CN117202756A - Portable semiconductor refrigerating sheet packaging equipment - Google Patents
Portable semiconductor refrigerating sheet packaging equipment Download PDFInfo
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- CN117202756A CN117202756A CN202311251873.5A CN202311251873A CN117202756A CN 117202756 A CN117202756 A CN 117202756A CN 202311251873 A CN202311251873 A CN 202311251873A CN 117202756 A CN117202756 A CN 117202756A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 75
- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 238000005057 refrigeration Methods 0.000 claims abstract description 24
- 238000005538 encapsulation Methods 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 25
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000000712 assembly Effects 0.000 abstract description 4
- 238000000429 assembly Methods 0.000 abstract description 4
- 230000003068 static effect Effects 0.000 abstract description 4
- 230000005611 electricity Effects 0.000 abstract description 3
- 230000000903 blocking effect Effects 0.000 abstract 1
- 238000001179 sorption measurement Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
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Abstract
The invention relates to portable semiconductor refrigeration piece packaging equipment which comprises a packaging box, wherein the front surface of the packaging box is rotatably connected with a box cover, the inner bottom wall of the packaging box is fixedly connected with a packaging table, two feeding assemblies are respectively arranged in the packaging box, and the two feeding assemblies are respectively used for conveying a base plate and a cover plate to the packaging table one by one. According to the invention, the output end of the first electric push rod drives the pushing plate to move, so that the substrate or the cover plate at the lowest layer in the storage box is pushed to the packaging table, and the bottom of the storage box can be used for blocking the substrate or the cover plate at the upper layer to avoid moving along with the substrate or the cover plate at the lowest layer by setting the height of the pushing groove to be greater than or equal to the height of the substrate or the cover plate corresponding to the feeding and smaller than twice the height of the substrate or the cover plate corresponding to the feeding, so that the problem of packaging failure caused by adsorption of a plurality of cover plates due to static electricity in the prior art is solved.
Description
Technical Field
The invention relates to the technical field of packaging equipment, in particular to portable semiconductor refrigeration piece packaging equipment.
Background
The semiconductor refrigerating sheet, also called thermoelectric refrigerating sheet, is a heat pump, and has the advantages of no sliding parts, and is applied to occasions with limited space, high reliability requirement and no refrigerant pollution. By utilizing the Peltier effect of the semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the purpose of refrigeration can be realized. The semiconductor refrigerating sheet package has the advantages of no moving parts, high reliability, and the semiconductor refrigerating sheet package needs to be packaged in order to protect and fix the internal structure of the refrigerating sheet, and meanwhile, the semiconductor refrigerating sheet needs to be packaged in order to provide heat dissipation and electrical connection.
The encapsulation of semiconductor refrigeration piece generally can operate in the dust-free box, and operating personnel can't contact the operation with base plate and apron, need adopt the suction head to adsorb to shift to the base plate top behind the apron, because reasons such as static, the suction head drives a plurality of apron simultaneously easily and shifts to the base plate on, causes the encapsulation failure, influences the yield of semiconductor refrigeration piece, and current encapsulation equipment causes a plurality of base plates and apron to feed together easily when carrying out the base plate material loading to lead to the material loading to block, influence material loading efficiency.
In order to solve the above problems, the present invention proposes a portable semiconductor refrigeration sheet packaging apparatus.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, adapt to the actual needs, and provide portable semiconductor refrigeration piece packaging equipment so as to solve the technical problems.
In order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows:
the utility model provides a portable semiconductor refrigeration piece encapsulation equipment, includes the encapsulation case, the front of encapsulation case rotates and is connected with the case lid, the interior bottom fixedly connected with encapsulation platform of encapsulation case, the inside of encapsulation case is provided with two feeding assemblies respectively, two feeding assemblies are used for carrying base plate and apron to the encapsulation bench one by one respectively.
Further, the feeding assembly comprises an upright post fixedly connected with the inner bottom wall of the packaging box, the top of the upright post is fixedly connected with the upper surface of the packaging box, a storage groove is formed in the top of the upright post and used for placing a base plate or a cover plate, the storage groove is matched with the corresponding base plate or cover plate, a pushing groove penetrating through the upright post is formed in one side, close to the packaging table, of the upright post, and a pushing plate is slidably connected with the inner wall of the pushing groove and used for pushing the base plate or the cover plate to the packaging table.
