CN206742198U - A kind of semiconductor cover plate make-up machine - Google Patents
A kind of semiconductor cover plate make-up machine Download PDFInfo
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- CN206742198U CN206742198U CN201720464804.6U CN201720464804U CN206742198U CN 206742198 U CN206742198 U CN 206742198U CN 201720464804 U CN201720464804 U CN 201720464804U CN 206742198 U CN206742198 U CN 206742198U
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Abstract
It the utility model is related to the art field of apparatus automatization assembling, refer in particular to a kind of semiconductor cover plate make-up machine, including workbench, cover plate load plate and semiconductor load plate, the workbench is provided with cover plate feed mechanism, rotating disk draw frame machine, cleaning device, heater and semiconductor feed mechanism, the cover plate feed mechanism and semiconductor feed mechanism are located at the both sides of rotating disk draw frame machine respectively, and the rotating disk draw frame machine draws cover plate and successively fits in cover plate on semiconductor after cleaning device and heater.The utility model further increases the stability, production efficiency and accuracy of the bonding process.
Description
Technical field
The technical field of apparatus automatization assembling is the utility model is related to, refers in particular to a kind of semiconductor cover plate make-up machine.
Background technology
With the development of smart mobile phone, fingerprint identification module is into one of smart mobile phone basic configuration.Metal-back/becket
With cover plate be bonded be fingerprint identification module production an important link.Because metal-back/becket, cover plate are smaller
Workpiece, handwork is during fitting, and not only fitting efficiency is low, and the error being bonded is big, outward appearance can not standard after fitting
It is unified.
The relevant automatic equipment that existing glass cover-plate is bonded with fingerprint recognition semiconductor, for the feed mechanism of cover plate
Generally existing need motion process space is bigger or feeding is low with the transmission efficiency of rewinding and workpiece, motion structure and
The problems such as control structure complexity, the problems such as not high Anawgy accuracy and bonding process imperfection specifically also be present.
The content of the invention
The utility model provides the utility model for problem of the prior art and provides one kind for problem of the prior art
Occupy little space, feeding and rewinding simple and fast, cover plate and semiconductor Anawgy accuracy is high and a kind of semiconductor cover plate of efficiency high
Make-up machine.
In order to solve the above-mentioned technical problem, the utility model adopts the following technical scheme that：
A kind of semiconductor cover plate make-up machine provided by the utility model, including workbench, cover plate load plate and semiconductor carry
Disk, the workbench are provided with cover plate feed mechanism, rotating disk draw frame machine, cleaning device, heater and semiconductor feeder
Structure, the cover plate feed mechanism and semiconductor feed mechanism are located at the both sides of rotating disk draw frame machine, the rotating disk suction machine respectively
Structure draws cover plate and successively fits in cover plate on semiconductor after cleaning device and heater.
Therein, the semiconductor feed mechanism includes being used for material receiving, the first feeding dress for receiving semiconductor load plate
Put, for drive the first feed device respectively along the first XY axles drive mechanism of X-axis and Y-axis displacement and positioned at material receiving and
Conveying robot above first feed device, first feed device include material conveying platform, for driving material conveying platform liter
The lift drive mechanism of drop and the rotating drive mechanism for driving material conveying platform to rotate.
As several the first screw mandrel spiral shells preferable, that the lift drive mechanism includes lifter plate, is connected with lifter plate
It is female and coordinate with the first feed screw nut the first screw mandrel, be connected with the first leading screw belt pulley, be set around the transmission skin of belt pulley
Band and the lifting motor for driving driving belt to move, the lifting motor and the first screw mandrel are and material conveying platform
Connection.
As preferable, fixed seat that the rotating drive mechanism includes being connected with the first XY axle drive mechanisms, it is connected to
The rotary shaft of fixed seat, the first rotational drive motor for being connected to fixed seat side and be connected to fixed seat relative to first rotate
Second leading screw of motor opposite side and the second feed screw nut coordinated with the second leading screw；The rotary shaft and lifter plate
Connection, is provided with rotational variations compensation device between the lifter plate and the second feed screw nut.
As preferable, the rotational variations compensation device include fixed block be connected with second feed screw nut and
Sliding block, the slide rail coordinated with sliding block and the projection being connected with slide rail, the bottom of the projection that fixed block connects are connected with slide rail,
The top of the projection is connected with lifter plate.
