CN109103134A - The label streamlined Preparation equipment of chip - Google Patents

The label streamlined Preparation equipment of chip Download PDF

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Publication number
CN109103134A
CN109103134A CN201811017530.1A CN201811017530A CN109103134A CN 109103134 A CN109103134 A CN 109103134A CN 201811017530 A CN201811017530 A CN 201811017530A CN 109103134 A CN109103134 A CN 109103134A
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CN
China
Prior art keywords
fixed
chip
printing
print head
cylinder
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Granted
Application number
CN201811017530.1A
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Chinese (zh)
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CN109103134B (en
Inventor
张晓明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangmen Boyi Intellectual Property Operation Co ltd
Original Assignee
Wenzhou Branch Robot Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to CN201811017530.1A priority Critical patent/CN109103134B/en
Publication of CN109103134A publication Critical patent/CN109103134A/en
Application granted granted Critical
Publication of CN109103134B publication Critical patent/CN109103134B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67282Marking devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Specific Conveyance Elements (AREA)
  • Labeling Devices (AREA)

Abstract

The present invention relates to industrial automation equipments, more specifically to a kind of Automatic Conveying and storage device for chip.The label streamlined Preparation equipment of chip, comprising: for pio chip body converge track, the receiving pipeline for receiving chip body, the rotating machine arm for arranging and carrying chip body, for chip body progress label printing printing mechanism, for the corrected adjusting mechanism in position to chip body.The label streamlined Preparation equipment of chip of the present invention, Automatic Conveying and manufacture for realizing chip.