Further, the pushing groove is located at the bottom of the storage groove, the height of the pushing groove is larger than or equal to the height of the substrate or the cover plate corresponding to the feeding and smaller than twice the height of the substrate or the cover plate corresponding to the feeding, a first electric push rod is fixedly connected to the side face of the packaging box, and the output end of the first electric push rod penetrates through the inner wall of the packaging box and is fixedly connected with one side of the pushing plate.
Further, go up the silo has been seted up at the top of stand, go up the silo and be linked together with the holding tank, go up the cross-section of silo and be polygon or circular, and go up the silo cross-section and be greater than base plate or apron that corresponds in order to reduce base plate or apron and cause the jam by the card post, the interior bottom wall sliding connection of going up the silo has the transfer portion, it is used for pushing the base plate or the apron to in the holding tank to transfer the portion, the side fixedly connected with second electric putter of encapsulation case, the output of second electric putter runs through the inner wall of going up the silo and with transfer portion fixed connection, the through-hole that corresponds with the silo that goes up is seted up to the upper surface of encapsulation case.
Further, transfer the portion include with material loading groove inner bottom wall sliding connection's sliding plate, the front and the back of sliding plate all are provided with the boundary lever, the mounting groove has all been seted up to the front and the back of sliding plate, openly the mounting groove with the back the mounting groove is crisscross to be set up, and the inner wall sliding connection of mounting groove has the slide bar, the one end and the boundary lever fixed connection of slide bar, set up the spring in the mounting groove, the one end and the one end fixed connection of slide bar of spring, the other end and the inner wall fixed connection of mounting groove of spring.
Further, the cross section of going up the silo is isosceles trapezoid, go up the side axis coincidence of silo and holding tank, the boundary lever is laminated with the hypotenuse of going up the silo inside, transfer the department and move to the boundary lever and closely laminate with the sliding plate when going up the silo and holding tank junction, go up the height that the bottom wall is higher than the bottom wall in the holding tank in the silo.
Further, the encapsulation platform includes the platform body with encapsulation incasement diapire fixed connection, sliding connection has the encapsulation seat on the platform body, the spout has been seted up to the upper surface of platform body, and the inner wall rotation of spout is connected with the screw thread lead screw, the surface threaded connection of screw thread lead screw has the movable block, movable block and spout sliding connection, and the upper surface and the encapsulation seat fixed connection of movable block, the positive fixedly connected with motor of platform body, the output of motor runs through the inner wall of spout and with the one end fixed connection of screw thread lead screw.
Further, the packaging seat comprises a seat body which is in sliding connection with the table body, the middle of the upper surface of the seat body is provided with a groove, the inner wall of the groove is respectively provided with two entering grooves, the two entering grooves are opposite in opening direction, the entering groove corresponding to the feeding component for conveying the substrate is positioned below the entering groove corresponding to the feeding component for conveying the cover plate, the two entering grooves are communicated, the depth of the entering groove is equal to that of the corresponding basic or cover plate, and the inner bottom wall of the entering groove is equal to that of the inner bottom wall of the corresponding pushing groove.
Further, the inner chamber of recess is provided with the kicking block, the indent groove has been seted up to the upper surface of movable block, and the interior bottom wall fixedly connected with third electric putter in indent groove, the output of third electric putter and the lower surface fixed connection of kicking block, the interior roof fixedly connected with dead lever of encapsulation case, the bottom fixedly connected with dead lever.
Further, the upper surface fixedly connected with vacuum pump of encapsulation case, the inlet end fixedly connected with intake pipe of vacuum pump, the one end of intake pipe is linked together with the inner chamber of encapsulation case, the surface of intake pipe is two branch pipes of fixedly connected with respectively, the branch pipe is linked together with the inner chamber of holding tank, the equal fixedly connected with solenoid valve in the surface of intake pipe and branch pipe.
