too big, and the area of fibre faceplate 120 accordingly reduces, and is unfavorable for formed cover sheet leaded light effect
Implement, is unfavorable for expanding the function of the cover sheet.Specifically, in the present embodiment, the side wall of the fibre faceplate 120 and institute
The gap between the initial cover board of non-through porose area 100 is stated in 0.05mm to 1.5mm ranges, that is to say, that the fibre faceplate 120
110 side wall of side wall and the through-hole between clearance G in 0.05mm to 1.5mm ranges.
It should be noted that in the present embodiment, the fibre faceplate 120 has towards the side of 110 side wall of the through-hole
And the vertical side and the first face and the second face that are disposed opposite to each other, have at least one face in first face or the second face
There is pattern.
The fibre faceplate 120 can transmit HD image without distortions, therefore the first of the fibre faceplate 120
Pattern is set on face or the second face, can make the fibre faceplate that image be presented, to be conducive to improve the cover sheet
Aesthetics.
With reference to figure 8 and Fig. 9, fusion connection layer is formed between the fibre faceplate 120 and remaining initial cover board 100
130.Wherein Fig. 9 is in embodiment illustrated in fig. 8 along the schematic cross-sectional view of BB lines.
The fusion connection layer 130 is for realizing between the fibre faceplate 120 and the initial cover board of the non-through porose area 100
Connection, to form cover sheet.
In the present embodiment, the material of the fusion connection layer 130 is glass.In other embodiments of the invention, the fusion
The material of articulamentum 130 can also be cured silica gel or cured optics shadowless glue.
Specifically, the step of forming fusion connection layer 130 between the fibre faceplate 120 and the initial cover board 100
Including：Integrating materials are filled between the fibre faceplate 120 and the initial cover board 100；The integrating materials are consolidated
Change processing to form the fusion connection layer 130.
The step of filling integrating materials for the formation of the fusion connection layer 130 for providing Process ba- sis；The solidification
Processing forms the fusion connection layer 130, to realize the fibre faceplate 120 and institute for making the integrating materials cure
State the connection between initial cover board 100.
In the present embodiment, the material of the fusion connection layer 130 is glass, therefore the integrating materials are glass powder.
So including the step of fusion connection layer 130 to be formed to integrating materials progress curing process：Pass through laser curing
Mode to the integrating materials carry out curing process to form the fusion connection layer 130.
Specifically, by the glass powder between fibre faceplate described in laser irradiation 120 and the initial cover board 100, it is right
The glass powder heat；When the glass powder temperature is increased to fusing point, glass powder melts to form melting glass
Glass layer；Later cool down again the molten glass layers, to the shape between the fibre faceplate 120 and the initial cover board 100
At the fusion connection layer 130 that material is glass.
In other embodiments of the invention, the material of the fusion connection layer may be cured silica gel.Therefore described to melt
Condensation material is silica gel.So including the step of the fusion connection layer to be formed to integrating materials progress curing process：It is logical
The mode for crossing thermmohardening or moisture-curable carries out curing process to form the fusion connection layer to the integrating materials.Due to silicon
Glue sheet is as colloidal materials, so the thermmohardening or the mode of moisture-curable can be such that the silica gel of colloid cures, to be formed
The fusion connection layer.
In other embodiments of the invention, the material of the fusion connection layer can be cured optics shadowless glue, i.e., described
Integrating materials are optics shadowless glue.The optics shadowless glue is also known as light-sensitive emulsion or ultraviolet cured adhesive.So to the fusion material
Material carries out curing process：To the fusion material by way of ultraviolet light
Material carries out curing process to form the fusion connection layer.
It should be noted that in the present embodiment, filled between the fibre faceplate 120 and the initial cover board 100
The step of integrating materials includes：Pigment is added into integrating materials to form the coloured integrating materials of tool.
Make the coloured integrating materials solidification of tool, can be formed and have coloured fusion connection layer 130.The fusion connection
Layer 130 surrounds the fibre faceplate 130, so as to make the appearance of the fibre faceplate 130 further to the shape of button,
Be conducive to improve the aesthetics for improving the cover sheet.
It should be noted that in the present embodiment, with applied to the protection cap in the electronic equipment with fingerprint imaging function
It is illustrated for plate.But this way is only an example, in other embodiments of the invention, the cover sheet can also answer
For in the electronic equipment with display function.In the electronic equipment that the cover sheet is applied to display function, the light
The guide-lighting effect of fine panel can effectively improve the display effect of the electronic equipment, play the function of display enhancing.
