CN109103134A - The label streamlined Preparation equipment of chip - Google Patents
The label streamlined Preparation equipment of chip Download PDFInfo
- Publication number
- CN109103134A CN109103134A CN201811017530.1A CN201811017530A CN109103134A CN 109103134 A CN109103134 A CN 109103134A CN 201811017530 A CN201811017530 A CN 201811017530A CN 109103134 A CN109103134 A CN 109103134A
- Authority
- CN
- China
- Prior art keywords
- fixed
- chip
- printing
- print head
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- 238000007639 printing Methods 0.000 claims abstract description 56
- 230000007246 mechanism Effects 0.000 claims abstract description 41
- 238000012937 correction Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 claims description 13
- 230000007717 exclusion Effects 0.000 claims description 13
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 230000033001 locomotion Effects 0.000 claims description 5
- 230000004886 head movement Effects 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 18
- 238000010586 diagram Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000009776 industrial production Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Specific Conveyance Elements (AREA)
- Labeling Devices (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811017530.1A CN109103134B (en) | 2018-09-01 | 2018-09-01 | Chip label streamlined preparation equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811017530.1A CN109103134B (en) | 2018-09-01 | 2018-09-01 | Chip label streamlined preparation equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109103134A true CN109103134A (en) | 2018-12-28 |
CN109103134B CN109103134B (en) | 2021-07-30 |
Family
ID=64864785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811017530.1A Active CN109103134B (en) | 2018-09-01 | 2018-09-01 | Chip label streamlined preparation equipment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109103134B (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040121493A1 (en) * | 2002-12-24 | 2004-06-24 | Eo Technics Co., Ltd. | Chip scale marker and method of calibrating marking position |
KR20090012977A (en) * | 2007-07-31 | 2009-02-04 | 킹 유안 일렉트로닉스 코포레이션 리미티드 | Method for marking wafer, method for marking failed die, method for aligning wafer and wafer test equipment |
CN101409240A (en) * | 2008-03-21 | 2009-04-15 | 北京德鑫泉科技发展有限公司 | Intelligent label capable of using chip and equipment for producing flip-chip module |
CN102419822A (en) * | 2010-09-24 | 2012-04-18 | 株式会社日立高新技术仪器 | Tool management method of die bonder and die bonder |
US20150082620A1 (en) * | 2010-09-15 | 2015-03-26 | Mycronic AB | Methods and apparatuses for generating patterns on workpieces |
CN105826225A (en) * | 2016-05-10 | 2016-08-03 | 刘宁 | Electronic tag packaging equipment |
CN108447806A (en) * | 2018-03-30 | 2018-08-24 | 杭州旗捷科技有限公司 | Chip automated production equipment, system and method |
-
2018
- 2018-09-01 CN CN201811017530.1A patent/CN109103134B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040121493A1 (en) * | 2002-12-24 | 2004-06-24 | Eo Technics Co., Ltd. | Chip scale marker and method of calibrating marking position |
KR20090012977A (en) * | 2007-07-31 | 2009-02-04 | 킹 유안 일렉트로닉스 코포레이션 리미티드 | Method for marking wafer, method for marking failed die, method for aligning wafer and wafer test equipment |
CN101409240A (en) * | 2008-03-21 | 2009-04-15 | 北京德鑫泉科技发展有限公司 | Intelligent label capable of using chip and equipment for producing flip-chip module |
US20150082620A1 (en) * | 2010-09-15 | 2015-03-26 | Mycronic AB | Methods and apparatuses for generating patterns on workpieces |
CN102419822A (en) * | 2010-09-24 | 2012-04-18 | 株式会社日立高新技术仪器 | Tool management method of die bonder and die bonder |
CN105826225A (en) * | 2016-05-10 | 2016-08-03 | 刘宁 | Electronic tag packaging equipment |
CN108447806A (en) * | 2018-03-30 | 2018-08-24 | 杭州旗捷科技有限公司 | Chip automated production equipment, system and method |
Also Published As
Publication number | Publication date |
---|---|
CN109103134B (en) | 2021-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210707 Address after: Room 522 and 524, Building C, Science and Technology Business Incubator, Venture Service Center, Wenzhou High-tech Industrial Development Zone, Zhejiang Province, 325000 Applicant after: Yu Xiaofei Address before: Room 522 and 524, Building C, Science and Technology Business Incubator, Venture Service Center, Wenzhou High-tech Industrial Development Zone, Zhejiang Province, 325000 Applicant before: WENZHOU KEHONG ROBOT TECHNOLOGY Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240104 Address after: 529000 Floor 5, No. 6, Nanchang Village, Encheng Industrial Fourth Road, Enping City, Jiangmen, Guangdong Province Patentee after: Jiangmen Boyi Intellectual Property Operation Co.,Ltd. Address before: Room 522 and 524, Building C, Science and Technology Business Incubator, Venture Service Center, Wenzhou High-tech Industrial Development Zone, Zhejiang Province, 325000 Patentee before: Yu Xiaofei |
|
TR01 | Transfer of patent right |