CN108447806A - Chip automated production equipment, system and method - Google Patents
Chip automated production equipment, system and method Download PDFInfo
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- CN108447806A CN108447806A CN201810276355.1A CN201810276355A CN108447806A CN 108447806 A CN108447806 A CN 108447806A CN 201810276355 A CN201810276355 A CN 201810276355A CN 108447806 A CN108447806 A CN 108447806A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 177
- 238000000034 method Methods 0.000 title claims description 13
- 238000003860 storage Methods 0.000 claims abstract description 25
- 238000001514 detection method Methods 0.000 claims abstract description 23
- 238000004891 communication Methods 0.000 claims abstract description 18
- 238000012545 processing Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 24
- 230000002452 interceptive effect Effects 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 5
- 238000011161 development Methods 0.000 claims description 4
- 239000000523 sample Substances 0.000 claims description 4
- 238000000354 decomposition reaction Methods 0.000 claims description 3
- 238000005194 fractionation Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000013486 operation strategy Methods 0.000 description 1
- 238000012857 repacking Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
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Abstract
The invention discloses a kind of chip mechanized production systems,It includes main control module,Storage module,ERP database,Communication module,And chip automated production equipment,The wherein described chip automated production equipment includes device control module,The reading and writing code module communicated to connect respectively with the device control module,First delivery module,Mark module,Second delivery module,Vision-based detection module,Third delivery module,Signal identification module,Intelligent fixture,The wherein described device control module by the communication module respectively with the main control module,The storage module communication connection,The main control module is realized by the communication module with the ERP database and is communicated to connect,The chip automated production equipment is arranged on the production and processing automated to chip under the control of the main control module,Improve the production efficiency and yields of chip.
Description
Technical field
The present invention relates to chip manufacturing fields, are in more detail related to a kind of automated production equipment of consumable chip, are
System and its method.
Background technology
In general, chip is the general designation of semiconductor element product, is the carrier of integrated circuit, is split to form by wafer.
Chip is part most important and most crucial in computer or other electronic equipments, carries the cores work(such as operation and storage
Can, operation strategies almost cover all spectras such as military project, civilian, industrial.The complete procedure of chip manufacturing production includes core
Piece designs, wafer fabrication, and encapsulation makes, and several links such as test verification, the requirement to production process is more accurate, but existing
Chip production process there is also some defects.
First, the degree of automation of existing traditional chip production assembly line is relatively low, and process portion is using manually-operated
Mode.Due to the operating error of operating personnel, it is easy to cause production error even production accident, while cause the good of product
Product rate is not also high.
Secondly, manually-operated production efficiency is relatively low, when the hysteresis quality of a process can cause the production of whole assembly line into
Degree is slow, and yield is not high.
Again, it is essentially all that a station corresponds to one even existing traditional chip automation production flow line
Automation equipment, integrated level be not high.And it is also not strong for the suitability of the chip of different model, in the core of production different model
When piece, generally require that existing automated production equipment reequip on a large scale to adjust the core that could be adapted to different model
Piece causes the equipment cost of its production line to increase.
In conclusion currently existing traditional chip production pattern has been unable to meet growing and complicated kind chip
Quantity on order and indent structure, there is an urgent need for a kind of new chip mechanized production systems for this field to solve the above problems.
Invention content
It is an object of the present invention to provide a kind of chip automated production equipment, system and method, improve existing
The problem for having consumable chip production efficiency low improves the production efficiency of chip.
It is another object of the present invention to provide a kind of chip automated production equipment, system and method, improve
The high problem of existing consumable chip production fault rate, improves the yields of chip production, avoids the generation of production accident.
It is another object of the present invention to provide a kind of chip automated production equipment, system and method, improve
The degree of automation of chip production improves yield to accelerate manufacturing schedule.
It is another object of the present invention to provide a kind of chip automated production equipment, system and method, improve
The suitability of chip automatic production line, repacking adjustment on a large scale need not be carried out to production equipment can realize pair simultaneously
In the processing of different model chip, while also reducing the scrap build cost of production line.
