CN213184245U

CN213184245U - Automatic feeding device for integrated circuit packaging bonding wires

Info

Publication number: CN213184245U
Application number: CN202022768205.8U
Authority: CN
Inventors: 吴桂泉
Original assignee: Shenzhen Loongson Semiconductor Technology Co ltd
Current assignee: Shenzhen Loongson Semiconductor Technology Co ltd
Priority date: 2020-11-26
Filing date: 2020-11-26
Publication date: 2021-05-11
Anticipated expiration: 2030-11-26

Abstract

The utility model relates to the technical field of integrated circuit production, and discloses an integrated circuit packaging bonding wire automatic feeding device, which comprises a bottom plate, wherein the top of the bottom plate is symmetrically bolted with a baffle plate, the top of the bottom plate is symmetrically bolted with a support plate, the top of the bottom plate is provided with a connecting plate which is bolted with the support plate, a blanking groove is arranged inside the connecting plate, and the top of the connecting plate is symmetrically bolted with a limiting plate; the utility model discloses a mode that adjustment mechanism adjusted the interval between two slides has reached the purpose of adjusting the storage case, let operating personnel when carrying out the pay-off to the integrated circuit of equidimension not, can adjust two slides to the size the same with integrated circuit, and then improved the precision of integrated circuit when the blanking, and two slides with adjustable also can let operating personnel dredge to the storage case faster, not only shortened the mediation time, simultaneously also effectual the pay-off efficiency who improves the device.

Description

Automatic feeding device for integrated circuit packaging bonding wires

Technical Field

The utility model relates to an integrated circuit production technical field specifically is an integrated circuit encapsulation bonding wire automatic feeding.

Background

An integrated circuit is a microelectronic device or component. The integrated circuit is manufactured on a small or a plurality of small semiconductor wafers or medium substrates by interconnecting the elements such as transistors, resistors, capacitors, inductors and the like required in a circuit and wiring by adopting a certain process, and then the integrated circuit is sent into the bonding wire machine by an automatic feeding device to be welded.

But present automatic feeding is when using, because the unable regulation of the storage case size of device, after the integrated circuit of equidimension not comes out through the storage case, take place to deviate with the runway easily, and integrated circuit is in case deviated, the circumstances with baffle friction then can appear in the propelling movement in-process in later stage, and then cause the condemned circumstances of integrated circuit appearance, and take place to block up when integrated circuit in the inside of storage case, at this moment then need operating personnel to dismantle the storage case and just can dredge, not only spend time and influence pay-off efficiency, so, in order to solve above-mentioned problem, we provide an integrated circuit encapsulation bonding wire automatic feeding.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an integrated circuit encapsulation bonding wire automatic feeding, possess the advantage that can adjust the storage case, solved present integrated circuit encapsulation bonding wire automatic feeding and can't adjust the problem to the storage case when using.

In order to achieve the above object, the utility model provides a following technical scheme: an automatic feeding device for packaging bonding wires of integrated circuits comprises a bottom plate, wherein baffles are symmetrically bolted on the top of the bottom plate, the top of the bottom plate is symmetrically bolted with support plates, the top of the bottom plate is provided with a connecting plate bolted with the support plates, a blanking groove is arranged in the connecting plate, the top of the connecting plate is symmetrically bolted with a limiting plate, the tops of the connecting plates are symmetrically provided with sliding plates, the insides of the sliding plates are symmetrically provided with guide grooves matched with the limiting plates, the top of the bottom plate is provided with an adjusting mechanism, the top of the bottom plate is symmetrically provided with positioning plates bolted with the connecting plate, one side of the connecting plate is bolted with a mounting plate, a sensor is embedded in the mounting plate, the top of the bottom plate is bolted with a fixing plate which is bolted with the baffle plate, the inside of fixed plate is embedded to have the electric telescopic handle with sensor electric connection, electric telescopic handle's output runs through to one side of fixed plate and bolted connection has the push pedal.

Preferably, the adjusting mechanism comprises a motor, one side of the motor is bolted to the positioning plate, the output end of the motor penetrates through one side of the positioning plate and is bolted to a rotating rod through a coupler, forward threads and reverse threads are integrally punched on the surface of the rotating rod respectively, and the surfaces of the forward threads and the reverse threads are in threaded connection with the sliding plate.

Preferably, the top of the limiting plate is provided with a sliding groove, and the top of the guide groove is bolted with a sliding block in sliding connection with the sliding groove.

Preferably, the top of the bottom plate is provided with four mounting blocks bolted with the baffle, the top of the bottom plate is symmetrically provided with slide bars, two ends of each slide bar are bolted with the mounting blocks, and two sides of the push plate are respectively bolted with sliding sleeves slidably connected with the slide bars.

