TWM572985U - Testing device - Google Patents

Testing device Download PDF

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Publication number
TWM572985U
TWM572985U TW107208814U TW107208814U TWM572985U TW M572985 U TWM572985 U TW M572985U TW 107208814 U TW107208814 U TW 107208814U TW 107208814 U TW107208814 U TW 107208814U TW M572985 U TWM572985 U TW M572985U
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Taiwan
Prior art keywords
light
detection device
light guide
guide element
reflection
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TW107208814U
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Chinese (zh)
Inventor
林伯駿
巫仁杰
黃承鈞
游國良
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金佶科技股份有限公司
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Priority claimed from US16/008,037 external-priority patent/US10460188B2/en
Application filed by 金佶科技股份有限公司 filed Critical 金佶科技股份有限公司
Publication of TWM572985U publication Critical patent/TWM572985U/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

A bio-sensing apparatus adapted to sense biopolymers is provided. The bio-sensing apparatus includes a sensing device, a translucent device and a surface plasmon resonance layer. The translucent device is disposed on the sensing device. The surface plasmon resonance layer is disposed on the translucent device and is adapted to receive the biopolymers. The translucent device is disposed between the surface plasmon resonance layer and the sensing device.

Description

檢測裝置Detection device

本新型是有關於一種檢測裝置,且特別是有關於用以感測生物高聚物的一種檢測裝置。The present invention relates to a detection device, and more particularly, to a detection device for sensing a biopolymer.

以往的身份辨識技術例如是利用將生物特徵(例如:手指)按壓墨水後轉印到紙張上形成指紋圖形,接著再利用光學掃描輸入電腦作建檔或比對。上述的身份辨識具有無法即時處理的缺點,也無法符合現今社會中對於即時身份認證的需求。因此,電子式的生物特徵辨識裝置成為了目前科技發展的主流之一。然而,一般而言,生物特徵辨識裝置僅具備生物特徵辨識的功能。因此,如何增加生物特徵辨識裝置的其它功能,以提升生物特徵辨識裝置的附加價值也是目前開發的方向之一。In the past, the identification technology used, for example, a biometric (for example, a finger) to press the ink and transfer it to a paper to form a fingerprint pattern, and then an optical scan was used to enter a computer for file creation or comparison. The above-mentioned identity recognition has the disadvantage that it cannot be processed immediately, nor can it meet the needs for instant identity authentication in today's society. Therefore, electronic biometric identification devices have become one of the mainstreams of current scientific and technological development. However, in general, the biometric identification device only has a function of biometric identification. Therefore, how to increase other functions of the biometric identification device to enhance the added value of the biometric identification device is also one of the current development directions.

本新型提供一種檢測裝置,能感測生物高聚物。The present invention provides a detection device capable of sensing a biopolymer.

本新型一實施例的檢測裝置包括導光元件、第一反射元件、感測元件、發光元件以及表面電漿共振層。導光元件包括頂面以及相對於頂面的底面。第一反射元件設置於導光元件的底面上。感測元件配置於導光元件的底面旁。發光元件用以發出光束,其中光束被第一反射元件反射而傳遞至感測元件。表面電漿共振層設置於導光元件上,且用以接收生物高聚物。導光元件位於表面電漿共振層與感測元件之間。The detection device according to an embodiment of the present invention includes a light guide element, a first reflection element, a sensing element, a light emitting element, and a surface plasma resonance layer. The light guide element includes a top surface and a bottom surface opposite to the top surface. The first reflective element is disposed on a bottom surface of the light guide element. The sensing element is disposed beside the bottom surface of the light guide element. The light emitting element is used for emitting a light beam, wherein the light beam is reflected by the first reflecting element and transmitted to the sensing element. The surface plasma resonance layer is disposed on the light guide element and is used to receive the biopolymer. The light guide element is located between the surface plasma resonance layer and the sensing element.

基於上述,本新型一實施例的檢測裝置兼具生物特徵辨識及感測生物高聚物的功能,附加價值高。Based on the above, the detection device according to an embodiment of the present invention has the functions of both biometric identification and biopolymer detection, and has high added value.

為讓本新型的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, embodiments are described below in detail with reference to the accompanying drawings.

有關本新型之前述及其他技術內容、特點與功效,在以下配合參考圖式之各實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:「上」、「下」、「前」、「後」、「左」、「右」等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明,而並非用來限制本新型。並且,在下列任一實施例中,相同或相似的元件將採用相同或相似的標號。The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of each embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as: "up", "down", "front", "rear", "left", "right", etc., are only directions referring to the attached drawings. Therefore, the directional terms used are used for illustration, not for limiting the present invention. Also, in any of the following embodiments, the same or similar elements will be given the same or similar reference numerals.

圖1為本新型一實施例之檢測裝置的剖面示意圖。圖2為本新型一實施例之檢測裝置的局部的示意圖。請參照圖1及圖2,檢測裝置200位於環境介質1中。在本實施例中,環境介質1例如為空氣。但本新型不限於此,在其他實施例中,檢測裝置200也可能位於其他種類的環境介質中。檢測裝置200用以擷取物體的影像。在正常情況下,所述物體為生物特徵,例如:指紋,但本新型不以此為限。FIG. 1 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 2 is a schematic diagram of a part of a detection device according to an embodiment of the present invention. Referring to FIGS. 1 and 2, the detection device 200 is located in the environmental medium 1. In this embodiment, the environmental medium 1 is, for example, air. However, the present invention is not limited to this. In other embodiments, the detection device 200 may be located in other types of environmental media. The detection device 200 is used for capturing an image of an object. Under normal circumstances, the object is a biological feature, such as a fingerprint, but the present invention is not limited to this.

檢測裝置200包括導光元件210。導光元件210具有頂面212、相對於頂面212的底面214、連接於頂面212與底面214之間的入光面216以及出光面218。出光面218相對於頂面212。底面214連接於入光面216與出光面218之間。特別是,入光面216相對於頂面212傾斜,且入光面216與頂面212夾有銳角α。The detection device 200 includes a light guide element 210. The light guide element 210 has a top surface 212, a bottom surface 214 opposite to the top surface 212, a light incident surface 216 and a light exit surface 218 connected between the top surface 212 and the bottom surface 214. The light emitting surface 218 is opposite to the top surface 212. The bottom surface 214 is connected between the light incident surface 216 and the light exit surface 218. In particular, the light incident surface 216 is inclined with respect to the top surface 212, and the light incident surface 216 and the top surface 212 have an acute angle α therebetween.

在本實施例中,導光元件210更具有內壁213。出光面218較底面214靠近透光元件220。內壁213連接於底面214與出光面218之間。內壁213與出光面218形成凹陷210a。換言之,導光元件210包括具有底面214的厚部210-1以及具有出光面218的薄部210-2。在本實施例中,出光面218及底面214可選擇性地平行於頂面212,但本新型不以此為限,在其他實施例中,出光面218也可相對於頂面212傾斜,以下將於後續段落中配合其他圖示舉例說明之。In this embodiment, the light guide element 210 further has an inner wall 213. The light emitting surface 218 is closer to the light transmitting element 220 than the bottom surface 214. The inner wall 213 is connected between the bottom surface 214 and the light emitting surface 218. The inner wall 213 and the light emitting surface 218 form a depression 210a. In other words, the light guide element 210 includes a thick portion 210-1 having a bottom surface 214 and a thin portion 210-2 having a light emitting surface 218. In this embodiment, the light emitting surface 218 and the bottom surface 214 may be selectively parallel to the top surface 212, but the present invention is not limited thereto. In other embodiments, the light emitting surface 218 may be inclined with respect to the top surface 212, as follows It will be illustrated in the following paragraphs with other illustrations.

檢測裝置200包括透光元件220。透光元件220配置於導光元件210的頂面212上。在本實施例中,透光元件220可透過光學膠(未繪示)固定於導光元件210的頂面212上。導光元件210的材料及/或透光元件220的材料可選自玻璃、聚甲基丙烯酸甲酯(PMMA,Polymethylmethacrylate)、聚碳酸酯(PC,Polycarbonate)或其他適當的透光材質。在本實施例中,導光元件210、所述光學膠及透光元件220可具有相同或相近的折射率,但本新型不以此為限。The detection device 200 includes a light transmitting element 220. The light transmitting element 220 is disposed on the top surface 212 of the light guiding element 210. In this embodiment, the light-transmitting element 220 can be fixed on the top surface 212 of the light-guiding element 210 through an optical adhesive (not shown). The material of the light guide element 210 and / or the material of the light transmitting element 220 may be selected from glass, polymethylmethacrylate (PMMA, Polycarbonate), or other appropriate light transmitting materials. In this embodiment, the light guide element 210, the optical adhesive, and the light transmitting element 220 may have the same or similar refractive indices, but the present invention is not limited thereto.

檢測裝置200包括發光元件230。發光元件230配置於入光面216旁且用以發出光束L。在本實施例中,導光元件210的入光面216具有凹陷216a。發光元件230配置於凹陷216a中。檢測裝置200更包括光學膠250。光學膠250填入凹陷216a,以包覆發光元件230並連接發光元件230與導光元件210。在本實施例中,光學膠250可具有與導光元件210相同或相近的折射率,以減少光束L進入導光元件210前的損失,但本新型不以此為限。在本實施例中,光束L例如為非可見光。藉此,裝有檢測裝置200的電子產品在擷取物體的影像時,光束L不會影響電子產品的外觀。然而,本新型不限於此,在其他實施例中,光束L也可為可見光或可見光與不可見光的組合。在本實施例中,發光元件230可為發光二極體,但本新型不限於此,在其他實施例中,發光元件230也可為其他適當種類的發光元件。The detection device 200 includes a light emitting element 230. The light emitting element 230 is disposed beside the light incident surface 216 and is used to emit a light beam L. In this embodiment, the light incident surface 216 of the light guide element 210 has a recess 216a. The light emitting element 230 is disposed in the recess 216a. The detection device 200 further includes an optical glue 250. The optical glue 250 is filled in the recess 216 a to cover the light emitting element 230 and connect the light emitting element 230 and the light guiding element 210. In this embodiment, the optical glue 250 may have the same or similar refractive index as the light guide element 210 to reduce the loss before the light beam L enters the light guide element 210, but the present invention is not limited thereto. In this embodiment, the light beam L is, for example, invisible light. Therefore, when the electronic product equipped with the detection device 200 captures an image of an object, the light beam L does not affect the appearance of the electronic product. However, the present invention is not limited to this. In other embodiments, the light beam L may be visible light or a combination of visible light and invisible light. In this embodiment, the light-emitting element 230 may be a light-emitting diode, but the present invention is not limited thereto. In other embodiments, the light-emitting element 230 may also be another appropriate type of light-emitting element.

檢測裝置200包括感測元件240。感測元件240配置於導光元件210的出光面218上。感測元件240的光接收面240a面向導光元件210的出光面218。在本實施例中,感測元件240承靠於導光元件210的出光面218,而感測元件240的光接收面240a可與導光元件210的出光面218實質上平行。感測元件240例如為電荷耦合元件(Charge Coupled Device,CCD)或互補式金屬氧化物半導體元件(Complementary Metal-Oxide Semiconductor,CMOS),但本新型不限於此,在其他實施例中,感測元件240也可為其他適當種類的影像感測器。The detection device 200 includes a sensing element 240. The sensing element 240 is disposed on the light emitting surface 218 of the light guide element 210. The light-receiving surface 240 a of the sensing element 240 faces the light-emitting surface 218 of the light-emitting element 210. In this embodiment, the sensing element 240 bears on the light emitting surface 218 of the light guiding element 210, and the light receiving surface 240 a of the sensing element 240 may be substantially parallel to the light emitting surface 218 of the light guiding element 210. The sensing element 240 is, for example, a Charge Coupled Device (CCD) or a Complementary Metal-Oxide Semiconductor (CMOS). However, the present invention is not limited thereto. In other embodiments, the sensing element 240 240 may also be other suitable types of image sensors.

請參照圖1及圖2,光束L穿過入光面216後向透光元件220傳遞,至少部份的光束L會於透光元件220與環境介質1的交界面222發生全反射。當物體(例如:指紋凸部)觸碰交界面222時,在對應指紋凸部的部份交界面222上,光束L的全反射會被破壞,進而使感測元件240取得對應指紋凸部的暗紋;指紋凸部觸碰部份交界面222的同時,指紋凹部不會觸碰交界面222,在對應指紋凹部的另一部份交界面222上,光束L的全反射不會被破壞,進而使感測元件240取得對應指紋凹部的亮紋;藉此,感測元件240能取得亮暗相間的物體影像(例如:指紋影像)。1 and FIG. 2, the light beam L passes through the light incident surface 216 and is transmitted to the light transmitting element 220. At least a part of the light beam L is totally reflected at the interface 222 between the light transmitting element 220 and the environmental medium 1. When an object (for example: a fingerprint convex portion) touches the interface 222, the total reflection of the light beam L will be destroyed on a portion of the interface 222 corresponding to the fingerprint convex portion, so that the sensing element 240 obtains the corresponding fingerprint convex portion. Dark lines; while the convex part of the fingerprint touches part of the interface 222, the concave part of the fingerprint will not touch the interface 222. On the other part of the interface 222 corresponding to the concave part of the fingerprint, the total reflection of the light beam L will not be damaged. Furthermore, the sensing element 240 is configured to obtain a bright pattern corresponding to the concave portion of the fingerprint; thereby, the sensing element 240 can obtain a bright and dark object image (for example, a fingerprint image).

值得注意的是,透過傾斜的入光面216(即銳角α的設計),發光元件230發出的光束L能在短距離k內於透光元件220與環境介質1的交界面222發生全反射。藉此,檢測裝置200的尺寸能縮減,以利於安裝在各式電子產品中。在本實施例中,可適當地設計銳角α的大小,以在縮減檢測裝置200尺寸的前提下,更進一步提高光束L在交界面222發生全反射的比例。舉例而言,在本實施例中,銳角α可滿足下式(1): ---(1) ,其中θ i為光束L自入光面216射入導光元件210的角度,n 1為環境介質1的折射率,而n 2為導光元件210的折射率。若由入光面216之法線(例如:在圖2中,沒有與光束L平行的虛線)到光束L的方向為順時針方向,則θ i為負值。若由入光面216之法線(例如:在圖2中,沒有與光束L平行的虛線)到光束L的方向為逆時針方向,則θ i為正值。角α滿足上式(1)時,光束L於交界面222發生全反射的比例提高,而有助於提升檢測裝置200的取像品質。 It is worth noting that through the inclined light incident surface 216 (ie, the design of the acute angle α), the light beam L emitted from the light emitting element 230 can be totally reflected at the interface 222 between the light transmitting element 220 and the environmental medium 1 within a short distance k. Accordingly, the size of the detection device 200 can be reduced to facilitate installation in various electronic products. In this embodiment, the size of the acute angle α can be appropriately designed to further increase the proportion of total reflection of the light beam L at the interface 222 while reducing the size of the detection device 200. For example, in this embodiment, the acute angle α may satisfy the following formula (1): --- (1), where θ i is the angle at which the light beam L enters the light guide element 210 from the light incident surface 216, n 1 is the refractive index of the environmental medium 1, and n 2 is the refractive index of the light guide element 210. If the direction from the normal of the light incident surface 216 (for example: in FIG. 2, there is no dashed line parallel to the light beam L) to the light beam L is clockwise, then θ i is negative. If the direction from the normal line of the light incident surface 216 (for example: in FIG. 2, there is no dotted line parallel to the light beam L) to the light beam L is counterclockwise, then θ i is a positive value. When the angle α satisfies the above formula (1), the proportion of total reflection of the light beam L at the interface 222 is increased, which is helpful to improve the image pickup quality of the detection device 200.

請參照圖1,在本實施例中,檢測裝置200可進一步包括第二反射元件270以及第一反射元件260。第二反射元件270配置於導光元件210的頂面212且位於透光元件220與導光元件120之間。第一反射元件260配置於導光元件210的底面214。光束L穿過入光面216後依序被第二反射元件270與第一反射元件260反射,以擴大光束L。被擴大的光束L傳向透光元件220且於透光元件220與環境介質1的交界面222發生全反射。感測元件240設置於較第一反射元件260靠近透光元件220處(例如:凹陷210a處)。Referring to FIG. 1, in this embodiment, the detection device 200 may further include a second reflective element 270 and a first reflective element 260. The second reflecting element 270 is disposed on the top surface 212 of the light guiding element 210 and is located between the light transmitting element 220 and the light guiding element 120. The first reflective element 260 is disposed on a bottom surface 214 of the light guide element 210. The light beam L passes through the light incident surface 216 and is sequentially reflected by the second reflection element 270 and the first reflection element 260 to expand the light beam L. The enlarged light beam L is transmitted to the light transmitting element 220 and is totally reflected at the interface 222 between the light transmitting element 220 and the environmental medium 1. The sensing element 240 is disposed closer to the light-transmitting element 220 than the first reflecting element 260 (for example, at the recess 210 a).

值得注意是,透過第二反射元件270與第一反射元件260的擴束作用以及調整感測元件240的位置(例如:令感測元件240的光接收面240a靠近透光元件220,或令感測元件240的光接收面240a相對於頂面212傾斜),感測元件240能使用面積小的光接收面240a擷取完整的物體影像(例如:指紋影像)。換言之,感測元件240的面積可縮小,而包括感測元件240的檢測裝置200的尺寸也能進一步縮減。然而,本新型不限於此,在其他實施中,檢測裝置也可不包括第二反射元件270及第一反射元件260,以下將於後續段落中配合其它圖示舉例說明之。It is worth noting that the beam expansion effect of the second reflecting element 270 and the first reflecting element 260 and the position of the sensing element 240 are adjusted (for example, the light receiving surface 240a of the sensing element 240 is close to the light transmitting element 220, or the sensing element 240 is adjusted). The light receiving surface 240a of the measuring element 240 is inclined relative to the top surface 212), and the sensing element 240 can use the light receiving surface 240a with a small area to capture a complete object image (for example, a fingerprint image). In other words, the area of the sensing element 240 can be reduced, and the size of the detection device 200 including the sensing element 240 can be further reduced. However, the present invention is not limited to this. In other implementations, the detection device may not include the second reflective element 270 and the first reflective element 260, which will be described in the following paragraphs with other examples.

值得注意的是,本實施例的檢測裝置200更包括表面電漿共振(Surface Plasmon Resonance)層SPR。表面電漿共振層SPR設置於透光元件220的表面222上。透光元件220配置於表面電漿共振層SPR與感測元件240之間。在本實施例中,表面電漿共振層SPR的材質例如包括金屬,表面電漿共振層SPR的厚度例如約50奈米(nm),但本新型不以此為限。It is worth noting that the detection device 200 of this embodiment further includes a surface plasma resonance (SPR) layer SPR. The surface plasma resonance layer SPR is disposed on the surface 222 of the light transmitting element 220. The light transmitting element 220 is disposed between the surface plasma resonance layer SPR and the sensing element 240. In this embodiment, the material of the surface plasma resonance layer SPR includes, for example, a metal, and the thickness of the surface plasma resonance layer SPR is, for example, about 50 nanometers (nm), but the present invention is not limited thereto.

表面電漿共振層SPR用以接收生物高聚物(Biopolymers)80,例如:汗水、血液、尿液、細菌、病毒等,但本新型不以此為限。至少一發光元件230用以向表面電漿共振層SPR發出感測光束L。被表面電漿共振層SPR反射的感測光束L具有各種反射角θ;生物高聚物80形成於表面電漿共振層SPR上時,具有各種反射角θ中特定角度(即共振角)之部分感測光束L的反射率會驟降;感測元件240接收被表面電漿共振層SPR反射之具有各種反射角θ的感測光束L;分析感測元件240接收到之感測光束L的光分佈便可推知所述特定角度(即共振角)為何。藉由所述特定角度,便能辨識出設置於表面電漿共振層SPR上的生物高聚物80是否為特定的一種生物高聚物80。以下配合圖52舉例說明之。The surface plasmon resonance layer SPR is used to receive biopolymers 80, such as sweat, blood, urine, bacteria, viruses, etc., but the present invention is not limited to this. The at least one light emitting element 230 is configured to emit a sensing light beam L to the surface plasma resonance layer SPR. The sensing beam L reflected by the surface plasmon resonance layer SPR has various reflection angles θ; when the biopolymer 80 is formed on the surface plasmon resonance layer SPR, it has a specific angle (ie, resonance angle) of various reflection angles θ The reflectivity of the sensing beam L will drop sharply; the sensing element 240 receives the sensing beam L with various reflection angles θ reflected by the surface plasma resonance layer SPR; analyzing the light of the sensing beam L received by the sensing element 240 The distribution can infer what the specific angle (ie the resonance angle) is. Based on the specific angle, whether the biopolymer 80 disposed on the surface plasma resonance layer SPR can be identified is a specific biopolymer 80. This is illustrated below with reference to FIG. 52.

圖52示出被表面電漿共振層SPR反射之感測光束L的各種反射角θ及其反射率的關係。請參照圖1及圖52,舉例而言,第一種生物高聚物80形成於表面電漿共振層SPR上時,被表面電漿共振層SPR反射之具有各種反射角θ的感測光束L於特定角度θ1的反射率會驟降,分析感測元件240所接收之被表面電漿共振層SPR反射之具有各種反射角θ的感測光束L便可推知特定角度θ1為何,藉由特定角度θ1,便能辨識設置於表面電漿共振層SPR上的生物高聚物80為第一種生物高聚物80;第二種生物高聚物80形成於表面電漿共振層SPR上時,被表面電漿共振層SPR反射之具有各種反射角θ2的感測光束L於特定角度θ2的反射率會驟降,分析感測元件240所接收之被表面電漿共振層SPR反射之具有各種反射角θ的感測光束L便可推知特定角度θ2為何,藉由特定角度θ2,便能辨識設置於表面電漿共振層SPR上的生物高聚物80為第二種生物高聚物80;第三種生物高聚物80形成於表面電漿共振層SPR上時,被表面電漿共振層SPR反射之具有各種反射角θ3的感測光束L於特定角度θ3的反射率會驟降,分析感測元件240所接收之被表面電漿共振層SPR反射之具有各種反射角θ的感測光束L便可推知特定角度θ3為何,藉由特定角度θ3,便能辨識設置於表面電漿共振層SPR上的生物高聚物80為第三種生物高聚物80。FIG. 52 shows the relationship between various reflection angles θ of the sensing light beam L reflected by the surface plasma resonance layer SPR and its reflectance. Please refer to FIG. 1 and FIG. 52. For example, when the first biopolymer 80 is formed on the surface plasma resonance layer SPR, the sensing beam L having various reflection angles θ reflected by the surface plasma resonance layer SPR is reflected. The reflectivity at a specific angle θ1 will drop sharply. Analyzing the sensing beam L with various reflection angles θ received by the surface plasma resonance layer SPR received by the sensing element 240 can infer what the specific angle θ1 is. θ1, it can be identified that the biopolymer 80 disposed on the surface plasma resonance layer SPR is the first biopolymer 80; when the second biopolymer 80 is formed on the surface plasma resonance layer SPR, The reflectivity of the sensing beam L with various reflection angles θ2 reflected by the surface plasmon resonance layer SPR at a specific angle θ2 will decrease sharply. The reflections received by the sensing element 240 and reflected by the surface plasmon resonance layer SPR have various reflection angles. The sensing beam L of θ can infer what the specific angle θ2 is. With the specific angle θ2, the biopolymer 80 disposed on the surface plasma resonance layer SPR can be identified as the second biopolymer 80; the third Biopolymer 80 formed on the surface plasma resonance When SPR is on, the reflectance of the sensing beam L with various reflection angles θ3 reflected by the surface plasmon resonance layer SPR at a specific angle θ3 will drop sharply. Analysis received by the sensing element 240 is reflected by the surface plasmon resonance layer SPR The sensing beam L with various reflection angles θ can infer what the specific angle θ3 is. With the specific angle θ3, it is possible to identify the biopolymer 80 disposed on the surface plasma resonance layer SPR as the third biopolymer物 80。 80.

圖3為本新型另一實施例之檢測裝置的剖面示意圖。請參照圖3,檢測裝置200A與前述的檢測裝置200類似,因此相同或相對應的元件,以相同或相對應的標號表示。檢測裝置200A與檢測裝置200的差異在於,檢測裝置200A的出光面218A與檢測裝置200的出光面218不同。以下主要說明此差異,兩者相同或相對應處還請參照前述說明。FIG. 3 is a schematic cross-sectional view of a detection device according to another embodiment of the present invention. Referring to FIG. 3, the detection device 200A is similar to the aforementioned detection device 200, and therefore the same or corresponding components are denoted by the same or corresponding reference numerals. The difference between the detection device 200A and the detection device 200 is that the light emitting surface 218A of the detection device 200A is different from the light emitting surface 218 of the detection device 200. The following mainly describes this difference. Please refer to the previous description for the same or corresponding parts.

請參照圖3,檢測裝置200A包括導光元件210、透光元件220、發光元件230以及感測元件240。導光元件210具有頂面212、相對於頂面212的底面214、連接於頂面212與底面214之間的入光面216以及出光面218A。出光面218A相對於頂面212。底面214連接於入光面216與出光面218A之間。入光面216與頂面212夾有銳角α。透光元件220配置於導光元件210的頂面212上。發光元件230配置於入光面216旁且用以發出光束L。光束L穿過入光面216後向透光元件220傳遞,且於透光元件220與環境介質1的交界面222全反射。感測元件240配置於導光元件210的出光面218A上。Referring to FIG. 3, the detection device 200A includes a light guiding element 210, a light transmitting element 220, a light emitting element 230, and a sensing element 240. The light guide element 210 has a top surface 212, a bottom surface 214 opposite to the top surface 212, a light incident surface 216 connected between the top surface 212 and the bottom surface 214, and a light exit surface 218A. The light emitting surface 218A is opposite to the top surface 212. The bottom surface 214 is connected between the light incident surface 216 and the light exit surface 218A. An acute angle α is included between the light incident surface 216 and the top surface 212. The light transmitting element 220 is disposed on the top surface 212 of the light guiding element 210. The light emitting element 230 is disposed beside the light incident surface 216 and is used to emit a light beam L. The light beam L passes through the light incident surface 216 and is transmitted to the light transmitting element 220, and is totally reflected at the interface 222 between the light transmitting element 220 and the environmental medium 1. The sensing element 240 is disposed on the light emitting surface 218A of the light guide element 210.