Therefore, to achieve the goals above, the present invention provides a kind of chip automated production equipment, for being carried out to chip
Automated production comprising：
Device control module；
Reading and writing code module, the first delivery module, mark module, the second delivery module, vision-based detection module and third pass
Send module；
The wherein described reading and writing code module, first delivery module, the mark module, second delivery module, institute
It states vision-based detection module and the third delivery module to communicate to connect with the device control module respectively, wherein the reading
It writes a yard module and is provided through probe corresponding with chip reading and writing code contact and code information is burned onto chip and is verified, institute
It states mark module and is provided through laser and print the identification information to chip, the vision-based detection module is set to chip
Appearance detection is carried out, first delivery module is set is sent to the mark module by chip from the reading and writing code module,
Second delivery module is set is sent to the vision-based detection module, the third transmission by chip from the mark module
Module, which is set, to be removed from the vision-based detection module by chip and is sent to subsequent processing.
According to one embodiment of present invention, the chip automated production equipment further comprises at least one intelligent fixture
With signal identification module, wherein the intelligence fixture includes signal element, the signal element, which is set, can store different shaped
Number corresponding identification information of chip, the signal identification module, which is set, can identify identification information in the signal element simultaneously
The reading and writing code module is controlled by the device control module and the mark module is processed the chip of respective model.
According to one embodiment of present invention, the intelligent fixture further comprises an adjustment unit, the adjustment unit
By modular assembled so that the fixture adapts to the layout of different scale chips and different layout numbers.
Preferably, first delivery module, second delivery module and the third delivery module are implemented as
Multi-joint mechanical arm.
Preferably, the signal element is RFID tag, and the signal identification unit is RFID reader.
According to one embodiment of present invention, the reading and writing code module includes interface unit, and the reading and writing code module passes through
The interface unit realizes the update of code.
According to one embodiment of present invention, the chip automated production equipment further comprises interactive module, described
Interactive module is communicated to connect with the device control module, and the interactive module includes display unit and operating unit, wherein institute
It states display unit to be set to condition of production progress real-time display, the operating unit is set for administrative staff to described automatic
Change equipment and carries out manual intervention operation.
According to one embodiment of present invention, the chip automated production equipment further comprises tearing plate module and a packet open
Die-filling piece, plate module and the packaging module of tearing open is communicated to connect with the device control module respectively, described to tear plate module open
It is arranged for splitting full page chip, the packaging module is set packs the chip after fractionation again.
According to another aspect of the present invention, the present invention further provides a chip mechanized production systems comprising：
Main control module；
Storage module；
ERP database；
Communication module；And
The chip automated production equipment, wherein the device control module of the chip automated production equipment is logical
It crosses the communication module to communicate to connect with the main control module, the storage module respectively, the main control module and the ERP numbers
It is realized and is communicated to connect by the communication module according to library, obtained from the ERP database wherein the main control module is set
Production information simultaneously generates a mission bit stream after processing, and the main control module is by the production information and the mission bit stream
It is sent to the device control module of the chip automated production equipment simultaneously, the chip automated production equipment is set
It sets and chip is produced and processed automatically according to the mission bit stream and the production information.
According to one embodiment of present invention, the production information includes order information, material information, code information and mark
Know information.
According to one embodiment of present invention, the storage chip automated production equipment production is set in the storage module
Raw facility information, the facility information include the production quantity that chip is completed, device exception information, material information, write-read
Code result information, vision-based detection result information etc..
According to one embodiment of present invention, the mission bit stream refers to the main control module according to the production information pair
The production schedule that the chip automated production equipment is formulated includes the layout information split to the intelligent fixture,
Production time etc..
Other side under this invention, the present invention further provides a kind of chip automatic production methods comprising such as
Lower step：
(A) main control module 10 starts creation data crawl decomposition thread；
(B) judge whether chip automated production equipment 50 has connected with main control module 10, if：It has connected, described in startup
Chip automated production equipment 50；If
It is not connected, wait for the chip automated production equipment 50 to be attached with the main control module 10；
(C) judge whether the chip automated production equipment 50 disconnects with the main control module 10, if：
It does not disconnect, automated production is carried out to chip；If
It has been disconnected that, wait for the chip automated production equipment 50 to be attached with the main control module 10.