It is therein, the cover plate feed mechanism include being used for bearing supporting platform, the second feed device of cover plate load plate with
And for driving the second feed device respectively along X-axis and the 2nd XY axle drive mechanisms of Y-axis displacement；The supporting platform is set respectively
There are upper material position and the rewinding position of hollow out, the both sides of the upper material position hollow out are provided with for the fixture block of clamping cover plate load plate and for driving
The drive cylinder that dynamic fixture block slides, the fixture block are provided with the chimb for the onboard disk of Supporting cover；The hollow out edge of the rewinding position
Provided with inclined-plane projection.
Therein, the rotating disk draw frame machine is included located at gantry between cover plate feed mechanism and semiconductor transport mechanism
Support, the rotating disk being connected with gantry support, the suction pushing meanss for being respectively arranged on gantry support both sides and fitting pushing meanss and
For the second rotational drive motor of driving rotating disk rotation, circumferential arrangement is located at multiple vacuum cups of rotating disk on the rotating disk,
The material pushing meanss and fitting pushing meanss are located at the top of vacuum cups.
As preferable, the vacuum cups includes head sucting body, vacuum is passed through block, vacuum soup stick, the first reset element
And stopping means；The head sucting body is provided with the first accommodating chamber, the second accommodating chamber and the steam vent connected with the second accommodating chamber；Institute
State vacuum and be passed through block slip in the first accommodating chamber, the vacuum is passed through block and is provided with passage；The vacuum soup stick is slided and set
It is passed through in vacuum in block and through head sucting body, the vacuum soup stick is provided with vacuum sucking holes, and the bottom of the vacuum soup stick connects
It is connected to suction nozzle；The stopping means is located at the top of head sucting body, is communicated to limit the vacuum sucking holes with the passage；
First reset element is connected in the second accommodating chamber and with vacuum soup stick.
As preferable, the material receiving and material conveying platform are equipped with heating board.
Therein, the workbench is additionally provided with cover plate positioner for being positioned to cover plate and for semiconductor
Semiconductor positioner, the cover plate positioner are located between cleaning device and heater, the semiconductor positioner
Located at the front of fitting pushing meanss.
The beneficial effects of the utility model：
A kind of semiconductor cover plate make-up machine provided by the utility model, it is by can be with multi-shaft interlocked cover plate and semiconductor
Feed mechanism realize the process that feeding and rewinding are completed in smaller space, can also be realized not by rotating disk draw frame machine
Discontinuously suction and blowing, and joint movement is also completed while blowing, substantially increase production efficiency.This practicality is new
Type further increases the stability, production efficiency and accuracy of the bonding process.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is another structural representation of the present utility model.
Fig. 3 is the structural representation of semiconductor feed mechanism.
Fig. 4 is another structural representation of the present utility model.
Fig. 5 is the structural representation of semiconductor feed mechanism.
Fig. 6 is the structural representation of rotating drive mechanism.
Fig. 7 is the partial structurtes enlarged diagram of supporting platform.
Fig. 8 is the partial structurtes enlarged diagram at supporting platform A.
Fig. 9 is the structural representation of material conveying platform.
Figure 10 is the structural representation of vacuum cups.
Description of reference numerals
1- workbenches；2- semiconductor feed mechanisms；201- material receivings；The feed devices of 202- first；21- feedings are put down
Platform；The XY axle drive mechanisms of 22- the first；221-X axle drive mechanisms；222-Y axle drive mechanisms；211- vacuum through holes；2101- inhales
Disk；215- heating boards；24- lift drive mechanisms；The screw mandrels of 241- first；The feed screw nuts of 242- first；243- lifter plates；244- skins
Belt wheel；245- lifts motor；246- driving belts；25- rotating drive mechanisms；251- fixed seats；252- rotary shafts；253-
First rotational drive motor；The leading screws of 254- second；The feed screw nuts of 255- second；26- rotational variations compensation devices；261- is fixed
Block；262- sliding blocks；263- slide rails；264- projections；203- conveying robots；2031- captures sucker；3- rotating disk draw frame machines；
301- gantry supports；302- rotating disks；303- suction pushing meanss；304- is bonded pushing meanss；The rotational drive motors of 305- second；
31- vacuum cups；310- head sucting bodies；The accommodating chambers of 312- first；The accommodating chambers of 313- second；314- steam vents；315- first is multiple
Bit unit；320- vacuum soup sticks；321- vacuum sucking holes；325- suction nozzles；330- vacuum is passed through block；332- passages；340- is spacing
Device；4- cover plate feed mechanisms；41- supporting platforms；The upper material positions of 411-；412- fixture blocks；4121- chimbs；413- drive cylinders；
414- rewindings position；415- inclined-planes projection；The feed devices of 42- second；The XY axle drive mechanisms of 43- the 2nd；5- cleaning devices；6- is heated
Device；7- semiconductor positioners；8- cover plate positioners.
