CN204067425U - A kind of clearing of improvement/count pipe encapsulating structure - Google Patents
A kind of clearing of improvement/count pipe encapsulating structure Download PDFInfo
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- CN204067425U CN204067425U CN201420435276.8U CN201420435276U CN204067425U CN 204067425 U CN204067425 U CN 204067425U CN 201420435276 U CN201420435276 U CN 201420435276U CN 204067425 U CN204067425 U CN 204067425U
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- clearing
- encapsulating structure
- insulation
- transmission element
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Abstract
A kind of clearing of improvement/count pipe encapsulating structure; comprise lead portion, be located at the signal element portion in described lead portion and the pipe cap portion for the protection of described signal element portion; described pipe cap portion comprises the insulation-encapsulated body sealing coated described signal element portion, and described insulation-encapsulated body top is also provided with hard transmission element.The utility model structure is simple, easy to use, described insulation-encapsulated body replaces traditional pipe cap completely, simplify production process thus enhance productivity, reduce costs input, described hard transmission element also makes described clearing/count wear-resisting and extend its useful life to pipe while guarantee translucent effect, and product serviceability is also better.
Description
Technical field
The utility model relates to infrared signal diode technologies field, the clearing of specifically a kind of improvement/count pipe encapsulating structure.
Background technology
The clearing be made up of infrared transmitting tube and photosensitive receiving tube/count is mainly used in all kinds of electromechanical equipment to pipe, as paper money counter, mahjong machine, remote controller etc.After the clearing of current production/count is generally pedestal die bond, bonding wire encapsulation to tubular construction, on pedestal, suit has light transmission function pipe cap, technology tradition and ripe relatively, but total cost is higher, and having sealing cap operation, sealing cap product confrontation product quality reliability and data consistency affect very large.As application number a kind of metallic support infrared emission photosensitive disclosed in the patent document of 200920115417.7 receives photoelectric device, namely there is the defect that structure is comparatively complicated, production efficiency is low, cost is higher.
Utility model content
Technical purpose of the present utility model is to provide a kind of clearing of improvement/count pipe encapsulating structure, solves complex structure, production efficiency is low, cost is higher problem.
Concrete technical scheme of the present utility model is as follows: a kind of clearing of improvement/count pipe encapsulating structure; comprise lead portion, be located at the signal element portion in described lead portion and the pipe cap portion for the protection of described signal element portion; described pipe cap portion comprises the insulation-encapsulated body sealing coated described signal element portion, and described insulation-encapsulated body top is also provided with hard transmission element.
Infrared photosensitive diode package structure is in the past encapsulating layer coated signal element portion added metal cap bag, relative complex in structure, and the encapsulating structure that the utility model proposes is an encapsulating encapsulated moulding, described insulation-encapsulated body is also aforesaid encapsulating layer, replace metal cap bag in the past completely, the top of described insulation-encapsulated body is also combined with described hard transmission element simultaneously, infrared signal is guaranteed normal by described hard transmission element or is strengthened transmitting-receiving effect, and described hard transmission element also can stand the friction of colliding with in use procedure, play wear-resisting and effect that is that increase the service life.Described hard transmission element can be glass blocks or crystal block or quartz wedge.
As preferably, described hard transmission element comprises the joint portion that is coated in described insulation-encapsulated body and is placed on the external exposed division of described insulation-encapsulated.
As preferably, the surface of described exposed division is arc burnishing surface.
As preferably, the surface of the described joint portion of described hard transmission element is burnishing surface.
As preferably, the surface of the described joint portion of described hard transmission element is curved surface.
Described insulation-encapsulated body generally adopts the materials such as epoxy resin, if whole described pipe cap portion all adopts insulation-encapsulated body, its head can cannot stand the medium-term and long-term frictionally damage of use procedure and affect product quality and effect, described exposed division by the partial denudation of described hard transmission element outside, the arc burnishing surface of described exposed division ensure that the outgoing effect of infrared light on the one hand, on the other hand also because of the quality and effect of the described diode package structure of the wear-resisting guarantee of itself material.Described burnishing surface or described curved surface all can be determined according to product service condition, and described curved surface can be the curved surface that raises up or to lower convexity curved surface or there is the curved surface of complex outline, object is to carry out secondary light-distribution to exited signal as required, makes infrared signal shooting angle have controllability.
As preferably, the bottom of described insulation-encapsulated body has base ring.