Description

The label streamlined Preparation equipment of chip
Technical field
The present invention relates to industrial automation equipments, equip more specifically to a kind of automated manufacturing for chip.
Background technique
Industrial automation is that automatic control, automatic regulating apparatus are widely used in the industrial production, to replace artificial behaviour The trend that vertical machine and machine architecture are processed.Under the conditions of industrial production automation, people only look after indirectly and Supervision machine is produced.Industrial automation can be divided by its developing stage: (1) semi-automatic.I.e. part is using automatic control System and automatic device, and another part is then produced by manual operation machine.(2) full-automatic.Refer in production process all Process, including feeding, blanking, handling etc. are all not required to very important person and directly carry out production operation (people only keeps an eye on and supervises indirectly Machine run), and continuously, repeatedly produce one or a collection of product automatically by machine.
Industrial automation technology is a kind of with control theory, instrument and meter, computer and other information technology, to industry Production process realize detection, control, optimization, scheduling, management and decision, reach increase yield, improve quality, reduce consumption, really The comprehensive high-tech of the purpose of ensuring safety, including Industrial Automation Software, hardware and system three parts.Industrial automation skill Art mainly solves production efficiency and consistency problem as one of most important technology in 20th century modern manufacturing field.No matter Flexible, flexible and customization enterprise is still pursued by high speed high-volume manufacturing enterprise, it is necessary to by the application of automatic technology. Automated system itself does not create benefit directly, but it plays the effect of being obviously improved to enterprise production process:
(1) safety of production process is improved;
(2) production efficiency is improved;
(3) product quality is improved;
(4) raw material, the energy loss of production process are reduced.
In process of production, the carrying and conveying of traditional chip are all manual modes, cause the consistency of product low, The automated production that chip manufacturing operation is realized using industrial automation technology, is had important practical significance.
Summary of the invention
The object of the present invention is to provide a kind of label streamlined Preparation equipments of chip, apply the manufacture in chip Cheng Zhong;The label streamlined Preparation equipment of chip of the present invention, the automation for realizing chip are put and are conveyed.
A kind of label streamlined Preparation equipment of chip, comprising: converge track, for receiving core for pio chip body The receiving pipeline of sheet body, the rotating machine arm for arranging and carrying chip body, for the carry out label printing to chip body Printing mechanism, for the corrected adjusting mechanism in position to chip body;
The printing mechanism includes: printing support, print head up-down mechanism, pattern delivering mechanism, above and below the print head Movement mechanism, pattern delivering mechanism are fixed on the printing support, and the print head up-down mechanism driving print head carries out It moves up and down, the pattern delivering mechanism is used to provide pattern for the print head;The print head up-down mechanism includes: Print head upper and lower air cylinders, print head guide rail, printing head substrate, Turbogrid plates, opposite type sensor, print head, printing head slider, it is described The cylinder block of print head upper and lower air cylinders, printing head slider are fixed on the printing support, and the print head guide rail is movably connected on The printing head slider, one end of the print head guide rail are fixed on the printing head substrate, the print head upper and lower air cylinders The end of piston rod is fixed on the printing head substrate, and the print head is fixed on the lower part of the printing head substrate;The grid Panel is fixed on the printing head substrate, and the opposite type sensor is fixed on the printing support, the Turbogrid plates and passes to penetrating Sensor matches;The pattern delivering mechanism includes: oil can, pattern slide plate, pattern cylinder, oil can baffle, the pattern slide plate It is movably connected on the printing support by linear guide, it is sliding that the end of the piston rod of the pattern cylinder is fixed on the pattern Plate, the oil can are movably connected on the pattern slide plate, and the oil can baffle is fixed on the printing support, the oil can baffle For preventing the oil can from being taken away by the pattern slide plate.
Preferably, the adjusting mechanism includes: that front limit baffle, front apron cylinder, V-type groove, side push and block plate, side push away gas Cylinder, the end of the piston rod of the front apron cylinder are fixed on the front limit baffle, set in front of the front limit baffle It is equipped with the V-type groove, the V-type groove and the front limit baffle match;The end of the piston rod of the side push cylinder It is fixed on the side push and block plate, the side push and block plate is for chip body to be fitly aligned.
Preferably, the track that converges includes: track support, conveyer belt, No.1 correction cylinder, No. two corrections cylinders, three Number correction cylinder, transmission shaft coupling, half of bracket, excludes cylinder, excludes push plate, guide pad, the track branch transmission translator Frame is fixed on the workbench, and the conveyer belt is movably connected on the track support, and the transmission translator passes through the biography Shaft coupling is sent to drive the conveyer belt movement;The No.1 correction gas of the position for correcting chip is provided on the track support Cylinder, No. two correction cylinders, No. three correction cylinders;The end of the track support is provided with the half of bracket, described one side of something Bracket holds the both ends of chip, and the centre of one side of something bracket is provided with the channel for passing through the rotating machine arm;It is described The cylinder block of exclusion cylinder, guide pad are fixed on the track support, and the exclusion push plate is movably connected on the guide pad, institute It states and excludes the end that push plate is fixed on the exclusion cylinder piston rod, chip can be accommodated by being provided in the exclusion push plate Pusher cavity.
The receiving pipeline includes: to receive bracket, secondary conveyer belt, and the pair conveyer belt is movably connected on the receiving branch On frame, the quantity of the pair conveyer belt is two, and at being arranged in juxtaposition, the centre of the pair conveyer belt is provided with the pair conveyer belt For passing through the channel of the rotating machine arm;
The rotating machine arm includes: turning motor, Cam splitter, rotary flange, rotary support, full wind-up, described convex The shell of wheel divider is fixed on the rotary support, and the output shaft fixed connection of the turning motor is in the defeated of the Cam splitter Enter axis, the rotary flange is fixed on the output flange of the Cam splitter;The Cam splitter is in the revolution electricity 90 degree are rotated under the driving of machine every time;The quantity of the full wind-up is four, and radial equipartition is on the rotary flange, institute Stating full wind-up array has vacuum chuck.
The full wind-up will be located at described from the lower part of the half of bracket to the ionized motion of the half of bracket The chip of half of bracket is sucked;The full wind-up reaches the top of the secondary conveyer belt, and the full wind-up discharges chip, core Piece is fallen on the secondary conveyer belt.
Detailed description of the invention
Fig. 1 is the general structure schematic diagram of the label streamlined Preparation equipment of chip of the present invention;
Fig. 2,3 be chip of the present invention label streamlined Preparation equipment printing mechanism structural schematic diagram;
Fig. 4,5,6 are the structural schematic diagrams for converging track of the label streamlined Preparation equipment of chip of the present invention;