與檢測裝置200不同的是,檢測裝置200A的出光面218A是相對於頂面212及底面214傾斜,且頂面212與出光面218A的距離k隨著遠離發光元件230而漸減。感測元件240承靠於出光面218A上,而感測元件240的光接收面240a可與導光元件210的出光面218A實質上平行。感測元件240的光接收面240a也相對於頂面212及底面214傾斜。檢測裝置200A除了具有上述檢測裝置200的功效與優點外,利用傾斜的感測元件240,檢測裝置200A可減少雜散光進入感測元件240的機率,進而提高擷取的物體影像品質,例如:可提高物體影像的對比。Different from the detection device 200, the light-emitting surface 218A of the detection device 200A is inclined with respect to the top surface 212 and the bottom surface 214, and the distance k between the top surface 212 and the light-emitting surface 218A gradually decreases as it moves away from the light emitting element 230. The sensing element 240 bears on the light emitting surface 218A, and the light receiving surface 240 a of the sensing element 240 may be substantially parallel to the light emitting surface 218A of the light guiding element 210. The light receiving surface 240 a of the sensing element 240 is also inclined with respect to the top surface 212 and the bottom surface 214. In addition to the functions and advantages of the detection device 200 described above, the detection device 200A uses a tilted sensing element 240. The detection device 200A can reduce the probability of stray light entering the sensing element 240, thereby improving the image quality of the captured object. Improve the contrast of object images.

圖4為本新型一實施例之檢測裝置的剖面示意圖。圖5為本新型一實施例之檢測裝置的局部的示意圖。請參照圖4及圖5,檢測裝置200B與檢測裝置200A類似,因此相同或相對應的元件,以相同或相對應的標號表示。檢測裝置200B與檢測裝置200A的差異在於,發光元件230B是配置於導光元件210外且位於環境介質1中。以下主要說明此差異,兩者相同或相對應處還請參照前述說明。FIG. 4 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 5 is a schematic diagram of a part of a detection device according to an embodiment of the present invention. Please refer to FIG. 4 and FIG. 5, the detection device 200B is similar to the detection device 200A, and therefore the same or corresponding components are denoted by the same or corresponding reference numerals. The difference between the detection device 200B and the detection device 200A is that the light emitting element 230B is disposed outside the light guide element 210 and is located in the environmental medium 1. The following mainly describes this difference. Please refer to the previous description for the same or corresponding parts.

請參照圖4及圖5,檢測裝置200B包括導光元件210、透光元件220、發光元件230B以及感測元件240。導光元件210具有頂面212、相對於頂面212的底面214、連接於頂面212與底面214之間的入光面216B以及出光面218A。出光面218A相對於頂面212。底面214連接於入光面216B與出光面218A之間。入光面216B與頂面212夾有銳角α。透光元件220配置於導光元件210的頂面212上。發光元件230B配置於入光面216旁且用以發出光束L。光束L穿過入光面216B後向透光元件220傳遞,且於透光元件220與環境介質1的交界面222全反射。感測元件240配置於導光元件210的出光面218A上。Referring to FIGS. 4 and 5, the detection device 200B includes a light guiding element 210, a light transmitting element 220, a light emitting element 230B, and a sensing element 240. The light guide element 210 has a top surface 212, a bottom surface 214 opposite to the top surface 212, a light incident surface 216B and a light exit surface 218A connected between the top surface 212 and the bottom surface 214. The light emitting surface 218A is opposite to the top surface 212. The bottom surface 214 is connected between the light incident surface 216B and the light exit surface 218A. An acute angle α is included between the light incident surface 216B and the top surface 212. The light transmitting element 220 is disposed on the top surface 212 of the light guiding element 210. The light emitting element 230B is disposed beside the light incident surface 216 and is used to emit a light beam L. The light beam L passes through the light incident surface 216B and is transmitted to the light transmitting element 220 and is totally reflected at the interface 222 between the light transmitting element 220 and the environmental medium 1. The sensing element 240 is disposed on the light emitting surface 218A of the light guide element 210.

與檢測裝置200A不同的是,檢測裝置200B的入光面216B可不具有凹陷216a,發光元件230B是配置於導光元件210外且位於環境介質1中。換言之,發光元件230B發出的光束L需先在環境介質1中傳遞一段距離後才會穿過入光面216B而進入導光元件210中。由於上述光束L的傳遞路徑的改變,檢測裝置200B的銳角α的最佳範圍也會與檢測裝置200A的銳角α的最佳範圍不同。詳言之,在檢測裝置200B中,銳角α可滿足下式(2): ---(2) ,其中θ i為光束L入射至入光面216B的入射角度,n 1為環境介質1的折射率,而n 2為導光元件210的折射率。若由入光面216B之法線(例如:圖5中的虛線)到光束L的方向為順時針方向,則θ i為負值。若由入光面216B之法線(例如:圖5中的虛線)到光束L的方向為逆時針方向,則θ i為正值。檢測裝置200B具有與檢測裝置200A類似的功效及優點,於此便不再重述。 Different from the detection device 200A, the light incident surface 216B of the detection device 200B may not have a depression 216a, and the light emitting element 230B is disposed outside the light guide element 210 and is located in the environmental medium 1. In other words, the light beam L emitted from the light-emitting element 230B needs to pass through the environmental medium 1 for a certain distance before passing through the light-entering surface 216B and entering the light-guiding element 210. Due to the change in the transmission path of the light beam L described above, the optimal range of the acute angle α of the detection device 200B is also different from the optimal range of the acute angle α of the detection device 200A. In detail, in the detection device 200B, the acute angle α can satisfy the following formula (2): --- (2), where θ i is the incident angle of the light beam L to the light incident surface 216B, n 1 is the refractive index of the environmental medium 1, and n 2 is the refractive index of the light guide element 210. If the direction from the normal line of the light incident surface 216B (for example, the dotted line in FIG. 5) to the light beam L is clockwise, θ i is negative. If the direction from the normal line of the light incident surface 216B (for example, the dotted line in FIG. 5) to the light beam L is counterclockwise, θ i is a positive value. The detection device 200B has similar functions and advantages as the detection device 200A, and will not be repeated here.

圖6為本新型一實施例之檢測裝置的剖面示意圖。請參照圖6,檢測裝置200C與前述的檢測裝置200A類似,因此相同或相對應的元件,以相同或相對應的標號表示。檢測裝置200C與檢測裝置200A的差異在於,檢測裝置200C可不包括第二反射元件270及第一反射元件260,且檢測裝置200C的導光元件210可不具內壁213。以下主要說明此差異,兩者相同或相對應處還請參照前述說明。FIG. 6 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. Referring to FIG. 6, the detection device 200C is similar to the aforementioned detection device 200A, and therefore the same or corresponding components are represented by the same or corresponding reference numerals. The difference between the detection device 200C and the detection device 200A is that the detection device 200C may not include the second reflection element 270 and the first reflection element 260, and the light guide element 210 of the detection device 200C may not have the inner wall 213. The following mainly describes this difference. Please refer to the previous description for the same or corresponding parts.

請參照圖6,檢測裝置200C包括導光元件210、透光元件220、發光元件230以及感測元件240。導光元件210具有頂面212、相對於頂面212的底面214、連接於頂面212與底面214之間的入光面216以及出光面218C。出光面218C相對於頂面212。底面214連接於入光面216與出光面218C之間。出光面218C相對於頂面212傾斜,且頂面212與出光面218C的距離k隨著遠離發光元件230而漸減。入光面216與頂面212夾有銳角α。透光元件220配置於導光元件210的頂面212上。發光元件230配置於入光面216旁且用以發出光束L。光束L穿過入光面216後向透光元件220傳遞,且於透光元件220與環境介質1的交界面222全反射。感測元件240配置於導光元件210的出光面218C上。感測元件240承靠於出光面218C上,而感測元件240的光接收面240a與導光元件210的出光面218C平行。換言之,感測元件240的光接收面240a也是傾斜的。Referring to FIG. 6, the detection device 200C includes a light guiding element 210, a light transmitting element 220, a light emitting element 230, and a sensing element 240. The light guide element 210 has a top surface 212, a bottom surface 214 opposite to the top surface 212, a light incident surface 216 connected between the top surface 212 and the bottom surface 214, and a light exit surface 218C. The light emitting surface 218C is opposite to the top surface 212. The bottom surface 214 is connected between the light incident surface 216 and the light exit surface 218C. The light emitting surface 218C is inclined with respect to the top surface 212, and the distance k between the top surface 212 and the light emitting surface 218C gradually decreases as it moves away from the light emitting element 230. An acute angle α is included between the light incident surface 216 and the top surface 212. The light transmitting element 220 is disposed on the top surface 212 of the light guiding element 210. The light emitting element 230 is disposed beside the light incident surface 216 and is used to emit a light beam L. The light beam L passes through the light incident surface 216 and is transmitted to the light transmitting element 220, and is totally reflected at the interface 222 between the light transmitting element 220 and the environmental medium 1. The sensing element 240 is disposed on the light emitting surface 218C of the light guide element 210. The sensing element 240 bears on the light emitting surface 218C, and the light receiving surface 240 a of the sensing element 240 is parallel to the light emitting surface 218C of the light guiding element 210. In other words, the light receiving surface 240a of the sensing element 240 is also inclined.

與檢測裝置200A不同的是,檢測裝置200C的導光元件210可不具內壁213,而導光元件210的出光面218C可直接與底面214連接。此外,檢測裝置200C可不包括第二反射元件270及第一反射元件260,光束L通過出光面116後可直接向透光元件220傳遞,而於透光元件220與環境介質1的交界面222全反射。換言之,利用一次反射(即光束L在交界面222上的全反射)以及傾斜的感測元件240,也可縮減檢測裝置200C的尺寸,而不一定要設置第二反射元件270及第一反射元件260。Different from the detection device 200A, the light guide element 210 of the detection device 200C may not have the inner wall 213, and the light emitting surface 218C of the light guide element 210 may be directly connected to the bottom surface 214. In addition, the detection device 200C may not include the second reflective element 270 and the first reflective element 260, and the light beam L can be directly transmitted to the light transmitting element 220 after passing through the light emitting surface 116, and the interface 222 of the light transmitting element 220 and the environmental medium 1 is completely reflection. In other words, the use of the primary reflection (ie, the total reflection of the light beam L on the interface 222) and the tilted sensing element 240 can also reduce the size of the detection device 200C without necessarily providing the second reflecting element 270 and the first reflecting element. 260.

圖7為本新型一實施例之檢測裝置的剖面示意圖。圖8為本新型一實施例之檢測裝置的局部的示意圖。請參照圖7及圖8,檢測裝置200D與前述的檢測裝置200類似,因此相同或相對應的元件,以相同或相對應的標號表示。檢測裝置200D與檢測裝置200的差異在於,檢測裝置200D的入光面216可設置在導光元件210的底部。以下主要說明此差異,兩者相同或相對應處還請參照前述說明。FIG. 7 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 8 is a schematic diagram of a part of a detection device according to an embodiment of the present invention. Referring to FIG. 7 and FIG. 8, the detection device 200D is similar to the foregoing detection device 200, and therefore the same or corresponding components are represented by the same or corresponding reference numerals. The difference between the detection device 200D and the detection device 200 is that the light incident surface 216 of the detection device 200D may be disposed on the bottom of the light guide element 210. The following mainly describes this difference. Please refer to the previous description for the same or corresponding parts.

請參照圖7及圖8,檢測裝置200D包括導光元件210、透光元件220、發光元件230、感測元件240、第二反射元件270以及第一反射元件260。導光元件210具有頂面212、相對於頂面212的底面214、連接於頂面212與底面214之間的入光面216以及出光面218。出光面218相對於頂面212。底面214連接於入光面216與出光面218之間。透光元件220配置於導光元件210的頂面212上。發光元件230用以發出光束L。感測元件240配置於導光元件210的出光面218上。第二反射元件270配置於導光元件210的頂面212,且位於透光元件220與導光元件210之間。第一反射元件260配置於導光元件210的底面214。光束L穿過入光面216後被第二反射元件270與第一反射元件260反射。光束L被第二反射元件270與第一反射元件260反射後於透光元件220與環境介質1的交界面222全反射。Referring to FIGS. 7 and 8, the detection device 200D includes a light guiding element 210, a light transmitting element 220, a light emitting element 230, a sensing element 240, a second reflecting element 270 and a first reflecting element 260. The light guide element 210 has a top surface 212, a bottom surface 214 opposite to the top surface 212, a light incident surface 216 and a light exit surface 218 connected between the top surface 212 and the bottom surface 214. The light emitting surface 218 is opposite to the top surface 212. The bottom surface 214 is connected between the light incident surface 216 and the light exit surface 218. The light transmitting element 220 is disposed on the top surface 212 of the light guiding element 210. The light emitting element 230 is used for emitting a light beam L. The sensing element 240 is disposed on the light emitting surface 218 of the light guide element 210. The second reflective element 270 is disposed on the top surface 212 of the light guide element 210 and is located between the light transmitting element 220 and the light guide element 210. The first reflective element 260 is disposed on a bottom surface 214 of the light guide element 210. The light beam L passes through the light incident surface 216 and is reflected by the second reflection element 270 and the first reflection element 260. The light beam L is totally reflected by the second reflecting element 270 and the first reflecting element 260 at the interface 222 of the light transmitting element 220 and the environmental medium 1.

與檢測裝置200A不同的是,檢測裝置200D的入光面216可設置在導光元件210的底部。換言之,部份的入光面216可與底面214實質上可共平面,但本新型不以此為限。在本實施例中,θ i為光束L自入光面216射入導光元件210的角度,而θ i滿足下式(3): ---(3) ,其中n 1為環境介質1的折射率,而n 2為導光元件210的折射率。若由入光面216之法線(例如:圖8中的虛線)到光束L的方向為順時針方向,則θ i為負值。若由入光面216之法線(例如:圖8中的虛線)到光束L的方向為逆時針方向,則θ i為正值。檢測裝置200D具有與檢測裝置200類似的功效及優點,於此便不再重述。 Different from the detection device 200A, the light incident surface 216 of the detection device 200D may be disposed on the bottom of the light guide element 210. In other words, part of the light incident surface 216 may be substantially coplanar with the bottom surface 214, but the present invention is not limited thereto. In this embodiment, θ i is the angle at which the light beam L enters the light guide element 210 from the light incident surface 216, and θ i satisfies the following formula (3): --- (3), where n 1 is the refractive index of the environmental medium 1 and n 2 is the refractive index of the light guide element 210. If the direction from the normal line of the light incident surface 216 (for example, the dashed line in FIG. 8) to the light beam L is clockwise, then θ i is negative. If the direction from the normal line of the light incident surface 216 (for example, the dotted line in FIG. 8) to the light beam L is counterclockwise, then θ i is a positive value. The detection device 200D has similar functions and advantages as the detection device 200, and will not be repeated here.

圖9為本新型一實施例之檢測裝置的剖面示意圖。請參照圖9,檢測裝置200E包括導光元件210。導光元件210具有相對的頂面212與底面214。導光元件210還具有連接於頂面212與底面214之間的側壁219。在本實施例中,側壁219相對於頂面212可不傾斜。換言之,側壁219與頂面212大致上可垂直。但本新型不限於此,在其他實施例中,側壁219也可相對於頂面212傾斜。在本實施例中,導光元件210的折射率可大於或等於1.4且小於或等於1.6。導光元件210的材質例如為玻璃。但本新型不限於此,在其他實施例中,導光元件210的材質也可為其他適當材料,例如:聚甲基丙烯酸甲酯(PMMA,Polymethylmethacrylate)、聚碳酸酯(PC,Polycarbonate)或其他適當的透光材質。FIG. 9 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. Referring to FIG. 9, the detection device 200E includes a light guide element 210. The light guide element 210 has a top surface 212 and a bottom surface 214 opposite to each other. The light guide element 210 further has a side wall 219 connected between the top surface 212 and the bottom surface 214. In this embodiment, the side wall 219 may not be inclined with respect to the top surface 212. In other words, the side wall 219 and the top surface 212 may be substantially perpendicular. However, the present invention is not limited to this. In other embodiments, the side wall 219 may be inclined with respect to the top surface 212. In this embodiment, the refractive index of the light guide element 210 may be greater than or equal to 1.4 and less than or equal to 1.6. The material of the light guide element 210 is, for example, glass. However, the present invention is not limited to this. In other embodiments, the material of the light guide element 210 may be other suitable materials, such as: polymethylmethacrylate (PMMA), polycarbonate (PC), or other materials. Appropriate transparent material.

檢測裝置200E包括透光元件220。透光元件220配置於導光元件210的頂面212上。透光元件220具有背向導光元件210的表面222。在本實施例中,若檢測裝置200E用以擷取指紋及/或手指的靜脈,則透光元件220的表面222可供手指按壓。The detection device 200E includes a light transmitting element 220. The light transmitting element 220 is disposed on the top surface 212 of the light guiding element 210. The light transmitting element 220 has a surface 222 that faces away from the light guiding element 210. In this embodiment, if the detection device 200E is used to capture a fingerprint and / or a vein of a finger, the surface 222 of the light transmitting element 220 can be pressed by a finger.

檢測裝置200E包括第一光學膠201。第一光學膠201配置於透光元件220與導光元件210的頂面212之間。透光元件220利用第一光學膠201與導光元件210的頂面212連接。在本實施例中,第一光學膠201可具有與導光元件210及/或透光元件220相同或相近的折射率,以減少光束L在第一光學膠201與導光元件210之交界及/或第一光學膠201與透光元件220之交界上的損耗。換言之,第一光學膠201的折射率也可大於或等於1.4且小於或等於1.6,但本新型不以此為限。The detection device 200E includes a first optical glue 201. The first optical glue 201 is disposed between the light transmitting element 220 and the top surface 212 of the light guiding element 210. The light-transmitting element 220 is connected to the top surface 212 of the light-guiding element 210 by using the first optical glue 201. In this embodiment, the first optical glue 201 may have the same or similar refractive index as the light guide element 210 and / or the light transmitting element 220 to reduce the beam L at the boundary between the first optical glue 201 and the light guide element 210 and / Or loss on the boundary between the first optical glue 201 and the light-transmitting element 220. In other words, the refractive index of the first optical adhesive 201 may also be greater than or equal to 1.4 and less than or equal to 1.6, but the present invention is not limited thereto.

檢測裝置200E包括感測元件240。感測元件240配置於導光元件210的底面214上。導光元件210位於透光元件220與感測元件240之間。感測元件240具有面向導光元件210的光接收面240a。The detection device 200E includes a sensing element 240. The sensing element 240 is disposed on the bottom surface 214 of the light guide element 210. The light guide element 210 is located between the light transmitting element 220 and the sensing element 240. The sensing element 240 has a light-receiving surface 240 a facing the light guiding element 210.

檢測裝置200E包括第二光學膠202。第二光學膠202配置於導光元件210的底面214與感測元件240之間。感測元件240利用第二光學膠202與導光元件210的底面214連接。在本實施例中,第二光學膠202可具有與導光元件210相同或相近的折射率,以減少光束L在第二光學膠202與導光元件210之交界上的損耗。換言之,第二光學膠202的折射率也可大於或等於1.4且小於或等於1.6,但本新型不以此為限。The detection device 200E includes a second optical glue 202. The second optical glue 202 is disposed between the bottom surface 214 of the light guiding element 210 and the sensing element 240. The sensing element 240 is connected to the bottom surface 214 of the light guide element 210 by using the second optical glue 202. In this embodiment, the second optical glue 202 may have the same or similar refractive index as the light guide element 210 to reduce the loss of the light beam L at the boundary between the second optical glue 202 and the light guide element 210. In other words, the refractive index of the second optical glue 202 may also be greater than or equal to 1.4 and less than or equal to 1.6, but the present invention is not limited thereto.

導光元件210的材質與第一光學膠201及第二光學膠202的材質不同。換言之,在透光元件220與感測元件240之間可插入材料成本較低的導光元件210,以減少填充於透光元件220與感測元件240之間的光學膠的用量。由於材料成本高的第一光學膠201及第二光學膠202的使用量少,因此檢測裝置200E的製造成本低。The material of the light guide element 210 is different from that of the first optical glue 201 and the second optical glue 202. In other words, a light guide element 210 with a lower material cost can be inserted between the light transmitting element 220 and the sensing element 240 to reduce the amount of optical glue filled between the light transmitting element 220 and the sensing element 240. Since the amount of the first optical glue 201 and the second optical glue 202 which are high in material costs is small, the manufacturing cost of the detection device 200E is low.

檢測裝置200E包括發光元件230。發光元件230用以發出光束L。光束L通過導光元件210後向透光元件220傳遞,且於透光元件220與環境介質1的交界面(即表面222)全反射。當物體(例如:指紋凸部)觸碰表面222時,在對應指紋凸部的部份表面222上,光束L的全反射會被破壞,進而使感測元件240取得對應指紋凸部的暗紋;指紋凸部觸碰部份表面222的同時,指紋凹部不會觸碰表面222,在對應指紋凹部的另一部份表面222上,光束L的全反射不會被破壞,進而使感測元件240取得對應指紋凹部的亮紋;藉此,感測元件240能取得亮暗相間的物體影像(例如:指紋影像)。在本實施例中,光束L例如為可見光。然而,本新型不限於此,在其他實施例中,光束L也可為非可見光或非可見光與可見光的組合。發光元件230例如為發光二極體,但本新型不限於此,在其他實施例中,發光元件230也可為其他適當種類的發光元件。The detection device 200E includes a light emitting element 230. The light emitting element 230 is used for emitting a light beam L. The light beam L is transmitted to the light-transmitting element 220 through the light-guiding element 210 and is totally reflected at the interface (ie, the surface 222) of the light-transmitting element 220 and the environmental medium 1. When an object (such as a fingerprint convex portion) touches the surface 222, on a portion of the surface 222 corresponding to the convex portion of the fingerprint, the total reflection of the light beam L will be destroyed, so that the sensing element 240 obtains a dark pattern on the convex portion of the fingerprint. ; When the convex part of the fingerprint touches part of the surface 222, the concave part of the fingerprint will not touch the surface 222. On the other part of the surface 222 corresponding to the concave part of the fingerprint, the total reflection of the light beam L will not be destroyed, thereby making the sensing element 240 obtains the light pattern corresponding to the concave portion of the fingerprint; thereby, the sensing element 240 can obtain a bright and dark object image (for example, a fingerprint image). In this embodiment, the light beam L is, for example, visible light. However, the present invention is not limited to this. In other embodiments, the light beam L may be invisible light or a combination of invisible light and visible light. The light-emitting element 230 is, for example, a light-emitting diode, but the present invention is not limited thereto. In other embodiments, the light-emitting element 230 may be another appropriate type of light-emitting element.

在本實施例中,檢測裝置200E可進一步包括第二反射元件270以及第一反射元件260。第二反射元件270配置於導光元件210的頂面212上。第二反射元件270位於透光元件220與導光元件210之間。第一反射元件260配置於導光元件210的底面214上。導光元件210位於第二反射元件270與第一反射元件260之間。光束L被第二反射元件270及第一反射元件260反射後向透光元件220傳遞,且於透光元件220與環境介質1的交界面(即表面222)發生全反射。舉例而言,在本實施例中,第二反射元件270及第一反射元件260可以是反射片、或以塗佈方式所形成的反射層,本新型不加以限制。In this embodiment, the detection device 200E may further include a second reflective element 270 and a first reflective element 260. The second reflective element 270 is disposed on the top surface 212 of the light guide element 210. The second reflecting element 270 is located between the light transmitting element 220 and the light guiding element 210. The first reflective element 260 is disposed on the bottom surface 214 of the light guide element 210. The light guide element 210 is located between the second reflective element 270 and the first reflective element 260. The light beam L is reflected by the second reflective element 270 and the first reflective element 260 and transmitted to the light transmitting element 220, and a total reflection occurs at the interface (ie, the surface 222) of the light transmitting element 220 and the environmental medium 1. For example, in this embodiment, the second reflective element 270 and the first reflective element 260 may be a reflective sheet or a reflective layer formed by a coating method, which is not limited in the present invention.

在本實施例中,光束L在未傳遞至第二反射元件270與第一反射元件260前可向導光元件210的頂面212傳遞,而光束L可依序被第二反射元件270及第一反射元件260反射,以向透光元件220傳遞。然而,本新型不限於此,在其他實施例中,光束L也可沿其他路徑傳遞。此外,在本實施例中,第二反射元件270與第一反射元件260可錯開且部份重疊。然而,本本新型不限於此,在其他實施例中,第二反射元件270與第一反射元件260也可完全錯開而不相重疊,或者以其他適當的相對位置配置,以下配合圖10、及圖11舉例說明之。In this embodiment, the light beam L can be transmitted to the top surface 212 of the light guide element 210 before being transmitted to the second reflection element 270 and the first reflection element 260, and the light beam L can be sequentially transmitted by the second reflection element 270 and the first The reflecting element 260 reflects to transmit to the light transmitting element 220. However, the present invention is not limited to this. In other embodiments, the light beam L may be transmitted along other paths. In addition, in this embodiment, the second reflective element 270 and the first reflective element 260 may be staggered and partially overlap. However, the present invention is not limited to this. In other embodiments, the second reflective element 270 and the first reflective element 260 may be completely staggered without overlapping, or may be arranged at other appropriate relative positions. The following is shown in conjunction with FIG. 10 and FIG. 11 illustrates it.

圖10為本新型一實施例之檢測裝置的剖面示意圖。圖10的檢測裝置200F與圖9的檢測裝置200E類似,因此相同或相對應的元件以相同或相對應的標號表示。與檢測裝置200E不同的是,在圖10的實施例中,光束L在未傳遞至第二反射元件270與第一反射元件260之前可向導光元件210的底面214傳遞,而光束L可依序被第一反射元件260及第二反射元件270反射,以向透光元件220傳遞。舉例而言,在本實施例中,第二反射元件270及第一反射元件260可以是反射片、或以塗佈方式所形成的反射層,本新型不加以限制。另外,在其他實施例中,第一反射元件260的反射功能也可用第二光學膠202與外部的空氣層之間的界面反射來取代,其中第二光學膠202的折射率與外部的空氣層的折射率不同。FIG. 10 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The detection device 200F of FIG. 10 is similar to the detection device 200E of FIG. 9, and therefore the same or corresponding components are represented by the same or corresponding reference numerals. Different from the detection device 200E, in the embodiment of FIG. 10, the light beam L can be transmitted to the bottom surface 214 of the light emitting element 210 before being transmitted to the second reflection element 270 and the first reflection element 260, and the light beam L can be sequentially Reflected by the first reflective element 260 and the second reflective element 270 to be transmitted to the light transmitting element 220. For example, in this embodiment, the second reflective element 270 and the first reflective element 260 may be a reflective sheet or a reflective layer formed by a coating method, which is not limited in the present invention. In addition, in other embodiments, the reflection function of the first reflective element 260 may also be replaced by the interface reflection between the second optical glue 202 and the external air layer, wherein the refractive index of the second optical glue 202 is related to the external air layer The refractive index is different.