Correspondingly, the present invention also provides a kind of cover sheets.
With reference to figure 8 and Fig. 9, the structural schematic diagram of one embodiment of cover sheet of the present invention is shown.Wherein Fig. 9 is in Fig. 8
Along the schematic cross-sectional view of BB lines.
It should be noted that in the present embodiment, the cover sheet is applied to the electronic equipment with fingerprint imaging function
In.But this is only an example, cover sheet of the invention can also be applied to electronic equipment etc. with display function its
In the electronic equipment of his type.
The cover sheet includes：
Initial cover board 100；Through the fibre faceplate 120 of the initial cover board 100；Positioned at the fibre faceplate 120 and institute
The fusion connection layer 130 between initial cover board 100 is stated, for realizing the company of the fibre faceplate 120 and the initial cover board 100
It connects.
The initial cover board 100 is used to form cover sheet, for providing technological operation basis.
In the present embodiment, the cover sheet is used to form hand-set lid, so the initial cover board 100 is the lid of mobile phone
Glass sheet, the part for constituting hand-set lid, to protect the hardware device covered by the hand-set lid.
Specifically, in order to improve the protective capability of formed cover sheet, reduces and be located at hardware below the cover sheet
The damage of equipment, in the present embodiment, the material of the initial cover board 100 is tempered glass, make the hardness of the cover sheet compared with
Greatly.
The fibre faceplate 120 is used to form cover sheet, and the fibre faceplate 120 is additionally operable to realize leaded light, makes institute's shape
There is light-guiding function at cover sheet, to extend the function of formed cover sheet.
Fibre faceplate (Fiber Optic Plate, FOP) is regularly arranged by a large amount of optical fiber and formed, therefore with number
It is worth the features such as aperture is big, interstage coupling loss is small, high resolution, zero optical thickness, HD image can be transmitted without distortions.
Fibre faceplate 120 has the optical fiber of transmission a performance of collimation, and with higher optical transmission efficiency and zero optical thickness
Feature, therefore the setting of the fibre faceplate 120 can make formed cover sheet have the function of leaded light, to be conducive to
State the expansion of cover sheet function.
As shown in figure 9, in the electronic equipment that the cover sheet is applied to fingerprint imaging function, the fiber facet
The light-guiding function of plate 120 can play collimation, so as to effectively reduce to the light for transmiting the cover sheet
The angle of divergence for penetrating the cover sheet incident light is conducive to obtain the reflection light compared with small divergence angle, is conducive to improve fingerprint image
As the problem of amplification.
It should be noted that in the present embodiment, 120 thickness of the fibre faceplate is suitable with 110 thickness of initial cover board.
By 120 thickness of the fibre faceplate be set as with 110 comparable way of the initial cover board, formed cover sheet can be improved
The uniformity of thickness, to be conducive to reduce the stress inside the cover sheet, the especially described initial cover board 100 with it is described
Stress between fibre faceplate 120 is conducive to the intensity for improving the cover sheet and durable performance.
Specifically, the difference of 120 thickness of the fibre faceplate and non-through initial 110 thickness of cover board of porose area is in -0.5mm
Into 0.5mm, that is to say, that the difference of 120 thickness of the fibre faceplate and non-through initial 110 thickness of cover board of porose area is not
It is no more than more than 0.5mm or initial 110 thickness of cover board of the non-through porose area and the difference of 120 thickness of the fibre faceplate
0.5mm.If 120 thickness of the fibre faceplate and the difference of non-through initial 110 thickness of cover board of porose area are too big, it is unfavorable for
The reduction of the cover sheet internal stress, is unfavorable for the enhancing of intensity and durable performance.
In the present embodiment, the shape of the fibre faceplate 120 is oblong.In other embodiments of the invention, the optical fiber
The shape of panel may be the other shapes such as round or rectangular.
It should be noted that the fibre faceplate 120 is shaped to oblong, circle or the closed figures such as rectangular
Way, the shape of 120 analogue-key of the fibre faceplate can be made, so as to effectively improve the outer of the cover sheet
It sees.The shape of the fibre faceplate 120 is related to the specific appearance design of the cover sheet, with the integrated cover sheet electricity
The appearance of sub- equipment is related.