Fig. 7 is the structural schematic diagram of the receiving pipeline of the label streamlined Preparation equipment of chip of the present invention.
Marked in the figure:
112 track supports, 113 conveyer belts, 114 No.1s correct cylinder, 115 No. two correction cylinders, 116 No. three correction gas Cylinder, 117 transmission translators, 118 transmission shaft couplings, 119 half of brackets, 120 exclude cylinder, 121 exclusion push plates, 122 Guide pad, 123 pusher cavitys, 130 rotating machine arms, 131 turning motors, 132 harmonic speed reducers, 133 rotary flanges, 134 rotary supports, 135 full wind-ups, 140 receive pipeline, 141 to receive bracket, 142 secondary conveyer belts, 145 adjusting machines Structure, 146 front limit baffles, 147 front apron cylinders, 148 V-type grooves, 149 side push and block plates, 150 side push cylinder, 155 prints Brush mechanism, 156 print head up-down mechanisms, 157 pattern delivering mechanisms, 160 print head upper and lower air cylinders, 161 print heads Guide rail, 162 printing head substrates, 163 Turbogrid plates, 164 opposite type sensors, 165 print heads, 166 printing head sliders, 167 Printing support, 170 oil cans, 171 pattern slide plates, 172 pattern cylinders.
Specific embodiment
The present invention is described in further detail below in conjunction with attached drawing, but does not constitute any limitation of the invention, Similar element numbers represent similar element in attached drawing.As described above, the present invention provides a kind of label streamlineds of chip Preparation equipment is applied in the manufacturing process of chip;The label streamlined Preparation equipment of chip of the present invention, for realizing chip Automatic Conveying and manufacture.
Fig. 1 is the general structure schematic diagram of the label streamlined Preparation equipment of chip of the present invention, and Fig. 2,3 are chips of the present invention Label streamlined Preparation equipment the structural schematic diagram for converging track, Fig. 4 be chip of the present invention label streamlined preparation set The structural schematic diagram of standby receiving pipeline.
A kind of label streamlined Preparation equipment of chip, comprising: converge track 103, for connecing for pio chip body 7 The receiving pipeline 140 of nano chip body 7, the rotating machine arm 130 for arranging and carrying chip body 7, for chip body 7 Carry out the printing mechanism 155 of label printing, for the corrected adjusting mechanism 145 in position to chip body 7;
The printing mechanism 155 includes: printing support 167, print head up-down mechanism 156, pattern delivering mechanism 157, institute State print head up-down mechanism 156, pattern delivering mechanism 157 is fixed on the printing support 167, fortune above and below the print head Motivation structure 156 drives print head 165 to move up and down, and the pattern delivering mechanism 157 is used to provide for the print head 165 Pattern;The print head up-down mechanism 156 includes: print head upper and lower air cylinders 160, print head guide rail 161, printing head substrate 162, Turbogrid plates 163, opposite type sensor 164, print head 165, printing head slider 166, the gas of the print head upper and lower air cylinders 160 Cylinder body, printing head slider 166 are fixed on the printing support 167, and the print head guide rail 161 is movably connected on the print head Sliding block 166, one end of the print head guide rail 161 are fixed on the printing head substrate 162, the print head upper and lower air cylinders 160 The end of piston rod be fixed on the printing head substrate 162, the print head 165 is fixed on the printing head substrate 162 Lower part;The Turbogrid plates 163 are fixed on the printing head substrate 162, and the opposite type sensor 164 is fixed on the printing support 167, the Turbogrid plates 163 and opposite type sensor 164 match;The pattern delivering mechanism 157 includes: oil can 170, pattern cunning Plate 171, pattern cylinder 172, oil can baffle 173, the pattern slide plate 171 are movably connected on the printing branch by linear guide Frame 167, the end of the piston rod of the pattern cylinder 172 are fixed on the pattern slide plate 171, and the oil can 170 is flexibly connected In the pattern slide plate 171, the oil can baffle 173 is fixed on the printing support 167, and the oil can baffle 173 is for preventing Only the oil can 170 is taken away by the pattern slide plate 171.
More specifically, the adjusting mechanism 145 include: front limit baffle 146, front apron cylinder 147, V-type groove 148, Side push and block plate 149, side push cylinder 150, the end of the piston rod of the front apron cylinder 147 are fixed on the front limit baffle 146, the front of the front limit baffle 146 is provided with the V-type groove 148, the V-type groove 148 and the front limit Baffle 146 matches;The end of the piston rod of the side push cylinder 150 is fixed on the side push and block plate 149, the side push and block plate 149 for chip body 7 to be fitly aligned.
More specifically, the track 103 that converges includes: track support 112, conveyer belt 113, No.1 correction cylinder 114, two Number correction 115, No. three correction cylinders 116 of cylinder, transmission translator 117, transmission shaft coupling 118, half of bracket 119, exclusion gas Cylinder 120 excludes push plate 121, guide pad 122, and the track support 112 is fixed on the workbench 65, and the conveyer belt 113 is living Dynamic to be connected to the track support 112, the transmission translator 117 drives the conveyer belt by the transmission shaft coupling 118 113 movements;It is provided on the track support 112 and corrects 114, No. two schools of cylinder for the No.1 of the position of correcting chip body 7 115, No. three correction cylinders 116 of positive cylinder;The end of the track support 112 is provided with the half of bracket 119, described half Side bracket 119 holds the both ends of chip body 7, and the centre of one side of something bracket 119 is provided with for by the rotating machine arm 130 channel;The cylinder block for excluding cylinder 120, guide pad 122 are fixed on the track support 112, the exclusion push plate 121 are movably connected on the guide pad 122, and the exclusion push plate 121 is fixed on the end for excluding 120 piston rod of cylinder, The pusher cavity 123 that can accommodate chip body 7 is provided in the exclusion push plate 121.
The receiving pipeline 140 includes: to receive bracket 141, secondary conveyer belt 142, and the pair conveyer belt 142 is flexibly connected In on the receiving bracket 141, the quantity of the pair conveyer belt 142 is two, and the pair conveyer belt 142 is at being arranged in juxtaposition, institute The centre for stating secondary conveyer belt 142 is provided with for the channel by the rotating machine arm 130;
The rotating machine arm 130 include: turning motor 131, Cam splitter 132, rotary flange 133, rotary support 134, Full wind-up 135, the shell of the Cam splitter 132 are fixed on the rotary support 134, the turning motor 131 it is defeated Shaft is fixed on the input shaft of the Cam splitter 132, and the rotary flange 133 is fixed on the Cam splitter 132 On output flange;The Cam splitter 132 rotates 90 degree under the driving of the turning motor 131 every time;The rotation The quantity of arm 135 is four, and for radial equipartition on the rotary flange 133,135 array of full wind-up has vacuum suction Disk.
The full wind-up 135 from the lower part of the half of bracket 119 to the ionized motion of the half of bracket 119, and The chip body 7 for being located at the half of bracket 119 is sucked;The full wind-up 135 reaches the top of the secondary conveyer belt 142, The full wind-up 135 discharges chip body 7, and chip body 7 is fallen on the secondary conveyer belt 142.
Finally it is pointed out that above embodiments be only chip of the present invention label streamlined Preparation equipment it is more representative Example.Obviously, the label streamlined Preparation equipment of chip of the present invention is not limited to the above embodiments, and acceptable there are many deformations. The technical spirit of the label streamlined Preparation equipment of all chips according to the present invention is to the above embodiments any simply to repair Change, equivalent variations and modification, is considered as belonging to the protection scope of the label streamlined Preparation equipment of chip of the present invention.