圖11為本新型一實施例之檢測裝置的剖面示意圖。圖11的檢測裝置200G與圖10的檢測裝置200F類似,因此相同或相對應的元件以相同或相對應的標號表示。與檢測裝置200F不同的是,在圖11的實施例中,第二反射元件270B與第一反射元件260B並非部份重疊。詳言之,第二反射元件270B可位於第一反射元件260B的面積以內。換言之,第二反射元件270B在底面214上的垂直投影可完全地位於第一反射元件260B在底面214上的垂直投影以內。光束L可依序被第一反射元件260B的前端、第二反射元件270B及第一反射元件260B的後端反射,以向透光元件220傳遞。FIG. 11 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The detection device 200G of FIG. 11 is similar to the detection device 200F of FIG. 10, and therefore the same or corresponding components are denoted by the same or corresponding reference numerals. Different from the detection device 200F, in the embodiment of FIG. 11, the second reflective element 270B and the first reflective element 260B do not partially overlap. In detail, the second reflective element 270B may be located within the area of the first reflective element 260B. In other words, the vertical projection of the second reflective element 270B on the bottom surface 214 can be completely located within the vertical projection of the first reflective element 260B on the bottom surface 214. The light beam L may be sequentially reflected by the front end of the first reflective element 260B, the second reflective element 270B, and the rear end of the first reflective element 260B to be transmitted to the light transmitting element 220.

圖12為本新型一實施例之檢測裝置的剖面示意圖。圖12的檢測裝置200H與圖10的檢測裝置200F類似,因此相同或相對應的元件以相同或相對應的標號表示。與檢測裝置200F不同的是,圖12的檢測裝置200H還包括第三反射元件280。第三反射元件280配置於導光元件210的底面214上。光束L依序被第一反射元件260、第二反射元件270及第三反射元件280反射,以向透光元件220傳遞。第一反射元件260與第三反射元件280可分離。第一反射元件260與第二反射元件270部份重疊。詳言之,第一反射元件260與第二反射元件270的前端重疊而不與第二反射元件270的後端重疊。第三反射元件280與第二反射元件270部份重疊。詳言之,第三反射元件280與第二反射元件270的後端重疊而不與第二反射元件270的前端重疊。另外,圖12所繪的第一反射元件260、第三反射元件280或者是感測元件240不一定非得配置於第二光學膠202內。在其他實施例中,第一反射元件260、第三反射元件280或者是感測元件240也有可能配置在導光元件210的底面214上;換言之,第一反射元件260、第三反射元件280或者是感測元件240也有可能配置在第二光學膠202的另一側。FIG. 12 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The detection device 200H of FIG. 12 is similar to the detection device 200F of FIG. 10, and therefore the same or corresponding components are denoted by the same or corresponding reference numerals. Different from the detection device 200F, the detection device 200H of FIG. 12 further includes a third reflection element 280. The third reflective element 280 is disposed on the bottom surface 214 of the light guide element 210. The light beam L is sequentially reflected by the first reflective element 260, the second reflective element 270, and the third reflective element 280 to be transmitted to the light transmitting element 220. The first reflective element 260 is detachable from the third reflective element 280. The first reflective element 260 partially overlaps the second reflective element 270. In detail, the first reflective element 260 overlaps the front end of the second reflective element 270 and does not overlap the rear end of the second reflective element 270. The third reflective element 280 partially overlaps the second reflective element 270. In detail, the third reflective element 280 overlaps the rear end of the second reflective element 270 and does not overlap the front end of the second reflective element 270. In addition, the first reflective element 260, the third reflective element 280, or the sensing element 240 depicted in FIG. 12 need not necessarily be disposed in the second optical glue 202. In other embodiments, the first reflective element 260, the third reflective element 280, or the sensing element 240 may also be disposed on the bottom surface 214 of the light guide element 210; in other words, the first reflective element 260, the third reflective element 280, or It is possible that the sensing element 240 is disposed on the other side of the second optical glue 202.

須加以說明的是,在圖9至圖12所繪示的任一實施例中,導光元件210具有連接於頂面212及底面214的側壁219,並且可以在所述的側壁219上設置有光吸收層(圖未繪示)。It should be noted that, in any of the embodiments shown in FIGS. 9 to 12, the light guide element 210 has a side wall 219 connected to the top surface 212 and the bottom surface 214, and the side wall 219 may be provided on the side wall 219. Light absorbing layer (not shown).

圖13為本新型一實施例之檢測裝置的剖面示意圖。圖13的檢測裝置200I與圖9的檢測裝置200E類似,因此相同或相對應的元件以相同或相對應的標號表示。與檢測裝置200E不同的是,在圖13的實施例中,第二反射元件270D與第一反射元件260D的至少一者具有一個或多個光學微結構276、266。舉例而言,第二反射元件270D與第一反射元件260D可選擇性地皆具一個或多個光學微結構276、266,在本實施例的一範例中,若以多個光學微結構276、266者,當可以連續或間隔配置的方式設置於所述的第二反射元件270D、第一反射元件260D上。總言之,本說明書所稱的光學微結構可以全面性或者是部分配置在任一反射元件上,此外,也不加以侷限光學微結構是連續配置方式或者是間隔配置。光束L可被第二反射元件270D的一個或多個光學微結構276及/或第一反射元件260D的一個或多個光學微結構266反射,以透光元件220傳遞。在本實施例中,光學微結構276可全面性(或局部)地佈置於第二反射元件270D反射元件上,光學微結構266可全面性(或局部)地佈置於第一反射元件260D反射元件上。此外,配置光學微結構276及/或第一反射元件260D的作用是:增加取像面積以及使傳遞到感測元件240的光束L更加的均勻,有利於成像效果。FIG. 13 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The detection device 200I of FIG. 13 is similar to the detection device 200E of FIG. 9, and therefore the same or corresponding components are denoted by the same or corresponding reference numerals. Different from the detection device 200E, in the embodiment of FIG. 13, at least one of the second reflective element 270D and the first reflective element 260D has one or more optical microstructures 276, 266. For example, the second reflective element 270D and the first reflective element 260D may each optionally have one or more optical microstructures 276, 266. In an example of this embodiment, if multiple optical microstructures 276, 266 persons, can be arranged on the second reflection element 270D and the first reflection element 260D in a continuous or spaced manner. In summary, the optical microstructures referred to in this specification may be arranged on any reflective element in a comprehensive or partial manner, and there is no limitation on whether the optical microstructures are continuously arranged or spaced. The light beam L may be reflected by one or more optical microstructures 276 of the second reflective element 270D and / or one or more optical microstructures 266 of the first reflective element 260D, and transmitted by the light transmitting element 220. In this embodiment, the optical microstructures 276 may be comprehensively (or locally) disposed on the second reflective element 270D, and the optical microstructures 266 may be comprehensively (or partially) disposed on the first reflective element 260D. on. In addition, the function of disposing the optical microstructure 276 and / or the first reflecting element 260D is to increase the image capturing area and make the light beam L transmitted to the sensing element 240 more uniform, which is beneficial to the imaging effect.

圖14為本新型一實施例之檢測裝置的剖面示意圖。圖15為圖14之檢測裝置的上視示意圖。圖14及圖15的檢測裝置200J與圖9的檢測裝置200E類似,因此相同或相對應的元件以相同或相對應的標號表示。與檢測裝置200E不同的是,檢測裝置200E還包括光吸收層292。光吸收層292能吸收光。換言之,光吸收層292可為不透明且不反光的光遮蔽層。光吸收層292覆蓋導光元件210的側壁219。光吸收層292能吸收入射至側壁219的雜散光束L,進而提升檢測裝置200J的取像品質。在本實施例中,光吸收層292可為油墨層或黏貼件。但本新型不限於此,在其他實施例中,光吸收層292也可為其他適當吸光材料。FIG. 14 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 15 is a schematic top view of the detection device of FIG. 14. The detection device 200J of FIGS. 14 and 15 is similar to the detection device 200E of FIG. 9, and therefore the same or corresponding components are represented by the same or corresponding reference numerals. Different from the detection device 200E, the detection device 200E further includes a light absorption layer 292. The light absorbing layer 292 can absorb light. In other words, the light absorbing layer 292 may be an opaque and non-reflective light shielding layer. The light absorption layer 292 covers the sidewall 219 of the light guide element 210. The light absorption layer 292 can absorb the stray light beam L incident on the side wall 219, thereby improving the image pickup quality of the detection device 200J. In this embodiment, the light absorbing layer 292 may be an ink layer or an adhesive member. However, the present invention is not limited to this. In other embodiments, the light absorbing layer 292 may be other suitable light absorbing materials.

圖16為本新型一實施例之檢測裝置的剖面示意圖。圖17為本新型一實施例之檢測裝置的剖面示意圖。圖18為本新型一實施例之檢測裝置的剖面示意圖。圖19為本新型一實施例之檢測裝置的剖面示意圖。圖16、圖17、圖18及圖19的檢測裝置200K、200L、200M、200N分別與圖10、圖11、圖12及圖13的檢測裝置200F、200G、200H、200I類似,此相同或相對應的元件以相同或相對應的標號表示。檢測裝置200K、200L、200M、200N與檢測裝置200F、200G、200H、200I的主要差異在於:檢測裝置200K、200L、200M、200N分別較檢測裝置200F、200G、200H、200I多了覆蓋側壁219的光吸收層292。FIG. 16 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 17 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 18 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 19 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The detection devices 200K, 200L, 200M, and 200N of Figs. 16, 17, 18, and 19 are similar to the detection devices 200F, 200G, 200H, and 200I of Figs. 10, 11, 12, and 13, respectively, and they are the same or similar. Corresponding elements are denoted by the same or corresponding reference numerals. The main differences between the detection devices 200K, 200L, 200M, and 200N and the detection devices 200F, 200G, 200H, and 200I are that the detection devices 200K, 200L, 200M, and 200N have more than the detection devices 200F, 200G, 200H, and 200I, which cover the side wall 219 Light absorbing layer 292.

圖20為本新型一實施例之檢測裝置的剖面示意圖。圖20的檢測裝置200O與圖9的檢測裝置200E類似,此相同或相對應的元件以相同或相對應的標號表示。檢測裝置200O與檢測裝置200E的主要差異在於:檢測裝置200O較檢測裝置200多了光吸收層292。光吸收層292至少覆蓋導光元件210的側壁219。在圖20的實施例中,光吸收層292還可選擇性地覆蓋第一光學膠201的側壁及/或第二光學膠202的側壁,但本新型不以此為限。FIG. 20 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The detection device 200O of FIG. 20 is similar to the detection device 200E of FIG. 9, and the same or corresponding components are denoted by the same or corresponding reference numerals. The main difference between the detection device 200O and the detection device 200E is that the detection device 200O has a light absorbing layer 292 more than the detection device 200. The light absorption layer 292 covers at least the side wall 219 of the light guide element 210. In the embodiment of FIG. 20, the light absorption layer 292 can also selectively cover the sidewall of the first optical glue 201 and / or the sidewall of the second optical glue 202, but the present invention is not limited thereto.

圖21為本新型一實施例之檢測裝置的剖面示意圖。請參照圖21,檢測裝置200P包括導光元件210。導光元件210具有相對的頂面212與底面214。檢測裝置200P包括透光元件220。透光元件220配置於導光元件210的頂面212上。透光元件220具有背向導光元件210的表面222。FIG. 21 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. Referring to FIG. 21, the detection device 200P includes a light guide element 210. The light guide element 210 has a top surface 212 and a bottom surface 214 opposite to each other. The detection device 200P includes a light transmitting element 220. The light transmitting element 220 is disposed on the top surface 212 of the light guiding element 210. The light transmitting element 220 has a surface 222 that faces away from the light guiding element 210.

檢測裝置200P包括第二反射元件270及第一反射元件260。第二反射元件270配置於導光元件210的頂面212。第二反射元件270位於透光元件220與導光元件210之間。第一反射元件260配置於導光元件210的底面214。導光元件210位於第二反射元件270與第一反射元件260之間。在本實施例中,第一反射元件260可位於第二反射元件270的面積以內,但本新型不以此為限。檢測裝置200P包括發光元件230。發光元件230用以發出光束L。光束L被第二反射元件270及第一反射元件260反射後向透光元件220傳遞,且於透光元件220與環境介質1的交界面(即表面222)發生全反射。檢測裝置200P包括感測元件240。感測元件240配置於導光元件210的底面214上。導光元件210位於透光元件220與感測元件240之間。感測元件240具有面向導光元件210的光接收面240a。The detection device 200P includes a second reflection element 270 and a first reflection element 260. The second reflection element 270 is disposed on the top surface 212 of the light guide element 210. The second reflecting element 270 is located between the light transmitting element 220 and the light guiding element 210. The first reflective element 260 is disposed on a bottom surface 214 of the light guide element 210. The light guide element 210 is located between the second reflective element 270 and the first reflective element 260. In this embodiment, the first reflective element 260 may be located within the area of the second reflective element 270, but the present invention is not limited thereto. The detection device 200P includes a light emitting element 230. The light emitting element 230 is used for emitting a light beam L. The light beam L is reflected by the second reflective element 270 and the first reflective element 260 and transmitted to the light transmitting element 220, and a total reflection occurs at the interface (ie, the surface 222) of the light transmitting element 220 and the environmental medium 1. The detection device 200P includes a sensing element 240. The sensing element 240 is disposed on the bottom surface 214 of the light guide element 210. The light guide element 210 is located between the light transmitting element 220 and the sensing element 240. The sensing element 240 has a light-receiving surface 240 a facing the light guiding element 210.

值得注意的是,檢測裝置200P包括第一吸光元件291。第一吸光元件291配置於導光元件210的底面214上。第一吸光元件291可吸收向底面214傳遞的雜散光束L,進而提升檢測裝置200P的取像品質。在本實施例中,第一吸光元件291可配置於第一反射元件260旁而不與第一反射元件260重疊。更進一步地說,檢測裝置200P還包括第三反射元件280。第三反射元件280配置於導光元件210的底面214上。第一吸光元件291可位於第一反射元件260與第三反射元件280之間。光束L被第二反射元件270、第一反射元件260及第三反射元件280反射後向透光元件220傳遞。It is worth noting that the detection device 200P includes a first light absorbing element 291. The first light absorbing element 291 is disposed on the bottom surface 214 of the light guiding element 210. The first light absorbing element 291 can absorb the stray light beam L transmitted to the bottom surface 214, thereby improving the image pickup quality of the detection device 200P. In this embodiment, the first light absorbing element 291 may be disposed beside the first reflective element 260 without overlapping the first reflective element 260. Furthermore, the detection device 200P further includes a third reflective element 280. The third reflective element 280 is disposed on the bottom surface 214 of the light guide element 210. The first light absorbing element 291 may be located between the first reflective element 260 and the third reflective element 280. The light beam L is reflected by the second reflective element 270, the first reflective element 260, and the third reflective element 280 and transmitted to the light transmitting element 220.

圖22為本新型一實施例之檢測裝置的剖面示意圖。圖22的檢測裝置200Q與圖21的檢測裝置200P類似,因此相同或相對應的元件以相同或相對應的標號表示。檢測裝置200Q與檢測裝置200P的主要差異在於:檢測裝置200Q還包括第四反射元件293。第四反射元件293配置於導光元件210的頂面212上且與第二反射元件270分離。光束L被第二反射元件270、第一反射元件260、第三反射元件280及第四反射元件293反射後向透光元件220傳遞。在本實施例中,光束L可依序被第二反射元件270、第一反射元件260、第四反射元件293及第三反射元件280反射而向透光元件220傳遞。22 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The detection device 200Q of FIG. 22 is similar to the detection device 200P of FIG. 21, and therefore the same or corresponding components are denoted by the same or corresponding reference numerals. The main difference between the detection device 200Q and the detection device 200P is that the detection device 200Q further includes a fourth reflective element 293. The fourth reflective element 293 is disposed on the top surface 212 of the light guide element 210 and is separated from the second reflective element 270. The light beam L is reflected by the second reflective element 270, the first reflective element 260, the third reflective element 280, and the fourth reflective element 293 and transmitted to the light transmitting element 220. In this embodiment, the light beam L may be sequentially reflected by the second reflective element 270, the first reflective element 260, the fourth reflective element 293, and the third reflective element 280 and transmitted to the light transmitting element 220.

圖23為本新型一實施例之檢測裝置的剖面示意圖。圖23的檢測裝置200R與圖21的檢測裝置200P類似,因此相同或相對應的元件以相同或相對應的標號表示。檢測裝置200R與檢測裝置200P的主要差異在於:檢測裝置200R還包括第二吸光元件296。第二吸光元件296配置於導光元件210的頂面212上。第二吸光元件296可吸收向頂面212傳遞的雜散光束L,進而提升檢測裝置200B的取像品質。在本實施例中,第二吸光元件296可選擇性地配置於第二反射元件270上且位於第二反射元件270與導光元件210的底面214之間。第一吸光元件291與第二吸光元件296可錯開,而在垂直於表面222的方向d上不重疊。FIG. 23 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The detection device 200R of FIG. 23 is similar to the detection device 200P of FIG. 21, and therefore the same or corresponding components are represented by the same or corresponding reference numerals. The main difference between the detection device 200R and the detection device 200P is that the detection device 200R further includes a second light absorbing element 296. The second light absorbing element 296 is disposed on the top surface 212 of the light guiding element 210. The second light absorbing element 296 can absorb the stray light beam L transmitted to the top surface 212, thereby improving the image capturing quality of the detection device 200B. In this embodiment, the second light absorbing element 296 may be selectively disposed on the second reflective element 270 and located between the second reflective element 270 and the bottom surface 214 of the light guide element 210. The first light absorbing element 291 and the second light absorbing element 296 may be staggered without overlapping in a direction d perpendicular to the surface 222.

圖24為本新型一實施例之檢測裝置的剖面示意圖。圖24的檢測裝置200S與圖21的檢測裝置200P類似,因此相同或相對應的元件以相同或相對應的標號表示。檢測裝置200S與檢測裝置200P的主要差異在於:檢測裝置200P的第一吸光元件291C配置於第一反射元件260上且位於導光元件210的頂面212與第一反射元件260之間。FIG. 24 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The detection device 200S of FIG. 24 is similar to the detection device 200P of FIG. 21, and therefore the same or corresponding components are represented by the same or corresponding reference numerals. The main difference between the detection device 200S and the detection device 200P is that the first light absorption element 291C of the detection device 200P is disposed on the first reflection element 260 and is located between the top surface 212 of the light guide element 210 and the first reflection element 260.

圖25為本新型一實施例之檢測裝置的剖面示意圖。圖25的檢測裝置200T與圖22的檢測裝置200Q類似,因此相同或相對應的元件以相同或相對應的標號表示。檢測裝置200T與檢測裝置200Q的主要差異在於:檢測裝置200T不包括檢測裝置200Q的第三反射元件280,檢測裝置200T的第一反射元件260D至少由第二反射元件270與第四反射元件293之間的空隙g的正下方延伸到第四反射元件293之末端的正下方,而第一吸光元件291D可配置於第一反射元件260D上且位於導光元件210的底面214與第一反射元件260D之間。FIG. 25 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The detection device 200T of FIG. 25 is similar to the detection device 200Q of FIG. 22, and therefore the same or corresponding components are represented by the same or corresponding reference numerals. The main difference between the detection device 200T and the detection device 200Q is that the detection device 200T does not include the third reflection element 280 of the detection device 200Q. The first reflection element 260D of the detection device 200T is at least composed of the second reflection element 270 and the fourth reflection element 293 The gap g extends directly below the end of the fourth reflective element 293, and the first light absorbing element 291D may be disposed on the first reflective element 260D and located on the bottom surface 214 of the light guide element 210 and the first reflective element 260D. between.

須加以說明的是,從圖21至圖25的另一變化實施例中,導光元件210具有相對的一頂面212與一底面以及連接於頂面與底面214的一側壁219;上述的側壁219亦可覆蓋有光吸收層294。此外,圖93至圖97之任一的導光元件210可以是一個透光板件或填入導光元件210所佔空間中的光學膠(亦可如圖9使用多層導光介質),本新型並不加以限制It should be noted that, in another modified embodiment from FIG. 21 to FIG. 25, the light guide element 210 has a top surface 212 and a bottom surface opposite to each other, and a side wall 219 connected to the top surface and the bottom surface 214. 219 may also be covered with a light absorbing layer 294. In addition, the light guide element 210 of any one of FIG. 93 to FIG. 97 may be a light-transmitting plate or an optical glue filled in the space occupied by the light guide element 210 (multi-layer light guide medium may also be used as shown in FIG. 9). New types are not restricted

請參照圖1、圖3、圖4、圖6、圖7、圖9、圖10、圖11、圖12、圖13、圖14、圖16、圖17、圖18、圖19、圖20、圖21、圖22、圖23、圖24及圖25,檢測裝置200、200A~200T均包括各自的表面電漿共振(Surface Plasmon Resonance)層SPR。Please refer to Figs. 1, 3, 4, 6, 7, 9, 9, 10, 11, 12, 13, 14, 14, 16, 17, 18, 19, 20, 21, 22, 23, 24, and 25, the detection devices 200, 200A to 200T each include a respective surface plasma resonance (SPR) layer SPR.

請參閱圖26以及圖27,圖26為本新型一實施例的檢測裝置的剖面示意圖。圖27為圖26的多個增透微結構在區域II的局部放大示意圖。本新型其中一實施例提供一種檢測裝置200U。檢測裝置200U是位於一環境介質中來使用。在一實施例中,前述的環境介質例如是空氣、水或者是其他種類的環境介質。檢測裝置U可用以擷取一物體F1的影像,以進行辨識。前述的物體F1例如是使用者的手指、 手掌、手腕或者是眼球,而檢測裝置200U所擷取的影像例如是指紋、掌紋、靜脈、瞳孔或者是虹膜等影像,但本新型不以此為限。Please refer to FIG. 26 and FIG. 27. FIG. 26 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 27 is a partially enlarged schematic view of the plurality of anti-reflection microstructures in region II in FIG. 26. One embodiment of the present invention provides a detection device 200U. The detection device 200U is used in an environmental medium. In one embodiment, the aforementioned environmental medium is, for example, air, water, or other types of environmental media. The detection device U can be used for capturing an image of an object F1 for identification. The aforementioned object F1 is, for example, a user's finger, palm, wrist, or eyeball, and the image captured by the detection device 200U is, for example, an image such as a fingerprint, palm print, vein, pupil, or iris, but the present invention is not limited thereto .

如圖26所示,本新型其中一實施例的檢測裝置200U包括基板14、發光元件230、導光元件210、透光元件220以及感測元件240。 導光元件210用以使光束在其中傳遞。本實施例的導光元件210具有一頂面212及與頂面212相對的一底面214,且導光元件210並具有位於底面214的一入光部E1以及一出光部E2。光束L由入光部E1進入導光元件210,以及在導光元件210內傳遞,之後通過至少一次全反射而形成一信號光束L’,再由導光元件210的出光部E2離開導光元件210。本實施例中,在導光元件210的出光部E2設有多個增透微結構300。As shown in FIG. 26, a detection device 200U according to an embodiment of the present invention includes a substrate 14, a light emitting element 230, a light guiding element 210, a light transmitting element 220, and a sensing element 240. The light guide element 210 is used for transmitting a light beam therein. The light guide element 210 of this embodiment has a top surface 212 and a bottom surface 214 opposite to the top surface 212, and the light guide element 210 has a light incident portion E1 and a light exit portion E2 located on the bottom surface 214. The light beam L enters the light guide element 210 from the light entrance part E1 and is transmitted in the light guide element 210. Then, a signal beam L 'is formed by at least one total reflection, and then the light guide part 210 of the light guide element 210 leaves the light guide element 210. In this embodiment, a plurality of anti-reflection microstructures 300 are provided in the light-exiting portion E2 of the light guide element 210.

需先說明的是,當信號光束L’由導光元件210進入到環境介質(如:空氣或氣泡)中時,為了避免光束投射到出光部E2的角度大於導光元件210的全反射臨界角,而導致原本應由出光部E2出射的信號光束L’又再度被全反射。因此,在本實施例中,通過使出光部E2具有多個增透微結構300,以破壞信號光束L’的全反射。It should be noted that when the signal light beam L 'enters the environmental medium (such as air or air bubbles) from the light guide element 210, in order to avoid the angle of the light beam projecting to the light exit portion E2 being greater than the critical angle of the total reflection of the light guide element 210 As a result, the signal light beam L ′, which should have been emitted by the light-exiting section E2, is totally reflected again. Therefore, in this embodiment, the light-emitting portion E2 has a plurality of anti-reflection microstructures 300 to destroy the total reflection of the signal light beam L '.

具體而言,每一個增透微結構300具有一受光區301以及一背光區302。在本實施例中,受光區301使信號光束L’的入射角小於導光元件210的全反射臨界角,而背光區302會使信號光束L’的入射角大於全反射臨界角。在一實施例中,背光區302會大致平行於信號光束L’的主要行進方向,從而使信號光束L’較不容易投射在背光區302。另一方面,受光區301大致垂直於光束的主要 行進方向,且受光區301的面積會大於背光區302的面積,從而使大部分的信號光束L’都投射到受光區301,且投射到受光區301的信號光束L’也較不容易被全反射。Specifically, each AR microstructure 300 has a light receiving area 301 and a backlight area 302. In this embodiment, the light receiving region 301 makes the incident angle of the signal beam L 'smaller than the critical angle of total reflection of the light guide element 210, and the backlight region 302 makes the incident angle of the signal beam L' larger than the critical angle of total reflection. In one embodiment, the backlight region 302 is substantially parallel to the main traveling direction of the signal beam L ', so that the signal beam L' is less likely to be projected on the backlight region 302. On the other hand, the light-receiving area 301 is approximately perpendicular to the main traveling direction of the light beam, and the area of the light-receiving area 301 will be larger than the area of the backlight area 302, so that most of the signal beam L 'is projected onto the light-receiving area 301 and onto the light-receiving area. The signal beam L 'of the region 301 is also less likely to be totally reflected.

在此,請繼續參考圖26到圖27,須說明的是,儘管少部分的雜散光可能會投射到背光區302,但是投射到背光區302的雜散光會被全反射,而不會從出光部E2出射而干擾感測元件240的信號造成疊影。另外,信號光束L’通過受光區301後,部分光束會在感測元件240的光接收面240a後穿過背光區302時折射為另一角度較大的光束,此光束會在透光元件220的表面222進行全反射,因此全反射光束角度較原路徑來的大,導致此光束行進路線會遠於原路徑,故將不會再次進入到感測元件240的光接收面240a,從而避免信號造成疊影的現象。Here, please continue to refer to FIGS. 26 to 27. It should be noted that although a small part of stray light may be projected to the backlight region 302, the stray light projected to the backlight region 302 will be totally reflected instead of being emitted from the light. The signal emitted from the part E2 and disturbing the sensing element 240 causes ghosting. In addition, after the signal light beam L 'passes through the light receiving area 301, a part of the light beam is refracted into a light beam with a larger angle when passing through the backlight area 302 after the light receiving surface 240a of the sensing element 240, and this light beam will pass through the light transmitting element 220 The surface 222 is totally reflected, so the angle of the totally reflected beam is larger than the original path, which causes the beam to travel farther than the original path, so it will not enter the light receiving surface 240a of the sensing element 240 again, thereby avoiding signals Causes ghosting.