The above and other purposes of the present invention, feature, advantage will in the following detailed description, attached drawing and appended
Claim it is further clear.
Description of the drawings
Fig. 1 is the configuration schematic diagram of chip mechanized production system according to a preferred embodiment of the present invention；
Fig. 2 is that the chip automated production of chip mechanized production system according to a preferred embodiment of the present invention is set
Standby configuration schematic diagram；
Fig. 3 is that the chip automated production of chip mechanized production system according to a preferred embodiment of the present invention is set
The schematic diagram of standby intelligent fixture；
Fig. 4 is the flow diagram of chip automatic production method according to a preferred embodiment of the present invention；
Fig. 5 is another flow diagram of chip automatic production method according to a preferred embodiment of the present invention；
Fig. 6 is another flow diagram of chip automatic production method according to a preferred embodiment of the present invention；
In figure：Main control module 10；Storage module 20；ERP database 30；Communication module 40；Chip automated production equipment
50；Reading and writing code module 51；Burning unit 511；Authentication unit 512；Interface unit 513；First delivery module 52；Mark module
53；Second delivery module 54；Vision-based detection module 55；Third delivery module 56；Signal identification module 57；Device control module
58；Intelligent fixture 59；Signal element 591；Adjustment unit 592；Interactive module 501；Display unit 5011；Operating unit 5012；
Tear plate module 502 open；Pack module 503.
Specific implementation mode
In the following, in conjunction with attached drawing and specific implementation mode, invention is described further, it should be noted that in not phase
Under the premise of conflict, new implementation can be formed between various embodiments described below or between each technical characteristic in any combination
Example.
It is described below for disclosing the present invention so that those skilled in the art can realize the present invention.It is excellent in being described below
Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It defines in the following description
The present invention basic principle can be applied to other embodiments, deformation scheme, improvement project, equivalent program and do not carry on the back
Other technologies scheme from the spirit and scope of the present invention.
It will be understood by those skilled in the art that the present invention exposure in, term " longitudinal direction ", " transverse direction ", "upper",
The orientation or position of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside"
Relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, rather than
Indicate or imply that signified device or element must have a particular orientation, with specific azimuth configuration and operation, therefore above-mentioned
Term is not considered as limiting the invention.
It is understood that term " one " is interpreted as " at least one " or " one or more ", i.e., in one embodiment,
The quantity of one element can be one, and in a further embodiment, the quantity of the element can be multiple, and term " one " is no
It can be interpreted as the limitation to quantity.
Referring to Fig. 1 and Fig. 2 of attached drawing, chip mechanized production system according to a preferred embodiment of the present invention will be
It is elucidated in following description, wherein the chip mechanized production system includes main control module 10, storage module 20, ERP
Database 30, communication module 40 and chip automated production equipment 50, wherein the chip automated production equipment 50 includes
Device control module 58, respectively with the device control module 58 communicate to connect reading and writing code module 51, the first delivery module 52,
Mark module 53, the second delivery module 54, vision-based detection module 55, third delivery module 56, signal identification module 57, intelligence folder
Tool 59, wherein the device control module 58 of the chip automated production equipment 50 by the communication module 40 respectively with
The main control module 10, the storage module 20 communicate to connect, and the main control module 10 passes through described with the ERP database 30
Communication module 40 realizes communication connection.
The main control module 10, which is set, to be obtained production information from the ERP database 30 and is generated after processing
One mission bit stream is sent to the device control module 58 of the chip automated production equipment 50, the device control module
58 are set according to the mission bit stream and the production information control reading and writing code module 51, first delivery module
52, the mark module 53, second delivery module 54, the vision-based detection module 55, the third delivery module 56, institute
State signal identification module 57 and production and processing that the intelligent fixture 59 automates chip.
Specifically, the production information in the ERP database 30 includes order information, material information, code
Information and identification information etc..The main control module 10 is set from transferring the production information in the ERP data and carrying out
The mission bit stream is generated after reason, the mission bit stream and the production information are sent to the core by the main control module 10
The device control module 58 of piece automated production equipment 50.The mission bit stream refers to the main control module 10 according to described
The production schedule that production information formulates the chip automated production equipment 50, including the intelligent fixture 59 is torn open
The layout information divided, production time etc..
