CN106971968A - A kind of semiconductor cover plate make-up machine - Google Patents
A kind of semiconductor cover plate make-up machine Download PDFInfo
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- CN106971968A CN106971968A CN201710296897.0A CN201710296897A CN106971968A CN 106971968 A CN106971968 A CN 106971968A CN 201710296897 A CN201710296897 A CN 201710296897A CN 106971968 A CN106971968 A CN 106971968A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 70
- 230000007246 mechanism Effects 0.000 claims abstract description 79
- 238000004140 cleaning Methods 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims description 50
- 235000014347 soups Nutrition 0.000 claims description 24
- 238000010030 laminating Methods 0.000 claims description 21
- 238000006073 displacement reaction Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 7
- 230000007723 transport mechanism Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000033001 locomotion Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 241000252254 Catostomidae Species 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
Abstract
The present invention relates to the art field of apparatus automatization assembling, refer in particular to a kind of semiconductor cover plate make-up machine, including workbench, cover plate load plate and semiconductor load plate, the workbench is provided with cover plate feed mechanism, rotating disk draw frame machine, cleaning device, heater and semiconductor feed mechanism, the cover plate feed mechanism and semiconductor feed mechanism are located at the both sides of rotating disk draw frame machine respectively, and the rotating disk draw frame machine is drawn after cover plate sequentially passes through cleaning device and heater and fits in cover plate on semiconductor.The present invention further increases the stability, production efficiency and accuracy of the bonding process.
Description
Technical field
The present invention relates to the technical field of apparatus automatization assembling, a kind of semiconductor cover plate make-up machine is referred in particular to.
Background technology
With the development of smart mobile phone, fingerprint identification module is into one of smart mobile phone basic configuration.Metal-back/becket
It is an important link for fingerprint identification module production with fitting for cover plate.Because metal-back/becket, cover plate are smaller
Workpiece, handwork efficiency of being fitted during laminating, not only is low, and the error of laminating is big, outward appearance can not standard after laminating
It is unified.
The relevant automatic equipment that existing glass cover-plate is fitted with fingerprint recognition semiconductor, for the feed mechanism of cover plate
The motion process space that generally existing needs is lower than the transmission efficiency of larger or feeding and rewinding and workpiece, motion structure and
The problems such as control structure is complicated, specifically also has that Anawgy accuracy is not high and bonding process.
The content of the invention
The present invention provides the problem of the prior art of the invention that is directed to for problem of the prior art and provides a kind of space-consuming
Small, feeding and high and efficiency high a kind of semiconductor cover plate make-up machine of rewinding simple and fast, cover plate and semiconductor Anawgy accuracy.
In order to solve the above-mentioned technical problem, the present invention is adopted the following technical scheme that：
A kind of semiconductor cover plate make-up machine that the present invention is provided, including workbench, cover plate load plate and semiconductor load plate, the work
Make platform provided with cover plate feed mechanism, rotating disk draw frame machine, cleaning device, heater and semiconductor feed mechanism, the lid
Plate feed mechanism and semiconductor feed mechanism are located at the both sides of rotating disk draw frame machine respectively, and the rotating disk draw frame machine draws cover plate
Cover plate is fitted on semiconductor after sequentially passing through cleaning device and heater.
Therein, the semiconductor feed mechanism includes material receiving, the first feeding dress for being used to receive semiconductor load plate
Put, for drive the first feed device respectively along the first XY axles drive mechanism of X-axis and Y-axis displacement and positioned at material receiving and
Conveying robot above first feed device, first feed device includes material conveying platform, for driving material conveying platform liter
The lift drive mechanism of drop and the rotating drive mechanism for driving material conveying platform to rotate.
It is used as preferred, several the first screw mandrel spiral shells that the lift drive mechanism includes lifter plate, is connected with lifter plate
The first screw mandrel that is female and coordinating with the first feed screw nut, the belt pulley being connected with the first leading screw, the transmission skin for being set around belt pulley
Band and the lifting motor for driving driving belt to move, the lifting motor and the first screw mandrel are and material conveying platform
Connection.