請參照圖27,在本實施例中,多個增透微結構300彼此相連,且每一個增透微結構300的剖面形狀可以呈山形、波浪形或鋸齒形。在圖27的實施例中,每一個增透微結構300的剖面形狀為鋸齒形。另外,本實施例的受光區301與背光區302都是傾斜平面。Referring to FIG. 27, in this embodiment, a plurality of anti-reflection microstructures 300 are connected to each other, and a cross-sectional shape of each of the anti-reflection microstructures 300 may be mountain-shaped, wave-shaped, or zigzag-shaped. In the embodiment of FIG. 27, the cross-sectional shape of each anti-reflection microstructure 300 is zigzag. In addition, the light receiving region 301 and the backlight region 302 of this embodiment are both inclined planes.

請配合參照圖27以及圖28。圖28為本新型一實施例的導光元件的局部底視示意圖。進一步而言,在本實施例中,每一個增透微結構300為非對稱凸柱,且非對稱凸柱沿著第一方向D1延伸,且沿著第二方向D2並排。Please refer to FIG. 27 and FIG. 28 for cooperation. FIG. 28 is a partial bottom view of a light guide element according to an embodiment of the present invention. Further, in this embodiment, each of the anti-reflection microstructures 300 is an asymmetric convex pillar, and the asymmetric convex pillars extend along the first direction D1 and are arranged side by side along the second direction D2.

每一個非對稱凸柱具有一稜線300R,也就是受光區301與背光區302的交界線。在本實施例中,定義出一通過稜線300R的垂直參考面R1。如圖27所示,垂直參考面R1平行於第三方向D3,也就是平行於導光元件210的厚度方向。受光區301與背光區302是分別位於垂直參考面R1的兩相反側,受光區301與垂直參考面R1形成一第一夾角θ1,而背光區302與垂直參考面R1形成一第二夾角θ2。在本實施例中,第一夾角θ1會大於第二夾角θ2,以確保大部分的光束可投射到受光區301,且不會再被全反射。 另外,在本實施例中,對於兩相鄰的增透微結構300而言,其中一個增透微結構300的受光區301的邊緣會和另一個增透微結構300的背光區302的邊緣重合。也就是說,在兩相鄰的增透微結構300之間並未形成用以連接兩增透微結構300的連接區,以進一步減少光束被全反射的機率。但是在其他實施例中,只要連接區相對於垂直參考面R1的傾斜角度可以避免光束被全反射,或者是不影響光束的行進路徑,也可以在每兩相鄰的增透微結構300之間設置連接區。Each asymmetric convex pillar has a ridge line 300R, that is, a boundary line between the light receiving area 301 and the backlight area 302. In this embodiment, a vertical reference plane R1 passing through the ridge line 300R is defined. As shown in FIG. 27, the vertical reference plane R1 is parallel to the third direction D3, that is, parallel to the thickness direction of the light guide element 210. The light receiving region 301 and the backlight region 302 are located on two opposite sides of the vertical reference plane R1, respectively. The light receiving region 301 and the vertical reference plane R1 form a first included angle θ1, and the backlight region 302 and the vertical reference plane R1 form a second included angle θ2. In this embodiment, the first included angle θ1 is larger than the second included angle θ2 to ensure that most of the light beam can be projected to the light receiving area 301 and will not be totally reflected again. In addition, in this embodiment, for two adjacent anti-reflection microstructures 300, the edges of the light-receiving region 301 of one of the anti-reflection microstructures 300 coincide with the edges of the backlight region 302 of the other anti-reflection microstructure 300 . That is, a connection region for connecting the two anti-reflection microstructures 300 is not formed between two adjacent anti-reflection microstructures 300 to further reduce the probability that the light beam is totally reflected. However, in other embodiments, as long as the inclination of the connection area with respect to the vertical reference plane R1 can prevent the light beam from being totally reflected, or does not affect the travel path of the light beam, it can also be between every two adjacent anti-reflection microstructures 300 Set the connection area.

另外,本新型實施例的增透微結構300的外觀並不限制於非對稱凸柱,且受光區301以及背光區302也可以是曲面,其中曲面例如是包括凹面或凸面。請參照圖29,圖29為本新型一實施例的導光元件的局部底視示意圖。在本實施例中,多個增透微結構300是排列成陣列,且每一增透微結構300為偏心微透鏡。 如圖29所示,每一個增透微結構300的底部截面形狀為圓形,然而,從底視方向看,增透微結構300的頂點300C相對於底部截面形狀(圓形)的圓心偏移。也就是說,增透微結構300的頂點300C並未對準於底部截面形狀(圓形)的圓心。在本實施例中,每一個增透微結構300的邊緣會和另一個增透微結構300的邊緣彼此連接。In addition, the appearance of the anti-reflection microstructure 300 in the embodiment of the present invention is not limited to asymmetric convex pillars, and the light receiving area 301 and the backlight area 302 may also be curved surfaces, where the curved surfaces include, for example, concave surfaces or convex surfaces. Please refer to FIG. 29, which is a schematic bottom view of a part of a light guide element according to an embodiment of the present invention. In this embodiment, the plurality of AR microstructures 300 are arranged in an array, and each AR microstructure 300 is an eccentric microlens. As shown in FIG. 29, the bottom cross-sectional shape of each anti-reflection microstructure 300 is circular. However, when viewed from the bottom view direction, the apex 300C of the anti-reflection microstructure 300 is offset from the center of the bottom cross-sectional shape (round) . That is, the apex 300C of the anti-reflection microstructure 300 is not aligned with the center of the bottom cross-sectional shape (circular). In this embodiment, an edge of each AR coating microstructure 300 and an edge of another AR coating microstructure 300 are connected to each other.

另外,在本實施例中,定義沿著第一方向D1排列的同一行的所有增透微結構300的頂點300C形成一連線P2,而連線P2可將每一個增透微結構300的表面區域區分為受光區301以及背光區302。具體而言,受光區301是位於連線P2右半部分的表面區域,而背光區302則是位於連線P2左半部分的表面區域。由圖29中也可以看出,受光區301的面積會大於背光區302的面積。In addition, in this embodiment, the vertices 300C of all the AR microstructures 300 defined in the same row arranged along the first direction D1 form a line P2, and the line P2 can form the surface of each AR microstructure 300 The area is divided into a light receiving area 301 and a backlight area 302. Specifically, the light receiving area 301 is a surface area located on the right half of the line P2, and the backlight area 302 is a surface area located on the left half of the line P2. It can also be seen from FIG. 29 that the area of the light receiving area 301 is larger than the area of the backlight area 302.

請參照圖30,圖30為本新型一實施例的導光元件的局部剖面示意圖。具體而言,圖30可以是圖29中的多個增透微結構300在第二方向D2上的剖面示意圖。在本實施例中,增透微結構300的剖面形狀是大致呈波浪形或山形,也就是說,受光區301與背光 區102都是曲面。Please refer to FIG. 30, which is a schematic partial cross-sectional view of a light guide element according to an embodiment of the present invention. Specifically, FIG. 30 may be a schematic cross-sectional view of the plurality of anti-reflection microstructures 300 in the second direction D2 in FIG. 29. In this embodiment, the cross-sectional shape of the anti-reflection microstructure 300 is substantially wavy or mountain-shaped, that is, the light receiving region 301 and the backlight region 102 are both curved.

另外,通過受光區301任意一點的切面和通過頂點300C的垂直參考面R1之間形成一第一夾角θ1,而通過背光區302任意一點的切面和通過頂點300C的垂直參考面R1之間形成一第二夾角,且第一夾角會大於第二夾角。據此,當光束投射到受光區301時,可以確保光束的入射角小於導光元件210的全反射臨界角,以避免光束被全反射。In addition, a first included angle θ1 is formed between the cut plane passing through any point of the light receiving region 301 and the vertical reference plane R1 passing through the vertex 300C, and a cut plane passing through any point of the backlight region 302 and the vertical reference plane R1 passing through the vertex 300C forms a first angle θ1. The second included angle, and the first included angle is greater than the second included angle. According to this, when the light beam is projected to the light receiving area 301, it is possible to ensure that the incident angle of the light beam is smaller than the critical angle of total reflection of the light guide element 210 to prevent the light beam from being totally reflected.

在其他實施例中,增透微結構300也可以是其他種類的偏心錐體,例如是偏心多角形錐體,也就是增透微結構300的底部截面形狀為三角形、四角形或其他多邊形。只要能夠減少光束被全反射的比例(或者增加光束穿透出光部E2的比例)本新型實施例並不限制增透微結構300的形狀。In other embodiments, the anti-reflection microstructure 300 may also be another kind of eccentric cone, such as an eccentric polygonal cone, that is, the bottom cross-sectional shape of the anti-reflection microstructure 300 is triangular, quadrangular, or other polygon. As long as the proportion of the total reflection of the light beam can be reduced (or the proportion of the light beam penetrating the light exit portion E2 can be increased), the shape of the anti-reflection microstructure 300 is not limited by the present embodiment.

請再參照圖26。本實施例的檢測裝置200U還包括透光元件220。透光元件220設置在導光元件210的頂面212,並具有一和環境介質接觸並且背向導光元件210的表面222。若是檢測裝置200應用於光學式指紋辨識系統中,用以擷取指紋及/或靜脈影像,透光元件220的表面222可供手指接觸或按壓,以進行偵測及辨識。Please refer to FIG. 26 again. The detection device 200U of this embodiment further includes a light transmitting element 220. The light-transmitting element 220 is disposed on the top surface 212 of the light-guiding element 210 and has a surface 222 that is in contact with the environmental medium and faces away from the light-guiding element 210. If the detection device 200 is used in an optical fingerprint recognition system to capture fingerprints and / or vein images, the surface 222 of the light-transmitting element 220 can be touched or pressed by a finger for detection and identification.

檢測裝置200U還包括位於導光元件210第二側的基板14、發光元件230以及感測元件240,其中發光元件230與感測元件240都設置在基板14上。基板14可以是線路板,線路板已具有預先配置的線路。另外,基板14的材料為吸光材料。The detection device 200U further includes a substrate 14, a light emitting element 230, and a sensing element 240 located on the second side of the light guide element 210. The light emitting element 230 and the sensing element 240 are both disposed on the substrate 14. The substrate 14 may be a circuit board, which already has pre-configured circuits. The material of the substrate 14 is a light absorbing material.

感測元件240對應於導光元件210的多個增透微結構300而配置於基板14上,用以擷取物體F1的影像。換句話說,導光元件210是位於感測元件240以及透光元件220之間。The sensing element 240 is disposed on the substrate 14 corresponding to the plurality of anti-reflection microstructures 300 of the light guide element 210 to capture an image of the object F1. In other words, the light guide element 210 is located between the sensing element 240 and the light transmitting element 220.

感測元件240具有一光接收面240a,以接受由導光元件210的出光部E2所出射的光束L。換言之,光束穿過多個增透微結構300之後,會投射到感測元件240的光接收面240a。The sensing element 240 has a light receiving surface 240 a to receive the light beam L emitted from the light emitting portion E2 of the light guiding element 210. In other words, after passing through the plurality of anti-reflection microstructures 300, the light beam is projected onto the light receiving surface 240a of the sensing element 240.

發光元件230鄰近於導光元件210的入光部E1設置在基板14上,用於產生一在導光元件210內傳遞的光束L。在本實施例中,發光元件230是設置於導光元件210之外,並且發光元件230所產生的光束L會投射至導光元件210的一入光部E1。The light emitting element 230 is disposed on the substrate 14 adjacent to the light incident portion E1 of the light guiding element 210 for generating a light beam L transmitted in the light guiding element 210. In this embodiment, the light emitting element 230 is disposed outside the light guiding element 210, and the light beam L generated by the light emitting element 230 is projected to a light incident portion E1 of the light guiding element 210.

進一步而言,本新型實施例的導光元件210的底面214還具有一用以容納發光元件230的第一凹陷部C1以及一用以容納感測元件240的第二凹陷部C2。導光元件210的入光部E1位於第一凹陷部C1,而導光元件210的出光部E2是位於第二凹陷部C2。Further, the bottom surface 214 of the light guide element 210 of the present embodiment further includes a first recessed portion C1 for receiving the light emitting element 230 and a second recessed portion C2 for receiving the sensing element 240. The light incident portion E1 of the light guide element 210 is located in the first recessed portion C1, and the light exit portion E2 of the light guide element 210 is located in the second recessed portion C2.

如圖26所示,當發光元件、導光元件210以及感測元件240都設置在基板14上時,發光元件230正好可容納並且被卡固於第一凹陷部C1內,而感測元件240正好可容納並且被卡固於第 二凹陷部C2內。另外,在本實施例中,多個增透微結構300是位於第二凹陷部C2的底部。如此,可以縮小檢測裝置200的整體體積。然而,在其他實施例中,第一凹陷部C1與第二凹陷部C2也可以省略。在另一實施例中,發光元件230可以是被埋設在導光元件210內。具體而言,可以先將發光元件230固定在基板14上之後,再通過灌膠以及固化等步驟來形成導光元件210,從而使發光元件230被埋設於導光元件210內。此時,發光元件230所產生的光束L不需通過其他介質而直接在導光元件210內被傳遞。 除此之外,本新型實施例的發光元件230都是設置於導光元件210的底面214,但在其他實施例中,發光元件230也可以設置在導光元件210的頂面212。As shown in FIG. 26, when the light-emitting element, the light-guiding element 210, and the sensing element 240 are all disposed on the substrate 14, the light-emitting element 230 can be accommodated and clamped in the first recessed portion C1, and the sensing element 240 It can be accommodated and clamped in the second recess C2. In addition, in this embodiment, the plurality of anti-reflection microstructures 300 are located at the bottom of the second recessed portion C2. In this way, the entire volume of the detection device 200 can be reduced. However, in other embodiments, the first concave portion C1 and the second concave portion C2 may be omitted. In another embodiment, the light emitting element 230 may be buried in the light guide element 210. Specifically, after the light-emitting element 230 is fixed on the substrate 14, the light-guiding element 210 may be formed through steps such as potting and curing, so that the light-emitting element 230 is buried in the light-guiding element 210. At this time, the light beam L generated by the light emitting element 230 is directly transmitted in the light guide element 210 without passing through another medium. In addition, the light-emitting element 230 of the present embodiment is disposed on the bottom surface 214 of the light-guiding element 210. However, in other embodiments, the light-emitting element 230 may be disposed on the top surface 212 of the light-guiding element 210.

另外,本新型實施例的檢測裝置200U還進一步包括第二反射元件270以及第一反射元件260。第二反射元件270與第一反射元件260分別配置在導光元件210的頂面212與底面214。具體而言,第二反射元件270是位於透光元件220與導光元件210之間,第一反射元件260是位於基板14以及導光元件210之間。在一實施例中,第二反射元件270與第一反射元件260可以是反射片或者是形成於導光元件210表面的反射膜層,本新型並未限制。 另外,在本實施例中,第二反射元件270與第一反射元件260可彼此相互錯開設置,並在導光元件210的厚度方向上至少部分重疊,以將光束L導引至透光元件220。在其他實施例中,第二反射元件270與第一反射元件260也可以完全錯開而不重疊。因此,只要能夠將光束L導引至透光元件220,本新型並不限制第二反射元件270與第一反射元件260的相對位置或者是使光束L產生反射的形式。In addition, the detection device 200U of the present embodiment further includes a second reflective element 270 and a first reflective element 260. The second reflective element 270 and the first reflective element 260 are respectively disposed on the top surface 212 and the bottom surface 214 of the light guide element 210. Specifically, the second reflective element 270 is located between the light transmitting element 220 and the light guide element 210, and the first reflective element 260 is located between the substrate 14 and the light guide element 210. In an embodiment, the second reflective element 270 and the first reflective element 260 may be a reflective sheet or a reflective film layer formed on the surface of the light guide element 210, which is not limited in the present invention. In addition, in this embodiment, the second reflective element 270 and the first reflective element 260 may be staggered from each other and at least partially overlap in the thickness direction of the light guide element 210 to guide the light beam L to the light transmitting element 220. . In other embodiments, the second reflective element 270 and the first reflective element 260 may be completely staggered without overlapping. Therefore, as long as the light beam L can be guided to the light-transmitting element 220, the present invention does not limit the relative position of the second reflection element 270 and the first reflection element 260 or a form of reflecting the light beam L.

舉例而言,在其他實施例中,也可以通過設計光束L的行進方向,使光束L在導光元件210與環境介質之間產生全反射。在這個情況下,第一反射元件260可以被省略。整體而言,發光元件230所產生的光束L由入光部E1進入導光元件210內之後,依序通過第二反射元件270的反射與第一反射元件260的反射,而在導光元件210內向透光元件220傳遞,並且在透光元件220與環境介質的交界面,也就是透光元件220的表面222,產生全反射。For example, in other embodiments, the traveling direction of the light beam L may also be designed so that the light beam L generates total reflection between the light guide element 210 and the environmental medium. In this case, the first reflective element 260 may be omitted. Generally speaking, after the light beam L generated by the light emitting element 230 enters the light guide element 210 through the light incident portion E1, it passes through the reflection of the second reflection element 270 and the reflection of the first reflection element 260 in order, and the light guide element 210 The inward transmission to the light-transmitting element 220 results in total reflection at the interface between the light-transmitting element 220 and the environmental medium, that is, the surface 222 of the light-transmitting element 220.

當物體F1(如:手指)接觸透光元件220的表面222時,手指的凸紋接觸到表面222,會使一部分光束L無法產生全反射,從而使感測元件240取得對應手指凸紋的暗紋。另一方面,手指的凹紋並未接觸到透光元件220的表面222,而使另一部分光束L仍可被全反射而形成一信號光束L’。信號光束L’朝向導光元件210的出光部E2投射,並通過導光元件210的多個增透微結構300而投向感測元件240的光接收面240a。後續再通過一影像處理元件,對感測元件240所接收到的信號光束L’進行影像處理,可以得到物體F1的指紋影像。When the object F1 (eg, a finger) contacts the surface 222 of the light-transmitting element 220, the convex pattern of the finger contacts the surface 222, and a part of the light beam L cannot be totally reflected, so that the sensing element 240 obtains the darkness corresponding to the convex pattern of the finger Pattern. On the other hand, the indentation of the finger does not contact the surface 222 of the light-transmitting element 220, so that another part of the light beam L can still be totally reflected to form a signal light beam L '. The signal light beam L 'is projected toward the light emitting portion E2 of the light guide element 210, and is projected toward the light receiving surface 240a of the sensing element 240 through the plurality of anti-reflection microstructures 300 of the light guide element 210. Subsequently, an image processing element is used to image process the signal beam L 'received by the sensing element 240 to obtain a fingerprint image of the object F1.

也就是說,在本新型實施例中,通過在導光元件210的出光部E2設置增透微結構300,可以避免信號光束L’在進入感測元件240之前被再度全反射,從而降低檢測裝置200的影像辨識度。That is, in the embodiment of the present invention, by providing the anti-reflection microstructure 300 at the light-exiting portion E2 of the light guide element 210, the signal beam L 'can be prevented from being totally reflected again before entering the sensing element 240, thereby reducing the detection device. Image recognition of 200.

請參照圖31,圖31為本新型一實施例的檢測裝置的剖面示意圖。圖31的檢測裝置200V和圖26的檢測裝置200U相同或相對應的元件具有相同的標號,且相同的部分不再贅述。在圖31實施例中,檢測裝置200V還包括位於導光元件210底面214的第三反射元件280。也就是說,第一反射元件260與第三反射元件280位於導光元件210的同一表面,但彼此分隔設置。在本實施例中,光束L通過第二反射元件270、第一反射元件260與第三反射元件280的反射,以在導光元件210內進行傳遞,並投射至透光元件220。Please refer to FIG. 31, which is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The same or corresponding components of the detection device 200V of FIG. 31 and the detection device 200U of FIG. 26 have the same reference numerals, and the same parts are not described again. In the embodiment of FIG. 31, the detection device 200V further includes a third reflective element 280 located on the bottom surface 214 of the light guide element 210. That is, the first reflective element 260 and the third reflective element 280 are located on the same surface of the light guide element 210, but are disposed apart from each other. In this embodiment, the light beam L is reflected by the second reflective element 270, the first reflective element 260, and the third reflective element 280 to be transmitted within the light guide element 210 and projected to the light transmitting element 220.

在本實施例中,第二反射元件270與第一反射元件260在導光元件210的厚度方向上是完全重疊,而第二反射元件270和第三反射元件280在導光元件210的厚度方向上只有部分重疊。 另外,本實施例的檢測裝置200V還包括一設置於第一反射元件260與第三反射元件280之間的吸光元件291。在本實施例中,吸光元件291和第二反射元件270在導光元件210的厚度方向重疊。進一步而言,第二反射元件270的垂直投影可和吸光元件291至少部分重疊。吸光元件291可以是對光束L不透明且不反光的遮蔽層,例如是油墨層或黏著層,或者是遮蔽片,但前述例示並非用以限制本新型的範圍。In this embodiment, the second reflection element 270 and the first reflection element 260 are completely overlapped in the thickness direction of the light guide element 210, and the second reflection element 270 and the third reflection element 280 are in the thickness direction of the light guide element 210 It only partially overlaps. In addition, the detection device 200V of this embodiment further includes a light absorbing element 291 disposed between the first reflective element 260 and the third reflective element 280. In this embodiment, the light absorption element 291 and the second reflection element 270 overlap in the thickness direction of the light guide element 210. Further, the vertical projection of the second reflecting element 270 may at least partially overlap the light absorbing element 291. The light absorbing element 291 may be a shielding layer that is opaque and non-reflective to the light beam L, such as an ink layer or an adhesive layer, or a shielding sheet, but the foregoing examples are not intended to limit the scope of the present invention.

在其他實施例中,也可以在導光元件210的其他區域,也就是未設置第二反射元件270、第一反射元件260以及第三反射元件280的區域設置其它吸光元件(未繪示)。舉例而言,檢測裝置200V還可以進一步包括設置在導光元件210的兩相反側壁面上的多個吸光元件(未繪示),前述的側壁面是指連接於導光元件210的頂面212與底面214之間的表面。In other embodiments, other light absorbing elements (not shown) may be provided in other areas of the light guide element 210, that is, areas where the second reflective element 270, the first reflective element 260, and the third reflective element 280 are not provided. For example, the detection device 200V may further include a plurality of light absorbing elements (not shown) disposed on two opposite side walls of the light guide element 210. The aforementioned side wall surface refers to the top surface 212 connected to the light guide element 210. And the bottom surface 214.

吸光元件291可以吸收並減少未依循預定光路前進的雜散光,從而避免感測元件240接收到來自信號光束L’以外的雜散光。另外,配置吸光元件291可以增加取像面積,並使傳遞到感測元件240的信號光束L’更均勻,而有利於提高成像品質。The light absorbing element 291 can absorb and reduce stray light that does not follow a predetermined optical path, thereby preventing the sensing element 240 from receiving stray light from outside the signal light beam L '. In addition, the configuration of the light absorbing element 291 can increase the image pickup area and make the signal light beam L 'transmitted to the sensing element 240 more uniform, which is beneficial to improving the imaging quality.

請繼續參照圖32,圖32為本新型一實施例的檢測裝置的剖面示意圖。圖32的檢測裝置200W和圖31的檢測裝置200V相同或相對應的元件具有相同的標號,且相同的部分不再贅述。在圖32的實施例中,檢測裝置200W還包括位於導光元件210頂面212的第四反射元件290。也就是說,第二反射元件270與第四反射元件290位於導光元件210的同一表面,但彼此分隔設置。在本實施例中,光束L是依序通過第二反射元件270、第一反射元件260、第四反射元件290與第三反射元件280的反射,以在導光元件210內進行傳遞,並投射至透光元件220。Please continue to refer to FIG. 32, which is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The same or corresponding components of the detection device 200W of FIG. 32 and the detection device 200V of FIG. 31 have the same reference numerals, and the same parts are not described again. In the embodiment of FIG. 32, the detection device 200W further includes a fourth reflective element 290 located on the top surface 212 of the light guide element 210. That is, the second reflective element 270 and the fourth reflective element 290 are located on the same surface of the light guide element 210, but are disposed apart from each other. In this embodiment, the light beam L is sequentially reflected by the second reflective element 270, the first reflective element 260, the fourth reflective element 290, and the third reflective element 280 to be transmitted within the light guide element 210 and projected. To the light transmitting element 220.

在本實施例中,第二反射元件270與第一反射元件260在導光 元件10的厚度方向上至少部分重疊,而第四反射元件290和第三反射元件280在導光元件210的厚度方向上也是部分重疊。但是,第二反射元件270與第三反射元件280在導光元件210的厚度方向上完全不重疊。In this embodiment, the second reflection element 270 and the first reflection element 260 at least partially overlap in the thickness direction of the light guide element 10, and the fourth reflection element 290 and the third reflection element 280 are in the thickness direction of the light guide element 210 The top is also partially overlapping. However, the second reflection element 270 and the third reflection element 280 do not overlap at all in the thickness direction of the light guide element 210.

另外,本實施例的檢測裝置200W除了包括一設置於第一反射元件260與第三反射元件280之間的吸光元件291a之外,還進一步包括設置在第二反射元件270與第三反射元件280之間的另一吸光元件291b。在本實施例中,兩個吸光元件291a、291b和第二反射元件270在導光元件210的厚度方向上至少部分重疊。 和圖31的實施例相似,兩個吸光元件291a、291b可以吸收並減少未依循預定光路前進的雜散光,從而避免感測元件240接收到來自信號光束L’以外的雜散光。另外,配置吸光元件291可以增加取像面積,並使傳遞到感測元件240的信號光束L’更均勻,而有利於提高成像品質。In addition, the detection device 200W of this embodiment includes a light absorbing element 291a disposed between the first reflective element 260 and the third reflective element 280, and further includes a second reflective element 270 and a third reflective element 280. Between another light absorbing element 291b. In this embodiment, the two light absorbing elements 291 a and 291 b and the second reflection element 270 at least partially overlap in the thickness direction of the light guide element 210. Similar to the embodiment of FIG. 31, the two light absorbing elements 291a and 291b can absorb and reduce stray light that does not follow a predetermined optical path, thereby preventing the sensing element 240 from receiving stray light from outside the signal light beam L '. In addition, the configuration of the light absorbing element 291 can increase the image pickup area and make the signal light beam L 'transmitted to the sensing element 240 more uniform, which is beneficial to improving the imaging quality.