The size of the fibre faceplate 120 can realize that the range of light-guiding function is related to the cover sheet, so institute
The size for stating fibre faceplate 120 should not be too small.If the size of the fibre faceplate 120 is too small, the cover sheet can be real
The range of existing light-guiding function is too small, is unfavorable for the expansion of the cover sheet function.In the present embodiment, the cover sheet application
In the electronic equipment with fingerprint imaging function, the shape of the fibre faceplate 120 is oblong, so the oblong light
The wide D of fine panel 120 is (as shown in Figure 5) to be greater than or equal to 2mm.
In other embodiments of the invention, the fibre faceplate may be other shapes.When the shape of the fibre faceplate
Diameter for circle, the round fiber panel is greater than or equal to 2mm；The shape of the fibre faceplate be it is rectangular, it is described rectangular
The length of side of fibre faceplate is greater than or equal to 2mm.
It should be noted that in the present embodiment, the fibre faceplate 120 has towards the side of the initial cover board 100
And the vertical side and the first face and the second face that are disposed opposite to each other, have at least one face in first face or the second face
There is pattern.
The fibre faceplate 120 can transmit HD image without distortions, therefore the first of the fibre faceplate 120
Pattern is set on face or the second face, can make the fibre faceplate that image be presented, to be conducive to improve the cover sheet
Aesthetics.
The fusion connection layer 130 is for realizing the connection between the fibre faceplate 120 and the initial cover board 100.
In the present embodiment, the material of the fusion connection layer 130 is glass.In other embodiments of the invention, the fusion
The material of articulamentum 130 can also be silica gel or optics shadowless glue.
It should be noted that the thickness of the fusion connection layer 130 should not it is too big also should not be too small.
If the thickness of the fusion connection layer 130 is too small, it is unfavorable for the fibre faceplate 120 and the initial cover board
The intensity connected between 100, and 130 thickness of fusion connection layer also brings along the increase of technology difficulty；The fusion connects
If the thickness for connecing layer 130 is too big, 120 area of fibre faceplate reduces therewith, is unfavorable for formed cover sheet leaded light effect
Implementation, be unfavorable for expanding the function of the cover sheet.Specifically, in the present embodiment, the thickness of the fusion connection layer 130
In 0.05mm to 1.5mm ranges.
In addition, in the present embodiment, the fusion connection layer 130 is to have coloured fusion connection layer, so the fusion
The material of articulamentum further includes pigment.The fusion connection layer 130 surrounds the fibre faceplate 130, so as to make the light
The appearance of fine panel 130 is conducive to improve the aesthetics for improving the cover sheet further to the shape of button.
The present invention also provides a kind of electronic equipment.
With reference to figure 10, the cross-sectional view of one embodiment of electronic equipment of the present invention is shown.
The electronic equipment includes：
Light source 240, for generating incident light；The cover sheet 200 of the present invention, the fibre faceplate 220 is for transmiting institute
Incident light is stated, the incident light carries the reflected light of finger print information through reflecting to form；Imaging sensor 250, for acquiring
Reflected light is stated to obtain fingerprint image.
The light source 240 is for generating incident light.
In the present embodiment, the light source 240 is light emitting diode.
In order to improve the integrated level of the electronic equipment, in the present embodiment, the light source 240 is located at described image sensor
250 side, incident light caused by the light source 240 is with certain angle of divergence oblique transmission cover sheet 220.
The cover sheet 200 is the cover sheet of the present invention, the technical solution such as previous embodiment of the cover sheet
Described, details are not described herein by the present invention.
Although incident light with the oblique cover sheet 220 that is projected to of certain angle of divergence towards in the one side of light source 240,
It is that can play the effect of collimation, institute since the part of fibre faceplate 220 in the cover sheet 200 has the function of leaded light
To be projected to collimating effect of the incident light on fibre faceplate 220 by the fibre faceplate 220, so transmiting the fiber facet
The angle of divergence of the incident light of plate 220 is smaller.
The electronic equipment further includes：Sensing face, for receiving touch.
The incident light for transmiting the fibre faceplate 220 is reflected in the sensing face, and formation carries finger print information
Reflected light.Specifically, in the present embodiment, the fibre faceplate 220 is directly touched, so the fibre faceplate 220 is backwards
The surface of described image sensor is the sensing face.
Described image sensor 250 is used to acquire the reflected light, and the optical signal of the reflected light is converted to electric signal,
To obtain fingerprint image.