As preferred, fixed seat that the rotating drive mechanism includes being connected with the first XY axle drive mechanisms, it is connected to
The rotary shaft of fixed seat, the first rotational drive motor for being connected to fixed seat side and be connected to fixed seat relative to first rotate
Second leading screw of motor opposite side and the second feed screw nut coordinated with the second leading screw；The rotary shaft and lifter plate
Connection, is provided with rotational variations compensation device between the lifter plate and the second feed screw nut.
As preferred, the rotational variations compensation device include fixed block be connected with second feed screw nut and
The sliding block of fixed block connection, the slide rail coordinated with sliding block and the projection being connected with slide rail, the bottom of the projection are connected with slide rail,
The top of the projection is connected with lifter plate.
It is therein, the cover plate feed mechanism include being used for bearing the supporting platform of cover plate load plate, the second feed device with
And for driving the second feed device respectively along X-axis and the 2nd XY axle drive mechanisms of Y-axis displacement；The supporting platform is set respectively
There are upper material position and the rewinding position of hollow out, the both sides of the upper material position hollow out are provided with for the fixture block of clamping cover plate load plate and for driving
The drive cylinder that dynamic fixture block is slided, the fixture block is provided with the chimb for being used for supporting cover plate load plate；The hollow out edge of the rewinding position
Provided with inclined-plane projection.
Therein, the rotating disk draw frame machine is included located at gantry between cover plate feed mechanism and semiconductor transport mechanism
Support, the rotating disk being connected with gantry support, the suction pushing meanss for being respectively arranged on gantry support both sides and laminating pushing meanss and
Circumferential arrangement is located at multiple vacuum cups of rotating disk on the second rotational drive motor rotated for driving rotating disk, the rotating disk,
The material pushing meanss and laminating pushing meanss are located at the top of vacuum cups.
As preferred, the vacuum cups includes head sucting body, vacuum and is passed through block, vacuum soup stick, the first reset element
And stopping means；The head sucting body is provided with the first accommodating chamber, the second accommodating chamber and the steam vent connected with the second accommodating chamber；Institute
State vacuum and be passed through block slip in the first accommodating chamber, the vacuum is passed through block provided with passage；The vacuum soup stick is slided and set
It is passed through in vacuum in block and through head sucting body, the vacuum soup stick is provided with vacuum sucking holes, the bottom of the vacuum soup stick connects
It is connected to suction nozzle；The stopping means is located at the top of head sucting body, is communicated to limit the vacuum sucking holes with the passage；
First reset element is connected in the second accommodating chamber and with vacuum soup stick.
As preferred, the material receiving and material conveying platform are equipped with heating board.
Therein, the workbench is additionally provided with cover plate positioner for being positioned to cover plate and for semiconductor
Semiconductor positioner, the cover plate positioner is located between cleaning device and heater, the semiconductor positioner
Located at the front of laminating pushing meanss.
Beneficial effects of the present invention：
A kind of semiconductor cover plate make-up machine that the present invention is provided, it is by can be with the feeder of multi-shaft interlocked cover plate and semiconductor
Structure realizes the process that feeding and rewinding are completed in smaller space, can also be realized and inhaled incessantly by rotating disk draw frame machine
Material and blowing, and joint movement is also completed while blowing, substantially increase production efficiency.It is of the invention further to improve
The stability of the bonding process, production efficiency and accuracy.
Brief description of the drawings
Fig. 1 is structural representation of the invention.
Fig. 2 is another structural representation of the invention.
Fig. 3 is the structural representation of semiconductor feed mechanism.
Fig. 4 is another structural representation of the invention.
Fig. 5 is the structural representation of semiconductor feed mechanism.
Fig. 6 is the structural representation of rotating drive mechanism.
Fig. 7 is the partial structurtes enlarged diagram of supporting platform.
Fig. 8 is the partial structurtes enlarged diagram at supporting platform A.