The beneficial effects are that:
1. according to the invention, the substrate or the cover plate is placed through the storage tank, the pushing plate is driven to move through the output end of the first electric push rod, so that the substrate or the cover plate at the lowest layer in the storage tank is pushed to the packaging table, and the substrate or the cover plate at the upper layer can be blocked by utilizing the bottom of the storage tank by setting the height of the pushing tank to be greater than or equal to the height of the substrate or the cover plate corresponding to the feeding and smaller than twice the height of the substrate or the cover plate corresponding to the feeding, so that the substrate or the cover plate at the lowest layer moves along with the substrate or the cover plate, and the problem of packaging failure caused by the fact that a plurality of cover plates are adsorbed due to static electricity in the prior art is solved.
2. According to the invention, the feeding groove is arranged, the section of the feeding groove is larger than that of the corresponding substrate or cover plate, the phenomenon that the substrate or cover plate is easy to block can be avoided when the substrate or cover plate is directly added into the storage groove, the output end of the second electric push rod drives the transfer part to move, the substrate or cover plate is further pushed into the storage groove, the section of the feeding groove is arranged to be isosceles trapezoid, the central axes of the sides of the feeding groove and the storage groove are overlapped, and the deflected substrate or cover plate can be conveniently aligned in the pushing process, so that the portable semiconductor refrigeration piece packaging equipment has the effect of preventing the feeding from being blocked.
3. According to the invention, the base plate can be moved to the bottom of the inner cavity of the groove through the arrangement of the entering groove, after the semiconductor refrigerating sheet is installed, the cover plate is moved to the top of the inner cavity of the groove, the base plate corresponds to the cover plate under the limit of the entering groove, the output end of the third electric push rod drives the top plate to move, and the corresponding overlapped base plate and cover plate are driven to move until the base plate and the cover plate are positioned under the cooperation of the fixed block so as to facilitate subsequent welding.
4. According to the invention, through the cooperation of the vacuum pump, the air inlet pipe and the branch pipe, the air in the packaging box can be pumped out, so that the packaging box is kept in a vacuum state, the side rod is tightly attached to the sliding plate when the side rod is attached to the inclined edge in the feeding groove and the transferring part moves to the joint of the feeding groove and the storage groove, the storage groove can be sealed, the air is prevented from entering the packaging box, the bottom wall in the feeding groove is higher than the bottom wall in the storage groove, the storage groove can be sealed by using the substrate or the cover plate positioned at the bottom wall in the feeding groove and positioned at the bottom wall in the feeding groove when the feeding groove is fed in the feeding groove, the air entering the packaging box from the outside after the transferring part moves is reduced, the energy consumption of the vacuum pump for pumping the air is reduced, and the energy-saving effect is achieved.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic elevational view of the enclosure of the present invention;
FIG. 3 is a schematic cross-sectional view of a feed assembly of the present invention;
FIG. 4 is a schematic perspective view of a transfer part according to the present invention;
FIG. 5 is a schematic view of an exploded structure of the transfer part of the present invention;
FIG. 6 is a schematic perspective view of a package table according to the present invention;
FIG. 7 is a schematic cross-sectional view of a table of the present invention;
fig. 8 is a schematic cross-sectional view of a package base according to the present invention.
The reference numerals are as follows:
1. packaging the box; 2. a case cover; 3. a packaging table; 301. a table body; 302. a packaging seat; 3021. a base; 3022. a groove; 3023. entering a groove; 303. a threaded screw rod; 304. a moving block; 305. a motor; 4. a feeding assembly; 401. a column; 402. a storage tank; 403. a pushing groove; 404. a pushing plate; 405. a first electric push rod; 406. feeding a trough; 407. a transfer section; 4071. a sliding plate; 4072. a side bar; 4073. a slide bar; 4074. a spring; 408. a second electric push rod; 5. a top block; 6. a third electric push rod; 7. a fixed rod; 8. a fixed block; 9. a vacuum pump; 10. an air inlet pipe; 11. a branch pipe; 12. a solenoid valve.
Detailed Description
The invention is further illustrated by the following examples in connection with figures 1-8:
as shown in fig. 1-8, a portable semiconductor refrigeration piece packaging device comprises a packaging box 1, wherein the front surface of the packaging box 1 is rotationally connected with a box cover 2, the inner bottom wall of the packaging box 1 is fixedly connected with a packaging table 3, two feeding components 4 are respectively arranged in the packaging box 1 and are respectively used for conveying a base plate and a cover plate to the packaging table 3 one by one, a universal wheel with a brake is arranged at the bottom of the packaging box 1 so that the device can move portably, the device also comprises a welding component, a cooling component and a manipulator, the welding component, the cooling component and the manipulator are not shown in the figure, and the parts are all of the prior art and are not repeated here.