As preferably, described base ring has the mark part being used to indicate described lead portion positive-negative polarity.
Described mark part points out that respective side is described positive pole pin or described negative pole pin, facilitates post-production packaging and the practical operation of product.
As preferably, described lead portion comprises positive pole pin and negative pole pin, and the top of described positive pole pin and described negative pole pin is corresponding is respectively provided with positive pole end block and negative pole end block, described negative pole end block has the accommodation seat for installing described signal element portion.
Described accommodation seat can for ease of the bowl-shape of optically focused or the platform-like being convenient to Signal reception.
As preferably, described accommodation seat has conductive elargol, described signal element portion is fixed on described elargol, is connected with conductive connecting between described signal element portion and described positive pole end block.
As preferably, between described hard transmission element and described signal element portion, there is spacing.
Described spacing is determined according to the performance of actual product, and different technological parameters determines different spacing.
Technological merit of the present utility model is that the structure of the infrared signal pipe encapsulating structure of described improvement is simple, easy to use, described insulation-encapsulated body replaces traditional pipe cap completely, simplify production process thus enhance productivity, reduce costs input, described hard transmission element also makes described infrared signal diode wear-resisting and extends its useful life while guarantee translucent effect, and product serviceability is also better.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model embodiment one;
Fig. 2 is the structural representation of the utility model embodiment two;
Fig. 3 is the structural representation of the utility model embodiment three;
Fig. 4 is part A structural representation total in embodiment one, embodiment two and embodiment three;
Number corresponding each toponym in figure to be respectively: 1-insulation-encapsulated body, 11-base ring, 12-mark part, 2-hard transmission element, 3-positive pole pin, 31-positive pole end block, 4-negative pole pin, 41-negative pole end block, 42-accommodation seat, 43-elargol, 5-conductive connecting.
Embodiment
Below in conjunction with accompanying drawing, by specific embodiment, the utility model is described in further detail:
Embodiment one: see Fig. 1, Fig. 4; a kind of clearing of improvement/count pipe encapsulating structure; comprise lead portion, be located at the signal element portion in lead portion and the pipe cap portion for the protection of signal element portion; pipe cap portion comprises the insulation-encapsulated body 1 sealing coated signal element portion; insulation-encapsulated body 1 top is also provided with hard transmission element 2, and described hard transmission element 2 can be glass blocks or crystal block or quartz wedge.Infrared photosensitive diode package structure is in the past encapsulating layer coated signal element portion added metal cap bag; relative complex in structure; and the encapsulating structure that the utility model proposes is an encapsulating encapsulated moulding; insulation-encapsulated body 1 is also aforesaid encapsulating layer; replace metal cap bag in the past completely; the top of insulation-encapsulated body 1 is also combined with hard transmission element 2 simultaneously; infrared signal is guaranteed normal by hard transmission element 2 or is strengthened transmitting-receiving effect; and hard transmission element 2 also can stand the friction of colliding with in use procedure, play wear-resisting and effect that is that increase the service life.
Hard transmission element 2 comprises the joint portion be coated in insulation-encapsulated body 1 and the exposed division be placed on outside insulation-encapsulated body 1, and the surface of exposed division is arc burnishing surface, and the surface of the joint portion of hard transmission element 2 is burnishing surface.The bottom of insulation-encapsulated body 1 has base ring 11, base ring 11 has the mark part being used to indicate lead portion positive-negative polarity.Insulation-encapsulated body 1 generally adopts the materials such as epoxy resin, if whole pipe cap portion all adopts insulation-encapsulated body 1, its head can cannot stand the medium-term and long-term frictionally damage of use procedure and affect product quality and effect, exposed division by the partial denudation of hard transmission element 2 outside, the arc burnishing surface of exposed division ensure that the outgoing effect of infrared light on the one hand, on the other hand also because of the quality and effect of the wear-resisting guarantee diode package structure of itself material.
Lead portion comprises positive pole pin 3 and negative pole pin 4, and the top of positive pole pin 3 and negative pole pin 4 is corresponding is respectively provided with positive pole end block 31 and negative pole end block 41, negative pole end block 41 has the accommodation seat 42 for installing signal element portion.Accommodation seat 42 can for ease of the bowl-shape of optically focused or the platform-like being convenient to Signal reception.Accommodation seat 42 has conductive elargol 43, signal element portion is fixed on elargol 43, is connected with conductive connecting 5 between signal element portion and positive pole end block 31.There is spacing between hard transmission element 2 and signal element portion, the technological parameter adopted when spacing is and makes, can determine according to different production requirement, ensures the performance variation of product.