Fig. 9 is the structural representation of material conveying platform.
Figure 10 is the structural representation of vacuum cups.
Description of reference numerals
1- workbenches；2- semiconductor feed mechanisms；201- material receivings；The feed devices of 202- first；21- material conveying platforms；
The XY axle drive mechanisms of 22- the first；221-X axle drive mechanisms；222-Y axle drive mechanisms；211- vacuum through holes；2101- suckers；
215- heating boards；24- lift drive mechanisms；The screw mandrels of 241- first；The feed screw nuts of 242- first；243- lifter plates；244- belts
Wheel；245- lifts motor；246- driving belts；25- rotating drive mechanisms；251- fixed seats；252- rotary shafts；253-
One rotational drive motor；The leading screws of 254- second；The feed screw nuts of 255- second；26- rotational variations compensation devices；261- fixed blocks；
262- sliding blocks；263- slide rails；264- projections；203- conveying robots；2031- captures sucker；3- rotating disk draw frame machines；301- dragons
Door bracket；302- rotating disks；303- suction pushing meanss；304- laminating pushing meanss；The rotational drive motors of 305- second；31- is true
Suction head；310- head sucting bodies；The accommodating chambers of 312- first；The accommodating chambers of 313- second；314- steam vents；315- first resets member
Part；320- vacuum soup sticks；321- vacuum sucking holes；325- suction nozzles；330- vacuum is passed through block；332- passages；340- stopping means；
4- cover plate feed mechanisms；41- supporting platforms；The upper material positions of 411-；412- fixture blocks；4121- chimbs；413- drive cylinders；414- is received
Material position；415- inclined-planes projection；The feed devices of 42- second；The XY axle drive mechanisms of 43- the 2nd；5- cleaning devices；6- heaters；
7- semiconductor positioners；8- cover plate positioners.
Embodiment
For the ease of the understanding of those skilled in the art, the present invention is made further with reference to embodiment and accompanying drawing
It is bright, the content that embodiment is referred to not limitation of the invention.The present invention is described in detail below in conjunction with accompanying drawing.
As shown in Figures 1 to 9, a kind of semiconductor cover plate make-up machine that the present invention is provided, including workbench 1, cover plate are carried
Disk and semiconductor load plate, the workbench 1 is provided with cover plate feed mechanism 4, rotating disk draw frame machine 3, cleaning device 5, heating dress
6 and semiconductor feed mechanism 2 are put, the cover plate feed mechanism 4 and semiconductor feed mechanism 2 are located at rotating disk draw frame machine 3 respectively
Both sides, the rotating disk draw frame machine 3 is drawn cover plate and sequentially passed through after cleaning device 5 and heater 6 fits in half by cover plate
On conductor.Specifically, heater 6 uses infrared ray heating tube；Cleaning device 5 is plasma cleaning device, clear using plasma
The adhesion of cover plate can be improved by washing, and it is more effectively fitted with semiconductor, strengthened it and fitted the life-span.
In actual applications, rotating disk draw frame machine 3 can draw cover plate from cover plate feed mechanism 4, and then rotating disk is drawn
The sorption cover plate of mechanism 3 carries out the cleaning removal of impurity by cleaning device 5 to the binding face of cover plate；After cleaning, rotating disk draw frame machine 3 is inhaled
Cover plate to heat cover plate into heater 6, the viscose of its binding face is in hot melt state, so as to follow-up laminating；
Finally, rotating disk draw frame machine 3 fits to cover plate on semiconductor.