Further, in order to realize conveying the substrates and the cover plates one by one, the feeding assembly 4 comprises a stand column 401 fixedly connected with the inner bottom wall of the packaging box 1, the top of the stand column 401 is fixedly connected with the upper surface of the packaging box 1, a storage groove 402 is formed in the top of the stand column 401, the storage groove 402 is used for placing the substrates or the cover plates, the storage groove 402 is matched with the corresponding substrates or the cover plates, a pushing groove 403 penetrating through the stand column 401 is formed in one side, close to the packaging table 3, of the stand column 401, a pushing plate 404 is slidably connected with the inner wall of the pushing groove 403, and the pushing plate 404 is used for pushing the substrates or the cover plates to the packaging table 3.
The push groove 403 is located the bottom of holding groove 402, and the height of push groove 403 is greater than or equal to the height of the base plate or the apron of corresponding material loading and is less than the twice of the base plate or the apron height of corresponding material loading, and the side fixedly connected with first electric putter 405 of encapsulation case 1, the output of first electric putter 405 runs through the inner wall of encapsulation case 1 and with one side fixed connection of push plate 404.
Specifically, the substrate or the cover plate is placed through the storage tank 402, the output end of the first electric push rod 405 drives the pushing plate 404 to move, and then the substrate or the cover plate at the lowest layer in the storage tank is pushed onto the packaging table 3, and the substrate or the cover plate at the upper layer can be blocked by utilizing the bottom of the storage tank 402 by setting the height of the pushing tank 403 to be greater than or equal to the height of the substrate or the cover plate corresponding to the feeding and less than twice the height of the substrate or the cover plate corresponding to the feeding, so that the substrate or the cover plate moves along with the substrate or the cover plate at the lowest layer, the problem that the packaging failure is caused by the fact that a plurality of cover plates are adsorbed due to static electricity in the prior art is solved.
Further, in order to facilitate placing the substrate or the cover plate into the corresponding storage tank 402 and prevent the blockage caused by the inclination of the material during the placement, the top of the upright column 401 is provided with a feeding groove 406, the feeding groove 406 is communicated with the storage tank 402, the section of the feeding groove 406 is polygonal or circular, the section of the feeding groove 406 is larger than the corresponding substrate or the cover plate so as to reduce the blockage caused by the clamping of the substrate or the cover plate, the inner bottom wall of the feeding groove 406 is slidably connected with a transferring part 407, the transferring part 407 is used for pushing the substrate or the cover plate into the storage tank 402, the side surface of the packaging box 1 is fixedly connected with a second electric push rod 408, and the output end of the second electric push rod 408 penetrates through the inner wall of the feeding groove 406 and is fixedly connected with the transferring part 407, and the upper surface of the packaging box 1 is provided with a through hole corresponding to the feeding groove 406.
The transfer portion 407 includes the sliding plate 4071 with interior bottom sliding connection in the silo 406, the front and the back of sliding plate 4071 all are provided with boundary lever 4072, the mounting groove has all been seted up to the front and the back of sliding plate 4071, the crisscross setting of front mounting groove and back mounting groove, and the inner wall sliding connection of mounting groove has slide bar 4073, slide bar 4073's one end and boundary lever 4072 fixed connection, set up spring 4074 in the mounting groove, the one end and the one end fixed connection of slide bar 4073 of spring 4074, the other end and the inner wall fixed connection of mounting groove of spring 4074.
The cross section of the feeding groove 406 is isosceles trapezoid, and the feeding groove 406 coincides with the lateral central axis of the storage groove 402.
Specifically, through setting up silo 406 to make silo 406 cross-section be greater than the base plate or the apron that corresponds, can avoid directly adding base plate or apron to holding tank 402 and appear the phenomenon of jam easily, drive transfer portion 407 through the output of second electric putter 408 and remove, and then push base plate or apron to holding tank 402 in, through setting up the cross-section of silo 406 to isosceles trapezoid, and silo 406 and holding tank 402's side axis coincidence, can be convenient to correct the base plate or the apron of skew in the propelling movement in-process, thereby make this portable semiconductor refrigeration piece encapsulation equipment have the effect that prevents the material loading jam.
