CN201181255Y - Manifold pressure/temperature sensor - Google Patents

Manifold pressure/temperature sensor Download PDF

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Publication number
CN201181255Y
CN201181255Y CNU2008200892583U CN200820089258U CN201181255Y CN 201181255 Y CN201181255 Y CN 201181255Y CN U2008200892583 U CNU2008200892583 U CN U2008200892583U CN 200820089258 U CN200820089258 U CN 200820089258U CN 201181255 Y CN201181255 Y CN 201181255Y
Authority
CN
China
Prior art keywords
housing
circuit board
pressure
signal conditioning
conditioning circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008200892583U
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Chinese (zh)
Inventor
浦龙
王世青
王兵
陈海东
荆志彬
王鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Haerbin Northeast Auto Electronics Engineering Technology Research Development C
Original Assignee
Haerbin Northeast Auto Electronics Engineering Technology Research Development C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Haerbin Northeast Auto Electronics Engineering Technology Research Development C filed Critical Haerbin Northeast Auto Electronics Engineering Technology Research Development C
Priority to CNU2008200892583U priority Critical patent/CN201181255Y/en
Application granted granted Critical
Publication of CN201181255Y publication Critical patent/CN201181255Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a manifold pressure/temperature sensor, which comprises a sensing element, a signal conditioning circuit and a housing, wherein a detection end protruding downwards and a plug facing upwards are respectively arranged on both sides of the housing; a circuit board is arranged below an upper cover of the housing; an electrode is arranged in the plug; the signal conditioning circuit is welded on the circuit board in the housing; the sensitive element includes an inductive resistor arranged at the detection end and a pressure-sensitive chip arranged on the circuit board; and the pressure-sensitive chip, the signal conditioning circuit and the electrode on the housing are connected with each other through the circuit board. The manifold pressure/temperature sensor has the advantages of good high/low-temperature repeat property, good stability and insulation, high stability, high electromagnetic resistance, light weight, long service life, high corrosion resistance, low cost, high accuracy, batch production, high performance-to-price ratio, etc.