In the present embodiment, referring to Fig. 1, Fig. 3 and Fig. 4, the semiconductor feed mechanism 2 includes being used to receive semiconductor load plate
Material receiving 201, the first feed device 202, for driving the first feed device 202 respectively along the first of X-axis and Y-axis displacement
XY axles drive mechanism 22 and the conveying robot 203 positioned at the top of 201 and first feed device of material receiving 202.Specifically, institute
Stating the first XY axles drive mechanism 22 includes X-axis drive mechanism 221 and Y-axis drive mechanism 222, the X-axis drive mechanism 221 and Y-axis
Drive mechanism 222 can coordinate the mechanisms such as screw mandrel, nut to realize using cylinder, oil cylinder or motor；The Y-axis drive mechanism
222 on workbench 1, and the X-axis drive mechanism 221 is connected with Y-axis drive mechanism 222, first feed device 202
It is connected with X-axis drive mechanism 221, under the driving of the first XY axles drive mechanism 22, the first feed device 202 can be realized in work
Make smoothly to move along X-axis and Y-axis simultaneously on platform 1, enhance feeding flexibility and the automaticity of the present invention；It is described to remove
Transport manipulator 203 and be provided with symmetrical two crawl suckers 2031, can realize and one take an action put simultaneously.Conveying robot
The semiconductor load plate for being positioned over material receiving 201 can be drawn to the first material conveying platform 21 by 203, while also can be by the first feeding
The semiconductor load plate of platform 21 is drawn in next mechanism, thus improve the automaticity of the present invention, reduce it is artificial into
This and improve production efficiency.
As shown in figure 5, first feed device 202 includes material conveying platform 21, for driving the lifting of material conveying platform 21
Lift drive mechanism 24 and the rotating drive mechanism 25 for driving material conveying platform 21 to rotate.Wherein, the lift drive mechanism
24 include lifter plate 243, several first feed screw nuts 242 being connected with lifter plate 243 and coordinate with the first feed screw nut 242
The first screw mandrel 241, be connected with the first leading screw 241 belt pulley 244, be set around the driving belt 246 of belt pulley 244 and be used for
The lifting motor 245 for driving driving belt 246 to move, lifting motor 245 and first screw mandrel 241 is and feeding
Platform 21 is connected.Specifically, lift drive mechanism 24 includes four the first feed screw nuts 242, and it is connected to lifter plate 243
Four angles so that the first leading screw 241 is connected with four angles of transfer platform.In the driving lower band of lifting motor 245
Dynamic driving belt 246 is moved, and the sports belt wheel 244 of driving belt 246 is rotated, so that the first leading screw 241 is rotated along first
Feed screw nut 242 does lifting moving, and the lifting moving of the first leading screw 241 drives material conveying platform 21 to do lifting moving.Due to lifting
Motor 245 is connected with material conveying platform 21, therefore, when the lifting of material conveying platform 21 can drive lifting motor 245 and skin
The synchronization lifting of belt wheel 244, it is to avoid the lifting driving belt 246 of motor 245 and second produces deviation in displacement process.Lifting
Being designed to of drive mechanism 24 makes material conveying platform 21 smoothly to move, and can improve the accuracy of movement.
Such as Fig. 5 and Fig. 6, fixed seat 251 that the rotating drive mechanism 25 includes being connected with the first XY axles drive mechanism 22,
The rotary shaft 252 of fixed seat 251 is connected to, the first rotational drive motor 253 of the side of fixed seat 251 is connected to and is connected to solid
Reservation 251 relative to the opposite side of the first rotational drive motor 253 the second leading screw 254 and with the second leading screw 254 coordinate second
Feed screw nut 255；The rotary shaft 252 is connected with lifter plate 243, is set between the feed screw nut 255 of lifter plate 243 and second
There is rotational variations compensation device 26.Specifically, fixed seat 251 is connected with X-axis drive mechanism 221；First rotational drive motor 253
Belt gear, Chain conveyer or gear drive can be used with the kind of drive of the second leading screw 254, the present invention is preferably adopted
With belt gear, because belt transmission has the advantages that to have simple in construction, stable drive and can buffer absorbing；It is described to rotate
Offset compensation device 26 includes the fixed block 261 being connected with second feed screw nut 255, the sliding block being connected with fixed block 261
262nd, the slide rail 263 coordinated with sliding block 262 and the projection 264 being connected with slide rail 263, bottom and the slide rail 263 of the projection 264
Connection, the top of the projection 264 is connected with lifter plate 243.
