CN204118128U - A kind of surface attaching type LED - Google Patents
A kind of surface attaching type LED Download PDFInfo
- Publication number
- CN204118128U CN204118128U CN201420360200.3U CN201420360200U CN204118128U CN 204118128 U CN204118128 U CN 204118128U CN 201420360200 U CN201420360200 U CN 201420360200U CN 204118128 U CN204118128 U CN 204118128U
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- CN
- China
- Prior art keywords
- color chips
- color
- utility
- type led
- blue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- 241000218202 Coptis Species 0.000 claims abstract description 8
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 8
- 239000000084 colloidal system Substances 0.000 claims abstract description 5
- 238000012856 packing Methods 0.000 claims abstract description 5
- 230000007423 decrease Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000002950 deficient Effects 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of surface attaching type LED, comprising: the PPA support that white surface brush is black; Crystal-bonding adhesive; Three color chips on described PPA support are pasted onto by described crystal-bonding adhesive; Wherein, described three color chips are red, green, blue three color chip; Described three color chips are connected by gold thread with described PPA support; Described three color chips and described gold thread are encapsulated in packing colloid; It is characterized in that, described red, green, blue three color chip adopts the circuit structure of positive electrode altogether; Pin configuration adopts four embedded pins.Three color chips of the present utility model adopt the circuit structure of positive electrode altogether namely to reduce dead lamp probability, reduce the fraction defective of product, decrease the quantity of external pin simultaneously, improve production efficiency.
Description
Technical field
The utility model relates to LED light source encapsulation technology field, relates to a kind of surface attaching type LED in particular.
Background technology
At present, LED (light-emitting diode) application widely, due to the structure of the full-color surface attaching type LED employing red, green, blue three color chip circuit laid out in parallel that prior art provides, this circuit structure easily causes the dead lamp of LED to lose efficacy in LED application, and efficiency comparison is low in LED bonding wire production process, and the product of this circuit structure adopts the structure of six pins, efficiency comparison is low in process of production, workload is large, and production cost is higher, and when applying, welding efficiency is low.Therefore, how providing a kind of circuit structure simple surface attaching type LED, is current those skilled in the art's urgent problem.
Utility model content
In view of this, the utility model provides a kind of surface attaching type LED, can simplify pin configuration and the circuit connecting mode of pasting type LED.
In order to realize above-mentioned functions, the utility model provides following technical scheme:
A kind of surface attaching type LED, comprising: the PPA support that white surface brush is black; Crystal-bonding adhesive; Three color chips on described PPA support are pasted onto by described crystal-bonding adhesive; Wherein, described three color chips are red, green, blue three color chip; Described three color chips are connected by gold thread with described PPA support; Described three color chips and described gold thread are encapsulated in packing colloid; It is characterized in that, described red, green, blue three color chip adopts the circuit structure of positive electrode altogether; Pin configuration adopts four embedded pins.
Preferably, in above-mentioned a kind of surface attaching type LED, also comprising described PPA support entire length is 2.8 millimeters, and width is 2.8 millimeters, is highly 2.45 millimeters.
Known via above-mentioned technical scheme, compared with prior art, the utility model focuses on red, green, blue three color chips adopt positive electrode circuit structure altogether, this structure can reduce the dead lamp rate of LED, the light on and off of three color chips are independent of each other, structure due to common positive electrode is also corresponding decreases external pin count, three color chips of original technology adopt parallel construction arrangement, dead lamp is very easily caused to lose efficacy, and external pin count is 6, namely the utility model reduces dead lamp probability, decrease the quantity of external pin simultaneously, adopt stability embedded four pin configuration preferably.
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail simultaneously.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiment of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the accompanying drawing provided.
Fig. 1 accompanying drawing is the Facad structure schematic diagram of pasting type LED in background technology.
Fig. 2 accompanying drawing is the three color chip circuit structure diagrams of pasting type LED in background technology.
Fig. 3 accompanying drawing is Facad structure schematic diagram of the present utility model.
Fig. 4 accompanying drawing is structure schematic diagram of the present utility model.
Fig. 5 accompanying drawing is three color chip circuit structure diagrams of the present utility model.