Embodiment two: see Fig. 2, Fig. 4; a kind of clearing of improvement/count pipe encapsulating structure; comprise lead portion, be located at the signal element portion in lead portion and the pipe cap portion for the protection of signal element portion; pipe cap portion comprises the insulation-encapsulated body 1 sealing coated signal element portion; insulation-encapsulated body 1 top is also provided with hard transmission element 2, and described hard transmission element 2 can be glass blocks or crystal block or quartz wedge.Infrared photosensitive diode package structure is in the past encapsulating layer coated signal element portion added metal cap bag; relative complex in structure; and the encapsulating structure that the utility model proposes is an encapsulating encapsulated moulding; insulation-encapsulated body 1 is also aforesaid encapsulating layer; replace metal cap bag in the past completely; the top of insulation-encapsulated body 1 is also combined with hard transmission element 2 simultaneously; infrared signal is guaranteed normal by hard transmission element 2 or is strengthened transmitting-receiving effect; and hard transmission element 2 also can stand the friction of colliding with in use procedure, play wear-resisting and effect that is that increase the service life.
Hard transmission element 2 comprises the joint portion be coated in insulation-encapsulated body 1 and the exposed division be placed on outside insulation-encapsulated body 1, and the surface of exposed division is arc burnishing surface, and the surface of the joint portion of hard transmission element 2 is curved surface, and this curved surface is the curved surface to lower convexity.The bottom of insulation-encapsulated body 1 has base ring 11, base ring 11 has the mark part being used to indicate lead portion positive-negative polarity.Insulation-encapsulated body 1 generally adopts the materials such as epoxy resin, if whole pipe cap portion all adopts insulation-encapsulated body 1, its head can cannot stand the medium-term and long-term frictionally damage of use procedure and affect product quality and effect, exposed division by the partial denudation of hard transmission element 2 outside, the arc burnishing surface of exposed division ensure that the outgoing effect of infrared light on the one hand, on the other hand also because of the quality and effect of the wear-resisting guarantee diode package structure of itself material.
Lead portion comprises positive pole pin 3 and negative pole pin 4, and the top of positive pole pin 3 and negative pole pin 4 is corresponding is respectively provided with positive pole end block 31 and negative pole end block 41, negative pole end block 41 has the accommodation seat 42 for installing signal element portion.Accommodation seat 42 can for ease of the bowl-shape of optically focused or the platform-like being convenient to Signal reception.Accommodation seat 42 has conductive elargol 43, signal element portion is fixed on elargol 43, is connected with conductive connecting 5 between signal element portion and positive pole end block 31.There is spacing between hard transmission element 2 and signal element portion, the technological parameter adopted when spacing is and makes, can determine according to different production requirement, ensures the performance variation of product.
Embodiment three: see Fig. 3, Fig. 4; a kind of clearing of improvement/count pipe encapsulating structure; comprise lead portion, be located at the signal element portion in lead portion and the pipe cap portion for the protection of signal element portion; pipe cap portion comprises the insulation-encapsulated body 1 sealing coated signal element portion; insulation-encapsulated body 1 top is also provided with hard transmission element 2, and described hard transmission element 2 can be glass blocks or crystal block or quartz wedge.Infrared photosensitive diode package structure is in the past encapsulating layer coated signal element portion added metal cap bag; relative complex in structure; and the encapsulating structure that the utility model proposes is an encapsulating encapsulated moulding; insulation-encapsulated body 1 is also aforesaid encapsulating layer; replace metal cap bag in the past completely; the top of insulation-encapsulated body 1 is also combined with hard transmission element 2 simultaneously; infrared signal is guaranteed normal by hard transmission element 2 or is strengthened transmitting-receiving effect; and hard transmission element 2 also can stand the friction of colliding with in use procedure, play wear-resisting and effect that is that increase the service life.