Further, in order to cooperate the pay-off of two material loading subassemblies for the base plate is located the below of apron, encapsulation platform 3 include with encapsulation case 1 in bottom wall fixed connection's stage body 301, sliding connection has encapsulation seat 302 on the stage body 301, the spout has been seted up to the upper surface of stage body 301, and the inner wall rotation of spout is connected with screw thread lead screw 303, screw thread lead screw 303's surface threaded connection has movable block 304, movable block 304 and spout sliding connection, and movable block 304's upper surface and encapsulation seat 302 fixed connection, the positive fixedly connected with motor 305 of stage body 301, the output of motor 305 runs through the inner wall of spout and with screw thread lead screw 303's one end fixed connection.
The package base 302 includes a base body 3021 slidably connected with the platform body 301, a groove 3022 is formed in the middle of the upper surface of the base body 3021, two entry grooves 3023 are formed in the inner wall of the groove 3022, the openings of the two entry grooves 3023 are opposite, the entry groove 3023 corresponding to the feeding assembly 4 for conveying the substrate is located below the entry groove 3023 corresponding to the feeding assembly 4 for conveying the cover plate, the two entry grooves 3023 are communicated, the depth of the entry groove 3023 is equal to that of the corresponding base or cover plate, and the inner bottom wall of the entry groove 3023 is equal to that of the corresponding pushing groove 403.
Specifically, through setting up get into groove 3023, can make the base plate remove to the bottom of recess 3022 inner chamber, wait to install the semiconductor refrigeration piece after, the apron removes to the top of recess 3022 inner chamber, and under the spacing of getting into groove 3023 for the base plate corresponds with the apron, drives screw thread lead screw 303 through the output of motor 305, and then makes movable block 304 remove, and then drives encapsulation seat 302 and remove, so that base plate and apron remove to different stations.
Further, in order to facilitate subsequent welding of the substrate and the cover plate, an inner cavity of the groove 3022 is provided with a top block 5, an inward sink is formed on the upper surface of the moving block 304, a third electric push rod 6 is fixedly connected to the inner bottom wall of the inward sink, the output end of the third electric push rod 6 is fixedly connected with the lower surface of the top block 5, a fixing rod 7 is fixedly connected to the inner top wall of the packaging box 1, and a fixing block 8 is fixedly connected to the bottom end of the fixing rod 7.
Specifically, the output end of the third electric push rod 6 drives the top plate to move, so as to drive the corresponding coincident base plate and cover plate to move until the base plate and the cover plate are positioned under the cooperation of the fixed block 8, so that the subsequent welding is facilitated.
Further, in order to maintain the vacuum state in the packaging box 1 to ensure the high-performance refrigerating effect, the upper surface of the packaging box 1 is fixedly connected with a vacuum pump 9, an air inlet pipe 10 is fixedly connected to an air inlet end of the vacuum pump 9, one end of the air inlet pipe 10 is communicated with an inner cavity of the packaging box 1, two branch pipes 11 are fixedly connected to the surface of the air inlet pipe 10 respectively, the branch pipes 11 are communicated with the inner cavity of the storage groove 402, and electromagnetic valves 12 are fixedly connected to the surfaces of the air inlet pipe 10 and the branch pipes 11.
The side bar 4072 is attached to the inclined edge inside the upper trough 406, and the transfer portion 407 is moved to the junction between the upper trough 406 and the storage trough 402, so that the side bar 4072 is tightly attached to the sliding plate 4071, and the inner bottom wall of the upper trough 406 is higher than the inner bottom wall of the storage trough 402.
Specifically, through the cooperation of vacuum pump 9, intake pipe 10 and branch pipe 11, can take out the interior air of encapsulation case 1, make it keep the vacuum state, through making side bar 4072 and the hypotenuse laminating of material loading groove 406 inside, transfer portion 407 remove to the department of material loading groove 406 and holding tank 402 when being closely laminated with sliding plate 4071 side bar 4072, can seal holding tank 402, avoid the air to go into encapsulation case 1, through making the interior diapire of material loading groove 406 higher than the height of holding tank 402 inner bottom wall, can be when material loading in upward material loading groove 406, utilize the base plate or the apron that is located the interior bottom wall height of material loading groove 406 in holding tank 402 to seal holding tank 402, reduce because transfer portion 407 removes the external air that gets into encapsulation case 1 after the external world, reduce the power consumption that vacuum pump 9 draws the air, have energy-conserving effect.