In actual applications, the first rotational drive motor 253 moves screw mandrel 254 by belt driving band second and rotated, and second
The rotation of screw mandrel 254 drives the second feed screw nut 255 to produce straight-line displacement, because the bottom of projection 264 is connected with slide rail 263,
The top of projection 264 is connected with rotor plate, therefore, and the movement of the second feed screw nut 255 makes projection 264 to drive rotor plate to turn
Moving axis 252 is that axle center is rotated, and is turned about the Z axis so that material conveying platform 21 is realized；But, due to projection 264 top with
Rotor plate is connected, and material conveying platform 21 is that axle center is rotated with rotary shaft 252, and the top of projection 264 can be made to produce along camber line position
Move, and it is that, along straight-line displacement, therefore, the present invention is provided with rotational variations that the bottom of projection 264 is connected with the second feed screw nut 255
Compensation device 26, makes the top of projection 264 while driving rotor plate to rotate, the bottom of projection 264 can be 263 along slide rail
Move, rotation displacement is compensated, so that the top of projection 264 is realized along camber line displacement.The knot of the rotating drive mechanism 25
Structure is simply compact, accurate positioning, stable and reliable operation, reduces manual work, improves production efficiency, is adapted to popularize application in an all-round way.
In the present embodiment, as shown in Figure 1, Figure 2 and Figure 4, the cover plate feed mechanism 4 includes being used to bear cover plate load plate
The feed device 42 of supporting platform 41 second and for drive the second feed device 42 respectively along X-axis and the 2nd XY of Y-axis displacement
Axle drive mechanism 43.Specifically, the structure and principle all one of second feed device 42 and the first foregoing feed device 202
Sample, is repeated no more herein；The structure and principle of the 2nd XY axles drive mechanism and the first foregoing XY axle drive mechanisms are all
Equally, repeat no more herein.
As shown in Fig. 4, Fig. 7 and Fig. 8, the supporting platform 41 is respectively equipped with upper material position 411 and the rewinding position 414 of hollow out,
The both sides of the hollow out of upper material position 411 are provided with for the fixture block 412 of clamping cover plate load plate and the drive for driving fixture block 412 to slide
Take offence cylinder 413, the fixture block 412 is provided with the convex portion for being used for supporting cover plate load plate；The hollow out edge of the rewinding position 414 is provided with oblique
Face projection 415.
In practical application, the cover plate load plate for being loaded with cover plate is placed on by upper material position 411 using artificial or manipulator, this
When fixture block 412 convex portion support cover plate load plate；Second feed device 42 is moved under the upper material position 411 of supporting platform 41
Side, then rises and accepts cover plate load plate, and now drive cylinder 413 drives fixture block 412 to be removed to load plate outside, makes fixture block 412
Leave cover plate load plate in convex portion；Then the second feed device 42 accepts the decline of cover plate load plate, the driving fixture block 412 of drive cylinder 413
Reset, cover plate load plate is transferred absorption and laminating that rotating disk draw frame machine 3 carries out cover plate by the second feed device 42；When on load plate
After cover plate has been drawn, unloaded cover plate load plate is transplanted under the rewinding of supporting platform 41 position 414 by the second feed device 42
Side, now the second feed device 42 rising makes cover plate load plate by the inclined-plane projection 415 at the hollow out edge of rewinding position 414, so that
Make projection 264 abut with the bottom surface of cover plate load plate to play a part of supporting cover plate load plate；The design on the inclined-plane of projection 264, has
Beneficial to cover plate load plate is reduced by the resistance of projection 264, in order to which cover plate load plate can swimmingly slide into the top of projection 264, this
It is easy to the collection of cover plate load plate in rewinding position 414.