Claims (5)

1. a kind of label streamlined Preparation equipment of chip characterized by comprising for pio chip body converge track, For receive the receiving pipeline of chip body, the rotating machine arm for arranging and carrying chip body, for chip body into Row label printing printing mechanism, for the corrected adjusting mechanism in position to chip body;
The printing mechanism includes: printing support, print head up-down mechanism, pattern delivering mechanism, above and below the print head Movement mechanism, pattern delivering mechanism are fixed on the printing support, and the print head up-down mechanism driving print head carries out It moves up and down, the pattern delivering mechanism is used to provide pattern for the print head;The print head up-down mechanism includes: Print head upper and lower air cylinders, print head guide rail, printing head substrate, Turbogrid plates, opposite type sensor, print head, printing head slider, it is described The cylinder block of print head upper and lower air cylinders, printing head slider are fixed on the printing support, and the print head guide rail is movably connected on The printing head slider, one end of the print head guide rail are fixed on the printing head substrate, the print head upper and lower air cylinders The end of piston rod is fixed on the printing head substrate, and the print head is fixed on the lower part of the printing head substrate;The grid Panel is fixed on the printing head substrate, and the opposite type sensor is fixed on the printing support, the Turbogrid plates and passes to penetrating Sensor matches;The pattern delivering mechanism includes: oil can, pattern slide plate, pattern cylinder, oil can baffle, the pattern slide plate It is movably connected on the printing support by linear guide, it is sliding that the end of the piston rod of the pattern cylinder is fixed on the pattern Plate, the oil can are movably connected on the pattern slide plate, and the oil can baffle is fixed on the printing support, the oil can baffle For preventing the oil can from being taken away by the pattern slide plate.
2. the label streamlined Preparation equipment of chip according to claim 1, which is characterized in that the adjusting mechanism packet It includes: front limit baffle, front apron cylinder, V-type groove, side push and block plate, side push cylinder, the end of the piston rod of the front apron cylinder End is fixed on the front limit baffle, is provided with the V-type groove in front of the front limit baffle, the V-type groove and The front limit baffle matches;The end of the piston rod of the side push cylinder is fixed on the side push and block plate, the side push and block Plate is for chip body to be fitly aligned.
3. the label streamlined Preparation equipment of chip according to claim 1, which is characterized in that described to converge track packet It includes: track support, conveyer belt, No.1 correction cylinder, No. two correction cylinders, No. three correction cylinders, transmission translator, transmission shaft coupling Device, excludes cylinder, excludes push plate, guide pad half of bracket, and the track support is fixed on the workbench, the conveyer belt It is movably connected on the track support, the transmission translator drives the conveyer belt movement by the transmission shaft coupling;Institute State No.1 the correction cylinder, No. two correction cylinders, No. three correction cylinders that the position for correcting chip is provided on track support; The end of the track support is provided with the half of bracket, one side of something bracket holds the both ends of chip, the half of branch The centre of frame is provided with the channel for passing through the rotating machine arm;The cylinder block for excluding cylinder, guide pad are fixed on The track support, the exclusion push plate are movably connected on the guide pad, and the exclusion push plate is fixed on the exclusion cylinder The end of piston rod is provided with the pusher cavity that can accommodate chip in the exclusion push plate.
4. the label streamlined Preparation equipment of chip according to claim 1, which is characterized in that the receiving pipeline packet It includes: receiving bracket, secondary conveyer belt, the pair conveyer belt is movably connected on the receiving bracket, the quantity of the pair conveyer belt It is two, at being arranged in juxtaposition, the centre of the pair conveyer belt is provided with for by the rotating machine arm pair conveyer belt Channel.
5. the label streamlined Preparation equipment of chip according to claim 1, which is characterized in that the rotating machinery handbag Include: the shell of turning motor, Cam splitter, rotary flange, rotary support, full wind-up, the Cam splitter is fixed on The rotary support, for the output shaft fixed connection of the turning motor in the input shaft of the Cam splitter, the rotary flange is solid It is connected on the output flange of the Cam splitter;The Cam splitter rotates nine under the driving of the turning motor every time Ten degree;The quantity of the full wind-up is four, and for radial equipartition on the rotary flange, the full wind-up array has vacuum Sucker.
CN201811017530.1A 2018-09-01 2018-09-01 Chip label streamlined preparation equipment Active CN109103134B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811017530.1A CN109103134B (en) 2018-09-01 2018-09-01 Chip label streamlined preparation equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811017530.1A CN109103134B (en) 2018-09-01 2018-09-01 Chip label streamlined preparation equipment