Hard transmission element 2 comprises the joint portion be coated in insulation-encapsulated body 1 and the exposed division be placed on outside insulation-encapsulated body 1, and the surface of exposed division is arc burnishing surface, and the surface of the joint portion of hard transmission element 2 is curved surface, and this curved surface is the curved surface raised up.The bottom of insulation-encapsulated body 1 has base ring 11, base ring 11 has the mark part being used to indicate lead portion positive-negative polarity.Insulation-encapsulated body 1 generally adopts the materials such as epoxy resin, if whole pipe cap portion all adopts insulation-encapsulated body 1, its head can cannot stand the medium-term and long-term frictionally damage of use procedure and affect product quality and effect, exposed division by the partial denudation of hard transmission element 2 outside, the arc burnishing surface of exposed division ensure that the outgoing effect of infrared light on the one hand, on the other hand also because of the quality and effect of the wear-resisting guarantee diode package structure of itself material.
Lead portion comprises positive pole pin 3 and negative pole pin 4, and the top of positive pole pin 3 and negative pole pin 4 is corresponding is respectively provided with positive pole end block 31 and negative pole end block 41, negative pole end block 41 has the accommodation seat 42 for installing signal element portion.Accommodation seat 42 can for ease of the bowl-shape of optically focused or the platform-like being convenient to Signal reception.Accommodation seat 42 has conductive elargol 43, signal element portion is fixed on elargol 43, is connected with conductive connecting 5 between signal element portion and positive pole end block 31.There is spacing between hard transmission element 2 and signal element portion, the technological parameter adopted when spacing is and makes, can determine according to different production requirement, ensures the performance variation of product.
Claims (10)
1. the clearing/count pipe encapsulating structure improved; comprise lead portion, be located at the signal element portion in described lead portion and the pipe cap body for the protection of described signal element portion; it is characterized in that: described pipe cap body comprises the insulation-encapsulated body (1) of the printing opacity sealing coated described signal element portion, described insulation-encapsulated body (1) top is also provided with hard transmission element (2).
2. the clearing/count pipe encapsulating structure of a kind of improvement according to claim 1, is characterized in that: described hard transmission element (2) comprises the joint portion that is coated in described insulation-encapsulated body (1) and is placed on described insulation-encapsulated body (1) exposed division outward.
3. the clearing/count pipe encapsulating structure of a kind of improvement according to claim 2, is characterized in that: the surface of the described exposed division of described hard transmission element (2) is arc burnishing surface.
4. the clearing/count pipe encapsulating structure of a kind of improvement according to claim 2, is characterized in that: the surface of the described joint portion of described hard transmission element (2) is burnishing surface.
5. the clearing/count pipe encapsulating structure of a kind of improvement according to claim 2, is characterized in that: the surface of the described joint portion of described hard transmission element (2) is curved surface.
6. the clearing/count pipe encapsulating structure of a kind of improvement according to claim 1, is characterized in that: the bottom of described insulation-encapsulated body (1) has base ring (11).
7. the clearing/count pipe encapsulating structure of a kind of improvement according to claim 6, is characterized in that: described base ring (11) has the mark part (12) being used to indicate described lead portion positive-negative polarity.
8. the clearing/count pipe encapsulating structure of a kind of improvement according to claim 1, it is characterized in that: described lead portion comprises positive pole pin (3) and negative pole pin (4), the top of described positive pole pin (3) and described negative pole pin (4) is corresponding is respectively provided with positive pole end block (31) and negative pole end block (41), described negative pole end block (41) has the accommodation seat (42) for installing described signal element portion.
9. the clearing/count pipe encapsulating structure of a kind of improvement according to claim 8, it is characterized in that: described accommodation seat (42) has conductive elargol (43), described signal element portion is fixed on described elargol (43), is connected with conductive connecting (5) between described signal element portion and described positive pole end block (31).
10. the clearing/count pipe encapsulating structure of a kind of improvement according to claim 1, is characterized in that: there is spacing between described hard transmission element (2) and described signal element portion.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420435276.8U CN204067425U (en) | 2014-08-04 | 2014-08-04 | A kind of clearing of improvement/count pipe encapsulating structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420435276.8U CN204067425U (en) | 2014-08-04 | 2014-08-04 | A kind of clearing of improvement/count pipe encapsulating structure |
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| CN204067425U true CN204067425U (en) | 2014-12-31 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107389136A (en) * | 2017-08-28 | 2017-11-24 | 浙江沃得尔科技股份有限公司 | A kind of inlet manifold sensor construction |
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- 2014-08-04 CN CN201420435276.8U patent/CN204067425U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107389136A (en) * | 2017-08-28 | 2017-11-24 | 浙江沃得尔科技股份有限公司 | A kind of inlet manifold sensor construction |
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