For further, the reading and writing code module 51 includes burning unit 511, authentication unit 512 and interface unit
513.Code information in the production information is sent to described by the device control module 58 by the interface unit 513
The burning unit 511 of reading and writing code module 51.The burning unit 511 is provided through corresponding with chip reading and writing code contact
The code information is burned onto chip by probe.The authentication unit 512 is provided through corresponding with chip reading and writing code contact
The code that probe is burned onto chip to the burning unit 511 is verified, check the code for being burned onto chip it is whether complete and
Correctly.The code information for receiving and transmitting from the device control module 58 is set with to the reading in the interface unit 513
The code information write in yard module 51 is updated.
When chip is in the burning and verification of 51 completion code of reading and writing code module, first delivery module 52 is set
Chip is sent to the mark module 53 from the reading and writing code module 51.The device control module 58 will be in production information
Beacon information is sent to the mark module 53, the mark module 53 be provided through laser by the beacon information print to
Chip.Mark process is the relevant informations such as the process, such as marked product model that chip is marked.
When chip is after the mark module 53 is completed to mark, second delivery module 54 is set chip from described
Mark module 53 is sent to the vision-based detection module 55.The vision-based detection module 55 is set carries out appearance inspection to chip
It surveys, for example marks whether clearly, whether contact complete etc. without short circuit or paving copper.The third delivery module 56 is set
Chip is removed from the vision-based detection module 55 and is sent to subsequent processing.
Preferably, because the write-read code contact of chip and the identified surface of mark may be not at the same face of chip, that is, work as
When chip is transported to the mark module 53 from the reading and writing code module 51, need to carry out turn-over to chip, while in order to save
The about device space, first delivery module 52, second delivery module 54 and the third delivery module 56 are carried out
For multi-joint mechanical arm.Setting in this way can realize the overturning of chip and save space.
Preferably, the chip automated production equipment 50 further comprises the intelligent fixture 59 and the signal identification
Module 57, the intelligence fixture 59 includes signal element 591 and adjustment unit 592.The intelligence fixture 59 is provided for solid
Determine full page chip.The signal element 591, which is set, stores the corresponding identification information of different model chip, the signal identification
Module 57, which is set, can identify the identification information in the signal element 591 and control institute by the device control module 58
It states reading and writing code module 51 and the mark module 53 is processed the chip of respective model.In this way, Ke Yishi
Now the chip of different model in same version chip is carried out while being processed.
Include illustratively, on full page chip M*N chip, it is assumed that M*N=10*10 referring to Fig. 3 of attached drawing.If 10*
The chip of 10 quantity is the same prodigious chip of model yield, and the signal element 591, which is set, stores the corresponding knowledge of the model
Other information, the signal identification module 57 identify the identification information of the model chip and are controlled by the device control module 58
The reading and writing code module 51 and the mark module 53 directly carry out write-read code to the model chip that 10*10 is a full page and beat
Mark, considerably increases production capacity.
It is less than 100 model chip for demand, polytypic chip layout operation can be carried out, such as 1-20 corresponds to core
The identification information of piece is A, and it is A1 to need the code table being written, and it is A2 to need the mark information carried out；21-50 corresponds to the identification of chip
Information is B, and it is B1 to need the code table being written, and it is B2 to need the mark information carried out, and the identification information that 51-100 corresponds to chip is
C, it is C1 to need the code table being written, and it is C2 to need the mark information carried out.Described identification information A, B, C are stored in described simultaneously
In signal element 591, when it is A that the signal identification unit, which recognizes the identification information, the signal identification unit passes through
The device control module 58 controls the reading and writing code module 51 and code table A1 is written to 1-20 chips, and controls the mark module
53 couples of 1-20 chip mark mark signals A2；When it is B that the signal identification unit, which recognizes the identification information, the signal
Recognition unit controls the reading and writing code module 51 by the device control module 58 and code table B1 is written to 21-50 chips, and controls
The mark module 53 is made to 21-50 chip mark mark signals B2；When the signal identification unit recognizes the identification letter
When breath is C, the signal identification unit controls the reading and writing code module 51 to 51-100 cores by the device control module 58
Code table C1 is written in piece, and controls the mark module 53 to 51-100 chip mark mark signals C2.Pass through the intelligence as a result,
Fixture 59 and the signal identification module 57 manufacture while realizing Multiple Type chip, substantially increase production capacity and automation
The working efficiency of equipment.