Preferably, the locating plate is embedded with a bearing, and the inside of the bearing is rotatably sleeved with the output end of the motor.

Preferably, one side of the push plate is provided with a plurality of limiting grooves.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the utility model discloses a mode that adjustment mechanism adjusted the interval between two slides has reached the purpose of adjusting the storage case, let operating personnel when carrying out the pay-off to the integrated circuit of equidimension not, can adjust two slides to the size the same with integrated circuit, and then improved the precision of integrated circuit when the blanking, and two slides with adjustable also can let operating personnel dredge to the storage case faster, not only shortened the mediation time, simultaneously also effectual the pay-off efficiency who improves the device.

Drawings

FIG. 1 is a top view of the present invention;

FIG. 2 is an enlarged view of a portion A of FIG. 1 according to the present invention;

FIG. 3 is a side view of the structure of the present invention;

FIG. 4 is a sectional view of the side of the position-limiting plate of the present invention;

fig. 5 is a partially enlarged view of the point B in fig. 4 according to the present invention.

In the figure: 1. a base plate; 2. a baffle plate; 3. a support plate; 4. a connecting plate; 5. a discharging groove; 6. a limiting plate; 7. a slide plate; 8. a guide groove; 9. an adjustment mechanism; 91. a motor; 92. a rotating rod; 93. a positive thread; 94. reverse threads; 10. mounting a plate; 11. a sensor; 12. a fixing plate; 13. an electric telescopic rod; 14. pushing the plate; 15. positioning a plate; 16. a chute; 17. a slider; 18. mounting blocks; 19. a slide bar; 20. a sliding sleeve; 21. a bearing; 22. a limiting groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, an automatic feeding device for packaging and bonding wires of an integrated circuit comprises a bottom plate 1, a baffle plate 2 is symmetrically bolted on the top of the bottom plate 1, a support plate 3 is symmetrically bolted on the top of the bottom plate 1, a connecting plate 4 bolted with the support plate 3 is arranged on the top of the bottom plate 1, a blanking groove 5 is arranged inside the connecting plate 4, a limiting plate 6 is symmetrically bolted on the top of the connecting plate 4, a sliding plate 7 is symmetrically arranged on the top of the connecting plate 4, a guide groove 8 matched with the limiting plate 6 is symmetrically arranged inside the sliding plate 7, an adjusting mechanism 9 is arranged on the top of the bottom plate 1, a positioning plate 15 bolted with the connecting plate 4 is symmetrically arranged on the top of the bottom plate 1, a mounting plate 10 is bolted on one side of the connecting plate 4, a sensor 11 is embedded inside the mounting plate 10, a fixing plate 12 bolted with the baffle plate 2 is bolted on the top of the bottom, the output of electric telescopic handle 13 runs through to one side of fixed plate 12 and bolted connection has push pedal 14, the mode of adjusting the interval between two slides 7 through adjustment mechanism 9, the purpose of adjusting the storage case has been reached, let operating personnel when carrying out the pay-off to the integrated circuit of equidimension not, can adjust two slides 7 to the size the same with integrated circuit, and then the precision of integrated circuit when the blanking has been improved, and two adjustable slides 7 also can let operating personnel dredge the storage case faster, the mediation time has not only been shortened, simultaneously also effectual the pay-off efficiency who improves the device.

Further, adjustment mechanism 9 includes motor 91, one side and the 15 bolts of locating plate of motor 91, the output of motor 91 runs through to one side of locating plate 15 and has bull stick 92 through the shaft coupling bolt, the integrative punching press has forward screw thread 93 and reverse screw thread 94 respectively on the surface of bull stick 92, the surface of forward screw thread 93 and reverse screw thread 94 all with slide 7 threaded connection, setting through adjustment mechanism 9, the effect of regulation has been played, let operating personnel can adjust the interval between two slides 7 according to integrated circuit's size.

Further, 16 chutes are formed in the top of the limiting plate 6, the sliding blocks 17 connected with the sliding chutes 16 in a sliding manner are bolted to the top of the guide groove 8, and the sliding plates 7 are limited by the aid of the chutes 16 and the sliding blocks 17, so that the sliding plates 7 can slide back and forth more stably and smoothly.

Further, the top of bottom plate 1 is equipped with four installation pieces 18 with 2 bolted connections of baffle, the top symmetry of bottom plate 1 is equipped with slide bar 19, slide bar 19's both ends all with installation piece 18 bolted connection, push pedal 14's both sides all are bolted connection with slide bar 19 sliding connection's sliding sleeve 20, through installation piece 18, slide bar 19 and sliding sleeve 20's setting, spacing effect has been played to push pedal 14, let push pedal 14 more stable when being made a round trip to promote by electric telescopic handle 13 unobstructed.