In the present embodiment, as depicted in figs. 1 and 2, the rotating disk draw frame machine 3 is included located at cover plate feed mechanism 4 and half
Gantry support 301 between conductor transport mechanism, the rotating disk 302 being connected with gantry support 301, it is respectively arranged on gantry support 301
The suction pushing meanss 303 and laminating pushing meanss 304 of both sides and the second rotational drive motor rotated for driving rotating disk 302
305, second rotational drive motor 305 is DDR motors（Directly drive electric rotating machine）, the motor rotation precision is high, convenient peace
Fill and easy to maintain.Specifically, the lower section of suction pushing meanss 303 is equivalent to the suction position of machine, pushing meanss of fitting
Bonding position of 304 lower section equivalent to machine.Wherein, circumferential arrangement is located at the multiple true of rotating disk 302 on the rotating disk 302
Suction first 31, the material pushing meanss 303 and laminating pushing meanss 304 are located at the top of vacuum cups 31.Rotating disk 302 is being rotated
Vacuum cups 31 is driven to rotate under the driving of mechanism, during rotation, vacuum cups 31 sequentially passes through suction position, cleaning
Device 5, heater 6 and bonding position.
In the present embodiment, as shown in Figure 10, the vacuum cups 31 include head sucting body 310, vacuum be passed through block 330, it is true
Suction bar 320, the first reset element 315 and stopping means 340；The head sucting body 310 is provided with the first accommodating chamber 312, second
Accommodating chamber 313 and the steam vent 314 connected with the second accommodating chamber 313；The vacuum is passed through block 330 and slided located at the first accommodating chamber
In 312, the vacuum is passed through block 330 provided with passage 332；The vacuum soup stick 320 is slided and is passed through located at vacuum in block 330 simultaneously
Through head sucting body 310, the vacuum soup stick 320 is provided with vacuum sucking holes 321, and the bottom of the vacuum soup stick 320 is connected with
Suction nozzle 325；The stopping means 340 is located at the top of head sucting body 310, leads to limit the vacuum sucking holes 321 with described
Stomata 332 is communicated；First reset element 315 is connected in the second accommodating chamber 313 and with vacuum soup stick 320.Specifically,
The suction nozzle 325 is removably connected to vacuum soup stick 320, and its effect is can be easy to the ground demolition and maintenance of suction nozzle 325, and can basis
The size of material and change corresponding suction nozzle 325.
In actual applications, when vacuum cups 31, which turns to suction position, to draw cover plate, suction pushing meanss 303 are pushed away
Dynamic vacuum soup stick 320 is moved down and compression spring, the vacuum sucking holes 321 of vacuum soup stick 320 is passed through block 330 simultaneously into vacuum
Connected with passage 332, allow vacuum soup stick 320 to hold material；Pushed away when the sorption cover plate of vacuum cups 31 is rotated away from suction
During dynamic device 303, now stopping means 340 carries out spacing to vacuum soup stick 320, allows vacuum sucking holes 321 to be kept with passage 332
Communicate, so that vacuum soup stick 320, which is in, vacuumizes state, to hold cover plate rotation；When the sorption cover plate of vacuum cups 31 is rotated
During to bonding position, laminating pushing meanss 304 promote vacuum soup stick 320 to move down, and cover plate is moved down into the laminating of semiconductor
Face, makes cover plate be fitted with semiconductor, now vacuum soup stick 320 vacuum sucking holes 321 enter the second accommodating chamber 313 and with row
Stomata 314 is connected, and is in vacuum soup stick 320 and is put vacuum state and discharge cover plate；When vacuum cups 31 continues rotating away from patch
When closing position, vacuum soup stick 320 is resetted under the elastic force effect of the first reset element 315.In addition, the vacuum cups 31
All it is that it vacuumizes and put vacuum state using mechanical control in whole work process, and in the prior art, most of machines
Each suction nozzle of device is individually furnished with a magnetic valve to control the suction of its gas and put, and compared with prior art, the present invention can
To greatly reduce the use of magnetic valve, so as to lower the manufacturing cost of the present invention.
In the present embodiment, due in the technical process of the laminating of semiconductor again, it is necessary to be heated to semiconductor, in order to cover
Plate is preferably fitted in semiconductor, therefore, and the material receiving 201 and material conveying platform 21 are equipped with heating board 215, the heating board
215 be microcrystal glass plate（As shown in Figure 9）.