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CN109103134A true CN109103134A (en) 2018-12-28
CN109103134B CN109103134B (en) 2021-07-30

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040121493A1 (en) * 2002-12-24 2004-06-24 Eo Technics Co., Ltd. Chip scale marker and method of calibrating marking position
KR20090012977A (en) * 2007-07-31 2009-02-04 킹 유안 일렉트로닉스 코포레이션 리미티드 Method for marking wafer, method for marking failed die, method for aligning wafer and wafer test equipment
CN101409240A (en) * 2008-03-21 2009-04-15 北京德鑫泉科技发展有限公司 Intelligent label capable of using chip and equipment for producing flip-chip module
CN102419822A (en) * 2010-09-24 2012-04-18 株式会社日立高新技术仪器 Tool management method of die bonder and die bonder
US20150082620A1 (en) * 2010-09-15 2015-03-26 Mycronic AB Methods and apparatuses for generating patterns on workpieces
CN105826225A (en) * 2016-05-10 2016-08-03 刘宁 Electronic tag packaging equipment
CN108447806A (en) * 2018-03-30 2018-08-24 杭州旗捷科技有限公司 Chip automated production equipment, system and method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040121493A1 (en) * 2002-12-24 2004-06-24 Eo Technics Co., Ltd. Chip scale marker and method of calibrating marking position
KR20090012977A (en) * 2007-07-31 2009-02-04 킹 유안 일렉트로닉스 코포레이션 리미티드 Method for marking wafer, method for marking failed die, method for aligning wafer and wafer test equipment
CN101409240A (en) * 2008-03-21 2009-04-15 北京德鑫泉科技发展有限公司 Intelligent label capable of using chip and equipment for producing flip-chip module
US20150082620A1 (en) * 2010-09-15 2015-03-26 Mycronic AB Methods and apparatuses for generating patterns on workpieces
CN102419822A (en) * 2010-09-24 2012-04-18 株式会社日立高新技术仪器 Tool management method of die bonder and die bonder
CN105826225A (en) * 2016-05-10 2016-08-03 刘宁 Electronic tag packaging equipment
CN108447806A (en) * 2018-03-30 2018-08-24 杭州旗捷科技有限公司 Chip automated production equipment, system and method

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