CN107389136A - A kind of inlet manifold sensor construction - Google Patents
A kind of inlet manifold sensor construction Download PDFInfo
- Publication number
- CN107389136A CN107389136A CN201710748211.7A CN201710748211A CN107389136A CN 107389136 A CN107389136 A CN 107389136A CN 201710748211 A CN201710748211 A CN 201710748211A CN 107389136 A CN107389136 A CN 107389136A
- Authority
- CN
- China
- Prior art keywords
- pressure
- mounting surface
- cover plate
- inlet manifold
- sensing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
Abstract
The present invention relates to a kind of mounting structure of sensor.A kind of inlet manifold sensor construction, including housing, mounting surface is provided with housing, air-flow guiding pipe is connected with below mounting surface, pressure-sensing device is provided with mounting surface, pressure-sensing device is located at the side of the air stream outlet of air-flow guiding pipe, the sensing mouth of pressure-sensing device is upward, cover plate is provided with the top of pressure-sensing device and air stream outlet, cover plate is fixed on mounting surface using an encapsulating, closed installation cavity is formed between cover plate and mounting surface.The invention provides a kind of packaging technology is simple, it is only necessary to a dispensing, reduces assembly technology, improves production efficiency, can effectively meet the pressure limit of Client application and a kind of inlet manifold sensor construction of precision index；It is complicated to solve packaging technology present in prior art, installation step is more, and process equipment is more, it is necessary to multiple dispensing, the technical problem of production cycle length.
Description
Technical field
The present invention relates to a kind of mounting structure of sensor, more particularly to a kind of sensor knot in inlet manifold
Structure.
Background technology
Inlet manifold is a main parts size of automobile engine, needs to install pressure-sensing device in inlet manifold
And temperature-sensing element (device), to test the pressure and temperature of the air-flow entered in inlet manifold.At present, the pressure in automobile engine
Force sensitive element overall package, typically it is packaged by the way of metal shell, its weak point is that the cost of metal is high, added
Work long flow path (needing machining, electroplating processes), outward appearance are easily damaged, corrosion-resistant.The sealing of normal pressures sensing element
It is to be compressed by the sealing ring between pressure ring and housing, the sealing ring compression between terminal and housing comes close to sensor progress
Envelope.Assembly technology requires high, and difficulty is big, and flow is cumbersome, and cost is high.In existing patent document, disclose：Chinese patent
" a kind of motor intake manifold pressure-sensing device (CN106033017A) ", its upper cover body and lower cover be integral molded plastic into
The junction of the working of plastics of type, upper cover body and lower cover, which is provided with, applies the first Baltimore groove that epoxy resin is sealed；Upper cover body
It is provided with side wall and positioned at the part that four terminals stretch out the second Baltimore groove for applying epoxy resin and being sealed；Have on lower cover
Air inlet；Two pins of thermistor connect with terminal MAT, terminal GND respectively；Circuit board assembly includes circuit board and fixation
In pressure chip IC thereon, pressure chip IC the 2nd pin connects with terminal 5V, pressure chip IC the 6th pin, the 8th pin and end
Sub- GND connects, and the pin of pressure chip IC the 7th connect with terminal Vout.But because pressure-sensing device is located at forced draft import
End, therefore, the connecting line of temperature-sensing element (device) usually needs to open up new mounting hole to dispose line, complex process.And press
The sensing mouth down of force sensitive element, apply epoxy resin and it sealed in the top of pressure-sensing device, for assembly technology and
The requirement of installation is all higher, low production efficiency, and cost is high.
The content of the invention
The invention provides a kind of packaging technology is simple, it is only necessary to a dispensing, reduces assembly technology, improves production effect
Rate, it can effectively meet the pressure limit of Client application and a kind of inlet manifold sensor construction of precision index；Solve existing
Packaging technology present in technology is complicated, and installation step is more, and process equipment is more, it is necessary to multiple dispensing, the technology of production cycle length
Problem.
The present invention simultaneously additionally provide it is a kind of the connecting line of temperature-sensing element (device) can be directly connected on circuit board, work
Skill is simple, a kind of inlet manifold sensor construction that installing space rationally utilizes；It is quick to solve temperature present in prior art
The connecting line of sensing unit needs individually to open up installing space, the technical problem of complex process low to the utilization rate of installing space.