In figure: 101-PPA support; 102-gold thread; 103-luminescence chip; 104-crystal-bonding adhesive; 105-packing colloid; 106-pin; A-length; B-width.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
The utility model embodiment discloses a kind of surface attaching type LED, achieves the object that three color chip internal circuit configurations are simplified, pin configuration is simplified more.
To achieve these goals, following technical scheme is provided:
Please refer to Fig. 1-5: a kind of surface attaching type LED, comprising: the PPA support 101 that white surface brush is black; Crystal-bonding adhesive 104; Three color chips 103 on PPA support 101 are pasted onto by crystal-bonding adhesive 104; Wherein, three color chips 103 are red, green, blue three color chip; Three color chips 103 are connected by gold thread 102 with PPA support 101; Three color chips 103 and gold thread 102 are encapsulated in packing colloid 105; It is characterized in that, red, green, blue three color chip 103 adopts the circuit structure of positive electrode altogether; Pin 106 structure adopts four embedded pins 106, focus on red, green, blue three color chip and adopt positive electrode circuit structure altogether, this structure can reduce the dead lamp rate of LED, the light on and off of three color chips are independent of each other, structure due to common positive electrode is also corresponding decreases external pin count, it focuses on red, green, blue three color chip and adopts positive electrode circuit structure altogether, this structure can reduce the dead lamp rate of LED, the light on and off of three color chips are independent of each other, structure due to common positive electrode is also corresponding decreases external pin count, improves production efficiency.
In order to optimize technique scheme further, in a kind of surface attaching type LED described in above-described embodiment, also comprising PPA support entire length a is 2.8 millimeters, and width b is 2.8 millimeters, is highly 2.45 millimeters.
Known via above-mentioned technical scheme, compared with prior art, the utility model focuses on red, green, blue three color chips adopt positive electrode circuit structure altogether, this structure can reduce the dead lamp rate of LED, the light on and off of three color chips are independent of each other, structure due to common positive electrode is also corresponding decreases external pin count, three color chips of original technology adopt parallel construction arrangement, dead lamp is very easily caused to lose efficacy, and external pin count is 6, namely the utility model reduces dead lamp probability, reduce the fraction defective of product, decrease the quantity of external pin simultaneously, improve production efficiency.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually see.For device disclosed in embodiment, because it corresponds to the method disclosed in Example, so description is fairly simple, relevant part illustrates see method part.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein when not departing from spirit or scope of the present utility model, can realize in other embodiments.Therefore, the utility model can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (2)
1. a surface attaching type LED, comprising: the PPA support (101) that white surface brush is black; Crystal-bonding adhesive (104); Three color chips (103) on described PPA support (101) are pasted onto by described crystal-bonding adhesive (104); Wherein, described three color chips (103) are red, green, blue three color chip; Described three color chips (103) are connected by gold thread (102) with described PPA support (101); Described three color chips and described gold thread are encapsulated in packing colloid (105); It is characterized in that, described red, green, blue three color chip (103) adopts the circuit structure of positive electrode altogether; Pin (106) structure adopts four embedded pins (106).
2. a kind of surface attaching type LED according to claim 1, is characterized in that, described PPA support (101) entire length (a) is 2.8 millimeters, and width (b) is 2.8 millimeters, is highly 2.45 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420360200.3U CN204118128U (en) | 2014-07-02 | 2014-07-02 | A kind of surface attaching type LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420360200.3U CN204118128U (en) | 2014-07-02 | 2014-07-02 | A kind of surface attaching type LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204118128U true CN204118128U (en) | 2015-01-21 |
Family
ID=52335414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420360200.3U Expired - Lifetime CN204118128U (en) | 2014-07-02 | 2014-07-02 | A kind of surface attaching type LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204118128U (en) |
-
2014
- 2014-07-02 CN CN201420360200.3U patent/CN204118128U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170808 Address after: Suzhou City, Jiangsu province 215600 Zhangjiagang City North Guotai Road East Patentee after: SUZHOU KINGLIGHT OPTOELECTRONICS CO.,LTD. Address before: 518000, Guangdong, Baoan District, Fuyong Shenzhen Street (west side of Fu Garden Road) run Heng Industrial plant 4, plant third, fourth, fifth floor Patentee before: SHENZHEN JINGTAI Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20150121 |