Working principle: when the portable semiconductor refrigeration piece packaging equipment is used, a substrate and a cover plate are put into the upward trough 406 by a user, then the second electric push rod 408 is started, the output end of the second electric push rod 408 drives the transfer part 407 to move, the transfer part 407 pushes the substrate and the cover plate into the corresponding storage groove 402, at the moment, the transfer part 407 seals the storage groove 402, then the vacuum pump 9 is started, the vacuum pump 9, the air inlet pipe 10 and the branch pipe 11 are matched, air in the packaging box 1 is pumped out, the packaging box is kept in a vacuum state, then one of the first push rods is started, the output end of the first push rod drives the push plate 404 to move, the push plate 404 enables the substrate at the lowest layer in the storage box to be pushed onto the packaging table 3 along the corresponding inlet groove 3023 and fall into the bottom of the groove 3022, then the semiconductor refrigeration piece is mounted on the substrate by a manipulator, after the mounting is completed, the other first push rod is started, the first push rod acts, the cover plate at the lowest layer moves to the upper part of the substrate along the corresponding inlet groove 3023, the two are overlapped, then the motor 305 is started, the output end of the motor 305 drives the threaded block 302, and then the top plate 302 is driven by the motor 305 to move, and the top plate 302 is driven by the motor 305, and the top plate is driven by the motor to move, and the top plate 302 is welded, and the top plate is moved, and the top plate is welded, and the problem is solved, and the problem that the sealing is solved, and the sealing of the sealing assembly is achieved.
The embodiments of the present invention are disclosed as preferred embodiments, but not limited thereto, and those skilled in the art will readily appreciate from the foregoing description that various extensions and modifications can be made without departing from the spirit of the present invention.
Claims (10)
1. The utility model provides a portable semiconductor refrigeration piece encapsulation equipment, includes encapsulation case (1), the front rotation of encapsulation case (1) is connected with case lid (2), its characterized in that, interior bottom fixedly connected with encapsulation platform (3) of encapsulation case (1), the inside of encapsulation case (1) is provided with two feeding subassembly (4) respectively, two feeding subassembly (4) are used for carrying base plate and apron one by one to encapsulation bench (3) respectively.
2. A portable semiconductor refrigeration chip packaging apparatus as recited in claim 1, wherein: the feeding assembly (4) comprises an upright post (401) fixedly connected with the inner bottom wall of the packaging box (1), the top of the upright post (401) is fixedly connected with the upper surface of the packaging box (1), a storage groove (402) is formed in the top of the upright post (401), the storage groove (402) is used for accommodating a substrate or a cover plate, the storage groove (402) is matched with the corresponding substrate or cover plate, a pushing groove (403) penetrating through the upright post (401) is formed in one side, close to the packaging table (3), of the upright post (401), and a pushing plate (404) is connected with the inner wall of the pushing groove (403) in a sliding mode and used for pushing the substrate or the cover plate to the packaging table (3).
3. A portable semiconductor refrigeration chip packaging apparatus as recited in claim 2, wherein: the pushing groove (403) is located at the bottom of the storage groove (402), the height of the pushing groove (403) is larger than or equal to the height of the substrate or the cover plate corresponding to the feeding and smaller than twice the height of the substrate or the cover plate corresponding to the feeding, a first electric push rod (405) is fixedly connected to the side face of the packaging box (1), and the output end of the first electric push rod (405) penetrates through the inner wall of the packaging box (1) and is fixedly connected with one side of the pushing plate (404).
4. A portable semiconductor refrigeration chip packaging apparatus as recited in claim 2, wherein: the top of stand (401) has seted up material loading groove (406), material loading groove (406) are linked together with holding tank (402), the cross-section of material loading groove (406) is polygon or circular, and material loading groove (406) cross-section is greater than base plate or apron that corresponds in order to reduce base plate or apron and block up by the card post, interior bottom wall sliding connection of material loading groove (406) has transfer portion (407), transfer portion (407) are used for pushing base plate or apron to holding tank (402) in, the side fixedly connected with second electric putter (408) of encapsulation case (1), the output of second electric putter (408) runs through the inner wall of material loading groove (406) and with transfer portion (407) fixed connection, the through-hole that corresponds with material loading groove (406) is seted up to the upper surface of encapsulation case (1).