Embodiment
For the ease of the understanding of those skilled in the art, the utility model is made with reference to embodiment and accompanying drawing further
Explanation, the content that embodiment refers to not to restriction of the present utility model.The utility model is carried out below in conjunction with accompanying drawing
Detailed description.
As shown in Figures 1 to 9, a kind of semiconductor cover plate make-up machine provided by the utility model, including workbench 1, lid
Onboard disk and semiconductor load plate, the workbench 1 be provided with cover plate feed mechanism 4, rotating disk draw frame machine 3, cleaning device 5, plus
Thermal 6 and semiconductor feed mechanism 2, the cover plate feed mechanism 4 and semiconductor feed mechanism 2 are located at rotating disk suction machine respectively
The both sides of structure 3, the rotating disk draw frame machine 3 draw cover plate and successively fit in cover plate after cleaning device 5 and heater 6
On semiconductor.Specifically, heater 6 uses infrared ray heating tube；Cleaning device 5 is plasma cleaning device, using plasma
Cleaning can improve the adhesion of cover plate, it is more effectively bonded with semiconductor, strengthen it and be bonded the life-span.
In actual applications, rotating disk draw frame machine 3 can draw cover plate from cover plate feed mechanism 4, and then rotating disk is drawn
The sorption cover plate of mechanism 3 carries out the cleaning removal of impurity by cleaning device 5 to the binding face of cover plate；After cleaning, rotating disk draw frame machine 3 is inhaled
Cover plate to heat cover plate into heater 6, the viscose of its binding face is in hot melt state, to be subsequently bonded；
Finally, rotating disk draw frame machine 3 fits to cover plate on semiconductor.
In the present embodiment, referring to Fig. 1, Fig. 3 and Fig. 4, the semiconductor feed mechanism 2 includes being used to receive semiconductor load plate
Material receiving 201, the first feed device 202, for driving the first feed device 202 respectively along the first of X-axis and Y-axis displacement
XY axles drive mechanism 22 and the conveying robot 203 above the feed device 202 of material receiving 201 and first.Specifically, institute
Stating the first XY axles drive mechanism 22 includes X-axis drive mechanism 221 and Y-axis drive mechanism 222, the X-axis drive mechanism 221 and Y-axis
Drive mechanism 222 can coordinate the mechanisms such as screw mandrel, nut to realize using cylinder, oil cylinder or motor；The Y-axis drive mechanism
222 on workbench 1, and the X-axis drive mechanism 221 is connected with Y-axis drive mechanism 222, first feed device 202
It is connected with X-axis drive mechanism 221, under the driving of the first XY axles drive mechanism 22, the first feed device 202 can be realized in work
Make on platform 1 while smoothly moved along X-axis and Y-axis, enhance feeding flexibility of the present utility model and automaticity；Institute
State conveying robot 203 and be provided with symmetrical two crawl suckers 2031, can realize while one takes an action put.Handling machinery
The semiconductor load plate for being positioned over material receiving 201 can be drawn to the first material conveying platform 21 by hand 203, while can also be sent first
The semiconductor load plate of material platform 21 is drawn in next mechanism, so as to improve automaticity of the present utility model, reduce
Cost of labor and improve production efficiency.
As shown in figure 5, first feed device 202 includes material conveying platform 21, for driving the lifting of material conveying platform 21
Lift drive mechanism 24 and the rotating drive mechanism 25 for driving material conveying platform 21 to rotate.Wherein, the lift drive mechanism
24 include lifter plate 243, several first feed screw nuts 242 being connected with lifter plate 243 and coordinate with the first feed screw nut 242
The first screw mandrel 241, be connected with the first leading screw 241 belt pulley 244, be set around the driving belt 246 of belt pulley 244 and be used for
The lifting motor 245 for driving driving belt 246 to move, lifting motor 245 and first screw mandrel 241 is and feeding
Platform 21 connects.Specifically, lift drive mechanism 24 includes four the first feed screw nuts 242, and it is connected to lifter plate 243
Four angles so that the first leading screw 241 is connected with four angles of transfer platform.In the driving lower band of lifting motor 245
Dynamic driving belt 246 moves, and the sports belt wheel 244 of driving belt 246 rotates, so that the first leading screw 241 is rotated along first
Feed screw nut 242 does lifting moving, and the lifting moving of the first leading screw 241 drives material conveying platform 21 to do lifting moving.Due to lifting
Motor 245 is connected with material conveying platform 21, therefore, when the lifting of material conveying platform 21 can drive lifting motor 245 and skin
The synchronization lifting of belt wheel 244, the lifting driving belt 246 of motor 245 and second is avoided to produce deviation in displacement process.Lifting
Drive mechanism 24 is designed to make material conveying platform 21 can either smoothly move, and and can improves mobile accuracy.
