CN204067310U - A kind of SMT paster encapsulating structure - Google Patents
A kind of SMT paster encapsulating structure Download PDFInfo
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- CN204067310U CN204067310U CN201420288055.2U CN201420288055U CN204067310U CN 204067310 U CN204067310 U CN 204067310U CN 201420288055 U CN201420288055 U CN 201420288055U CN 204067310 U CN204067310 U CN 204067310U
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- paster
- encapsulating structure
- point glue
- smt
- wafer
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Abstract
The utility model discloses a kind of SMT paster encapsulating structure, belong to technical field of semiconductors, comprise wafer is cut into chip dies dicing device, in base panel frame brush soldering paste point glue equipment, chip dies moved and is positioned over the paster apparatus brushed in the base panel frame of soldering paste and the packaging system carrying out follow-up encapsulation, dicing device is connected with point glue equipment, paster apparatus is connected with point glue equipment with dicing device respectively, and packaging system is connected with paster apparatus.The technical solution of the utility model adopts the point glue equipment of brush soldering paste to be directly connected with paster apparatus paster, loader in conventional package technique and bonding equipment will be removed, reduce use equipment, and the general chip mounter in traditional SMT does not re-use, only adopt high speed placement system, there is the advantages such as entirety is injected capital into less, packaging semi-finished product produces height, minimizing encapsulating material, the electrical quantity performance improving device and heat dispersion.
Description
Technical field
The utility model belongs to technical field of semiconductors, relates to a kind of encapsulating structure, particularly relates to a kind of SMT paster encapsulating structure of TSOT23, DFN, QFN and TO220 packaging appearance.
Background technology
In semiconductor packages industry, equipment and the operation structure thereof of the usual flow process of device volume production mainly contain two kinds:
One is: planar wafer thinning (abrasive disc) → planar wafer cutting (scribing) → mucilage binding sheet → bonding wire (WB) → baking → plastic packaging → plating → laser marking → cut muscle is shaped → tests tape package;
Another kind of (flip chip bonding) is: and convex wafer thinning (abrasive disc) → convex wafer cutting (scribing) → wafer installs → and segmentation is clean → Reflow Soldering → solvent cleaned → base point adhesive curing → high-temperature baking → cooling → laser marking → go scaling powder → dress pallet or braid.
In the first volume production equipment and flow process thereof, encapsulating material is with the most use.Gold thread, copper cash or aluminum steel can be used in bonding wire (WB) this procedure.In this procedure of plastic packaging, because adopting the reason of mould, can multiplex plastic packaging material.This two procedures account for the share of encapsulating material cost 50%, and cost of labor accounting is 30% of finished product; And bonding wire (WB) this procedure is because of the encapsulation demand of special process and the inherent shortcoming of bonding equipment, production efficiency is low.Also have in this procedure of plastic packaging, capsulation material enters because there being pressure can have certain damage to bonding wire, such as short in injection mould, and cause solder joint engaging force to diminish, resistance change is large.
In the second volume production equipment and flow process thereof, in encapsulating material, bonding wire does not re-use, and capsulation material can reduce, but machine drops into many, and operation is many, and production efficiency is low, and cost of labor accounting increases.
Utility model content
In view of this, the utility model provides a kind of SMT paster encapsulating structure.
For achieving the above object, concrete technical scheme is as follows:
A kind of SMT paster encapsulating structure, comprise wafer is cut into chip dies dicing device, in base panel frame brush soldering paste point glue equipment, described chip dies moved and is positioned over the paster apparatus brushed in the described base panel frame of soldering paste and the packaging system carrying out follow-up encapsulation, described dicing device is connected with described point glue equipment, described paster apparatus is connected with described point glue equipment with described dicing device respectively, and described packaging system is connected with described paster apparatus.
Preferably, also comprise the carrier band placing described chip dies, described carrier band is connected with described paster apparatus with described dicing device respectively.
Preferably, also comprise abrasive disc device thinning for wafer, described abrasive disc device is connected with described dicing device.
Preferably, also comprise conveyer, described conveyer is connected with packaging system with described point glue equipment, paster apparatus respectively.
Preferably, described packaging system comprises baking mechanism, plastic package mechanism, electroplating mechanism that, laser marking mechanism, cuts muscle builder and test tape package mechanism.
Preferably, described wafer is planar wafer or convex wafer.
Preferably, described paster apparatus comprises high speed placement system.
Preferably, described point glue equipment comprises the steel mesh carrying out a glue.
Preferably, described steel mesh adopts laser cutting to make.
Relative to prior art, the technical solution of the utility model is relative to using traditional bonding equipment, the point glue equipment of brush soldering paste is adopted directly to be connected with paster apparatus paster, loader in conventional package technique and bonding equipment will be removed, reduce use equipment, and the general chip mounter in traditional SMT does not re-use, and only adopts high speed placement system, there is the advantages such as entirety is injected capital into less, packaging semi-finished product produces height, minimizing encapsulating material, the electrical quantity performance improving device and heat dispersion.