Since the angle of divergence of incident light is smaller, so the angle of divergence of formed reflected light is also smaller, described image sensor
The scale-up problem of 250 obtained fingerprint images is improved.That is, the light-guiding function of the cover sheet can be effectively
The scale-up problem for improving fingerprint image, is conducive to the fingerprint imaging function of improving the electronic equipment.
Described image sensor 250 is located at 220 corresponding position of the fibre faceplate.That is, described image senses
Projection of the device 250 on 200 surface of the cover sheet is located at the position of the fibre faceplate 200.This way can be advantageous
Reflected light is acquired in described image sensor 250, is conducive to the quality for improving formed fingerprint image.
The light source 240 and described image sensor 250 are for constituting fingerprint imaging module.Due to the cover sheet
200 have light-guiding function, can play the role of collimation to 240 formed incident light of the light source, so 240 energy of the light source
Enough it is set to the side of described image sensor 250；And the thickness of described image sensor 250 can be controlled by formation process
Degree, to which on the direction on vertical 220 surface of the cover sheet, the thickness of described image sensor 250 is less than or equal to described
The thickness of light source 240, therefore on the direction on vertical 200 surface of the cover sheet, the size of the fingerprint imaging module is big
In or equal to the light source 240 thickness.The reduction of the fingerprint imaging module size is conducive to improve the electronic equipment
Integrated level is conducive to the volume for reducing the electronic equipment.Specifically, in the present embodiment, vertical 200 surface of the cover sheet
Direction on, the thickness of the fingerprint imaging module is in 0.010mm to 1.200mm ranges.
It should be noted that in the present embodiment, the fibre faceplate 220 has towards the side of the initial cover board and hangs down
The first face and second face opposite with first face of the straight side, with pattern on first face；Described first
Facing towards described image sensor 250；Second face is the sensing face.
The way that will have figuratum first face and be provided towards described image sensor 250, is not provided with the of pattern
Two faces are used as sensing face, are touched for contacting.This way can reduce the probability of pattern abrasion, and the second face is not arranged
There is pattern, flatness is higher, is conducive to improve the comfort level that finger touches；In addition, cover sheet 200 described in incident light transmission
When, it is the direction transmission for being directed toward the second face with the first face, so described be arranged pattern on first face, also can effectively carries
The display effect of high pattern is conducive to the appearance for improving the electronic equipment.
To sum up, in technical solution of the present invention, by forming fusion connection layer between fibre faceplate and initial cover board, with institute
It states fusion connection layer and realizes connection between the fibre faceplate and the initial cover board, to form cover sheet.Due to light
Fine panel is to be formed by optical fiber fusion pressure, therefore fibre faceplate has higher optical transmission efficiency high, optically with zero thickness
Feature, so the use of the fibre faceplate can make the cover sheet have the function of leaded light, to be conducive to the guarantor
The expansion of protecting cover plate function.And in alternative of the present invention, the fibre faceplate thickness and the non-through initial cover board of porose area
The difference of thickness in -0.5mm within the scope of 0.5mm, compared with using the technical solution of half-blind hole, the fibre faceplate and described
Thickness difference is smaller between initial cover board, can effectively reduce stress between the fibre faceplate and the initial cover board, enhances
The intensity of the cover sheet is conducive to extend the service life and stability of the cover sheet；The fusion connection layer is filled out
It fills between the fibre faceplate and the initial cover board, avoids stitching between the fibre faceplate and the initial cover board
Gap can effectively reduce the appearance of drainage, be conducive to the water resistance for improving the cover sheet.In addition, of the invention
In alternative, by forming the through-hole through the initial cover board on the initial cover board；Light is inserted in the through-hole
Fine panel simultaneously forms fusion connection layer in the panel and the through-hole side wall.The wherein described through-hole is by etching or being machined
Mode formed on the initial cover board, the technology difficulty for forming the through-hole is relatively low, advantageously reduces process costs, improve
Process yields.In addition, the present invention also provides a kind of electronic equipment, the electronic equipment cover sheet using the present invention, light source
The initial light of generation, the transmission through the fibre faceplate form incident light, and the incident light carries fingerprint letter through reflecting to form
The reflected light of breath.Since fibre faceplate is formed by optical fiber fusion pressure, fibre faceplate is when transmiting the initial light, to described first
Beginning light has the function of collimation, so being formed by, incident light collimation performance is preferable, and the angle of divergence is smaller, to be conducive to reduce institute
The angle of divergence for forming reflected light reduces fingerprint image and the several of deformation problems occurs the problem of being conducive to improve fingerprint image amplification
Rate, to be conducive to improve the quality of the obtained fingerprint image of the electronic equipment.