In the present embodiment, as shown in figure 9, the material conveying platform 21 is provided with vacuum through holes 211, the vacuum through holes 211 may be used also
To install sucker 2101, load plate is held using sucker 2101, load plate is not likely to produce deviation in moving process, it is ensured that feeding
The precision and stability of the positioning feeding of platform 21, improve the practicality of the present invention.
In the present embodiment, as shown in Fig. 2 the workbench 1 is additionally provided with the cover plate positioner 8 for being positioned to cover plate
With for the semiconductor positioner 7 to semiconductor, the cover plate positioner 8 located at cleaning device 5 and heater 6 it
Between, the semiconductor positioner 7 is located at the front of laminating pushing meanss 304.Specifically, semiconductor positioner 7 and cover plate
The equal CCD automatic station-keeping systems of positioner 8.The system can be analyzed according to the positioning of cover plate and the positioning of semiconductor, analysis
The first feed device 202 can carry out rotating the bonding position of adjustment semiconductor afterwards, to ensure that cover plate can be accurately right with semiconductor
Position laminating, improves the accuracy of laminating, cover plate and the laminating deviation partly led is reduced, so as to improve quality product rate produced by the invention.
It is described above, only it is present pre-ferred embodiments, any formal limitation not is made to the present invention, although
The present invention is disclosed as above with preferred embodiment, but is not limited to the present invention, any those skilled in the art,
Do not depart from the range of technical solution of the present invention, when the technology contents using the disclosure above make a little change or are modified to equivalent change
The equivalent embodiment of change, as long as being, without departing from technical solution of the present invention content, to refer to according to the technology of the present invention to above example
Any simple modification, equivalent variations and the modification made, are belonged in the range of technical solution of the present invention.
Claims (10)
1. a kind of semiconductor cover plate make-up machine, including workbench, cover plate load plate and semiconductor load plate, it is characterised in that：It is described
Workbench is provided with cover plate feed mechanism, rotating disk draw frame machine, cleaning device, heater and semiconductor feed mechanism, described
Cover plate feed mechanism and semiconductor feed mechanism are located at the both sides of rotating disk draw frame machine, the rotating disk draw frame machine suction cap respectively
Plate fits in cover plate on semiconductor after sequentially passing through cleaning device and heater.
2. a kind of semiconductor cover plate make-up machine according to claim 1, it is characterised in that：The semiconductor feed mechanism
Including the material receiving for receiving semiconductor load plate, the first feed device, for drive the first feed device respectively along X-axis and
The first XY axles drive mechanism and the conveying robot above material receiving and the first feed device of Y-axis displacement, it is described
First feed device includes material conveying platform, the lift drive mechanism for driving material conveying platform lifting and for driving material conveying platform
The rotating drive mechanism of rotation.
3. a kind of semiconductor cover plate make-up machine according to claim 2, it is characterised in that：The lift drive mechanism bag
Several first feed screw nuts for include lifter plate, being connected with lifter plate and the first screw mandrel coordinated with the first feed screw nut, with the
The belt pulley of one leading screw connection, the driving belt for being set around belt pulley and the lifting driving electricity for driving driving belt to move
Machine, the lifting motor and the first screw mandrel are connected with material conveying platform.
4. a kind of semiconductor cover plate make-up machine according to claim 2, it is characterised in that：The rotating drive mechanism bag
The fixed seat being connected with the first XY axle drive mechanisms is included, the rotary shaft of fixed seat is connected to, is connected to the first of fixed seat side
Rotational drive motor and be connected to fixed seat relative to the second leading screw of the first rotational drive motor opposite side and with second
The second feed screw nut that thick stick coordinates；The rotary shaft is connected with lifter plate, is provided between the lifter plate and the second feed screw nut
Rotational variations compensation device.