Accompanying drawing explanation
The accompanying drawing forming a part of the present utility model is used to provide further understanding of the present utility model, and schematic description and description of the present utility model, for explaining the utility model, is not formed improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 is the structural representation of the SMT machine system of the utility model embodiment;
Fig. 2 is the schematic flow sheet of the utility model embodiment.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
It should be noted that, when not conflicting, the embodiment in the utility model and the feature in embodiment can combine mutually.
Below with reference to accompanying drawing, concrete explaination is done to embodiment of the present utility model.
A kind of SMT paster encapsulating structure of embodiment of the present utility model as shown in figs. 1 and 2, comprise wafer is cut into chip dies dicing device, in base panel frame brush soldering paste point glue equipment, described chip dies moved and is positioned over the paster apparatus brushed in the described base panel frame of soldering paste and the packaging system carrying out follow-up encapsulation, described dicing device is connected with described point glue equipment, described paster apparatus is connected with described point glue equipment with described dicing device respectively, and described packaging system is connected with described paster apparatus.
The utility model embodiment is relative to the encapsulation technology of traditional bonding equipment, the point glue equipment of brush soldering paste is adopted directly to be connected with paster apparatus paster, loader in conventional package technique and bonding equipment will be removed, reduce use equipment, and the general chip mounter in traditional SMT does not re-use, only adopt high speed placement system, there is the advantages such as entirety is injected capital into less, packaging semi-finished product produces height, minimizing encapsulating material, the electrical quantity performance improving device and heat dispersion.
As shown in figs. 1 and 2, wherein BOT face is bottom surface, TOP face is end face, reflow is Reflow Soldering, AOI (Automatic Optic Inspection) is automatic optics inspection, ICT (In-Circuit-Tester) is automatic on-line tester, Reflow solder is reflow soldering, in embodiment of the present utility model, the operation structure of chip carrier package techniqueflow comprises: wafer thinning (abrasive disc) → wafer cutting (scribing) → wafer load braid → brush soldering paste (some glue) → paster → baking → plastic packaging → plating → laser marking → cut muscle is shaped → tests tape package.
Compare with existing encapsulation technology, the operation wherein of existing encapsulation technology: select mucilage binding sheet → bonding wire (WB) and change wafer load braid → brush soldering paste (some glue) → paster into, namely after wafer well cutting, adopt manipulator suction nozzle that wafer DIE (chip dies) is put into special carrier band (this carrier band is reusable) by same direction is unified, then to after brush soldering paste in corresponding base panel frame (some glue), with the manipulator of SMT wafer DIE is placed on one to one and brushed on the framework of tin cream.
In this process, we eliminate important materials part bonding wire (gold thread, copper cash, aluminum steel) in traditional handicraft, and corresponding cost adds the tin cream more much lower than bonding wire cost.Meanwhile, because after the wafer DIE of well cutting puts into special carrier band, also conveniently to store for a long time.Further, be connect one by one during traditional bonding equipment bonding wire, because will arcing be considered, pulling force and crater problem, bonding wire efficiency is low; And the technology in embodiment of the present utility model, 8 bonding wires are had for a finished product, SMT machine is adopted directly to paste wafer DIE, up-to-date machine can paste 8 wafer DIE simultaneously, the prouctiveness adding a wafer braider with a SMT chip mounter compares for the half-finished calculating of 200K, need use 10-12 platform tradition bonding equipment, the effective utilization of board significantly improves.
In addition, in embodiment of the present utility model, general chip mounter in tradition SMT does not re-use, only adopt high speed placement system, and loader in conventional package technique and bonding equipment will be removed, the share that these two kinds of equipment account for equipment purchase fund in conventional package technique is comparatively large, therefore can reduce input cost completely, reduce the allowance for depreciation of equipment.Meanwhile, the slide holder because of chip package employing is a kind of matrix combination of profile, so the wafer DIE in 16 loaders is the same, greatly improves paster efficiency.
In addition, in embodiment of the present utility model, carry out a glue by steel mesh.Steel mesh is mainly made up of outside framework, glue, grenadine and steel disc, is mainly used in relevant position print solder paste and red glue etc. to wafer slide holder.The concrete size of SMT steel mesh is according to the size of client's wafer function bonding wire point and how many and determine.SMT steel net template requires to adopt laser cutting, but machining accuracy is higher than common paster SMT template, requires positional precision+5 μm, smallest aperture 0.04mm, thickness 10 μm.
Be described in detail specific embodiment of the utility model above, but it is just as example, the utility model is not restricted to specific embodiment described above.To those skilled in the art, any equivalent modifications that the utility model is carried out and substituting also all among category of the present utility model.Therefore, not departing from the equalization conversion and amendment done under spirit and scope of the present utility model, all should be encompassed in scope of the present utility model.