Although present disclosure is as above, present invention is not limited to this.Any those skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (27)
1. a kind of forming method of cover sheet, which is characterized in that including：
Initial cover board is provided, the initial cover board includes through hole area and non-through porose area；
Through-hole is formed in the through hole area of the initial cover board；
The fibre faceplate being adapted with the through-hole is provided and inserts the fibre faceplate in the through-hole；
Fusion connection layer is formed between the fibre faceplate and the initial cover board of the non-through porose area.
2. forming method as described in claim 1, which is characterized in that the shape between the fibre faceplate and the initial cover board
Include at the step of fusion connection layer：
Integrating materials are filled between the fibre faceplate and the initial cover board；
Curing process is carried out to form the fusion connection layer to the integrating materials.
3. forming method as claimed in claim 2, which is characterized in that the integrating materials are silica gel, glass powder or optics
Shadowless glue.
4. forming method as claimed in claim 3, which is characterized in that when the integrating materials are silica gel, to the fusion
Material carries out curing process：To institute by way of thermmohardening or moisture-curable
It states integrating materials and carries out curing process to form the fusion connection layer.
5. forming method as claimed in claim 3, which is characterized in that when the integrating materials are glass powder, to described
Integrating materials carry out curing process：Melted to described by way of laser curing
Condensation material carries out curing process to form the fusion connection layer.
6. forming method as claimed in claim 2, which is characterized in that filled out between the fibre faceplate and the initial cover board
The step of filling integrating materials include：Pigment is added into integrating materials to form the coloured integrating materials of tool.
7. forming method as described in claim 1, which is characterized in that the fibre faceplate has towards the initial cover board
At least one face in side and the vertical side and the first face and the second face being disposed opposite to each other, first face or the second face
It is upper that there is pattern.
8. forming method as described in claim 1, which is characterized in that the shape of the through-hole is round, oblong or rectangular.
9. forming method as claimed in claim 8, which is characterized in that described round logical when the shape of the through-hole is round
The diameter in hole is more than 2mm；
When the shape of the through-hole is oblong, the oblong through-hole is wider than 2mm；
When the shape of the through-hole is rectangular, the length of side of the square through hole is more than 2mm.
10. forming method as described in claim 1, which is characterized in that the side wall of the fibre faceplate and the non-through porose area
Gap between initial cover board is in 0.05mm to 1.5mm ranges.
11. forming method as described in claim 1, which is characterized in that at the beginning of the fibre faceplate thickness and the non-through porose area
The difference of beginning cover sheet thickness is within the scope of -0.5mm to 0.5mm.
12. forming method as described in claim 1, which is characterized in that the material of the initial cover board is tempered glass.
13. forming method as described in claim 1, which is characterized in that wrapped in the step of forming through-hole on the initial cover board
It includes：By way of etching or being machined the through-hole is formed on the initial cover board.
14. a kind of cover sheet, which is characterized in that including：
Initial cover board；
Through the fibre faceplate of the initial cover board；
Fusion connection layer between the fibre faceplate and the initial cover board.
15. cover sheet as claimed in claim 14, which is characterized in that the material of the fusion connection layer is silica gel, glass
Powder or optics shadowless glue.
16. the cover sheet as described in claims 14 or 15, which is characterized in that the fusion connection layer is to have coloured melt
Articulamentum is closed, the material of the fusion connection layer further includes pigment.
17. cover sheet as claimed in claim 14, which is characterized in that the thickness of the fusion connection layer is arrived in 0.05mm
Within the scope of 1.5mm.
18. cover sheet as claimed in claim 14, which is characterized in that the fibre faceplate has towards the initial cover board
Side and the vertical side and the first face and the second face that are disposed opposite to each other, first face or the second face it is at least one
There is pattern on face.
19. cover sheet as claimed in claim 14, which is characterized in that the shape of the fibre faceplate is round, oblong
Or it is rectangular.