Description

The menifold pressure
(1) technical field
The utility model relates to sensor technology, is specifically related to a kind of Pressure/Temperature survey sensor.
(2) background technology
Manifold absolute pressure sensor is applied in the D type EFI gasoline injection system.At present, most pressure transducers all can solve high temperature, problems such as corrosion, it such as number of patent application 200520028345.4 machine oil alarm pressure sensor, it can accurately transmit the machine oil alarm pressure sensor of oil pressure information in the engine, this sensor is by the pressure chamber, polyester film sheet, the conduction chamber, conduction mechanism, switch room, throw-over gear, printed resistor and wire harness constitute, described pressure chamber, conduction chamber and switch room constitute the inner chamber body of sensor, diaphragm arrangement is on the pressure chamber, it is indoor that conduction mechanism is arranged on conduction, throw-over gear and resistance board are arranged in the switch room, and resistance board links to each other with wire harness.Because the diaphragm of manufacturing adopts polyester film to replace existing metal material, makes that this sensor is high temperature resistant, high pressure, corrosion-resistant; Because resistance board adopts printed resistor to replace coiling resistance, its range and precision can be according to the request for utilization adjustment, have the characteristics of firm, heat-resisting, rapid heat dissipation, good stability; Number of patent application is 200420017924 mechanical type engine oil pressure pickup, and it comprises: film chamber sub-unit links to each other with the measurement sub-unit, also has the electronic switching circuit plate to be contained on the shell of measuring sub-unit.Its advantage is: owing to adopt electronic type noncontacting switch and polyimide diaphragm, changes mechanical contact and weares and teares easily, ablates, or the diaphragm non-refractory, oil resistance is poor, characteristics such as wear-resisting difference in the serviceable life of improving sensor, significantly improve than original sensor life-time.But they all can not resist electromagnetic interference (EMI), in addition the reliability height, but can not guarantee serviceable life when precision is good, perhaps long but precision is not high the life-span, cost performance is lower comparatively speaking.
(3) summary of the invention
The purpose of this utility model is to provide a kind of have good high low temperature repeat property and stability, insulate, stability is high, anti-electromagnetic interference (EMI), in light weight, long service life, anti-corrosion capability is strong, cost is low, precision is high, be suitable for production in enormous quantities, the menifold pressure that cost performance is high.
The purpose of this utility model is achieved in that it comprises sensitive element, signal conditioning circuit and housing three parts, the both sides of housing are respectively arranged with the test side of downward protrusion and the plug that makes progress, the case top lid positioned beneath has circuit board, be provided with electrode in the plug, signal conditioning circuit is welded on the interior circuit board of housing, sensitive element comprises inductive reactance that is installed in the test side and the presser sensor chip that is welded on the circuit board, and the electrode on presser sensor chip, signal conditioning circuit, the housing links together by circuit board.
The utility model also has some technical characterictics like this:
1, described inductive reactance is the thermistor of negative temperature coefficient, and induction chip is the pressure resistance type sensing chip of monocrystal silicon structure;
2, junction, described test side is provided with O-ring seal.
The utility model can be measured MAP and temperature, and the thermistor that adopts negative temperature coefficient is realized temperature signal collection is used to detect the air themperature that enters cylinder as temperature sensitive member.The size of the absolute pressure in the inlet manifold is finished the collection of pressure signal by a monocrystalline silicon piezoresistance formula induction chip, and with the signal that collects treatment for correcting by modulate circuit, to handle the back data and send ECU to, used presser sensor chip is that our unit develops voluntarily, has the sensitivity of good high low temperature repeat property, high low-temperature stability and Geng Gao.
Signal conditioning circuit of the present utility model adopts special circuit, this circuit has functions such as amplification, temperature compensation, nonlinear compensation, can adjust side-play amount, Sensitirity va1ue and side-play amount temperature coefficient, sensitivity temperature coefficient flexibly, make sensor in-40~125 ℃ of operating temperature ranges, obtain compensation preferably.
The utility model can be applicable in the inlet manifold absolute pressure and measures, and has good high low temperature repeat property and stability, insulate, and the stability height, anti-electromagnetic interference (EMI), in light weight, long service life, advantage such as anti-corrosion capability is strong.Have also in addition that size is little, response good, reliability is high, precision is high, temperature error is little, cost performance is high, repeatability, shock resistance be good, but on-line debugging, and PC realizes the configuration and the calibration of chip by a line system digital interface, and is simple, cost is low, is suitable for production in enormous quantities.
(4) description of drawings
Fig. 1-Fig. 3 is a structural representation of the present utility model, and wherein Fig. 1 is a front view, and Fig. 2 is a cut-open view, and Fig. 3 is a side view.
(5) embodiment
Below in conjunction with the drawings and specific embodiments the utility model is described further:
In conjunction with Fig. 1, present embodiment comprises sensitive element, signal conditioning circuit 1 and housing 2 three parts, the both sides of housing 2 are respectively arranged with the test side of downward protrusion and the plug 5 that makes progress, housing 2 loam cakes 6 positioned beneath have circuit board, be provided with electrode in the plug, signal conditioning circuit 1 is welded on the interior circuit board of housing.Sensitive element comprises inductive reactance 3 that is installed in the test side and the presser sensor chip 4 that is arranged on the circuit board.Electrode on presser sensor chip 4, signal conditioning circuit 1, the housing links together by circuit board.Inductive reactance 3 is the thermistor of negative temperature coefficient, and induction chip is the pressure resistance type sensing chip of monocrystal silicon structure; The junction, test side is provided with O-ring seal.
Induction chip is made up of a slice silicon in the present embodiment, with the single crystal silicon semiconductor is material of main part, in silicon, etch pressure-sensitive diaphragm, promptly monocrystalline silicon is etched into the flexible sheet of circle, rectangle or the twin islet structure etc. of a periphery fixed with the way of micromachined, on diaphragm, make the strain resistor device that is directly proportional and changes with fluid pressure, made the conversion element that pressure signal is converted to electric signal, that is the conversion element of power-electricity.The change of air pressure makes diaphragm deformation stressed, and piezoresistive effect changes resistance, after handling by chip, forms and the linear voltage signal of pressure.This sensing chip is directly installed on the inlet manifold, measured signal again through circuit amplify, conditioning, the needed signal of output system or on instrument, show.Temperature sensing then is that the thermistor by negative temperature coefficient comes acquired signal.Signal conditioning circuit adopts special circuit in the present embodiment, comprise amplifying unit, temperature compensation unit and nonlinear compensation unit, have functions such as amplification, temperature compensation, nonlinear compensation, can adjust side-play amount, Sensitirity va1ue and side-play amount temperature coefficient, sensitivity temperature coefficient flexibly, make sensor in-40~125 ℃ of operating temperature ranges, obtain compensation preferably.
Product is measured the variation of absolute pressure in the inlet manifold according to engine load conditions in the present embodiment, and converts thereof into voltage signal, delivers to ECU with tach signal, as the foundation of determining basic fuel injection amount.

Claims (3)

1, a kind of menifold pressure, it comprises sensitive element and housing, it is characterized in that it also comprises signal conditioning circuit, the both sides of housing are respectively arranged with the test side of downward protrusion and the plug that makes progress, the case top lid positioned beneath has circuit board, be provided with electrode in the plug, signal conditioning circuit is welded on the interior circuit board of housing, sensitive element comprises inductive reactance that is installed in the test side and the presser sensor chip that is arranged on the circuit board, and the electrode on presser sensor chip, signal conditioning circuit, the housing links together by circuit board.
2, menifold pressure according to claim 1 is characterized in that described inductive reactance is the thermistor of negative temperature coefficient, and induction chip is the pressure resistance type sensing chip of monocrystal silicon structure.
3, menifold pressure according to claim 1 and 2 is characterized in that the junction, test side is provided with O-ring seal.
CNU2008200892583U 2008-02-04 2008-02-04 Manifold pressure/temperature sensor Expired - Fee Related CN201181255Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008200892583U CN201181255Y (en) 2008-02-04 2008-02-04 Manifold pressure/temperature sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008200892583U CN201181255Y (en) 2008-02-04 2008-02-04 Manifold pressure/temperature sensor

Publications (1)

Publication Number Publication Date
CN201181255Y true CN201181255Y (en) 2009-01-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008200892583U Expired - Fee Related CN201181255Y (en) 2008-02-04 2008-02-04 Manifold pressure/temperature sensor

Country Status (1)

Country Link
CN (1) CN201181255Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107389136A (en) * 2017-08-28 2017-11-24 浙江沃得尔科技股份有限公司 A kind of inlet manifold sensor construction

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107389136A (en) * 2017-08-28 2017-11-24 浙江沃得尔科技股份有限公司 A kind of inlet manifold sensor construction

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090114

Termination date: 20100204