Claims (9)
1. a SMT paster encapsulating structure, it is characterized in that, comprise wafer is cut into chip dies dicing device, in base panel frame brush soldering paste point glue equipment, described chip dies moved and is positioned over the paster apparatus brushed in the described base panel frame of soldering paste and the packaging system carrying out follow-up encapsulation, described dicing device is connected with described point glue equipment, described paster apparatus is connected with described point glue equipment with described dicing device respectively, and described packaging system is connected with described paster apparatus.
2. SMT paster encapsulating structure as claimed in claim 1, it is characterized in that, also comprise the carrier band placing described chip dies, described carrier band is connected with described paster apparatus with described dicing device respectively.
3. SMT paster encapsulating structure as claimed in claim 2, it is characterized in that, also comprise abrasive disc device thinning for wafer, described abrasive disc device is connected with described dicing device.
4. SMT paster encapsulating structure as claimed in claim 3, it is characterized in that, also comprise conveyer, described conveyer is connected with packaging system with described point glue equipment, paster apparatus respectively.
5. SMT paster encapsulating structure as claimed in claim 4, is characterized in that, described packaging system comprises baking mechanism, plastic package mechanism, electroplating mechanism that, laser marking mechanism, cuts muscle builder and test tape package mechanism.
6. SMT paster encapsulating structure as claimed in claim 1, it is characterized in that, described wafer is planar wafer or convex wafer.
7. SMT paster encapsulating structure as claimed in claim 1, it is characterized in that, described paster apparatus comprises high speed placement system.
8. SMT paster encapsulating structure as claimed in claim 1, it is characterized in that, described point glue equipment comprises the steel mesh carrying out a glue.
9. SMT paster encapsulating structure as claimed in claim 8, is characterized in that, described steel mesh adopts laser cutting to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420288055.2U CN204067310U (en) | 2014-05-30 | 2014-05-30 | A kind of SMT paster encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420288055.2U CN204067310U (en) | 2014-05-30 | 2014-05-30 | A kind of SMT paster encapsulating structure |
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| Publication Number | Publication Date |
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| CN204067310U true CN204067310U (en) | 2014-12-31 |
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| CN201420288055.2U Expired - Fee Related CN204067310U (en) | 2014-05-30 | 2014-05-30 | A kind of SMT paster encapsulating structure |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106332470A (en) * | 2016-08-31 | 2017-01-11 | 河源西普电子有限公司 | SMD technique |
| CN107611068A (en) * | 2017-10-17 | 2018-01-19 | 深圳华创兆业科技股份有限公司 | Chip cutters |
| CN108447806A (en) * | 2018-03-30 | 2018-08-24 | 杭州旗捷科技有限公司 | Chip automated production equipment, system and method |
| CN108648999A (en) * | 2018-05-08 | 2018-10-12 | 广西桂芯半导体科技有限公司 | Method for packing semiconductor |
| CN109699169A (en) * | 2019-01-31 | 2019-04-30 | 深圳市益光实业有限公司 | A kind of microwave multichannel T/R component mount technology |
| CN110808221A (en) * | 2019-11-11 | 2020-02-18 | 东莞记忆存储科技有限公司 | SMT and DA process integration method for SIP packaging |
-
2014
- 2014-05-30 CN CN201420288055.2U patent/CN204067310U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106332470A (en) * | 2016-08-31 | 2017-01-11 | 河源西普电子有限公司 | SMD technique |
| CN107611068A (en) * | 2017-10-17 | 2018-01-19 | 深圳华创兆业科技股份有限公司 | Chip cutters |
| CN108447806A (en) * | 2018-03-30 | 2018-08-24 | 杭州旗捷科技有限公司 | Chip automated production equipment, system and method |
| CN108447806B (en) * | 2018-03-30 | 2024-05-03 | 杭州旗捷科技股份有限公司 | Chip automatic production equipment, system and method thereof |
| CN108648999A (en) * | 2018-05-08 | 2018-10-12 | 广西桂芯半导体科技有限公司 | Method for packing semiconductor |
| CN109699169A (en) * | 2019-01-31 | 2019-04-30 | 深圳市益光实业有限公司 | A kind of microwave multichannel T/R component mount technology |
| CN109699169B (en) * | 2019-01-31 | 2020-12-22 | 深圳市益光实业有限公司 | Microwave multichannel T/R assembly surface mounting technology |
| CN110808221A (en) * | 2019-11-11 | 2020-02-18 | 东莞记忆存储科技有限公司 | SMT and DA process integration method for SIP packaging |
| CN110808221B (en) * | 2019-11-11 | 2022-03-29 | 东莞记忆存储科技有限公司 | SMT and DA process integration method for SIP packaging |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141231 Termination date: 20180530 |
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| CF01 | Termination of patent right due to non-payment of annual fee |