20. cover sheet as claimed in claim 19, which is characterized in that described when the shape of the fibre faceplate is round
The diameter of round fiber panel is greater than or equal to 2mm；
When the shape of the fibre faceplate is oblong, the oblong fibre faceplate is wider than or is equal to 2mm；
When the shape of the fibre faceplate is rectangular, the length of side of the rectangular fibre faceplate is greater than or equal to 2mm.
21. cover sheet as claimed in claim 14, which is characterized in that the thickness of the fibre faceplate and the initial cover board
Thickness it is identical.
22. cover sheet as claimed in claim 14, which is characterized in that the material of the initial cover board is tempered glass.
23. a kind of electronic equipment, which is characterized in that including：
Light source, for generating incident light；
Cover sheet, as described in any one of claim 14 to claim 22 claim, the fibre faceplate is for transmiting
The incident light；
Sensing face, the incident light for transmiting the fibre faceplate are reflected in sensing face, form the reflection for carrying finger print information
Light；
Imaging sensor, for acquiring the reflected light to obtain fingerprint image.
24. electronic equipment as claimed in claim 23, which is characterized in that the light source is located at the one of described image sensor
Side, the light source and described image sensor are for constituting fingerprint imaging module；
On the direction on the vertical cover sheet surface, the size of the fingerprint imaging module is greater than or equal to the thickness of the light source
Degree.
25. the electronic equipment as described in claim 23 or 24, which is characterized in that the direction on the vertical cover sheet surface
On, the thickness of the fingerprint imaging module is in 0.010mm to 1.200mm ranges.
26. electronic equipment as claimed in claim 23, which is characterized in that described image sensor is located at the fibre faceplate pair
The position answered.
27. electronic equipment as claimed in claim 23, which is characterized in that the fibre faceplate has towards the initial cover board
Side and the vertical side the first face and second face opposite with first face；
There is pattern on first face；
Described first facing towards described image sensor；
Second face is the sensing face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710091497.6A CN108460315A (en) | 2017-02-20 | 2017-02-20 | Cover sheet and forming method thereof, electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710091497.6A CN108460315A (en) | 2017-02-20 | 2017-02-20 | Cover sheet and forming method thereof, electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108460315A true CN108460315A (en) | 2018-08-28 |
Family
ID=63221692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710091497.6A Pending CN108460315A (en) | 2017-02-20 | 2017-02-20 | Cover sheet and forming method thereof, electronic equipment |
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| Country | Link |
|---|---|
| CN (1) | CN108460315A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108733140A (en) * | 2017-04-24 | 2018-11-02 | 上海箩箕技术有限公司 | Display device and electronic equipment |
| CN109690663A (en) * | 2018-09-26 | 2019-04-26 | 京东方科技集团股份有限公司 | The hardness enhancement layer of flexible display apparatus and surface hardness and mechanical strength for enhancing flexible display panels |
| TWI767555B (en) * | 2021-02-05 | 2022-06-11 | 大陸商業成科技（成都）有限公司 | Cover plate structure and manufacturing method thereof |
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| US20080112607A1 (en) * | 2006-11-10 | 2008-05-15 | Hon Hai Precision Industry Co., Ltd. | System and method for testing leds on a motherboard |
| CN204331746U (en) * | 2014-11-27 | 2015-05-13 | 比亚迪股份有限公司 | Fingerprint identification device and electronic equipment |
| CN105809098A (en) * | 2014-12-31 | 2016-07-27 | 上海箩箕技术有限公司 | Mobile terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080112607A1 (en) * | 2006-11-10 | 2008-05-15 | Hon Hai Precision Industry Co., Ltd. | System and method for testing leds on a motherboard |
| CN204331746U (en) * | 2014-11-27 | 2015-05-13 | 比亚迪股份有限公司 | Fingerprint identification device and electronic equipment |
| CN105809098A (en) * | 2014-12-31 | 2016-07-27 | 上海箩箕技术有限公司 | Mobile terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108733140A (en) * | 2017-04-24 | 2018-11-02 | 上海箩箕技术有限公司 | Display device and electronic equipment |
| CN109690663A (en) * | 2018-09-26 | 2019-04-26 | 京东方科技集团股份有限公司 | The hardness enhancement layer of flexible display apparatus and surface hardness and mechanical strength for enhancing flexible display panels |
| TWI767555B (en) * | 2021-02-05 | 2022-06-11 | 大陸商業成科技（成都）有限公司 | Cover plate structure and manufacturing method thereof |
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