另外,在本實施例中,檢測裝置200W還進一步包括一設置在第一凹陷部C1內的遮光物20。遮光物20位於發光元件230與感測元件240之間,以避免光束L直接投射至感測元件240。另一方面,遮光物20可侷限發光元件230所產生的光束L的發散角度,從而可更精準地控制光束L以預定的入射角度進入導光元件210內。如此,可更進一步精準控制光束L的光路,並確保大部分的光束L都可朝向物體F1投射,而提高感測元件240的成像品質。In addition, in this embodiment, the detection device 200W further includes a light-shielding object 20 disposed in the first recessed portion C1. The light-shielding object 20 is located between the light-emitting element 230 and the sensing element 240 to prevent the light beam L from directly projecting onto the sensing element 240. On the other hand, the light-shielding object 20 can limit the divergence angle of the light beam L generated by the light-emitting element 230, so that the light beam L can be more accurately controlled to enter the light guide element 210 at a predetermined incident angle. In this way, the optical path of the light beam L can be controlled more accurately, and most of the light beam L can be projected toward the object F1, thereby improving the imaging quality of the sensing element 240.

請繼續參照圖33,圖33為本新型一實施例的檢測裝置的剖面示意圖。圖33的檢測裝置200X和圖31的檢測裝置200V相同或相對應的元件具有相同的標號,且相同的部分不再贅述。Please continue to refer to FIG. 33, which is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The same or corresponding components of the detection device 200X of FIG. 33 and the detection device 200V of FIG. 31 have the same reference numerals, and the same parts are not described again.

在圖33的實施例中,導光元件210包括一設置於第一反射元件260與第三反射元件280之間的多個光學微結構303。在本實施例中,多個光學微結構303分布的範圍和第二反射元件270在導光元件210的厚度方向至少部分重疊。進一步而言,第二反射元件270 的垂直投影可和多個光學微結構303分布的範圍至少部分重疊。In the embodiment of FIG. 33, the light guide element 210 includes a plurality of optical microstructures 303 disposed between the first reflective element 260 and the third reflective element 280. In this embodiment, a range in which the plurality of optical microstructures 303 are distributed and the second reflection element 270 at least partially overlap in a thickness direction of the light guide element 210. Further, the vertical projection of the second reflective element 270 may at least partially overlap the range in which the plurality of optical microstructures 303 are distributed.

每一光學微結構303的形狀可以和前述的增透微結構300相同。舉例而言,光學微結構303的剖面形狀也可以是鋸齒形、波浪形或山形,但本新型不以此為限。The shape of each optical microstructure 303 may be the same as that of the aforementioned anti-reflection microstructure 300. For example, the cross-sectional shape of the optical microstructure 303 may also be a zigzag shape, a wave shape, or a mountain shape, but the present invention is not limited thereto.

多個光學微結構303可以使通過第二反射元件270反射之後的一部分光束穿過多個光學微結構303而從導光元件210投射而出。進一步而言,未依據預定路徑行進的雜散光L1可通過光學微結構303投射至導光元件210之外,而被基板14所吸收,從而避免感測元件240接收到來自信號光束L’以外的雜散光L1。另外,光學微結構303的配置可以增加取像面積,並使傳遞到感測元件240的信號光束L’更均勻,而有利於提高成像品質。The plurality of optical microstructures 303 may allow a part of the light beams reflected by the second reflection element 270 to pass through the plurality of optical microstructures 303 and be projected from the light guide element 210. Further, the stray light L1 that does not travel according to a predetermined path may be projected outside the light guide element 210 through the optical microstructure 303 and absorbed by the substrate 14, thereby preventing the sensing element 240 from receiving signals other than the signal beam L ′. Stray light L1. In addition, the configuration of the optical microstructure 303 can increase the image pickup area and make the signal beam L 'transmitted to the sensing element 240 more uniform, which is beneficial to improving the imaging quality.

另外,和圖32的實施例相似,在圖33的實施例中,檢測裝置200X還進一步包括一設置在第一凹陷部C1內的遮光物20,以避免光束L直接投射至感測元件240,以及可侷限發光元件230所產生的光束L的發散角度,從而可更精準地控制光束L以預定的入射角度進入導光元件210內。In addition, similar to the embodiment of FIG. 32, in the embodiment of FIG. 33, the detection device 200X further includes a light shielding object 20 disposed in the first recessed portion C1 to prevent the light beam L from directly projecting onto the sensing element 240. And the divergence angle of the light beam L generated by the light emitting element 230 can be limited, so that the light beam L can be more accurately controlled to enter the light guide element 210 at a predetermined incident angle.

請繼續參照圖34,圖34為本新型一實施例的檢測裝置的剖面示意圖。圖34的檢測裝置200Y和圖32的檢測裝置200W相同或相對應的元件具有相同或相似的標號,且相同的部分不再贅述。Please continue to refer to FIG. 34, which is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The same or corresponding components of the detection device 200Y of FIG. 34 and the detection device 200W of FIG. 32 have the same or similar reference numerals, and the same parts are not described again.

在圖34的實施例中,檢測裝置200Y包括設置於第二反射元件270與第四反射元件290的吸光元件291c,且導光元件210包括一設置於第一反射元件260與第三反射元件280之間的多個光學微結構303。In the embodiment of FIG. 34, the detection device 200Y includes a light absorbing element 291c disposed on the second reflective element 270 and a fourth reflective element 290, and the light guide element 210 includes a first reflective element 260 and a third reflective element 280. Between multiple optical microstructures 303.

在本實施例中,多個光學微結構303分布的範圍和第二反射元件270以及第四反射元件290在導光元件210的厚度方向完全不重疊。另外,吸光元件291c和第一反射元件260在導光元件210的厚度方向至少部分重疊,但是吸光元件291c和第三反射元件280在導光元件210的厚度方向完全不重疊。In this embodiment, the range in which the plurality of optical microstructures 303 are distributed and the second reflection element 270 and the fourth reflection element 290 in the thickness direction of the light guide element 210 do not overlap at all. In addition, the light absorption element 291c and the first reflection element 260 at least partially overlap in the thickness direction of the light guide element 210, but the light absorption element 291c and the third reflection element 280 do not overlap at all in the thickness direction of the light guide element 210.

本實施例的吸光元件291c和光學微結構303可以使未依據預定路徑行進的雜散光L1從導光元件210出射,而被基板14所吸收,或者是直接被吸光元件291c所吸收,從而避免感測元件240接收到來自信號光束L’以外的雜散光。另外,吸光元件291c和光學微結構303的配置可以增加取像面積,並使傳遞到感測元件240的信號光束L’更均勻,而有利於提高成像品質。The light absorbing element 291c and the optical microstructure 303 of this embodiment can make stray light L1 that does not travel according to a predetermined path exit from the light guide element 210 and be absorbed by the substrate 14 or directly absorbed by the light absorbing element 291c, thereby avoiding sensation The measurement element 240 receives stray light from outside the signal light beam L ′. In addition, the configuration of the light absorbing element 291c and the optical microstructure 303 can increase the image pickup area and make the signal beam L 'transmitted to the sensing element 240 more uniform, which is conducive to improving the imaging quality.

請參照圖35,圖35為本新型一實施例的檢測裝置的剖面示意圖。圖35的檢測裝置200Z和圖26的檢測裝置200U相同或相對應的元件具有相同或相似的標號,且相同的部分不再贅述。 在本實施例中,檢測裝置200Z省略如圖26所示的透光元件220。據此,發光元件230所產生的光束L由入光部E1進入導光元件210內之後,依序通過第二反射元件270的反射與第一反射元件260的反射,而在導光元件210內傳遞,並且在導光元件210與環境介質的交界面,也就是位於導光元件210的頂面212之表面,產生全反射。Please refer to FIG. 35, which is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The same or corresponding components of the detection device 200Z of FIG. 35 and the detection device 200U of FIG. 26 have the same or similar reference numerals, and the same parts are not described again. In this embodiment, the detection device 200Z omits the light transmitting element 220 shown in FIG. 26. According to this, after the light beam L generated by the light emitting element 230 enters the light guide element 210 through the light incident portion E1, it passes through the reflection of the second reflection element 270 and the reflection of the first reflection element 260 in order, and is within the light guide element 210. Transmit and generate total reflection at the interface between the light guide element 210 and the environmental medium, that is, the surface located on the top surface 212 of the light guide element 210.

也就是說,位於導光元件210頂面212的表面可作為被物體F1接觸的接觸面。當物體F1(如:手指)由導光元件210的頂面212接觸導光元件210時,手指的凸紋會使一部分光束L無法產生全反射,從而使感測元件240取得對應手指凸紋的暗紋。另一方面,手指的凹紋並未接觸到導光元件210的頂面212表面,而使另一部分光束L仍可被全反射而形成一信號光束L’。信號光束L’朝向導光元件210的出光部E2投射,並通過導光元件210的多個增透微結構300而投向感測元件240的光接收面240a。之後,再通過一影像處理元件,對感測元件240所接收到的信號光束L’進行影像處理,可以得到物體F1的指紋影像並根據指紋影像進行身分辨識。That is, the surface on the top surface 212 of the light guide element 210 can be used as a contact surface to be contacted by the object F1. When the object F1 (such as a finger) contacts the light guide element 210 from the top surface 212 of the light guide element 210, the convexity of the finger will prevent a part of the light beam L from being totally reflected, so that the sensing element 240 obtains the corresponding finger convexity. Dark lines. On the other hand, the groove of the finger does not contact the surface of the top surface 212 of the light guide element 210, so that another part of the light beam L can still be totally reflected to form a signal light beam L '. The signal light beam L 'is projected toward the light emitting portion E2 of the light guide element 210, and is projected toward the light receiving surface 240a of the sensing element 240 through the plurality of anti-reflection microstructures 300 of the light guide element 210. After that, an image processing element is used to perform image processing on the signal beam L 'received by the sensing element 240 to obtain a fingerprint image of the object F1 and perform identity recognition based on the fingerprint image.

圖36為本新型一實施例的檢測裝置的剖面示意圖。本實例的檢測裝置200-1圖35的檢測裝置200Z相同或相對應的元件具有相同或相似的標號,且相同的部分不再贅述。FIG. 36 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. The same or corresponding components of the detection device 200Z of the detection device 200-1 of this example in FIG. 35 have the same or similar reference numerals, and the same parts are not described again.

在本實施例中,導光元件210的底面214不具有第一凹陷部C1以及第二凹陷部C2。也就是說,導光元件210在底面214的表面為平面,但多個增透微結構300仍設置在位於底面214的出光部E2。In this embodiment, the bottom surface 214 of the light guide element 210 does not have the first recessed portion C1 and the second recessed portion C2. That is, the surface of the light guide element 210 on the bottom surface 214 is flat, but the plurality of anti-reflection microstructures 300 are still disposed on the light emitting portion E2 located on the bottom surface 214.

另外,本實施例的檢測裝置200-1還包括光學膠G1。光學膠G1連接在導光元件210與基板14之間,以使導光元件210固定於基板14上,且發光元件230與感測元件240是埋入光學膠G1內。另外,光學膠G1的折射係數會和導光元件210大致相同,例如可大於或等於1.4,且小於或等於1.6。因此,光束L從導光元件210進入到光學膠G1內,或者是由光學膠G1進入導光元件210內時,會根據預定的光路前進,而不會產生折射。須說明的是,光學膠G1並未填滿感測元件240以及出光部E2(多個增透微結構300)之間所定義出的空隙。因此,通過在出光部E2設置的多個增透微結構300,可大幅減少信號光束L’在出光部E2再度被全反射的機率,從而提高感測元件240的成像品質。In addition, the detection device 200-1 of this embodiment further includes an optical glue G1. The optical glue G1 is connected between the light guiding element 210 and the substrate 14 so that the light guiding element 210 is fixed on the substrate 14, and the light emitting element 230 and the sensing element 240 are embedded in the optical glue G1. In addition, the refractive index of the optical adhesive G1 will be substantially the same as that of the light guide element 210, for example, it may be greater than or equal to 1.4 and less than or equal to 1.6. Therefore, when the light beam L enters the optical glue G1 from the light guide element 210 or the optical glue G1 enters the light guide element 210, it will advance according to a predetermined optical path without refraction. It should be noted that the optical glue G1 does not fill the gap defined between the sensing element 240 and the light emitting portion E2 (the plurality of anti-reflection microstructures 300). Therefore, the multiple anti-reflection microstructures 300 provided in the light emitting portion E2 can greatly reduce the probability that the signal beam L 'is totally reflected again in the light emitting portion E2, thereby improving the imaging quality of the sensing element 240.

另外,在本實施例中,導光元件210位於導光元件210頂面(表面222)具有另一凹陷部C3,且凹陷部C3的位置是對應於第二反射元件270的位置,以降低導光元件210的部分厚度,而有利於針對不同產品,提供較薄的檢測裝置。In addition, in this embodiment, the light guide element 210 is located on the top surface (surface 222) of the light guide element 210 and has another recessed portion C3, and the position of the recessed portion C3 corresponds to the position of the second reflective element 270 to reduce the light guide Part of the thickness of the light element 210 is beneficial to provide a thinner detection device for different products.

此外,檢測裝置200U~200Y、201-1均包括各自的表面電漿共振(Surface Plasmon Resonance)層SPR。檢測裝置200U~200Y、200-1之表面電漿共振層SPR的功能與前述檢測裝置200的表面電漿共振層SPR的功能相同,於此便不再重述。In addition, the detection devices 200U to 200Y, and 201-1 each include a respective surface plasma resonance (Surface Plasmon Resonance) layer SPR. The functions of the surface plasma resonance layer SPR of the detection devices 200U-200Y and 200-1 are the same as the functions of the surface plasma resonance layer SPR of the detection device 200, and will not be repeated here.

圖37是本新型一實施例的檢測裝置的一種實施態樣的剖面示意圖。請參照圖37,檢測裝置200-2適於擷取使用者O的生物特徵。在本實施例中,使用者O例如為手指,且生物特徵例如為指紋或靜脈,但不以此為限。舉例而言,在另一實施例中,使用者O也可為手掌,且生物特徵可為掌紋。37 is a schematic cross-sectional view of an embodiment of a detection device according to an embodiment of the present invention. Referring to FIG. 37, the detection device 200-2 is adapted to capture a biological characteristic of the user O. In this embodiment, the user O is, for example, a finger, and the biological feature is, for example, a fingerprint or a vein, but is not limited thereto. For example, in another embodiment, the user O may be a palm, and the biological feature may be a palm print.

檢測裝置200-2包括基板14、發光元件230、感測元件240、遮光物20、第一反射元件260、導光元件210以及第二反射元件270。The detection device 200-2 includes a substrate 14, a light emitting element 230, a sensing element 240, a light shield 20, a first reflection element 260, a light guide element 210, and a second reflection element 270.

基板14作為上述元件的載板,且基板14可以具有線路。舉例而言,基板14可以是印刷電路板(Printed Circuit Board, PCB)、可撓的軟性印刷電路板(Flexible Printed Circuit Board, FPCB)、具有線路的玻璃載板或具有線路的陶瓷基板,但不以此為限。The substrate 14 serves as a carrier for the above-mentioned elements, and the substrate 14 may have wiring. For example, the substrate 14 may be a printed circuit board (Printed Circuit Board, PCB), a flexible flexible printed circuit board (Flexible Printed Circuit Board, FPCB), a glass substrate with a circuit, or a ceramic substrate with a circuit. This is the limit.

發光元件230配置在基板14上,且發光元件230與基板14上的線路電性連接。舉例而言,檢測裝置200可進一步包括連接線CL1,且發光元件230透過連接線CL1而與基板14上的線路電性連接,但不以此為限。發光元件230適於提供照亮使用者O的光束B。The light-emitting element 230 is disposed on the substrate 14, and the light-emitting element 230 is electrically connected to a line on the substrate 14. For example, the detection device 200 may further include a connection line CL1, and the light-emitting element 230 is electrically connected to the line on the substrate 14 through the connection line CL1, but is not limited thereto. The light emitting element 230 is adapted to provide a light beam B that illuminates the user O.

感測元件240配置在基板14上且位於發光元件230旁。此外,感測元件240與基板14上的線路電性連接。舉例而言,檢測裝置200可進一步包括連接線CL2,且感測元件240透過連接線CL2而與基板14上的線路電性連接,但不以此為限。感測元件240適於接收光束B被使用者O反射的部分(如光束BB)。The sensing element 240 is disposed on the substrate 14 and is located beside the light emitting element 230. In addition, the sensing element 240 is electrically connected to a line on the substrate 14. For example, the detection device 200 may further include a connection line CL2, and the sensing element 240 is electrically connected to the line on the substrate 14 through the connection line CL2, but is not limited thereto. The sensing element 240 is adapted to receive a portion of the light beam B that is reflected by the user O (such as the light beam BB).

遮光物20配置在基板14上且位於發光元件230與感測元件240之間。遮光物20適於遮蔽發光元件230所發出的大角度光束(如光束BL),以避免大角度光束直接照射到感測元件240所造成的干擾。舉例而言,遮光物20可以是由吸光材料製作而成,或是在透光塊材上形成吸光層而形成。此外,遮光物20的高度可大於或等於發光元件230的高度且小於導光元件210的高度。也就是說,遮光物20的頂面S140T可以高於發光元件230的頂面S120T或與發光元件230的頂面S120T齊平。此外,遮光物20的頂面S140T低於導光元件210的頂面212,以允許發光元件230所發出的部分光束(如光束B)通過。在本申請的任一可行的範例中,所述的導光元件210可以是透光的膠材灌膠後烘乾形成。The light-shielding object 20 is disposed on the substrate 14 and is located between the light-emitting element 230 and the sensing element 240. The light-shielding object 20 is adapted to shield the large-angle light beam (such as the light beam BL) emitted by the light-emitting element 230 to avoid interference caused by the large-angle light beam directly irradiating the sensing element 240. For example, the light-shielding object 20 may be made of a light-absorbing material, or formed by forming a light-absorbing layer on a light-transmitting block. In addition, the height of the light shielding object 20 may be greater than or equal to the height of the light emitting element 230 and smaller than the height of the light guiding element 210. That is, the top surface S140T of the light-shielding object 20 may be higher than or flush with the top surface S120T of the light-emitting element 230. In addition, the top surface S140T of the light-shielding object 20 is lower than the top surface 212 of the light guide element 210 to allow a portion of the light beam (such as light beam B) emitted by the light-emitting element 230 to pass. In any feasible example of the present application, the light guide element 210 may be formed by pouring light-transmissive glue material and drying it.

第一反射元件260配置在基板14上且位於遮光物20與感測元件240之間。第一反射元件260適於將朝基板14傳遞的光束B反射,使光束B朝遠離基板14的方向傳遞。舉例而言,第一反射元件260可以是反射片或以電鍍、印刷、蝕刻、黏貼以及塗佈其中至少一者的方式形成在基板14上的反射層。The first reflective element 260 is disposed on the substrate 14 and is located between the light shielding object 20 and the sensing element 240. The first reflecting element 260 is adapted to reflect the light beam B transmitted toward the substrate 14 so that the light beam B is transmitted in a direction away from the substrate 14. For example, the first reflective element 260 may be a reflective sheet or a reflective layer formed on the substrate 14 by at least one of electroplating, printing, etching, pasting, and coating.

導光元件210配置在基板14上且覆蓋發光元件230、感測元件240、遮光物20以及第一反射元件260。導光元件210可以是透光膠體經由升溫製程或照光製程固化而成。所述透光膠體可以是環氧樹脂(epoxy)、矽膠、光學膠、樹脂(resin)或其他合適的透光材料。The light guide element 210 is disposed on the substrate 14 and covers the light emitting element 230, the sensing element 240, the light-shielding object 20, and the first reflecting element 260. The light guide element 210 may be made of a transparent colloid through a heating process or a light curing process. The light-transmitting colloid may be epoxy, silicon, optical glue, resin, or other suitable light-transmitting materials.

第二反射元件270配置在遮光物20的上方且位於發光元件230與感測元件240之間。具體地,第二反射元件270至少位於來自發光元件230且未被遮光物20遮蔽的光束B的傳遞路徑上,以將朝導光元件210的頂面212傳遞的光束B反射,使光束B朝第一反射元件260傳遞。第二反射元件270可以是反射片或以電鍍、印刷、蝕刻、黏貼以及塗佈其中至少一者的方式形成在導光元件210上的反射層。需另外加以說明的是,但在圖37、38、41、42的其他衍生的實施例中,也可以省略第二反射元件270配置在導光元件210的上方,即如圖43、圖45所繪示。The second reflection element 270 is disposed above the light shielding object 20 and is located between the light emitting element 230 and the sensing element 240. Specifically, the second reflecting element 270 is located at least on the transmission path of the light beam B from the light emitting element 230 and not shielded by the light shielding object 20 to reflect the light beam B transmitted toward the top surface 212 of the light guide element 210 so that the light beam B is directed toward The first reflective element 260 passes. The second reflective element 270 may be a reflective sheet or a reflective layer formed on the light guide element 210 by at least one of electroplating, printing, etching, pasting, and coating. It should be noted that, but in other derived embodiments of FIGS. 37, 38, 41, and 42, the second reflection element 270 may be omitted and disposed above the light guide element 210, as shown in FIG. 43, FIG. 45. Draw.

在本實施例中,第二反射元件270配置在導光元件210的頂面212上,但不以此為限。第二反射元件270可從遮光物20的上方朝第一反射元件260的上方延伸,並且第二反射元件270暴露出感測元件240。第一反射元件260可與第二反射元件270部分重疊,但不以此為限。在另一實施例中,第一反射元件260與第二反射元件270也可完全重疊或完全不重疊。另外,第一反射元件260與第二反射元件270可以具有相同或不同的反射率。In this embodiment, the second reflective element 270 is disposed on the top surface 212 of the light guide element 210, but is not limited thereto. The second reflective element 270 may extend from above the light shielding object 20 to above the first reflective element 260, and the second reflective element 270 exposes the sensing element 240. The first reflective element 260 may partially overlap the second reflective element 270, but is not limited thereto. In another embodiment, the first reflective element 260 and the second reflective element 270 may completely overlap or not overlap at all. In addition, the first reflective element 260 and the second reflective element 270 may have the same or different reflectivity.

由於第一反射元件260以及第二反射元件270有助於讓光束B在導光元件210中進行多次反射,因此可使傳遞於檢測裝置200-2中的光束B更均勻,進而讓使用者O能夠均勻受光,而有助於讓感測元件240擷取到完整的生物特徵影像。是以,檢測裝置200-2可具有良好的取像品質。Since the first reflecting element 260 and the second reflecting element 270 help the light beam B to be reflected multiple times in the light guide element 210, the light beam B transmitted to the detection device 200-2 can be made more uniform, thereby allowing users O can receive light uniformly, which helps the sensing element 240 capture a complete biometric image. Therefore, the detection device 200-2 can have good image quality.

在本實施例中,使用者O直接按壓在導光元件210的頂面212上,以進行生物特徵識別。在一實施例中,檢測裝置200-2可進一步包括保護蓋板(未繪示)或保護膜(未繪示)。保護蓋板或保護膜配置在導光元件210以及第二反射元件270上,且使用者O按壓在保護蓋板或保護膜遠離第二反射元件270的表面上,以進行生物特徵識別。保護蓋板或保護膜可保護位於下方的導光元件210以及第二反射元件270(例如防刮)。In this embodiment, the user O directly presses on the top surface 212 of the light guide element 210 to perform biometric identification. In one embodiment, the detection device 200-2 may further include a protective cover (not shown) or a protective film (not shown). The protective cover or protective film is disposed on the light guide element 210 and the second reflective element 270, and the user O presses on the surface of the protective cover or protective film away from the second reflective element 270 to perform biometric identification. The protective cover or the protective film can protect the light guide element 210 and the second reflective element 270 (eg, anti-scratch).

圖38至圖42分別是圖1之實施例的檢測裝置的其他種實施態樣的剖面示意圖,其中相同的元件以相同的標號表示,於下便不再重述。38 to 42 are schematic cross-sectional views of other implementations of the detection device of the embodiment of FIG. 1, respectively, in which the same components are denoted by the same reference numerals, and will not be described again below.

請參照圖38,檢測裝置200-3與圖37的檢測裝置200-2的主要差異如下所述。在檢測裝置200-3中,基板14、第二反射元件270、導光元件210以及第一反射元件260的其中至少一者的表面上可形成有所述多個微結構MS,以增加光束B的反射量,使光束B更均勻。圖38示意性繪示第一反射元件260遠離基板14的表面上形成有多個微結構MS,但不以此為限。在另一實施例中,基板14配置上述元件以外的區域上可形成所述多個微結構MS。導光元件210的頂面212上可形成所述多個微結構MS,且第二反射元件270配置在所述多個微結構MS的至少部分上。第二反射元件270面向基板14的表面或遠離基板14的表面上可形成所述多個微結構MS。Referring to FIG. 38, the main differences between the detection device 200-3 and the detection device 200-2 of FIG. 37 are as follows. In the detection device 200-3, the plurality of microstructures MS may be formed on the surface of at least one of the substrate 14, the second reflective element 270, the light guide element 210, and the first reflective element 260 to increase the light beam B. The amount of reflection makes the beam B more uniform. FIG. 38 schematically illustrates that a plurality of microstructures MS are formed on a surface of the first reflective element 260 away from the substrate 14, but not limited thereto. In another embodiment, the plurality of microstructures MS may be formed on a region of the substrate 14 other than the above-mentioned elements. The plurality of microstructures MS may be formed on the top surface 212 of the light guide element 210, and the second reflective element 270 is disposed on at least a part of the plurality of microstructures MS. The plurality of microstructures MS may be formed on a surface of the second reflective element 270 facing the substrate 14 or a surface remote from the substrate 14.

補充說明的是,所述多個微結構MS可以是全面性或者部分配置在上述元件上,且所述多個微結構MS可以連續或間隔配置的方式配置在上述元件上。此外,在本新型的任一個可行實施例中,所述多個微結構MS也可以採取部分貼合的方式配置在第一反射元件260或者是第二反射元件270上。例如,所述多個微結構MS與第一反射元件260(或第二反射元件270)之間可透過環形的黏著層(未繪示)貼合,其中環形的黏著層位於所述多個微結構MS的一部分與第一反射元件260(或第二反射元件270)的一部分之間,且所述多個微結構MS的另一部分與第一反射元件260(或第二反射元件270)的另一部分之間未設置黏著層,使得所述多個微結構MS、環形的黏著層以及第一反射元件260(或第二反射元件270)圍設出空氣間隙層(未繪示)。It is added that the plurality of microstructure MSs may be arranged on the above elements in a comprehensive or partial manner, and the plurality of microstructure MSs may be arranged on the above elements in a continuous or spaced manner. In addition, in any feasible embodiment of the present invention, the plurality of microstructures MS may also be disposed on the first reflective element 260 or the second reflective element 270 in a partially bonded manner. For example, the plurality of microstructures MS and the first reflective element 260 (or the second reflective element 270) may be bonded through a ring-shaped adhesive layer (not shown), wherein the ring-shaped adhesive layer is located on the plurality of micro-structures. Between a part of the structure MS and a part of the first reflective element 260 (or the second reflective element 270), and another part of the plurality of microstructures MS and another of the first reflective element 260 (or the second reflective element 270) An adhesive layer is not provided between one part, so that the plurality of microstructures MS, the annular adhesive layer, and the first reflective element 260 (or the second reflective element 270) surround an air gap layer (not shown).