The above-mentioned technical problem of the present invention is that solved by following technical proposals：A kind of inlet manifold sensor construction,
Including housing, mounting surface is provided with described housing, air-flow guiding pipe is connected with below mounting surface, is set on mounting surface
There is pressure-sensing device, pressure-sensing device is located at the side of the air stream outlet of air-flow guiding pipe, the sensing of pressure-sensing device
Mouth upward, is provided with cover plate in the top of pressure-sensing device and air stream outlet, cover plate is fixed on into mounting surface using an encapsulating
On, closed installation cavity is formed between cover plate and mounting surface, gap is left between cover plate and the sensing mouth of pressure-sensing device,
Gap is left between cover plate and air stream outlet.The present invention changes in original technology pressure-sensing device being directly installed on gas
At flow export, the problem of the technique and installation procedure complexity that are needed caused by when being installed and being sealed.The present invention will
Air stream outlet and pressure inductor are staggeredly arranged, forced draft by air-flow guiding pipe Lai, due to air stream outlet positioned at one it is close
In the cavity of envelope, closed cavity is formed by cover plate and mounting surface by sealant pouring and sealing.And pressure-sensing device is at this
In cavity, the cover plate of pressure-sensing device and air stream outlet from top has a certain distance, forms the sky of an air current flow
Between, allow air pressure to reach the sensing mouth of pressure-sensing device, the sensing mouth of pressure-sensing device is arranged upward, can be felt rapidly
Should be to the stream pressure in cavity.The air stream outlet and pressure-sensing device being staggeredly arranged so that be packaged and quick to remaining
Sensing unit arrangement obtains bigger installing space, and can also realize that sensor is sealed and fixed by a vacuum glue pouring can
Protect.Cumbersome technique and excessive potted component etc. are not needed, while the pressure limit of Client application can also be met
And precision index, and do not ruptured in the case that realization exceeds 5 times of operating pressure.
Preferably, the airflow outlet end of described air-flow guiding pipe is higher than encapsulating plane, described pressure-sensing device
Sensing mouth also above encapsulating plane.Encapsulating plane is used for securing cover plate and pressure-sensing device, between cover plate and mounting surface
Formed airtight cavity, while again ensure air-flow pressure energy be effectively passed on pressure-sensing device, therefore air stream outlet and
Encapsulating plane is above with the sensing mouth of pressure-sensing device, the sensing mouth of pressure-sensing device and the height of air stream outlet are substantially
It is identical, improve the sensing speed of stream pressure.
Preferably, described pressure-sensing device is fixed on circuit boards, circuit board is connected with stitch, the covering of encapsulating face
On circuit boards.Projection is provided with the mounting surface below described circuit board.Pressure-sensing device passes through circuit board and stitch
Connect, simple in construction, encapsulating face is higher than circuit board, and circuit board and IC pins are protected, and greatly improves the resistance to ring of sensor
Border corrosive power, while projection is provided with mounting surface, gap is formed between cover plate, is easy to glue to flow into internal, is realized good
Embedding effect.
Preferably, the lower end of described air-flow guiding pipe is provided with temperature-sensing element (device), the connecting line of temperature-sensing element (device)
By passing connection in air-flow guiding pipe on circuit boards.Because pressure-sensing device and air stream outlet are staggeredly arranged, not to gas
Flow export is blocked, and also avoids the need for being sealed in air flow outlet, therefore need not be individually for temperature-sensing element (device) company
A connecting hole is opened up in wiring, reduces manufacturing technique requirent, is improved installation effectiveness, reasonably be make use of the sky in air-flow guiding pipe
Between.
Preferably, described cover plate includes top plate and side plate, side plate is provided with the support turned up towards one end of mounting surface
Edge.Described mounting surface is provided with support protrusion, and support protrusion connects with support edge.The top plate of cover plate forms the sealing of upper end
Face, the side plate of cover plate form the sealing surface of surrounding side, flanging are integrally formed in the free end of side plate, are advantageous to increase with solid
Glue after change forms a firm mechanical connection relation, realizes the burst pressure for being up to 20 atmospheric pressure.Support protrusion with
Support edge connects, and so as to be positioned to cover plate installation, cover plate is depressed into after support protrusion touches with support edge, it is possible to is stopped
Push, complete located.