It will be appreciated by persons skilled in the art that the code information of different model chip and beacon information can pass through institute
It states main control module 10 and the device control module 58 while being sent to the reading and writing code module 51 and the mark module 53.
Those skilled in the art, which will also be appreciated that, can be arranged multiple intelligent fixtures 59, each intelligence
The signal element 591 of fixture 59 stores the identification information of different model chip, when further reducing the making of different chips
Between, improve production capacity.The correspondence of the different identification information of the signal element 591 and different model chip can be by described
Main control module 10 is preset.The main control module 10 is set according to the order information in the ERP database 30
Generate optimal layout scheme.
It is noted that the adjustment unit 592 can make the intelligent fixture 59 suitable by modular assembly
Answer the layout of different scale chips and different layout numbers.It will be appreciated by persons skilled in the art that the modular spelling
Dress refers to so that the intelligent fixture 59 is adapted to the spelling of different scale chips by adjusting the length and width dimensions of the intelligent fixture 59
Version and different layout numbers.
Preferably, the signal element 591 is implemented as RFID tag, and the signal identification module 57 is arranged to RFID
Reader.
Further, the chip automated production equipment 50 further comprises an interactive module 501, the interactive module
501 communicate to connect with the device control module 58.The interactive module 501 includes a display unit 5011 and an operating unit
5012, wherein the display unit 5011 is arranged for showing the operating result of each module, the condition of production is shown in real time
Show, such as the production quantity of chip is completed, device exception information, material information, write-read code result information, vision-based detection result
Information etc..
Preferably, the display unit 5011 is implemented as liquid crystal display.
The operating unit 5012 is set carries out manual intervention operation for administrative staff to the automation equipment, such as
To the start-up and shut-down control etc. of the chip automated production equipment 50.
Preferably, the operating unit 5011 is implemented as virtual key.
Preferably, the chip automated production equipment 50 further comprises that tearing plate module 502 and one open packs module
503, plate module 502 and the packaging module 503 of tearing open is communicated to connect with the device control module 58 respectively.It is described to tear plate open
Module 502 is arranged for splitting full page chip, and the packaging module 503, which is set, carries out again the chip after fractionation
Packaging.
It will be appreciated by persons skilled in the art that the plate module 502 and the packaging module 503 of tearing open can be carried out
The mechanical structure that full page chip is split and packed can be realized to be any.
Further, the storage module 20, which is set, stores the equipment letter that the chip automated production equipment 50 generates
Breath, the facility information include the production quantity that chip is completed, device exception information, material information, write-read code result information,
Vision-based detection result information etc..
Referring to Fig. 4 of attached drawing, the present invention further provides a kind of chip automatic production methods comprising following steps：
(A) main control module 10 starts creation data crawl decomposition thread；
(B) judge whether chip automated production equipment 50 has connected with main control module 10, if：
It has connected, starts the chip automated production equipment 50；If
It is not connected, wait for the chip automated production equipment 50 to be attached with the main control module 10；
(C) judge whether the chip automated production equipment 50 disconnects with the main control module 10, if：
It does not disconnect, automated production is carried out to chip；If
It has been disconnected that, wait for the chip automated production equipment 50 to be attached with the main control module 10.Specifically, institute
Step (A) is stated to include the following steps：
(A1) main control module 10 obtains production information from ERP database 30, and the production information is included at least and ordered
Single information, material information, code information and identification information；
(A2) allocation processing is decomposed to the production information and generates a mission bit stream, the mission bit stream includes at least one
Layout information.