在圖38的架構下,檢測裝置200-3可進一步包括配置在導光元件210以及第二反射元件270上的保護蓋板(未繪示)或保護膜(未繪示)。相關的描述請參照前述相關段落,於此便不再重述。Under the framework of FIG. 38, the detection device 200-3 may further include a protective cover (not shown) or a protective film (not shown) disposed on the light guide element 210 and the second reflective element 270. For related descriptions, please refer to the aforementioned related paragraphs, and will not be repeated here.

請參照圖39,檢測裝置200-4與圖37的檢測裝置200-2的主要差異如下所述。在檢測裝置200-4中,第一反射元件260包括間隔排列的多個反射部262,且第二反射元件270包括間隔排列的多個反射部272。具體地,第一反射元件260以及第二反射元件270各自可由一個以上的反射部(如反射片或反射層)組成。當反射元件由多個反射部組成時,這些反射部可以間隔排列。所述間隔排列可以包括等間距排列以及不等間距排列(散亂分布)的情況。在另一實施例中,第一反射元件260與第二反射元件270僅其中一者包括間隔排列的多個反射部。Referring to FIG. 39, the main differences between the detection device 200-4 and the detection device 200-2 of FIG. 37 are as follows. In the detection device 200-4, the first reflective element 260 includes a plurality of reflective portions 262 arranged at intervals, and the second reflective element 270 includes a plurality of reflective portions 272 arranged at intervals. Specifically, each of the first reflective element 260 and the second reflective element 270 may be composed of more than one reflective portion (such as a reflective sheet or a reflective layer). When the reflecting element is composed of a plurality of reflecting portions, the reflecting portions may be arranged at intervals. The interval arrangement may include a case of an equally spaced arrangement and an unevenly spaced arrangement (scattered distribution). In another embodiment, only one of the first reflective element 260 and the second reflective element 270 includes a plurality of reflective portions arranged at intervals.

在圖39的架構下,檢測裝置200-4可進一步包括配置在導光元件210以及第二反射元件270上的保護蓋板(未繪示)或保護膜(未繪示)。此外,基板14、第一反射元件260(反射部262)、導光元件210以及第二反射元件270(反射部272)的其中至少一者的表面上可形成多個微結構MS(參見圖38)。相關的描述請參照前述相關段落,於此便不再重述。Under the framework of FIG. 39, the detection device 200-4 may further include a protective cover (not shown) or a protective film (not shown) disposed on the light guide element 210 and the second reflective element 270. In addition, a plurality of microstructures MS may be formed on the surface of at least one of the substrate 14, the first reflection element 260 (the reflection portion 262), the light guide element 210, and the second reflection element 270 (the reflection portion 272) (see FIG. 38). ). For related descriptions, please refer to the aforementioned related paragraphs, and will not be repeated here.

請參照圖40,檢測裝置200-5與圖37的檢測裝置200-2的主要差異如下所述。在檢測裝置200-5中,檢測裝置200-5進一步包括配置在感測元件240上且位於導光元件210與感測元件240之間的空間濾波元件30。空間濾波元件30適於準直化傳遞至感測元件240的光束。在另一實施例中,空間濾波元件30也可替換成光柵(grating)。此外,空間濾波元件30與光柵可透過黏著層(未繪示)或固定機構(未繪示)固定在感測元件240上。或者,空間濾波元件30可替換成申請人在先申請的美國專利申請號15/151,471或中國專利申請號201810194406.6所描述的光纖陣列。Referring to FIG. 40, the main differences between the detection device 200-5 and the detection device 200-2 of FIG. 37 are as follows. In the detection device 200-5, the detection device 200-5 further includes a spatial filter element 30 disposed on the sensing element 240 and located between the light guide element 210 and the sensing element 240. The spatial filter element 30 is adapted to collimate the light beam passed to the sensing element 240. In another embodiment, the spatial filtering element 30 may be replaced with a grating. In addition, the spatial filter element 30 and the grating can be fixed on the sensing element 240 through an adhesive layer (not shown) or a fixing mechanism (not shown). Alternatively, the spatial filtering element 30 may be replaced with a fiber array described in the applicant's earlier application, US Patent Application No. 15 / 151,471 or Chinese Patent Application No. 201810194406.6.

在圖40的架構下,檢測裝置200-5可進一步包括配置在導光元件210以及第二反射元件270上的保護蓋板(未繪示)或保護膜(未繪示)。此外,基板14、第一反射元件260、導光元件210以及第二反射元件270的其中至少一者的表面上可形成多個微結構MS(參見圖38)。另外,第一反射元件260與第二反射元件270的其中至少一者可包括間隔排列的多個反射部(參見圖39)。相關的描述請參照前述相關段落,於此便不再重述。Under the structure of FIG. 40, the detection device 200-5 may further include a protective cover (not shown) or a protective film (not shown) disposed on the light guide element 210 and the second reflective element 270. In addition, a plurality of microstructures MS may be formed on the surface of at least one of the substrate 14, the first reflective element 260, the light guide element 210, and the second reflective element 270 (see FIG. 38). In addition, at least one of the first reflective element 260 and the second reflective element 270 may include a plurality of reflective portions arranged at intervals (see FIG. 39). For related descriptions, please refer to the aforementioned related paragraphs, and will not be repeated here.

請參照圖41,檢測裝置200-6與圖37的檢測裝置200-2的主要差異如下所述。在檢測裝置200-6中,檢測裝置200-6進一步包括牆體結構40。牆體結構40配置在基板14上,其中牆體結構40與基板14形成容納發光元件230、感測元件240、遮光物20以及第一反射元件260的容置空間AS。在一實施例中,牆體結構40與基板14可以是一體成型。舉例而言,牆體結構40與基板14可以是由一基底材質移除一凹槽形成,其中凹槽移除前所佔據的空間即容置空間AS。在另一實施例中,牆體結構40可以是透過機構件或黏著層(未繪示)而固定在基板14上,且牆體結構40與基板14可具有相同或相異的材質。此外,牆體結構40也可以如上述的實施例所提到,表面塗布有吸光材料。Please refer to FIG. 41. The main differences between the detection device 200-6 and the detection device 200-2 of FIG. 37 are as follows. In the detection device 200-6, the detection device 200-6 further includes a wall structure 40. The wall structure 40 is disposed on the substrate 14, and the wall structure 40 and the substrate 14 form an accommodating space AS accommodating the light emitting element 230, the sensing element 240, the shade 20, and the first reflective element 260. In one embodiment, the wall structure 40 and the substrate 14 may be integrally formed. For example, the wall structure 40 and the substrate 14 may be formed by removing a groove from a base material, wherein the space occupied before the groove is removed is the accommodation space AS. In another embodiment, the wall structure 40 may be fixed on the substrate 14 through a mechanism or an adhesive layer (not shown), and the wall structure 40 and the substrate 14 may have the same or different materials. In addition, the wall structure 40 may also be coated with a light absorbing material on the surface as mentioned in the above embodiment.

在圖41的架構下,檢測裝置200-6可進一步包括配置在導光元件210以及第二反射元件270上的保護蓋板(未繪示)或保護膜(未繪示)。此外,基板14、第一反射元件260、導光元件210以及第二反射元件270的其中至少一者的表面上可形成多個微結構MS(參見圖38)。另外,第一反射元件260與第二反射元件270的其中至少一者可包括間隔排列的多個反射部(參見圖39)。再者,檢測裝置200-6可進一步包括配置在感測元件240上且位於導光元件210與感測元件240之間的空間濾波元件30(參見圖40)、光柵或光纖陣列(描述於申請人在先申請的美國專利申請號15/151,471)。相關的描述請參照前述相關段落,於此便不再重述。Under the framework of FIG. 41, the detection device 200-6 may further include a protective cover (not shown) or a protective film (not shown) disposed on the light guide element 210 and the second reflective element 270. In addition, a plurality of microstructures MS may be formed on the surface of at least one of the substrate 14, the first reflective element 260, the light guide element 210, and the second reflective element 270 (see FIG. 38). In addition, at least one of the first reflective element 260 and the second reflective element 270 may include a plurality of reflective portions arranged at intervals (see FIG. 39). Furthermore, the detection device 200-6 may further include a spatial filter element 30 (see FIG. 40), a grating or an optical fiber array (described in the application) disposed on the sensing element 240 and located between the light guide element 210 and the sensing element 240. U.S. Patent Application No. 15 / 151,471, previously filed). For related descriptions, please refer to the aforementioned related paragraphs, and will not be repeated here.

請參照圖42,檢測裝置200-7與圖41的檢測裝置200-6的主要差異如下所述。在檢測裝置200-7中,檢測裝置200-7進一步包括透光蓋體TC。透光蓋體TC配置在導光元件210上並覆蓋發光元件230、感測元件240、遮光物20、第一反射元件260、連接線CL1、連接線CL2以及牆體結構40。此外,第二反射元件270配置在透光蓋體TC上。Please refer to FIG. 42. The main differences between the detection device 200-7 and the detection device 200-6 in FIG. 41 are as follows. In the detection device 200-7, the detection device 200-7 further includes a transparent cover TC. The translucent cover TC is disposed on the light guide element 210 and covers the light emitting element 230, the sensing element 240, the light shield 20, the first reflective element 260, the connection line CL1, the connection line CL2, and the wall structure 40. The second reflecting element 270 is disposed on the light-transmitting cover TC.

透光蓋體TC具有灌膠孔TC1以及抽真空孔TC2。灌膠孔TC1適於填充形成導光元件210的透光膠體,而抽真空孔TC2適於與抽真空裝置連接,以在填充透光膠體時抽出容置空間AS中的氣體。The transparent cover TC has a glue filling hole TC1 and a vacuum evacuation hole TC2. The glue-filling hole TC1 is suitable for filling the light-transmitting colloid forming the light-guiding element 210, and the vacuum-pumping hole TC2 is suitable for connecting with the vacuum-extracting device to extract the gas in the accommodation space AS when the light-transmitting colloid is filled.

在本實施例中,透光蓋體TC還包覆牆體結構40的側壁面S112S,且灌膠孔TC1以及抽真空孔TC2分別形成在透光蓋體TC包覆牆體結構40的側壁面S112S的部分中。牆體結構40包括第一通孔TCH1以及第二通孔TCH2。第一通孔TCH1以及第二通孔TCH2分別形成在牆體結構40位於基板14兩對側的部分中,其中第一通孔TCH1與灌膠孔TC1連接,且第二通孔TCH2與抽真空孔TC2連接。然而,本新型不以此為限。灌膠孔TC1以及抽真空孔TC2可形成在透光蓋體TC位於基板14上的部分,如此,牆體結構40可以不用形成第一通孔TCH1以及第二通孔TCH2。In this embodiment, the transparent cover TC also covers the side wall surface S112S of the wall structure 40, and the filling hole TC1 and the evacuation hole TC2 are respectively formed on the side wall surface of the transparent cover TC to cover the wall structure 40. S112S. The wall structure 40 includes a first through hole TCH1 and a second through hole TCH2. The first through-hole TCH1 and the second through-hole TCH2 are formed in portions of the wall structure 40 on the two opposite sides of the substrate 14, respectively. The first through-hole TCH1 is connected to the filling hole TC1, and the second through-hole TCH2 is evacuated. Hole TC2 is connected. However, the new model is not limited to this. The glue filling hole TC1 and the evacuation hole TC2 may be formed on a portion of the light-transmitting cover TC on the substrate 14, so that the wall structure 40 may not need to form the first through hole TCH1 and the second through hole TCH2.

在圖42的架構下,檢測裝置200-7可進一步包括配置在透光蓋體TC以及第二反射元件270上的保護蓋板(未繪示)或保護膜(未繪示)。此外,基板14、第一反射元件260、導光元件210以及第二反射元件270的其中至少一者的表面上可形成多個微結構MS(參見圖38)。另外,第一反射元件260與第二反射元件270的其中至少一者可包括間隔排列的多個反射部(參見圖39)。再者,檢測裝置200-7可進一步包括配置在感測元件240上且位於導光元件210與感測元件240之間的空間濾波元件30(參見圖40)、光柵或光纖陣列(描述於申請人在先申請的美國專利申請號15/151,471,或中國專利申請號201810194406.6)。相關的描述請參照前述相關段落,於此便不再重述。In the framework of FIG. 42, the detection device 200-7 may further include a protective cover (not shown) or a protective film (not shown) disposed on the light-transmitting cover TC and the second reflective element 270. In addition, a plurality of microstructures MS may be formed on the surface of at least one of the substrate 14, the first reflective element 260, the light guide element 210, and the second reflective element 270 (see FIG. 38). In addition, at least one of the first reflective element 260 and the second reflective element 270 may include a plurality of reflective portions arranged at intervals (see FIG. 39). Furthermore, the detection device 200-7 may further include a spatial filtering element 30 (see FIG. 40), a grating or a fiber array (described in the application) disposed on the sensing element 240 and located between the light guide element 210 and the sensing element 240. (U.S. Patent Application No. 15 / 151,471 or Chinese Patent Application No. 201810194406.6). For related descriptions, please refer to the aforementioned related paragraphs, and will not be repeated here.

圖43是本新型一實施例的檢測裝置的一種實施態樣的剖面示意圖。請參照圖43,檢測裝置200-8相似於圖37的檢測裝置200-2,其中相同的元件以相同的標號表示,於下便不再重述。檢測裝置200-8與圖37的檢測裝置200-2的主要差異如下所述。在檢測裝置200-8中,檢測裝置200-8進一步包括透光基座70。透光基座70配置在基板14上且覆蓋遮光物20。FIG. 43 is a schematic cross-sectional view of an embodiment of a detection device according to an embodiment of the present invention. Referring to FIG. 43, the detection device 200-8 is similar to the detection device 200-2 in FIG. 37, in which the same components are denoted by the same reference numerals, and will not be described again below. The main differences between the detection device 200-8 and the detection device 200-2 of FIG. 37 are as follows. In the detection device 200-8, the detection device 200-8 further includes a light transmitting base 70. The light-transmitting base 70 is disposed on the substrate 14 and covers the light-shielding object 20.

在本實施例中,透光基座70是罩設遮光物20的透光殼體,且透光殼體與基板14形成容納遮光物20的封閉空間CS。遮光物20可以不填滿封閉空間CS,也就是說,遮光物20與透光殼體之間可存在間隙。所述間隙可以填充用以固定遮光物20與透光殼體的黏著材料,但不以此為限。在另一實施例中,透光基座70可以是藉由電鍍、印刷、蝕刻、黏貼以及塗佈其中至少一者的方式形成在遮光物20的側壁面及頂面上的透光層,且所述透光層可以由一層以上的透光材料製作而成。In the present embodiment, the light-transmitting base 70 is a light-transmitting casing covering the light-shielding object 20, and the light-transmitting casing and the substrate 14 form a closed space CS that accommodates the light-shielding object 20. The shade 20 may not fill the closed space CS, that is, there may be a gap between the shade 20 and the transparent case. The gap may be filled with an adhesive material for fixing the light-shielding object 20 and the light-transmitting casing, but is not limited thereto. In another embodiment, the light-transmitting base 70 may be a light-transmitting layer formed on a side wall surface and a top surface of the light-shielding object 20 by at least one of electroplating, printing, etching, pasting, and coating, and The light-transmitting layer may be made of more than one layer of light-transmitting material.

在本實施例中,透光基座70不覆蓋第一反射元件260,也就是說,透光基座70不與第一反射元件260重疊,但不以此為限。在另一實施例中,透光基座70可覆蓋第一反射元件260之鄰近透光基座70的部分,使得透光基座70與第一反射元件260部分重疊。In this embodiment, the transparent base 70 does not cover the first reflective element 260, that is, the transparent base 70 does not overlap the first reflective element 260, but it is not limited thereto. In another embodiment, the transparent base 70 may cover a portion of the first reflective element 260 adjacent to the transparent base 70 such that the transparent base 70 partially overlaps the first reflective element 260.

第二反射元件270配置在透光基座70的頂面S210T上,其中第二反射元件270的頂面S170T可與導光元件210的頂面212齊平。也就是說,第二反射元件270的頂面S170T與導光元件210的頂面212具有相同高度,但不以此為限。在另一實施例中,第二反射元件270的頂面S170T可低於導光元件210的頂面212,且導光元件210可進一步覆蓋第二反射元件270及位於第二反射元件270下的透光基座70。The second reflection element 270 is disposed on the top surface S210T of the light-transmitting base 70, and the top surface S170T of the second reflection element 270 may be flush with the top surface 212 of the light guide element 210. That is, the top surface S170T of the second reflective element 270 and the top surface 212 of the light guide element 210 have the same height, but not limited thereto. In another embodiment, the top surface S170T of the second reflection element 270 may be lower than the top surface 212 of the light guide element 210, and the light guide element 210 may further cover the second reflection element 270 and the second reflection element 270. Transparent base 70.

在圖43的架構下,檢測裝置200-8可進一步包括配置在導光元件210以及第二反射元件270上的保護蓋板(未繪示)或保護膜(未繪示)。此外,基板14、第一反射元件260、導光元件210以及第二反射元件270的其中至少一者的表面上可形成多個微結構MS(參見圖38)。另外,第一反射元件260與第二反射元件270的其中至少一者可包括間隔排列的多個反射部(參見圖39)。再者,檢測裝置200-8可進一步包括配置在感測元件240上且位於導光元件210與感測元件240之間的空間濾波元件30(參見圖40)、光柵或光纖陣列(描述於申請人在先申請的美國專利申請號15/151,471)。又再者,檢測裝置200-8可進一步包括牆體結構40(參見圖41)。相關的描述請參照前述相關段落,於此便不再重述。Under the architecture of FIG. 43, the detection device 200-8 may further include a protective cover (not shown) or a protective film (not shown) disposed on the light guide element 210 and the second reflective element 270. In addition, a plurality of microstructures MS may be formed on the surface of at least one of the substrate 14, the first reflective element 260, the light guide element 210, and the second reflective element 270 (see FIG. 38). In addition, at least one of the first reflective element 260 and the second reflective element 270 may include a plurality of reflective portions arranged at intervals (see FIG. 39). Furthermore, the detection device 200-8 may further include a spatial filtering element 30 (see FIG. 40), a grating or a fiber array (described in the application) disposed on the sensing element 240 and located between the light guide element 210 and the sensing element 240. U.S. Patent Application No. 15 / 151,471, previously filed). Furthermore, the detection device 200-8 may further include a wall structure 40 (see FIG. 41). For related descriptions, please refer to the aforementioned related paragraphs, and will not be repeated here.

圖44是本新型一實施例的檢測裝置的另一種實施態樣的剖面示意圖。請參照圖44,檢測裝置200-9相似於圖43的檢測裝置200-8,其中相同的元件以相同的標號表示,於下便不再重述。檢測裝置200-9與圖43的檢測裝置200-8的主要差異如下所述。在檢測裝置200-9中,檢測裝置200-9進一步包括牆體結構40以及透光蓋體TC。牆體結構40以及透光蓋體TC的相關的描述請參照前述相關段落,於此便不再重述。FIG. 44 is a schematic cross-sectional view of another embodiment of a detection device according to an embodiment of the present invention. Referring to FIG. 44, the detection device 200-9 is similar to the detection device 200-8 of FIG. 43, in which the same components are denoted by the same reference numerals, and will not be described again below. The main differences between the detection device 200-9 and the detection device 200-8 of FIG. 43 are as follows. In the detection device 200-9, the detection device 200-9 further includes a wall structure 40 and a transparent cover TC. For related descriptions of the wall structure 40 and the transparent cover TC, please refer to the aforementioned related paragraphs, and will not be repeated here.

在圖44的架構下,透光蓋體TC可以保護位於下方的導光元件210以及第二反射元件270,因此可以不用額外設置保護蓋板或保護膜。此外,基板14、第一反射元件260、導光元件210以及第二反射元件270的其中至少一者的表面上可形成多個微結構MS(參見圖38)。另外,第一反射元件260與第二反射元件270的其中至少一者可包括間隔排列的多個反射部(參見圖39)。再者,檢測裝置200-9可進一步包括配置在感測元件240上且位於導光元件210與感測元件240之間的空間濾波元件30(參見圖40)、光柵或光纖陣列(描述於申請人在先申請的美國專利申請號15/151,471)。相關的描述請參照前述相關段落,於此便不再重述。In the structure of FIG. 44, the light-transmitting cover TC can protect the light guide element 210 and the second reflection element 270 located underneath. Therefore, it is not necessary to provide a protective cover or a protective film. In addition, a plurality of microstructures MS may be formed on the surface of at least one of the substrate 14, the first reflective element 260, the light guide element 210, and the second reflective element 270 (see FIG. 38). In addition, at least one of the first reflective element 260 and the second reflective element 270 may include a plurality of reflective portions arranged at intervals (see FIG. 39). Furthermore, the detection device 200-9 may further include a spatial filter element 30 (see FIG. 40), a grating or a fiber array (described in the application) disposed on the sensing element 240 and located between the light guide element 210 and the sensing element 240. U.S. Patent Application No. 15 / 151,471, previously filed). For related descriptions, please refer to the aforementioned related paragraphs, and will not be repeated here.

圖45是本新型一實施例的檢測裝置的一種實施態樣的剖面示意圖。請參照圖45,檢測裝置200-10相似於圖37的檢測裝置200-2,其中相同的元件以相同的標號表示,於下便不再重述。檢測裝置200-10與圖37的檢測裝置200-2的主要差異如下所述。在檢測裝置200-10中,未配置圖7的第二反射元件270。在此架構下,傳遞至導光元件210的頂面212的光束B的一部份經由內部反射而傳遞至第一反射元件260。具體地,當導光元件210的厚度T160落在0.3 mm到1.8 mm的範圍內時,傳遞至導光元件210的頂面212且具有不大於45度的角度(指光束B與頂面212所夾的角度)的光束B的部份可以藉由頂面212與第二反射元件270之間的多次反射而傳遞至感測元件240,而傳遞至導光元件210的頂面212且具有大於45度的角度(指光束B與頂面212所夾的角度)的光束的其餘部份經由折射而射出導光元件210。FIG. 45 is a schematic cross-sectional view of an embodiment of a detection device according to an embodiment of the present invention. Please refer to FIG. 45. The detection device 200-10 is similar to the detection device 200-2 in FIG. 37, in which the same components are denoted by the same reference numerals, and will not be described again below. The main differences between the detection device 200-10 and the detection device 200-2 of FIG. 37 are as follows. In the detection device 200-10, the second reflection element 270 of FIG. 7 is not arranged. Under this architecture, a part of the light beam B transmitted to the top surface 212 of the light guide element 210 is transmitted to the first reflective element 260 through internal reflection. Specifically, when the thickness T160 of the light guide element 210 falls within a range of 0.3 mm to 1.8 mm, the light guide element 210 is transmitted to the top surface 212 of the light guide element 210 and has an angle not greater than 45 degrees (referred to by the light beam B and the top surface 212). Part of the light beam B can be transmitted to the sensing element 240 through multiple reflections between the top surface 212 and the second reflecting element 270, and transmitted to the top surface 212 of the light guide element 210 and having a length greater than The rest of the light beam at an angle of 45 degrees (referring to the angle between the light beam B and the top surface 212) exits the light guide element 210 through refraction.

圖46是本新型一實施例的檢測裝置的另一種實施態樣的剖面示意圖。請參照圖46,檢測裝置200-11相似於圖45的檢測裝置200-10,其中相同的元件以相同的標號表示,於下便不再重述。檢測裝置200-11與圖45的檢測裝置200-10的主要差異如下所述。在檢測裝置200-11中,檢測裝置200-11進一步包括透光蓋體TC。透光蓋體TC適於保護位於其下的元件。此外,透光蓋體TC允許光束通過,以使來自發光元件的光束可以依序通過導光元件210以及透光蓋體TC,並傳遞至接觸透光蓋體TC的待測物,且被待測物反射的光束可依序通過透光蓋體TC以及導光元件210而傳遞至感測元件240。舉例而言,透光蓋體TC為玻璃蓋板,但不以此為限。在透光蓋體TC配置於導光元件210上且覆蓋發光元件230、感測元件240、遮光物20、第一反射元件260以及連接線CL1、CL2的架構下,導光元件210以及透光蓋體TC的總厚度TT落在0.3 mm到1.8 mm的範圍內,以利內部反射的形成,使得來自發光元件230的光束的至少一部份可以傳遞至接觸透光蓋體TC的待測物然後再傳遞至感測元件240。FIG. 46 is a schematic cross-sectional view of another embodiment of a detection device according to an embodiment of the present invention. Referring to FIG. 46, the detection device 200-11 is similar to the detection device 200-10 of FIG. 45, in which the same components are denoted by the same reference numerals, and will not be described again below. The main differences between the detection device 200-11 and the detection device 200-10 of FIG. 45 are as follows. In the detection device 200-11, the detection device 200-11 further includes a transparent cover TC. The light-transmitting cover TC is suitable for protecting an element located below it. In addition, the transparent cover TC allows the light beam to pass, so that the light beam from the light emitting element can sequentially pass through the light guide element 210 and the transparent cover TC, and is transmitted to the object to be tested that contacts the transparent cover TC, and is to be tested. The light beam reflected by the measurement object can be sequentially transmitted to the sensing element 240 through the transparent cover TC and the light guiding element 210. For example, the transparent cover TC is a glass cover, but is not limited thereto. Under the structure that the transparent cover TC is disposed on the light guide element 210 and covers the light emitting element 230, the sensing element 240, the light shield 20, the first reflective element 260, and the connection lines CL1 and CL2, the light guide element 210 and light transmittance The total thickness TT of the cover TC falls within the range of 0.3 mm to 1.8 mm to facilitate the formation of internal reflections, so that at least a part of the light beam from the light emitting element 230 can be transmitted to the object to be tested that contacts the transparent cover TC It is then transferred to the sensing element 240.