Preferably, described mounting surface is provided with projection, described cover plate includes top plate and side plate, in the inner side of top plate
Face is provided with the blind hole coordinated with projection.Interference prism is externally provided with described projection, projection is interference fitted with blind hole.Projection and blind
The cooperation in hole, it is convenient that positioning and temporary transient fixation, so as to realize after encapsulating, the firm company of cover plate and mounting surface are carried out to cover plate
Connect, improve sealing effectiveness.And the interference prism outside projection, when in cover plate lid, blind hole is by interference prism conquassation, so that will lid
Plate is positioned at encapsulating fixing seal continuous after an action of the bowels above housing.
Therefore, a kind of inlet manifold sensor construction of the invention possesses following advantages：
(1) mounting design of pressure-sensing device is simple in construction, and assembling process is completed by a vacuum glue pouring；
(2) process of mounting structure is reduced, and is reduced so as to which technological equipment takes, product qualification rate greatly improves；
(3) process costs are reduced, time production cycle is reduced, and improves the market competitiveness；
(4) it is connected firmly, it is possible to achieve the up to burst pressure of 20 atmospheric pressure, and realize beyond 5 times of operating pressure
In the case of do not rupture；
(5) location arrangements of pressure-sensing device and temperature-sensing element (device) are reasonable, realize the maximization of space availability ratio, temperature
The line of degree sensing element directly can be stretched out by air-flow guiding pipe, it is not necessary to extra installing space and installation procedure.
Brief description of the drawings
Fig. 1 is a kind of overall schematic of inlet manifold sensor construction of the present invention.
Fig. 2 is the stereogram that Fig. 1 removes cover plate.
Fig. 3 is Fig. 1 half-sectional stereogram.
Fig. 4 is Fig. 3 front view.
Embodiment
Below by embodiment, and with reference to accompanying drawing, the technical scheme of invention is described in further detail.
Embodiment：
As shown in Fig. 1 and 2 and 3 and 4, a kind of inlet manifold sensor construction, including housing 1, set in the side of housing 1
There is a mounting surface 2, mounting surface 2 forms the open type space that can accommodate encapsulating to lower recess.Connected in the lower section of mounting surface 2
There is air-flow guiding pipe 11.One end of air-flow guiding pipe 11 protrudes into the top of mounting surface 2, and forced draft is by under air-flow guiding pipe 11
Side's press-in, the air stream outlet 10 being located at by air-flow guiding pipe 11 above mounting surface flow out.In the lower semisection of air-flow guiding pipe 11
Temperature-sensing element (device) 18 is installed, the connecting line 9 of temperature-sensing element (device) 18 in air-flow guiding pipe 11 by exporting.
Circuit board 13 is installed in the outside of the air stream outlet 10 of air-flow guiding pipe, circuit board 13 passes through stitch 4 and outside
Circuit is connected.Circuit board 13 is located on mounting surface 2, integrally formed with projection 12, circuit on the mounting surface below circuit board 13
Plate 13 is in projection 12.Pressure-sensing device 8 is installed on circuit boards, the sensing mouth of pressure-sensing device 8 upward, pressure
Sensing element 8 is located at the side of air-flow guiding pipe 11.
After circuit board 13 is arranged, cover plate 3 is installed above circuit board 13.Cover plate 3 includes top plate 17 and side plate
16, cover plate 3 all includes the air stream outlet 10 of circuit board 13 and air-flow guiding pipe 11 wherein.On the inwall of top plate 17 integrally into
Type has blind hole, and integrally formed with the projection 7 being interference fitted with blind hole on mounting surface 2, interference is evenly equipped with the outer surface of projection 7
Prism 6.In the free end of side plate 16 integrally formed with the support edge 15 to turn up, side plate 16 and the mounting surface joint of cover plate into
Type has support protrusion 5, and support protrusion 5 connects with support edge 15.When cover plate 3 is installed on mounting surface 2, by blind on cover plate 3
The interference prism 6 that pore pressure is burst outside projection, so as to which cover plate 3 and mounting surface 2 be fixed, and the position that cover plate 3 pushes is by support protrusion 5
Determined with support edge 15, after support protrusion 5 is touched with support edge 15, represent that cover plate 3 has been installed in place.