Further, the step (A2) further comprises step (A21)：Judge whether have in the ERP database 30
Undecomposed order information, then：
When there is no undecomposed order information in the ERP database 30, generated according to current decomposed order information
One layout information；
When there is undecomposed order information in the ERP database 30, judge whether to reach fixed point item obtainment time, then：
When item obtainment time has arrived, generating a neck according to undecomposed order information expects information and a layout information；
When item obtainment time does not arrive, a layout information is generated according to current decomposed order information.
In this way, it is taken into account while generating layout information according to the existing order information disassembled
Item obtainment time prevents material, personal management caused by undecomposed order information frequently leads material chaotic.
Further, further comprise the steps before the step (C)：
(B1) it is judged whether or not unfinished order, if：
There are the order not produced, the main control module 10 to send the corresponding production information and the layout information to institute
Chip automated production equipment 50 is stated to be processed to chip；If
Without the order not produced, the new production information to be received and the layout information are waited；
(B2) judge whether present material produces to finish, if：
It does not produce and finishes, 58 sending device information of the device control module to the storage module 20, the equipment letter
Breath includes at least the production quantity that chip is completed, device exception information, material information, write-read code result information, vision-based detection
Result information etc.；If
It having produced and has finished, the device control module 58 judges whether there is other materials and does not produce, if：
There is other materials not produce, the device control module 58 sends non-production material information to the storage module
20；If
No other materials does not produce, terminates the communication of the chip automated production equipment 50 and the main control module 10；
(B3) main control module 10 receive and according in the storage module 20 the facility information and described do not give birth to
Production material information judges whether production mistake, if：
Production development mistake, the main control module 10 are believed to 20 write error information of the storage module and normal production
Breath；If
Normal production information is written to the storage module 20 in non-production development mistake, the main control module 10.
It should be understood by those skilled in the art that the embodiment of the present invention shown in foregoing description and attached drawing is only used as illustrating
And it is not intended to limit the present invention.The purpose of the present invention has been fully and effectively achieved.The function and structural principle of the present invention exists
It shows and illustrates in embodiment, under without departing from the principle, embodiments of the present invention can have any deformation or modification.
Claims (10)
1. chip automated production equipment, for carrying out automated production to chip, which is characterized in that including：
Device control module；
Reading and writing code module, the first delivery module, mark module, the second delivery module, vision-based detection module and third transmit mould
Block；
The wherein described reading and writing code module, the mark module, second delivery module, described regards first delivery module
Feel that detection module and the third delivery module are communicated to connect with the device control module respectively, wherein the reading and writing code
Module is provided through probe corresponding with chip reading and writing code contact and code information is burned onto chip and is verified, described to beat
Mark module is provided through laser and prints the identification information to chip, and the vision-based detection module, which is set, carries out chip
Appearance detects, and first delivery module is set is sent to the mark module by chip from the reading and writing code module, described
Second delivery module is set is sent to the vision-based detection module, the third delivery module by chip from the mark module
It is set and chip is removed from the vision-based detection module and is sent to subsequent processing.
2. chip automated production equipment as described in claim 1, which is characterized in that further comprise at least one intelligent fixture
With signal identification module, wherein the intelligence fixture includes signal element and adjustment unit, the signal element is set can
The corresponding identification information of different model chip is stored, the signal identification module is set and can identify in the signal element
Identification information simultaneously controls the core of the reading and writing code module and the mark module to respective model by the device control module
Piece is processed, and the adjustment unit is by the modular assembled layout for making the fixture adapt to different scale chips and not
Same layout number.
3. chip automated production equipment as claimed in claim 2, which is characterized in that first delivery module, described the
Two delivery modules and the third delivery module are implemented as multi-joint mechanical arm, wherein the signal element is marked for RFID
Label, the signal identification unit is RFID reader, wherein the reading and writing code module includes interface unit, the reading and writing code module
The update of code is realized by the interface unit, wherein the chip automated production equipment further comprises interactive module,
The interactive module and the device control module communicate to connect, and the interactive module includes display unit and operating unit,
Described in display unit be set real-time display carried out to the condition of production, the operating unit is set for administrative staff to described
Automation equipment carries out manual intervention operation, wherein the chip automated production equipment further comprises tearing plate module and a packet open
Die-filling piece, plate module and the packaging module of tearing open is communicated to connect with the device control module respectively, described to tear plate module open
It is arranged for splitting full page chip, the packaging module is set packs the chip after fractionation again.