在圖45及圖46的架構下,基板14、第一反射元件260以及導光元件210的其中至少一者的表面上可形成多個微結構MS(參見圖38)。此外,第一反射元件260可包括間隔排列的多個反射部(參見圖39)。另外,檢測裝置200-10以及檢測裝置200-11的其中至少一者可進一步包括配置在感測元件240上且位於導光元件210與感測元件240之間的空間濾波元件30(參見圖40)、光柵或多個各自以不同角度傾斜排成的光纖陣列或者是準直元件等等(或描述於申請人先前申請的美國專利申請號15/151,471或15/989,123)。再者,檢測裝置200-10以及檢測裝置200-11的其中至少一者可進一步包括配置於基板14上的牆體結構40(參見圖41)。相關的描述請參照前述相關段落,於此便不再重述。45 and 46, a plurality of microstructures MS can be formed on the surface of at least one of the substrate 14, the first reflective element 260, and the light guide element 210 (see FIG. 38). In addition, the first reflective element 260 may include a plurality of reflective portions arranged at intervals (see FIG. 39). In addition, at least one of the detection device 200-10 and the detection device 200-11 may further include a spatial filter element 30 (see FIG. 40) disposed on the sensing element 240 and located between the light guide element 210 and the sensing element 240 (see FIG. 40). ), A grating or a plurality of optical fiber arrays or collimating elements arranged obliquely at different angles, etc. (or described in the applicant's previously applied US patent application number 15 / 151,471 or 15 / 989,123). Furthermore, at least one of the detection devices 200-10 and 200-11 may further include a wall structure 40 (see FIG. 41) disposed on the substrate 14. For related descriptions, please refer to the aforementioned related paragraphs, and will not be repeated here.

此外,檢測裝置200-2~200-11均包括各自的表面電漿共振(Surface Plasmon Resonance)層SPR。檢測裝置200-2~200-11之表面電漿共振層SPR的功能與前述檢測裝置200之表面電漿共振層SPR的功能相同,於此便不再重述。In addition, the detection devices 200-2 to 200-11 each include a respective surface plasma resonance (Surface Plasmon Resonance) layer SPR. The functions of the surface plasma resonance layer SPR of the detection devices 200-2 to 200-11 are the same as the functions of the surface plasma resonance layer SPR of the detection device 200 described above, and will not be repeated here.

圖47A至圖47B分別為本新型一實施例的檢測裝置的上視及剖面示意圖,其中圖47A為沿圖47B的剖線A-A’的剖面示意圖,圖47B省略圖47A的表面電漿共振層SPR。請參照圖47A至圖47B,檢測裝置200-12適於擷取待測物10的生物特徵。在本實施例中,待測物10例如為手指,且生物特徵例如為指紋或靜脈,但不以此為限。舉例而言,在另一實施例中,待測物10也可為手掌,且生物特徵可為掌紋。47A to 47B are schematic top and cross-sectional views of a detection device according to an embodiment of the present invention, wherein FIG. 47A is a schematic cross-sectional view taken along section line AA ′ of FIG. 47B, and FIG. 47B omits the surface plasma resonance of FIG. 47A. Layer SPR. Referring to FIGS. 47A to 47B, the detection device 200-12 is adapted to capture the biological characteristics of the object 10 to be measured. In this embodiment, the test object 10 is, for example, a finger, and the biological characteristic is, for example, a fingerprint or a vein, but is not limited thereto. For example, in another embodiment, the object under test 10 may also be a palm, and the biological feature may be a palm print.

檢測裝置200-12包括基板14、多個發光元件230、感測元件240以及導光元件210。The detection device 200-12 includes a substrate 14, a plurality of light emitting elements 230, a sensing element 240, and a light guiding element 210.

為增加檢測裝置200-12的封裝結構的使用性,可於基板14中設置金屬環MR。金屬環MR位於基板14的上表面與下表面之間且環繞感測元件240的感測區。藉此,當待測物10按壓在導光元件210上時,即可通過感應起電的方式使裝置開始運作,而檢測裝置200-12的封裝結構可於未使用時進入暫時停止狀態,以達到節能省電的功效。In order to increase the usability of the packaging structure of the detection device 200-12, a metal ring MR may be provided in the substrate 14. The metal ring MR is located between the upper surface and the lower surface of the substrate 14 and surrounds the sensing area of the sensing element 240. Thereby, when the object under test 10 is pressed on the light guide element 210, the device can be started to operate by inductive electrification, and the packaging structure of the detection device 200-12 can be temporarily stopped when not in use, so that To achieve the effect of energy saving.

多個發光元件230設置於基板14上並與基板14電性連接。各發光元件230具有出光面230a。各發光元件230的出光面230a朝向待測物10發出光束L。The plurality of light emitting elements 230 are disposed on the substrate 14 and are electrically connected to the substrate 14. Each light emitting element 230 has a light emitting surface 230a. The light-emitting surface 230 a of each light-emitting element 230 emits a light beam L toward the test object 10.

感測元件240設置於基板14上並與基板14電性連接。此外,感測元件240位於多個發光元件230旁,用以接收光束L被待測物10反射的部分(即帶有指紋圖案資訊的反射光束L’)。The sensing element 240 is disposed on the substrate 14 and is electrically connected to the substrate 14. In addition, the sensing element 240 is located beside the plurality of light-emitting elements 230 and is configured to receive a portion of the light beam L reflected by the object 10 (that is, the reflected light beam L 'with fingerprint pattern information).

在一實施例中,感測元件240內可整合有脈寬調變電路。藉由脈寬調變電路控制發光元件230的發光時間與感測元件240的取像時間,使發光元件230的發光時間與感測元件240的取像時間同步,可達到精確控制的效果,但不以此為限。In one embodiment, a pulse width modulation circuit may be integrated in the sensing element 240. By controlling the light emitting time of the light emitting element 230 and the image capturing time of the sensing element 240 by the pulse width modulation circuit, the light emitting time of the light emitting element 230 is synchronized with the image capturing time of the sensing element 240, so that the effect of precise control can be achieved. But not limited to this.

導光元件210設置於基板14上並覆蓋感測元件240以及多個發光元件230。導光元件210例如為矽膠、樹脂、光學膠、環氧樹脂(Epoxy)等透光膠體經由升溫製程或照光製程固化而成。因此導光元件210除了可以防止靜電破壞以保護內部所覆蓋的感測元件240以及多個發光元件230,還可以讓多個發光元件230所發出的光束L以及待測物10所反射的光束L’穿透。The light guide element 210 is disposed on the substrate 14 and covers the sensing element 240 and the plurality of light emitting elements 230. The light guide element 210 is made of, for example, a silicone, a resin, an optical adhesive, an epoxy (Epoxy), or the like through a heating process or a light curing process. Therefore, in addition to preventing electrostatic damage to protect the sensing element 240 and the plurality of light-emitting elements 230, the light guide element 210 can also allow the light beams L emitted by the plurality of light-emitting elements 230 and the light beam L reflected by the object 10 to be measured. 'penetrate.

導光元件210相對感測元件240的一側具有至少一溝槽215,且至少一溝槽215位於感測元件240與多個發光元件230之間。在本實施例中,多個發光元件230位於感測元件240的兩對側,且導光元件210包括兩條溝槽215,但不以此為限。The light guide element 210 has at least one groove 215 on a side opposite to the sensing element 240, and the at least one groove 215 is located between the sensing element 240 and the plurality of light emitting elements 230. In this embodiment, the plurality of light-emitting elements 230 are located on two opposite sides of the sensing element 240, and the light-guiding element 210 includes two grooves 215, but is not limited thereto.

在本實施例中,溝槽215的深度Y3小於導光元件210的厚度H4,意即符合H3<H4。也就是說,溝槽215不用貫穿導光元件210,因此便於製作。In this embodiment, the depth Y3 of the trench 215 is smaller than the thickness H4 of the light guide element 210, which means that H3 <H4 is satisfied. In other words, the trench 215 does not need to penetrate the light guide element 210, and thus is easy to fabricate.

在本實施例中,各溝槽215為長條狀的V型溝槽,且各溝槽215具有兩個斜面215a。可藉由調整溝槽215的兩個斜面215a中較鄰近所對應的多個發光元件230的斜面215a與導光元件210相對於感測元件240的表面(如待測物10的觸碰面)所夾的角度的補角θ,以具有理想的光利用率。舉例而言,補角θ落在30度至45度的範圍內,且至少一溝槽215的深度Y3係依據此補角θ的大小來決定。在其他實施例中,各溝槽215的剖面形狀也可以是倒立梯形、倒立半圓形或其他形狀。所述半圓形泛指非完整圓形,而並不限於圓形的一半。In this embodiment, each groove 215 is a long V-shaped groove, and each groove 215 has two inclined surfaces 215a. The two inclined surfaces 215a of the groove 215 can be adjusted by adjusting the surfaces of the inclined surfaces 215a of the corresponding light emitting elements 230 and the light guiding element 210 opposite to the sensing element 240 (such as the touch surface of the object 10). The angle θ complements the angle θ to have an ideal light utilization efficiency. For example, the complementary angle θ falls within a range of 30 degrees to 45 degrees, and the depth Y3 of the at least one groove 215 is determined according to the magnitude of the complementary angle θ. In other embodiments, the cross-sectional shape of each groove 215 may also be an inverted trapezoid, an inverted semicircle, or other shapes. The semicircle generally refers to a non-complete circle, and is not limited to a half of the circle.

V型溝槽有助於改變光束L的行徑路徑。具體地,發光元件230所發出的光束L傳遞至溝槽215靠近發光元件230的斜面215a時,會通過靠近發光元件230的斜面215a而進入溝槽215(即射出導光元件210)。進入溝槽215的部分光束可再經由溝槽215靠近感測元件240的斜面215a進入導光元件210。藉由V型溝槽改變光束L的行徑路徑有助於避免發光元件230所發出的光束L直接照射至感測元件240,進而降低感測元件240的光干擾,並提升檢測裝置200-12的辨識能力。The V-shaped groove helps to change the path of the beam L. Specifically, when the light beam L emitted from the light emitting element 230 is transmitted to the inclined surface 215a of the trench 215 close to the light emitting element 230, it enters the trench 215 through the inclined surface 215a close to the light emitting element 230 (ie, exits the light guide element 210). Part of the light beam entering the groove 215 can enter the light guide element 210 through the inclined surface 215 a of the groove 215 close to the sensing element 240. Changing the path of the light beam L by the V-shaped groove helps to prevent the light beam L emitted by the light-emitting element 230 from directly irradiating the sensing element 240, thereby reducing the light interference of the sensing element 240, and improving the detection device 200-12. Discernment.

在本實施例中,溝槽215中的光傳遞介質為空氣,但不以此為限。在另一實施例中,溝槽215中可填充有透光材料,其中透光材料的折射率大於導光元件210的折射率,以較佳避免發光元件230所發出的光束L直接照射至感測元件240。所述透光材料為高折射率的透光材料,例如為可藉由光固化或熱固化的光學膠,但不以此為限。In this embodiment, the light transmission medium in the trench 215 is air, but it is not limited thereto. In another embodiment, the trench 215 may be filled with a light-transmitting material, wherein the refractive index of the light-transmitting material is greater than the refractive index of the light guide element 210 to better prevent the light beam L emitted by the light-emitting element 230 from directly irradiating the light.测 Element 240. The light-transmitting material is a light-transmitting material with a high refractive index, such as an optical adhesive that can be cured by light or heat, but is not limited thereto.

另外,還可使感測元件240的厚度H2小於發光元件230的厚度H1,也就是使發光元件230的出光面230a高於感測元件240的光接收面240a,以進一步降低光干擾。感測元件240的厚度H2指感測元件240的感光面132至基板14的距離,而發光元件230的厚度H1指發光元件230的出光面230a至基板14的距離。In addition, the thickness H2 of the sensing element 240 can be made smaller than the thickness H1 of the light emitting element 230, that is, the light emitting surface 230a of the light emitting element 230 is higher than the light receiving surface 240a of the sensing element 240 to further reduce light interference. The thickness H2 of the sensing element 240 refers to the distance from the photosensitive surface 132 of the sensing element 240 to the substrate 14, and the thickness H1 of the light emitting element 230 refers to the distance from the light emitting surface 230 a of the light emitting element 230 to the substrate 14.

使感測元件240的厚度H2小於發光元件230的厚度H1的方法可以是改變上述各元件(感測元件240以及發光元件230)本身的厚度。或者,在上述各元件與基板14之間設置有其他膜層的情況下,可調整所述其他膜層的厚度,以使感測元件240的厚度H2小於發光元件230的厚度H1。舉例而言,檢測裝置100還包括多個黏著層AD。黏著層AD分別設置位於多個發光元件230與基板14之間以及感測元件240與基板14之間。黏著層AD例如為黏著膠體或雙面膠等。各發光元件230及其下的黏著層AD的厚度總合即發光元件230的厚度H1,而感測元件240及其下的黏著層AD的厚度總合即感測元件240的厚度H2。可藉由改變各發光元件230下的黏著層AD的厚度以及感測元件240下的黏著層AD的厚度,來使感測元件240的厚度H2小於發光元件230的厚度H1。然而,在另一實施例中,感測元件240的厚度H2也可等於或大於發光元件230的厚度H1。A method for making the thickness H2 of the sensing element 240 smaller than the thickness H1 of the light emitting element 230 may be to change the thickness of each of the above elements (the sensing element 240 and the light emitting element 230). Alternatively, when other film layers are provided between the above-mentioned elements and the substrate 14, the thickness of the other film layers may be adjusted so that the thickness H2 of the sensing element 240 is smaller than the thickness H1 of the light-emitting element 230. For example, the detection device 100 further includes a plurality of adhesive layers AD. The adhesive layer AD is respectively disposed between the plurality of light emitting elements 230 and the substrate 14 and between the sensing element 240 and the substrate 14. The adhesive layer AD is, for example, an adhesive gel or a double-sided adhesive. The thickness of each light-emitting element 230 and the adhesive layer AD below it is the thickness H1 of the light-emitting element 230, and the thickness of the sensing element 240 and the adhesive layer AD below it is the thickness H2 of the sensing element 240. The thickness H2 of the sensing element 240 can be made smaller than the thickness H1 of the light-emitting element 230 by changing the thickness of the adhesive layer AD under each light-emitting element 230 and the thickness of the adhesive layer AD under the sensing element 240. However, in another embodiment, the thickness H2 of the sensing element 240 may be equal to or greater than the thickness H1 of the light emitting element 230.

在本實施例中,檢測裝置200-12還包括多條連接線CL1、CL2。連接線CL1、CL2分別連接於感測元件240與基板14之間以及多個發光元件230與基板14之間,以使感測元件240與多個發光元件230分別與基板14電性連接。多條連接線CL1、CL2的材質例如是金、銅等,但不以此為限。在另一實施例中,感測元件240與多個發光元件230也可透過焊球與基板14上的電路連接,而可省略連接線CL1、CL2。In this embodiment, the detection device 200-12 further includes a plurality of connection lines CL1 and CL2. The connecting lines CL1 and CL2 are respectively connected between the sensing element 240 and the substrate 14 and between the plurality of light emitting elements 230 and the substrate 14, so that the sensing element 240 and the plurality of light emitting elements 230 are electrically connected to the substrate 14 respectively. The material of the plurality of connecting lines CL1 and CL2 is, for example, gold, copper, etc., but is not limited thereto. In another embodiment, the sensing element 240 and the plurality of light emitting elements 230 can also be connected to the circuit on the substrate 14 through solder balls, and the connection lines CL1 and CL2 can be omitted.

本實施例的檢測裝置200-12的製作方式例如可包括以下步驟。首先,藉由多個黏著層AD將多個發光元件230及感測元件240黏貼於基板14上,其中多個發光元件230及感測元件240的高度可藉由研磨的方式進一步調整。其次,使用打線設備於基板14上形成多條連接線CL1、CL2,其中多條連接線CL1、CL2分別連接多個發光元件230的導電墊與基板14的導電墊以及連接感測元件240的導電墊與基板14的導電墊。接著,使用灌膠設備將透光膠體形成於基板14上並且覆蓋多個發光元件230、感測元件240以及多條連接線CL1、CL2。然後,透過升溫製程(如烘烤製程)或照光製程(如紫外光固化製程)固化透光膠體。最後,藉由蝕刻、雷射雕刻或其他現有的圖案化方法,在固化後的透光膠體相對於感測元件240的一側形成至少一溝槽215,從而形成導光元件210。在其他實施例中,也可以藉由模具而使導光元件210與至少一溝槽215一體成型,但本新型並不限於此。在一實施例中,可以在基板14上同時製造多個取像單元(包括發光元件230、感測元件240及導光元件210),並藉由切割製程切割出多個檢測裝置100。The manufacturing method of the detection device 200-12 of this embodiment may include, for example, the following steps. First, a plurality of light-emitting elements 230 and sensing elements 240 are adhered to the substrate 14 by a plurality of adhesive layers AD. The heights of the plurality of light-emitting elements 230 and the sensing elements 240 can be further adjusted by grinding. Secondly, a plurality of connection lines CL1 and CL2 are formed on the substrate 14 by using a wire bonding device. Among them, the plurality of connection lines CL1 and CL2 respectively connect the conductive pads of the plurality of light-emitting elements 230 with the conductive pads of the substrate 14 and the conductivity of the sensing element 240 The pad is a conductive pad with the substrate 14. Next, a translucent colloid is formed on the substrate 14 using a potting device and covers a plurality of light-emitting elements 230, a sensing element 240, and a plurality of connection lines CL1, CL2. Then, the light-transmitting colloid is cured through a heating process (such as a baking process) or a light process (such as an ultraviolet curing process). Finally, by etching, laser engraving, or other existing patterning methods, at least one groove 215 is formed on a side of the cured transparent colloid opposite to the sensing element 240 to form a light guiding element 210. In other embodiments, the light guide element 210 and the at least one groove 215 may be integrally formed by a mold, but the present invention is not limited thereto. In one embodiment, a plurality of image capturing units (including a light emitting element 230, a sensing element 240, and a light guiding element 210) can be manufactured on the substrate 14 at the same time, and a plurality of detection devices 100 are cut by a cutting process.

藉由上述的製作方式,本實施例的檢測裝置200-12可以製作為全平面的指紋辨識裝置,進而增加與其他裝置組裝的相容性。此外,藉由壓膜注膠的製作方式,本實施例的檢測裝置200-12可以被大量生產,進而降低生產成本。另外,由於導光元件210的溝槽215可以降低光干擾,因此可以省略遮光元件的設置,進而可以簡化製程步驟、減少製程所需元件並有助於縮減模組面積。With the above manufacturing method, the detection device 200-12 of this embodiment can be manufactured as a full-plane fingerprint recognition device, thereby increasing the compatibility with the assembly of other devices. In addition, by the method of laminating and injection molding, the detection device 200-12 of this embodiment can be mass-produced, thereby reducing the production cost. In addition, since the groove 215 of the light guide element 210 can reduce light interference, the setting of the light shielding element can be omitted, thereby simplifying the manufacturing steps, reducing the components required for the manufacturing process, and helping to reduce the module area.

圖48A至圖48B分別為本新型一實施例的檢測裝置的上視及剖面示意圖,其中圖48A為沿圖48B的剖線A-A’的剖面示意圖,圖48B省略圖48A的表面電漿共振層SPR。請參照圖48A及圖48B,檢測裝置200-13與圖47A的檢測裝置200-12類似。兩者的主要差異如下所述。檢測裝置200-13還包括至少一牆體結構40。至少一牆體結構40環繞感測元件240以及多個發光元件230,其中至少一牆體結構40的材料可選用與基板14相同或不同的材料,本新型並不限於此。48A to 48B are schematic top and cross-sectional views of a detection device according to an embodiment of the present invention, wherein FIG. 48A is a schematic cross-sectional view taken along section line AA ′ of FIG. 48B, and FIG. 48B omits the surface plasma resonance of FIG. 48A. Layer SPR. Referring to FIG. 48A and FIG. 48B, the detection device 200-13 is similar to the detection device 200-12 of FIG. 47A. The main differences between the two are described below. The detection device 200-13 further includes at least one wall structure 40. The at least one wall structure 40 surrounds the sensing element 240 and the plurality of light-emitting elements 230. The material of the at least one wall structure 40 may be the same as or different from the substrate 14. The present invention is not limited thereto.

在製作的過程中,牆體結構40可形成在設置感測元件240以及多個發光元件230之後且形成在導光元件210之前。或者,亦可先將基板14製作成凹槽狀,以凹槽邊緣的凸出部分作為牆體結構40。換句話說,至少一牆體結構40與基板14可為一體成型。至少一牆體結構40的設置可減少在灌入透光膠體時因加大灌膠壓力而造成連接線CL1、CL2被沖斷或感測元件240位移而失效的問題,進而有助於提升檢測裝置200-13的良率。同時,提供檢測裝置200-13較佳的結構強度。在一實施例中,可在形成導光元件210之後藉由切割製程移除牆體結構40,如此亦可形成圖47A所示的檢測裝置200-12。In the manufacturing process, the wall structure 40 may be formed after the sensing element 240 and the plurality of light emitting elements 230 are provided and before the light guide element 210. Alternatively, the substrate 14 may be first made into a groove shape, and the protruding portion at the edge of the groove is used as the wall structure 40. In other words, at least one wall structure 40 and the substrate 14 may be integrally formed. The arrangement of at least one wall structure 40 can reduce the problem that the connection lines CL1 and CL2 are broken or the sensing element 240 is lost due to the increase of the filling pressure when the light-transmitting colloid is poured, thereby helping to improve the detection. Yield of device 200-13. At the same time, a better structural strength of the detection device 200-13 is provided. In one embodiment, the wall structure 40 can be removed by a cutting process after the light guide element 210 is formed, so that the detection device 200-12 shown in FIG. 47A can also be formed.

圖49為本新型一實施例的檢測裝置的剖面示意圖。請參照圖49,檢測裝置200-15與圖47A的檢測裝置100類似。兩者的主要差異如下所述。檢測裝置200-15還包括透光蓋體TC。透光蓋體TC設置於導光元件210上並覆蓋至少一溝槽215,其中至少一溝槽215中的光傳遞介質包括空氣。透光蓋體TC的材質例如為玻璃或是透明塑膠。在一實施例中,透光蓋體TC可透過黏著層(未繪示)貼覆在導光元件210上。黏著層可以是黏著膠體或雙面膠。如此一來,可進一步增強阻隔水氣能力及保護檢測裝置200-15內部元件(如防止導光元件210刮傷)。在另一實施中,透光蓋體TC也可藉由固定機構件而固定在導光元件210上,如此便可省略黏著層。FIG. 49 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. Referring to FIG. 49, the detection device 200-15 is similar to the detection device 100 of FIG. 47A. The main differences between the two are described below. The detection device 200-15 further includes a transparent cover TC. The light-transmitting cover TC is disposed on the light guide element 210 and covers at least one groove 215. The light transmission medium in the at least one groove 215 includes air. The material of the transparent cover TC is, for example, glass or transparent plastic. In one embodiment, the transparent cover TC can be pasted on the light guide element 210 through an adhesive layer (not shown). The adhesive layer may be an adhesive gel or a double-sided adhesive. In this way, it is possible to further enhance the ability to block water vapor and protect the internal components of the detection device 200-15 (such as preventing the light guide element 210 from being scratched). In another implementation, the transparent cover TC can also be fixed to the light guide element 210 by a fixing mechanism, so that the adhesive layer can be omitted.

在圖49的架構下,檢測裝置200-15B也可進一步包括圖48A的牆體結構40。相關的描述請參照前述相關段落,於此便不再重述。In the framework of FIG. 49, the detection device 200-15B may further include the wall structure 40 of FIG. 48A. For related descriptions, please refer to the aforementioned related paragraphs, and will not be repeated here.

圖50為本新型一實施例的檢測裝置的剖面示意圖。請參照圖50,檢測裝置200-16與圖47A的檢測裝置200-12類似。兩者的主要差異如下所述。檢測裝置200-16還包括空間濾波元件30。空間濾波元件30設置於感測元件240上且位於導光元件210與感測元件240之間,用以準直化傳遞至感測元件240的光束。空間濾波元件30例如可選用針孔準直器(pinhole collimator)或者是光纖準直器(fiber collimator)。如此一來,可增加感測元件240感測被待測物反射的光束的光強度,進而提升檢測裝置200-16的辨識率。FIG. 50 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. Referring to FIG. 50, the detection device 200-16 is similar to the detection device 200-12 of FIG. 47A. The main differences between the two are described below. The detection device 200-16 further includes a spatial filter element 30. The spatial filter element 30 is disposed on the sensing element 240 and is located between the light guide element 210 and the sensing element 240 to collimate the light beam transmitted to the sensing element 240. The spatial filter element 30 may be, for example, a pinhole collimator or a fiber collimator. In this way, the light intensity of the light beam reflected by the sensing element 240 to be detected by the sensing element 240 can be increased, thereby improving the recognition rate of the detection devices 200-16.

在圖50的架構下,檢測裝置200-16也可進一步包括圖48A的牆體結構40或圖49的透光蓋體TC。相關的描述請參照前述相關段落,於此便不再重述。In the structure of FIG. 50, the detection device 200-16 may further include the wall structure 40 of FIG. 48A or the transparent cover TC of FIG. 49. For related descriptions, please refer to the aforementioned related paragraphs, and will not be repeated here.

圖51A為本新型一實施例的檢測裝置的溝槽的另一種剖面示意圖。請參照圖51,檢測裝置200-17與圖47A的檢測裝置200-12類似。兩者的主要差異如下所述。在檢測裝置200-17D中,溝槽215A的兩個頂角的角度不同。舉例而言,兩個斜面215aA中較鄰近所對應的發光元件230的斜面215aA與導光元件210相對於感測元件240的表面所夾的角度的補角為66.8度,兩個斜面215aA中較鄰近感測元件240的斜面215aA與導光元件210相對於感測元件240的表面所夾的角度的補角為32.5度,且溝槽215A的底角為90度。在其他實施例中,溝槽215A的兩個頂角的角度也可顛倒,或依據設計需求改變,而不以此為限。另外,溝槽215A的深度Y3A係依據上述角度決定。在本實施例中,溝槽215A的深度Y3A大於各發光元件230的出光面至導光元件210相對於感測元件240的表面的距離H5,但不以此為限。51A is another schematic cross-sectional view of a groove of a detection device according to an embodiment of the present invention. Referring to FIG. 51, the detection device 200-17 is similar to the detection device 200-12 of FIG. 47A. The main differences between the two are described below. In the detection device 200-17D, the angles of the two apex angles of the groove 215A are different. For example, the angle between the two inclined surfaces 215aA and 215aA adjacent to the corresponding light emitting element 230 and the surface of the light guide element 210 relative to the surface of the sensing element 240 is 66.8 degrees. The complementary angle between the inclined surface 215aA adjacent to the sensing element 240 and the angle between the light guide element 210 and the surface of the sensing element 240 is 32.5 degrees, and the bottom angle of the groove 215A is 90 degrees. In other embodiments, the angles of the two apex angles of the trench 215A may be reversed or changed according to design requirements, without being limited thereto. The depth Y3A of the trench 215A is determined based on the above-mentioned angle. In this embodiment, the depth Y3A of the trench 215A is greater than the distance H5 from the light emitting surface of each light emitting element 230 to the surface of the light guiding element 210 relative to the sensing element 240, but is not limited thereto.