Further, the inside of locating plate 15 is embedded to have bearing 21, and the inside of bearing 21 is rotated with the output of motor 91 and is cup jointed, through the setting of bearing 21, has played spacing effect to bull stick 92, lets the condition of bull stick 92 shake can not appear when rotating.

Furthermore, a plurality of limiting grooves 22 are formed in one side of the push plate 14, and the limiting grooves 22 are arranged to limit the integrated circuit, so that the integrated circuit cannot deviate when being pushed.

The working principle is as follows: when the integrated circuit storage box is used, an operator can start the motor 91 according to the size of the integrated circuit, the motor 91 can drive the rotating rod 92 to rotate after being started, the rotating rod 92 can drive the forward thread 93 and the reverse thread 94 on the surface to rotate when rotating, the two sliding plates 7 can be driven to approach together when the forward thread 93 and the reverse thread 94 rotate, the motor 91 is closed after being adjusted to a required position, the integrated circuit is conveyed between the two sliding plates 7 through the conveying device, the integrated circuit falls to the top of the bottom plate 1 through the discharging groove 5, the purpose of adjusting the storage box is further achieved, the two sliding plates 7 can be adjusted to the same size as the integrated circuit when the operator feeds the integrated circuits with different sizes, the precision of the integrated circuit during discharging is improved, and the two adjustable sliding plates 7 can also enable the operator to dredge the storage box more quickly, not only shortened the mediation time, simultaneously also effectual the pay-off efficiency who improves the device, and after integrated circuit fell on bottom plate 1's top, integrated circuit's arrival can be sensed to sensor 11, and the data that integrated circuit fell can be followed to mounting panel 10, conveys to electric telescopic handle 13, after electric telescopic handle 13 obtained data, then can promote push pedal 14 and carry out the bonding wire work with integrated circuit to the inside of bonding wire machine.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An integrated circuit packaging bonding wire automatic feeding device comprises a bottom plate (1), and is characterized in that: the top symmetry bolt of bottom plate (1) has baffle (2), the top symmetry bolt of bottom plate (1) has extension board (3), the top of bottom plate (1) is equipped with connecting plate (4) with extension board (3) bolt, silo (5) down have been seted up to the inside of connecting plate (4), the top symmetry bolt of connecting plate (4) has limiting plate (6), the top symmetry of connecting plate (4) is equipped with slide (7), guide slot (8) that use with limiting plate (6) cooperation are seted up to the inside symmetry of slide (7), the top of bottom plate (1) is equipped with adjustment mechanism (9), the top symmetry of bottom plate (1) is equipped with locating plate (15) with connecting plate (4) bolt, one side bolt of connecting plate (4) has mounting panel (10), the inside of mounting panel (10) is embedded to have sensor (11), the sensor is characterized in that a fixing plate (12) bolted with the baffle (2) is bolted to the top of the bottom plate (1), an electric telescopic rod (13) electrically connected with the sensor (11) is embedded in the fixing plate (12), and the output end of the electric telescopic rod (13) penetrates through one side of the fixing plate (12) and is bolted with a push plate (14).

2. The apparatus of claim 1, wherein the automatic feeding device for packaging bonding wire of integrated circuit comprises: the adjusting mechanism (9) comprises a motor (91), one side of the motor (91) is bolted with the positioning plate (15), the output end of the motor (91) penetrates through one side of the positioning plate (15) and is bolted with a rotating rod (92) through a coupler, the surface of the rotating rod (92) is respectively and integrally stamped with a forward thread (93) and a reverse thread (94), and the surfaces of the forward thread (93) and the reverse thread (94) are both in threaded connection with the sliding plate (7).

3. The apparatus of claim 1, wherein the automatic feeding device for packaging bonding wire of integrated circuit comprises: the top of the limiting plate (6) is provided with a sliding groove (16), and the top of the guide groove (8) is bolted with a sliding block (17) which is in sliding connection with the sliding groove (16).

4. The apparatus of claim 1, wherein the automatic feeding device for packaging bonding wire of integrated circuit comprises: the top of bottom plate (1) is equipped with four installation pieces (18) with baffle (2) bolt connection, the top symmetry of bottom plate (1) is equipped with slide bar (19), the both ends of slide bar (19) all with installation piece (18) bolt connection, the sliding sleeve (20) with slide bar (19) sliding connection are all bolted connection to the both sides of push pedal (14).

5. The apparatus of claim 2, wherein the automatic feeding device for packaging bonding wire of integrated circuit comprises: the inside of locating plate (15) is embedded to have bearing (21), the inside of bearing (21) rotates with the output of motor (91) and cup joints.

6. The apparatus of claim 1, wherein the automatic feeding device for packaging bonding wire of integrated circuit comprises: one side of the push plate (14) is provided with a plurality of limiting grooves (22).