4. chip mechanized production system, which is characterized in that including：
Main control module；
Storage module；
ERP database；
Communication module；And
Chip automated production equipment as described in any in claims 1 to 3, wherein the chip automated production equipment
The device control module is communicated to connect with the main control module, the storage module respectively by the communication module, described
Main control module and the ERP database realized by the communication module and communicated to connect, wherein the main control module be set from
Production information is obtained in the ERP database and generates a mission bit stream after processing, and the main control module is by the life
Production information and the mission bit stream are sent to the device control module of the chip automated production equipment, the core simultaneously
Piece automated production equipment is set produces and processes chip according to the mission bit stream and the production information automatically,
Described in production information include order information, material information, code information and identification information, the mission bit stream includes to described
The storage chip automated production is set in the layout information that intelligent fixture is split, production time, the storage module
The facility information that equipment generates, the facility information include the production quantity that chip is completed, write-read code result information, vision inspection
Survey result information.
5. chip automatic production method is suitable for the chip mechanized production system described in claim 4, which is characterized in that
Include the following steps：
(A) main control module starts creation data crawl decomposition thread；
(B) judge whether chip automated production equipment connect with main control module, if：
It has connected, starts the chip automated production equipment communication thread；If
It is not connected, wait for the chip automated production equipment to be attached with the main control module；
(C) judge whether the chip automated production equipment disconnects with the main control module, if：
It does not disconnect, automated production is carried out to chip；If
It has been disconnected that, wait for the chip automated production equipment to be attached with the main control module.
6. chip automatic production method as claimed in claim 5, which is characterized in that the step (A) includes the following steps：
(A1) main control module obtains production information from ERP database, and the production information includes order information, material letter
Breath, code information and identification information it is one or more；
(A2) allocation processing is decomposed to the production information and generates a mission bit stream, the mission bit stream includes an at least layout
Information.
7. chip automatic production method as claimed in claim 6, which is characterized in that the step (A2) further comprises walking
Suddenly (A21)：Judge whether there is undecomposed order information in the ERP database, then：
When not having undecomposed order information in the ERP database, a layout is generated according to current decomposed order information
Information；
When there is undecomposed order information in the ERP database, judge whether to reach fixed point item obtainment time, then：
When item obtainment time has arrived, generating a neck according to undecomposed order information expects information and a layout information；
When item obtainment time does not arrive, a layout information is generated according to current decomposed order information.
8. chip automatic production method as claimed in claims 6 or 7, which is characterized in that in the advance one of the step (C)
Step includes the following steps (B1)：It is judged whether or not unfinished order, if：
There are the order not produced, the main control module to send the corresponding production information and the layout information to the chip
Automated production equipment is to be processed chip；If
Without the order not produced, the new production information to be received and the layout information are waited.
9. chip automatic production method as claimed in claim 8, which is characterized in that in the step (B1) and the step
(C) further comprise step (B2) between：Judge whether present material produces to finish, if：
It does not produce and finishes, the device control module sending device information to the storage module, the facility information at least wraps
Include the production quantity that chip is completed, device exception information, material information, write-read code result information, vision-based detection result information
Deng；If
It having produced and has finished, the device control module judges whether there is other materials and does not produce, if：
There is other materials not produce, the device control module sends non-production material information to the storage module；If
No other materials does not produce, terminates the communication of the chip automated production equipment and the main control module.
10. chip automatic production method as claimed in claim 9, which is characterized in that in the step (B2) and the step
Suddenly further comprise step (B3) between (C)：
The main control module receive and according in the storage module the facility information and the non-production material information sentence
It is disconnected whether to produce mistake, if：
Production development mistake, the main control module is to the storage module write error information and normal production information；If
Normal production information is written to the storage module in non-production development mistake, the main control module.
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