Now, cover plate is fixed on mounting surface 2 using a vacuum glue pouring, and solidified.Due to having below circuit board
Projection, glue can be flowed into the lower section of circuit board, realize good sealant pouring and sealing effect.One time vacuum glue pouring covers circuit board
Cover under encapsulating face, the sensing mouth of pressure-sensing device 8 and the air stream outlet 10 of air-flow guiding pipe are located on encapsulating face 14.
Forced draft is entered by the bottom of pressure guide pipe, and temperature-sensing element (device) 18 is located at the airflow inlet end of pressure guide pipe 11, will
Temperature parameter imports circuit board by connecting line 9, and circuit board 13 connects external circuit by stitch 4.Then by pressure guide pipe
Air stream outlet 10 flow out, because air stream outlet is higher by encapsulating face 14, forced draft quickly fills with the closed chamber formed by cover plate
Body 20, the sensing mouth of pressure-sensing device senses rapidly stream pressure upward, so as to realize the pressure monitoring to air-flow.
Claims (9)
1. a kind of inlet manifold sensor construction, including housing and cover plate, it is characterised in that：Installation is provided with described housing
Face, air-flow guiding pipe is connected with below mounting surface, pressure-sensing device is provided with mounting surface, pressure-sensing device is located at
The side of the air stream outlet of air-flow guiding pipe, the sensing mouth of pressure-sensing device upward, in pressure-sensing device and air stream outlet
Top be provided with cover plate, cover plate is fixed on mounting surface using an encapsulating, closed peace is formed between cover plate and mounting surface
It behave affectedly body, leaves gap between cover plate and the sensing mouth of pressure-sensing device, gap is left between cover plate and air stream outlet.
A kind of 2. inlet manifold sensor construction according to claim 1, it is characterised in that：Described air-flow guiding pipe
Airflow outlet end is higher than encapsulating plane, and the sensing mouth of described pressure-sensing device is also above encapsulating plane.
A kind of 3. inlet manifold sensor construction according to claim 1, it is characterised in that：Described pressure-sensing device
Fixed circuit board is connected with stitch on circuit boards, and encapsulating face covers on circuit boards.
A kind of 4. inlet manifold sensor construction according to claim 3, it is characterised in that：Below described circuit board
Mounting surface be provided with projection.
A kind of 5. inlet manifold sensor construction according to Claims 1-4 any one, it is characterised in that：Described
The lower end of air-flow guiding pipe is provided with temperature-sensing element (device), and the connecting line of temperature-sensing element (device) is connected to by being passed in air-flow guiding pipe
On circuit board.
A kind of 6. inlet manifold sensor construction according to Claims 1-4 any one, it is characterised in that：Described
Cover plate includes top plate and side plate, and side plate is provided with the support edge to turn up towards one end of mounting surface.
A kind of 7. inlet manifold sensor construction according to claim 6, it is characterised in that：Described mounting surface is provided with
Support protrusion, support protrusion connect with support edge.
A kind of 8. inlet manifold sensor construction according to Claims 1-4 any one, it is characterised in that：Described
Mounting surface is provided with projection, and described cover plate includes top plate and side plate, and the blind hole coordinated with projection is provided with the medial surface of top plate.
A kind of 9. inlet manifold sensor construction according to claim 8, it is characterised in that：It is externally provided with described projection
Interference prism, projection are interference fitted with blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710748211.7A CN107389136A (en) | 2017-08-28 | 2017-08-28 | A kind of inlet manifold sensor construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710748211.7A CN107389136A (en) | 2017-08-28 | 2017-08-28 | A kind of inlet manifold sensor construction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107389136A true CN107389136A (en) | 2017-11-24 |
Family
ID=60345456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710748211.7A Pending CN107389136A (en) | 2017-08-28 | 2017-08-28 | A kind of inlet manifold sensor construction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107389136A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110186534A (en) * | 2019-06-27 | 2019-08-30 | 芜湖乐佳电器有限公司 | A kind of chip-shaped fluid sensor |
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| CN110186534A (en) * | 2019-06-27 | 2019-08-30 | 芜湖乐佳电器有限公司 | A kind of chip-shaped fluid sensor |
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