5. The portable semiconductor refrigeration piece packaging device as claimed in claim 4, wherein: transfer portion (407) include with interior wall sliding connection's of material loading groove (406) slide plate (4071), the front and the back of slide plate (4071) all are provided with boundary lever (4072), the mounting groove has all been seted up to the front and the back of slide plate (4071), front the mounting groove with the back the mounting groove is crisscross to be set up, and the inner wall sliding connection of mounting groove has slide bar (4073), the one end and boundary lever (4072) fixed connection of slide bar (4073), be provided with spring (4074) in the mounting groove, the one end and the one end fixed connection of slide bar (4073) of spring (4074), the other end and the inner wall fixed connection of mounting groove of spring (4074).
6. A portable semiconductor refrigeration chip package apparatus as recited in claim 5, wherein: the cross-section of going up silo (406) is isosceles trapezoid, go up silo (406) and the coincidence of the side axis of holding tank (402), boundary lever (4072) are laminated with the hypotenuse of going up silo (406) inside, transfer portion (407) and move boundary lever (4072) and closely laminate with sliding plate (4071) when going up silo (406) and holding tank (402) junction, the interior bottom wall of going up silo (406) is higher than the height of the interior bottom wall of holding tank (402).
7. A portable semiconductor refrigeration chip packaging apparatus as recited in claim 1, wherein: the packaging table (3) comprises a table body (301) fixedly connected with the inner bottom wall of the packaging box (1), a packaging seat (302) is slidably connected onto the table body (301), a sliding groove is formed in the upper surface of the table body (301), a threaded screw rod (303) is rotatably connected to the inner wall of the sliding groove, a moving block (304) is in threaded connection with the surface of the threaded screw rod (303), the moving block (304) is slidably connected with the sliding groove, the upper surface of the moving block (304) is fixedly connected with the packaging seat (302), a motor (305) is fixedly connected to the front surface of the table body (301), and the output end of the motor (305) penetrates through the inner wall of the sliding groove and is fixedly connected with one end of the threaded screw rod (303).
8. The portable semiconductor refrigeration piece packaging device as claimed in claim 7, wherein: the packaging seat (302) comprises a seat body (3021) which is slidably connected with the platform body (301), a groove (3022) is formed in the middle of the upper surface of the seat body (3021), two entering grooves (3023) are formed in the inner wall of the groove (3022) respectively, the two entering grooves (3023) are opposite in opening direction, the entering groove (3023) corresponding to the feeding assembly (4) for conveying the substrate is located below the entering groove (3023) corresponding to the feeding assembly (4) for conveying the cover plate, the two entering grooves (3023) are communicated, the depth of the entering groove (3023) is equal to that of the corresponding basic or cover plate, and the inner bottom wall of the entering groove (3023) is equal to that of the corresponding pushing groove (403).
9. The portable semiconductor refrigeration piece packaging device as claimed in claim 8, wherein: the inner cavity of recess (3022) is provided with kicking block (5), the indent groove has been seted up to the upper surface of movable block (304), and the interior bottom wall fixedly connected with third electric putter (6) in indent groove, the output of third electric putter (6) and the lower fixed surface of kicking block (5) are connected, interior roof fixedly connected with dead lever (7) of encapsulation case (1), the bottom fixedly connected with dead lever (8) of dead lever (7).
10. A portable semiconductor refrigeration chip packaging apparatus as recited in claim 1, wherein: the utility model discloses a vacuum pump, including encapsulation case (1), vacuum pump (9) are fixed surface, the inlet end fixedly connected with intake pipe (10) of vacuum pump (9), the one end of intake pipe (10) is linked together with the inner chamber of encapsulation case (1), the surface of intake pipe (10) is two branch pipes (11) of fixedly connected with respectively, branch pipe (11) are linked together with the inner chamber of holding tank (402), the equal fixedly connected with solenoid valve (12) of surface of intake pipe (10) and branch pipe (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN117202756B (en) | 2024-06-14 |
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