在本實施例中,溝槽215A中填充有透光材料F2,此透光材料F2的折射率大於導光元件210的折射率。因此,當發光元件230所發出的光束L傳遞至溝槽215A時,部分的光束L將被鄰近發光元件230的斜面215aA全反射,而部分的光束L會通過鄰近發光元件230的斜面215aA且朝遠離感測元件240的方向傳遞。如此一來,可以避免發光元件230所發出的光束L直接照射至感測元件240,進而降低光干擾。In this embodiment, the groove 215A is filled with a light-transmitting material F2, and the refractive index of the light-transmitting material F2 is greater than the refractive index of the light guide element 210. Therefore, when the light beam L emitted from the light emitting element 230 is transmitted to the groove 215A, a part of the light beam L will be totally reflected by the inclined surface 215aA adjacent to the light emitting element 230, and a part of the light beam L will pass through the inclined surface 215aA adjacent to the light emitting element 230 and be directed toward Passing away from the sensing element 240. In this way, the light beam L emitted from the light-emitting element 230 can be prevented from being directly irradiated to the sensing element 240, thereby reducing light interference.

圖51B為本新型一實施例的檢測裝置的溝槽的又一種剖面示意圖。請參照圖51B,檢測裝置200-18與圖47A的檢測裝置200-12類似。兩者的主要差異如下所述。在檢測裝置200-18中,溝槽215B為U型溝槽。具體地,溝槽215B具有相對且相互平行的兩個側面146及底面148。依據製作方式的不同,底面148可能是平面、傾斜面或曲面。51B is another schematic cross-sectional view of a groove of a detection device according to an embodiment of the present invention. Referring to FIG. 51B, the detection device 200-18 is similar to the detection device 200-12 of FIG. 47A. The main differences between the two are described below. In the detection device 200-18, the groove 215B is a U-shaped groove. Specifically, the trench 215B has two side surfaces 146 and a bottom surface 148 that are opposite and parallel to each other. Depending on the manufacturing method, the bottom surface 148 may be a flat surface, an inclined surface, or a curved surface.

U型溝槽除了可藉由折射來改變光束的行徑路徑之外,還可利用鄰近發光元件230的側面146將傳遞至側面146的光束全內反射,使光束朝遠離感測元件240的方向傳遞。在本實施例中,溝槽215B的深度Y3B大於各發光元件230的出光面至導光元件210相對於感測元件240的表面的距離H5,以使傳遞至溝槽215B鄰近發光元件230的側面146的大部分光束在側面146經由全內反射而朝遠離感測元件240的方向傳遞。In addition to the U-shaped groove that can change the path of the beam by refraction, it can also use the side 146 adjacent to the light emitting element 230 to totally internally reflect the beam transmitted to the side 146, so that the beam is transmitted away from the sensing element 240. . In this embodiment, the depth Y3B of the trenches 215B is greater than the distance H5 from the light-emitting surface of each light-emitting element 230 to the surface of the light-guiding element 210 relative to the sensing element 240 so as to be transmitted to the side of the trench 215B adjacent to the light-emitting element 230. Most of the light beams of 146 are transmitted on the side 146 away from the sensing element 240 via total internal reflection.

在一較佳的實施例中,溝槽215B的寬度D2(如底面148的寬度D2)、溝槽215B所對應的發光元件230的其中之一至溝槽215B的距離D1以及感測元件240至溝槽215B的距離D3皆為所對應的發光元件230的其中之一至感測元件240的距離D的三分之一,但本新型不以此為限。In a preferred embodiment, the width D2 of the trench 215B (such as the width D2 of the bottom surface 148), the distance D1 from one of the light-emitting elements 230 corresponding to the trench 215B to the trench 215B, and the sensing element 240 to the trench The distance D3 of the groove 215B is one third of the distance D from one of the corresponding light-emitting elements 230 to the sensing element 240, but the present invention is not limited thereto.

在本實施例中,溝槽215B中填充有透光材料F2。透光材料F2的折射率小於導光元件210的折射率,以產生全內反射。然而,在其他實施例中,也可省略透光材料F2。In this embodiment, the trench 215B is filled with a light-transmitting material F2. The refractive index of the light-transmitting material F2 is smaller than the refractive index of the light guide element 210 to generate total internal reflection. However, in other embodiments, the light transmitting material F2 may be omitted.

圖51C至圖51D分別為本新型實施例的檢測裝置的溝槽的再兩種剖面示意圖。請參照圖51C與圖51D,檢測裝置200-19、200-20與圖47的檢測裝置200-12類似。兩者的主要差異如下所述。在檢測裝置200-19、200-20、100G中,溝槽215C、215D為倒梯形溝槽。具體地,溝槽215C(或溝槽215D)具有兩個斜面215aB(或兩個斜面215aC)及底面148。在本實施例中,檢測裝置100F、100G的倒梯形溝槽皆為倒立的等腰梯形,但不以此為限。51C to FIG. 51D are schematic cross-sectional views of two more types of grooves of the detection device according to the embodiment of the present invention. Please refer to FIG. 51C and FIG. 51D, the detection devices 200-19, 200-20 are similar to the detection device 200-12 of FIG. 47. The main differences between the two are described below. In the detection devices 200-19, 200-20, and 100G, the grooves 215C and 215D are inverted trapezoidal grooves. Specifically, the groove 215C (or the groove 215D) has two inclined surfaces 215aB (or two inclined surfaces 215aC) and a bottom surface 148. In this embodiment, the inverted trapezoidal grooves of the detection devices 100F and 100G are all inverted isosceles trapezoids, but not limited thereto.

倒梯形溝槽除了可藉由折射來改變光束的行徑路徑之外,還可利用鄰近發光元件230的斜面215aB(或斜面215aC)將傳遞至斜面215aB(或斜面215aC)的光束全內反射,使光束不會直接射到感測元件240的感測面。在檢測裝置200-19、200-20中,溝槽215C、215D的深度Y3C、H3D小於各發光元件230的出光面至導光元件210相對於感測元件240的表面的距離H5,以使傳遞至溝槽215C、215D的底面148的大部分光束在底面148經由全內反射而轉向,從而不會直接射到感測元件240的感測面(如圖53A所示)。In addition to the inverted trapezoidal groove, which can change the path of the light beam by refraction, the inclined beam 215aB (or inclined plane 215aC) adjacent to the light emitting element 230 can be used to totally internally reflect the light beam transmitted to the inclined plane 215aB (or inclined plane 215aC) so The light beam does not directly hit the sensing surface of the sensing element 240. In the detection devices 200-19, 200-20, the depths Y3C, H3D of the grooves 215C, 215D are smaller than the distance H5 from the light emitting surface of each light emitting element 230 to the surface of the light guide element 210 with respect to the sensing element 240, so that the transmission Most of the light beams to the bottom surface 148 of the grooves 215C, 215D are turned on the bottom surface 148 via total internal reflection, so that they do not directly hit the sensing surface of the sensing element 240 (as shown in FIG. 53A).

在本實施例中,溝槽215C、215D中填充有透光材料F3,其中透光材料F3的折射率小於導光元件210的折射率,以產生全內反射。In this embodiment, the grooves 215C and 215D are filled with a light-transmitting material F3, wherein the refractive index of the light-transmitting material F3 is smaller than the refractive index of the light guide element 210 to generate total internal reflection.

此外,檢測裝置200-12~200-20均包括各自的表面電漿共振(Surface Plasmon Resonance)層SPR。檢測裝置200-2~200-11之表面電漿共振層SPR的功能與前述檢測裝置200之表面電漿共振層SPR的功能相同,於此便不再重述。In addition, the detection devices 200-12 to 200-20 each include a respective surface plasma resonance (Surface Plasmon Resonance) layer SPR. The functions of the surface plasma resonance layer SPR of the detection devices 200-2 to 200-11 are the same as the functions of the surface plasma resonance layer SPR of the detection device 200 described above, and will not be repeated here.

雖然本新型已以實施例揭露如上,然其並非用以限定本新型,任何所屬技術領域中具有通常知識者,在不脫離本新型的精神和範圍內,當可作些許的更動與潤飾,故本新型的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the new model shall be determined by the scope of the attached patent application.

C1、C2、C3‧‧‧凹陷部C1, C2, C3 ‧‧‧ Depression

D、k‧‧‧距離 D, k‧‧‧ distance

D1、D2、D3‧‧‧方向 D1, D2, D3 ‧‧‧ directions

E1、E2‧‧‧出光部 E1, E2‧‧‧Light-emitting Department

α、θ、θ1、θ2、θi‧‧‧角α, θ, θ1, θ2, θ i ‧‧‧ angle

L、L’、L1、B、BB‧‧‧光束 L, L ', L1, B, BB‧‧‧ beam

II‧‧‧區域 II‧‧‧Area

F1‧‧‧物體 F1‧‧‧ Object

S120T、S140T、S1421S、S1441S、S1441C、S1444S、S131、S133A、S133B、S170T、S210T、160a、160b、160c、212、214、215a、215aA、215aB、215aC、216、216B、218、218A、218C、222、P1、146、148‧‧‧面 S120T, S140T, S1421S, S1441S, S1441C, S1444S, S131, S133A, S133B, S170T, S210T, 160a, 160b, 160c, 212, 214, 215a, 215aA, 215aB, 215aC, 216, 216B, 218, 218A, 218C, 222, P1, 146, 148‧‧‧ faces

SPR‧‧‧表面電漿共振層 SPR‧‧‧Surface Plasma Resonance Layer

P、P1~P5‧‧‧間距 P, P1 ~ P5‧‧‧Pitch

T1、T2‧‧‧厚度 T1, T2‧‧‧thickness

H、H1~H5‧‧‧厚度 H, H1 ~ H5‧‧‧thickness

1‧‧‧環境介質 1‧‧‧ environmental media

14‧‧‧基板 14‧‧‧ substrate

20‧‧‧遮光物 20‧‧‧ shade

40‧‧‧牆體結構 40‧‧‧wall structure

70‧‧‧透光基座 70‧‧‧light base

80‧‧‧生物高聚物 80‧‧‧Biopolymer

200、200~200Y、200-1~200-20‧‧‧檢測裝置 200, 200 ~ 200Y, 200-1 ~ 200-20‧‧‧ Detection device

230‧‧‧發光元件 230‧‧‧Light-emitting element

240‧‧‧感測元件 240‧‧‧ sensing element

260、260B‧‧‧反射元件 260, 260B‧‧‧Reflective element

260D、270‧‧‧反射元件 260D, 270‧‧‧Reflective element

270B、270D‧‧‧反射元件 270B, 270D‧‧‧Reflective element

280、293‧‧‧反射元件 280, 293‧‧‧Reflective elements

210‧‧‧導光元件 210‧‧‧light guide

201、202、250、G1‧‧‧光學膠 201, 202, 250, G1‧‧‧ Optical Adhesive

210-1‧‧‧厚部 210-1‧‧‧Thick part

210-2‧‧‧薄部 210-2‧‧‧ thin section

213‧‧‧內壁 213‧‧‧Inner wall

215、215A、215B、215C、215D‧‧‧溝槽 215, 215A, 215B, 215C, 215D

219‧‧‧側壁 219‧‧‧ sidewall

240a‧‧‧光接收面 240a‧‧‧ light receiving surface

262、272‧‧‧反射部 262, 272‧‧‧Reflection

266、276、MS‧‧‧微結構 266, 276, MS‧‧‧‧ microstructure

291、291a、291b、291c、291C、291D、296‧‧‧吸光元件 291, 291a, 291b, 291c, 291C, 291D, 296‧‧‧ light-absorbing element

292‧‧‧光吸收層 292‧‧‧light absorbing layer

300‧‧‧增透微結構 300‧‧‧ Anti-reflection Microstructure

300C‧‧‧頂點 300C‧‧‧ Vertex

300R‧‧‧稜線 300R‧‧‧Edge

301‧‧‧受光區 301‧‧‧light receiving area

302‧‧‧背光區 302‧‧‧ backlight area

303‧‧‧光學微結構 303‧‧‧Optical microstructure

圖1為本新型一實施例之檢測裝置的剖面示意圖。 圖2為本新型一實施例之檢測裝置的局部的示意圖。 圖3為本新型另一實施例之檢測裝置的剖面示意圖。 圖4為本新型一實施例之檢測裝置的剖面示意圖。 圖5為本新型一實施例之檢測裝置的局部的示意圖。 圖6為本新型一實施例之檢測裝置的剖面示意圖。 圖7為本新型一實施例之檢測裝置的剖面示意圖。 圖8為本新型一實施例之檢測裝置的局部的示意圖。 圖9為本新型一實施例之檢測裝置的剖面示意圖。 圖10為本新型一實施例之檢測裝置的剖面示意圖。 圖11為本新型一實施例之檢測裝置的剖面示意圖。 圖12為本新型一實施例之檢測裝置的剖面示意圖。 圖13為本新型一實施例之檢測裝置的剖面示意圖。 圖14為本新型一實施例之檢測裝置的剖面示意圖。 圖15為圖14之檢測裝置的上視示意圖。 圖16為本新型一實施例之檢測裝置的剖面示意圖。 圖17為本新型一實施例之檢測裝置的剖面示意圖。 圖18為本新型一實施例之檢測裝置的剖面示意圖。 圖19為本新型一實施例之檢測裝置的剖面示意圖。 圖20為本新型一實施例之檢測裝置的剖面示意圖。 圖21為本新型一實施例之檢測裝置的剖面示意圖。 圖22為本新型一實施例之檢測裝置的剖面示意圖。 圖23為本新型一實施例之檢測裝置的剖面示意圖。 圖24為本新型一實施例之檢測裝置的剖面示意圖。 圖25為本新型一實施例之檢測裝置的剖面示意圖。 圖26為本新型一實施例的檢測裝置的剖面示意圖。 圖27為圖26的多個增透微結構在區域II的局部放大示意圖。 圖28為本新型一實施例的導光元件的局部底視示意圖。 圖29為本新型一實施例的導光元件的局部底視示意圖。 圖30為本新型一實施例的導光元件的局部剖面示意圖。 圖31為本新型一實施例的檢測裝置的剖面示意圖。 圖32為本新型一實施例的檢測裝置的剖面示意圖。 圖33為本新型一實施例的檢測裝置的剖面示意圖。 圖34為本新型一實施例的檢測裝置的剖面示意圖。 圖35為本新型一實施例的檢測裝置的剖面示意圖。 圖36為本新型一實施例的檢測裝置的剖面示意圖。 圖37是本新型一實施例的檢測裝置的一種實施態樣的剖面示意圖。 圖38至圖42分別是圖1之實施例的檢測裝置的其他種實施態樣的剖面示意圖。 圖43是本新型一實施例的檢測裝置的一種實施態樣的剖面示意圖。 圖44是本新型一實施例的檢測裝置的另一種實施態樣的剖面示意圖。 圖45是本新型一實施例的檢測裝置的一種實施態樣的剖面示意圖。 圖46是本新型一實施例的檢測裝置的另一種實施態樣的剖面示意圖。 圖47A至圖47B分別為本新型一實施例的檢測裝置的上視及剖面示意圖。 圖48A至圖48B分別為本新型一實施例的檢測裝置的上視及剖面示意圖。 圖49為本新型一實施例的檢測裝置的剖面示意圖。 圖50為本新型一實施例的檢測裝置的剖面示意圖。 圖51A為本新型一實施例的檢測裝置的溝槽的另一種剖面示意圖。 圖51B為本新型一實施例的檢測裝置的溝槽的又一種剖面示意圖。 圖51C至圖51D分別為本新型實施例的檢測裝置的溝槽的再兩種剖面示意圖。 圖52示出被表面電漿共振層SPR反射之感測光束L的各種反射角θ及其反射率的關係。FIG. 1 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 2 is a schematic diagram of a part of a detection device according to an embodiment of the present invention. FIG. 3 is a schematic cross-sectional view of a detection device according to another embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 5 is a schematic diagram of a part of a detection device according to an embodiment of the present invention. FIG. 6 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 7 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 8 is a schematic diagram of a part of a detection device according to an embodiment of the present invention. FIG. 9 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 10 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 11 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 12 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 13 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 14 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 15 is a schematic top view of the detection device of FIG. 14. FIG. 16 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 17 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 18 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 19 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 20 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 21 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. 22 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 23 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 24 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 25 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 26 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 27 is a partially enlarged schematic view of the plurality of anti-reflection microstructures in region II in FIG. 26. FIG. 28 is a partial bottom view of a light guide element according to an embodiment of the present invention. FIG. 29 is a partial bottom view of a light guide element according to an embodiment of the present invention. FIG. 30 is a schematic partial cross-sectional view of a light guide element according to an embodiment of the present invention. FIG. 31 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 32 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 33 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 34 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 35 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 36 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. 37 is a schematic cross-sectional view of an embodiment of a detection device according to an embodiment of the present invention. 38 to 42 are schematic cross-sectional views of other embodiments of the detection device of the embodiment shown in FIG. 1, respectively. FIG. 43 is a schematic cross-sectional view of an embodiment of a detection device according to an embodiment of the present invention. FIG. 44 is a schematic cross-sectional view of another embodiment of a detection device according to an embodiment of the present invention. FIG. 45 is a schematic cross-sectional view of an embodiment of a detection device according to an embodiment of the present invention. FIG. 46 is a schematic cross-sectional view of another embodiment of a detection device according to an embodiment of the present invention. 47A to 47B are schematic top and cross-sectional views of a detection device according to an embodiment of the present invention, respectively. 48A to 48B are schematic top and cross-sectional views of a detection device according to an embodiment of the present invention, respectively. FIG. 49 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. FIG. 50 is a schematic cross-sectional view of a detection device according to an embodiment of the present invention. 51A is another schematic cross-sectional view of a groove of a detection device according to an embodiment of the present invention. 51B is another schematic cross-sectional view of a groove of a detection device according to an embodiment of the present invention. 51C to FIG. 51D are schematic cross-sectional views of two more types of grooves of the detection device according to the embodiment of the present invention. FIG. 52 shows the relationship between various reflection angles θ of the sensing light beam L reflected by the surface plasma resonance layer SPR and its reflectance.

Claims (15)

一種檢測裝置,包括: 一導光元件,包括: 一頂面;以及 一底面,相對於該頂面; 一第一反射元件,設置於該導光元件的該底面上; 一感測元件,配置於該導光元件的該底面旁; 一發光元件,用以發出一光束,其中該光束被該第一反射元件反射而傳遞至該感測元件;以及 一表面電漿共振層,設置於該導光元件上,且用以接收該生物高聚物,其中該導光元件位於該表面電漿共振層與該感測元件之間。A detection device includes: a light guiding element including: a top surface; and a bottom surface opposite to the top surface; a first reflecting element disposed on the bottom surface of the light guiding element; a sensing element configured Next to the bottom surface of the light guide element; a light emitting element for emitting a light beam, wherein the light beam is reflected by the first reflection element and transmitted to the sensing element; and a surface plasma resonance layer is disposed on the light guide element The light element is used to receive the biopolymer, wherein the light guide element is located between the surface plasma resonance layer and the sensing element. 如申請專利範圍第1項所述的檢測裝置,其中該導光元件更包括: 一入光面,連接於該頂面與該底面之間,其中該入光面與該頂面夾有一銳角α。The detection device according to item 1 of the scope of patent application, wherein the light guide element further comprises: a light incident surface connected between the top surface and the bottom surface, wherein the light incident surface and the top surface have an acute angle α . 如申請專利範圍第2項所述的檢測裝置,其中該檢測裝置位於一環境介質中,而該銳角α滿足下式(1): ---(1) ,其中θ i為該光束自該入光面射入該導光元件的角度,n 1為該環境介質的折射率,而n 2為該導光元件的折射率。 The detection device according to item 2 of the scope of patent application, wherein the detection device is located in an environmental medium, and the acute angle α satisfies the following formula (1): --- (1), where θ i is the angle at which the light beam enters the light guide element from the light incident surface, n 1 is the refractive index of the environmental medium, and n 2 is the refractive index of the light guide element. 如申請專利範圍第2項所述的檢測裝置,其中該檢測裝置位於一環境介質中,而該銳角α滿足下式(2): ---(2) ,其中θ i為該光束入射至該入光面的入射角度,n 1為該環境介質的折射率,而n 2為該導光元件的折射率。 The detection device according to item 2 of the scope of patent application, wherein the detection device is located in an environmental medium, and the acute angle α satisfies the following formula (2): --- (2), where θ i is the incident angle of the light beam incident on the light incident surface, n 1 is the refractive index of the environmental medium, and n 2 is the refractive index of the light guide element. 如申請專利範圍第1項所述的檢測裝置,更包括: 一第二反射元件,配置於該導光元件的該底面,其中該光束被該第一反射元件及該第二反射元件反射,而傳遞至該感測元件。The detection device according to item 1 of the scope of patent application, further comprising: a second reflecting element disposed on the bottom surface of the light guide element, wherein the light beam is reflected by the first reflecting element and the second reflecting element, and Passed to the sensing element. 如申請專利範圍第1項所述的檢測裝置,更包括: 一透光元件,配置於該導光元件的該頂面上; 一第一光學膠,配置於該透光元件與該導光元件的該頂面之間,該透光元件利用該第一光學膠與該導光元件的該頂面連接;以及 一第二光學膠,配置於該導光元件的該底面與該感測元件之間,該感測元件利用該第二光學膠與該導光元件的該底面連接,其中該導光元件的材質相異於該第一光學膠及/或該第二光學膠的材質。The detection device according to item 1 of the scope of patent application, further comprising: a light transmitting element disposed on the top surface of the light guiding element; a first optical glue disposed on the light transmitting element and the light guiding element Between the top surface, the light transmitting element is connected to the top surface of the light guide element using the first optical glue; and a second optical glue is disposed between the bottom surface of the light guide element and the sensing element. In the meantime, the sensing element is connected to the bottom surface of the light guide element by using the second optical glue, wherein the material of the light guide element is different from the material of the first optical glue and / or the second optical glue. 如申請專利範圍第6項所述的檢測裝置,其中該導光元件為一玻璃。The detection device according to item 6 of the scope of patent application, wherein the light guide element is a glass. 如申請專利範圍第1項所述的檢測裝置,其中該導光元件的該底面具有一出光部,且該出光部設有多個增透微結構,其中,該光束至少在該導光元件內經過至少一次全反射而形成一投向該些增透微結構的一信號光束,且該信號光束穿過該些增透微結構以投向該感測元件。The detection device according to item 1 of the patent application range, wherein the bottom mask of the light guide element has a light emitting portion, and the light emitting portion is provided with a plurality of anti-reflection microstructures, wherein the light beam is at least in the light guiding element After at least one total reflection, a signal beam is formed which is directed to the AR microstructures, and the signal beam passes through the AR structures to be projected toward the sensing element. 如申請專利範圍第8項所述的檢測裝置,其中該導光元件具有一全反射臨界角,每一該增透微結構包括一使該信號光束的入射角小於該全反射臨界角的一受光區以及一使該信號光束的入射角大於該全反射臨界角的一背光區,且該受光區的面積大於該背光區的面積。The detection device according to item 8 of the scope of patent application, wherein the light guide element has a critical angle for total reflection, and each of the anti-reflection microstructures includes a light receiving which makes the incident angle of the signal beam smaller than the critical angle for total reflection. Area and a backlight area where the incident angle of the signal beam is greater than the critical angle of total reflection, and the area of the light receiving area is larger than the area of the backlight area. 如申請專利範圍第9項所述的檢測裝置,其中每一該增透微結構為一非對稱凸柱,所述非對稱凸柱具有一稜線,該受光區和一通過該稜線的垂直參考面之間形成一第一夾角,該背光區和該垂直參考面形成一第二夾角,且該第一夾角大於該第二夾角。The detection device according to item 9 of the scope of patent application, wherein each of the anti-reflection microstructures is an asymmetric convex column, the asymmetric convex column has an edge line, the light receiving area and a vertical reference plane passing through the edge line. A first included angle is formed therebetween, the backlight region and the vertical reference plane form a second included angle, and the first included angle is greater than the second included angle. 如申請專利範圍第9項所述的檢測裝置,其中該些增透微結構排列成陣列,且每一該增透微結構為一偏心微透鏡,該偏心微透鏡具有一頂點,通過該受光區的任意一點的切面和一通過該頂點的垂直參考面之間形成一第一夾角,通過該背光區的任意一點的切面和該垂直參考面形成一第二夾角,且該第一夾角大於該第二夾角。The detection device according to item 9 of the scope of patent application, wherein the antireflection microstructures are arranged in an array, and each of the antireflection microstructures is an eccentric microlens, the eccentric microlens has a vertex and passes through the light receiving area A first included angle is formed between a cut surface at any point of the and a vertical reference plane passing through the vertex, a second included angle is formed between the cut surface at any point of the backlight region and the vertical reference plane, and the first included angle is greater than the Two angles. 如申請專利範圍第1項所述的檢測裝置,更包括: 一基板,該第一反射元件配置在該基板與該導光元件之間;以及 一遮光物,配置在該基板上且位於該發光元件與該感測元件之間,其中該第一反射元件位於該遮光物與該感測元件之間,而該導光元件覆蓋該感測元件、該發光元件、該遮光物以及該第一反射元件。The detection device according to item 1 of the scope of patent application, further comprising: a substrate, the first reflective element is disposed between the substrate and the light guide element; and a light-shielding object is disposed on the substrate and located on the light-emitting element. Between the element and the sensing element, wherein the first reflecting element is located between the light blocking object and the sensing element, and the light guiding element covers the sensing element, the light emitting element, the light blocking object and the first reflection element. 如申請專利範圍第1項所述的檢測裝置,其中該第一反射元件以及該導光元件的其中至少一者的表面上形成有多個微結構。The detection device according to item 1 of the scope of patent application, wherein a plurality of microstructures are formed on a surface of at least one of the first reflection element and the light guide element. 如申請專利範圍第1項所述的檢測裝置,其中該第一反射元件包括間隔排列的多個反射部。The detection device according to item 1 of the patent application scope, wherein the first reflective element includes a plurality of reflective portions arranged at intervals. 如申請專利範圍第1項所述的檢測裝置,更包括: 一基板,其中該導光元件、該第一反射元件、該感測元件及該發光元件設置於該基板上; 多條連接線,分別連接於該基板與該感測元件之間以及該基板與該發光元件之間;以及 一牆體結構,配置在該基板上,其中該牆體結構與該基板形成容納該發光元件、該感測元件以及該第一反射元件的一容置空間。The detection device according to item 1 of the scope of patent application, further comprising: a substrate, wherein the light guide element, the first reflection element, the sensing element, and the light emitting element are disposed on the substrate; a plurality of connection lines, Respectively connected between the substrate and the sensing element and between the substrate and the light-emitting element; and a wall structure arranged on the substrate, wherein the wall structure and the substrate form to accommodate the light-emitting element, the sensor An accommodating space of the measuring element and the first reflecting element.
TW107208814U 2017-06-29 2018-06-29 Testing device TWM572985U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI688891B (en) * 2019-03-04 2020-03-21 友達光電股份有限公司 Fingerprint identification apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI688891B (en) * 2019-03-04 2020-03-21 友達光電股份有限公司 Fingerprint identification apparatus

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