5. a kind of semiconductor cover plate make-up machine according to claim 4, it is characterised in that：The rotational variations compensation dress
Put the slide rail that coordinates including the fixed block being connected with second feed screw nut, the sliding block being connected with fixed block, with sliding block and with
The projection of slide rail connection, the bottom of the projection is connected with slide rail, and the top of the projection is connected with lifter plate.
6. a kind of semiconductor cover plate make-up machine according to claim 1, it is characterised in that：The cover plate feed mechanism bag
Include for the supporting platform for bearing cover plate load plate, the second feed device and for driving the second feed device respectively along X-axis and Y
2nd XY axle drive mechanisms of axial displacement；The supporting platform is respectively equipped with upper material position and the rewinding position of hollow out, the upper material position
The both sides of hollow out are provided with for the fixture block of clamping cover plate load plate and the drive cylinder for driving fixture block to slide, and the fixture block is provided with
Chimb for supporting cover plate load plate；The hollow out edge of the rewinding position is provided with inclined-plane projection.
7. a kind of semiconductor cover plate make-up machine according to claim 1, it is characterised in that：The rotating disk draw frame machine bag
Include located at the gantry support between cover plate feed mechanism and semiconductor transport mechanism, the rotating disk being connected with gantry support, set respectively
Driving electricity is rotated in the suction pushing meanss and laminating pushing meanss of gantry support both sides and for driving rotating disk is rotated second
Circumferential arrangement is located at multiple vacuum cups of rotating disk on machine, the rotating disk, and the material pushing meanss and laminating pushing meanss are located at
The top of vacuum cups.
8. a kind of semiconductor cover plate make-up machine according to claim 7, it is characterised in that：The vacuum cups includes inhaling
Head main body, vacuum are passed through block, vacuum soup stick, the first reset element and stopping means；The head sucting body provided with the first accommodating chamber,
Second accommodating chamber and the steam vent connected with the second accommodating chamber；The vacuum is passed through block and slided in the first accommodating chamber, described
Vacuum is passed through block provided with passage；The vacuum soup stick is slided to be passed through in block and through head sucting body located at vacuum, described true
Suction bar is provided with vacuum sucking holes, and the bottom of the vacuum soup stick is connected with suction nozzle；The stopping means is located at the top of head sucting body
End, is communicated to limit the vacuum sucking holes with the passage；First reset element in the second accommodating chamber and with
Vacuum soup stick is connected.
9. a kind of semiconductor cover plate make-up machine according to claim 2, it is characterised in that：The material receiving and feeding
Platform is equipped with heating board.
10. a kind of semiconductor cover plate make-up machine according to claim 1, it is characterised in that：The workbench is additionally provided with
For the cover plate positioner positioned to cover plate and for the semiconductor positioner to semiconductor, the cover plate positioner is set
Between cleaning device and heater, the semiconductor positioner is located at the front of laminating pushing meanss.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710296897.0A CN106971968A (en) | 2017-04-28 | 2017-04-28 | A kind of semiconductor cover plate make-up machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710296897.0A CN106971968A (en) | 2017-04-28 | 2017-04-28 | A kind of semiconductor cover plate make-up machine |
Publications (1)
| Publication Number | Publication Date |
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| CN106971968A true CN106971968A (en) | 2017-07-21 |
Family
ID=59331668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710296897.0A Pending CN106971968A (en) | 2017-04-28 | 2017-04-28 | A kind of semiconductor cover plate make-up machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106971968A (en) |
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| CN109483227A (en) * | 2018-12-11 | 2019-03-19 | 广东天机工业智能系统有限公司 | Fingerprint mould group assembly machine |
| CN113327878A (en) * | 2021-08-03 | 2021-08-31 | 四川明泰微电子有限公司 | Wafer loading device and wafer film pasting device |
| CN114967189A (en) * | 2021-02-22 | 2022-08-30 | 广州视源电子科技股份有限公司 | Laminating device |
| CN117202756A (en) * | 2023-09-26 | 2023-12-08 | 河南省科学院 | Portable semiconductor refrigerating sheet packaging equipment |
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