Such as Fig. 5 and Fig. 6, fixed seat 251 that the rotating drive mechanism 25 includes being connected with the first XY axles drive mechanism 22,
The rotary shaft 252 of fixed seat 251 is connected to, the first rotational drive motor 253 of the side of fixed seat 251 is connected to and is connected to solid
Reservation 251 is relative to the second leading screw 254 of the opposite side of the first rotational drive motor 253 and second with the cooperation of the second leading screw 254
Feed screw nut 255；The rotary shaft 252 is connected with lifter plate 243, is set between the feed screw nut 255 of lifter plate 243 and second
There is rotational variations compensation device 26.Specifically, fixed seat 251 is connected with X-axis drive mechanism 221；First rotational drive motor 253
Belt gear, Chain conveyer or gear drive can be used with the kind of drive of the second leading screw 254, and the utility model is preferred
Ground uses belt gear, because belt transmission has the advantages that to have simple in construction, stable drive and can buffer absorbing；It is described
Fixed block 261 that rotational variations compensation device 26 includes being connected with second feed screw nut 255, it is connected with fixed block 261
Sliding block 262, the slide rail 263 coordinated with sliding block 262 and the projection 264 being connected with slide rail 263, the bottom of the projection 264 and cunning
Rail 263 is connected, and the top of the projection 264 is connected with lifter plate 243.
In actual applications, the first rotational drive motor 253 moves screw mandrel 254 by belt driving band second and rotated, and second
The rotation of screw mandrel 254 drives the second feed screw nut 255 to produce straight-line displacement, because the bottom of projection 264 is connected with slide rail 263,
The top of projection 264 is connected with rotor plate, and therefore, the movement of the second feed screw nut 255 makes projection 264 to drive rotor plate to turn
Moving axis 252 is that axle center is rotated, and is turned about the Z axis so that material conveying platform 21 is realized；But the top due to projection 264 with
Rotor plate connects, and material conveying platform 21 is that axle center is rotated with rotary shaft 252, and the top of projection 264 can be made to produce along camber line position
Move, and it is along straight-line displacement that the bottom of projection 264 is connected with the second feed screw nut 255, therefore, the utility model, which is provided with, to be rotated
Offset compensation device 26, making the top of projection 264, the bottom of projection 264 can be along slide rail while driving rotor plate to rotate
263 displacements, are compensated to rotation displacement, so that the top of projection 264 is realized along camber line displacement.The rotating drive mechanism 25
Simple and compact for structure, accurate positioning, stable and reliable operation, reduce manual work, improve production efficiency, be adapted to popularize in an all-round way should
With.
In the present embodiment, as shown in Figure 1, Figure 2 and Figure 4, the cover plate feed mechanism 4 includes being used to bear cover plate load plate
The feed device 42 of supporting platform 41 second and for drive the second feed device 42 respectively along X-axis and the 2nd XY of Y-axis displacement
Axle drive mechanism 43.Specifically, the structure and principle all one of second feed device 42 and the first foregoing feed device 202
Sample, repeat no more herein；The structure and principle of the 2nd XY axles drive mechanism and the first foregoing XY axle drive mechanisms are all
Equally, repeat no more herein.
As shown in Fig. 4, Fig. 7 and Fig. 8, the supporting platform 41 is respectively equipped with upper material position 411 and the rewinding position 414 of hollow out,
The both sides of the hollow out of upper material position 411 are provided with the fixture block 412 for clamping cover plate load plate and the drive for driving fixture block 412 to slide
Take offence cylinder 413, the fixture block 412 is provided with the convex portion for the onboard disk of Supporting cover；The hollow out edge of the rewinding position 414 is provided with oblique
Face projection 415.
In practical application, the cover plate load plate for being loaded with cover plate is placed on by upper material position 411 using artificial or manipulator, this
When fixture block 412 convex portion support cover plate load plate；Second feed device 42 is moved under the upper material position 411 of supporting platform 41
Side, then rise and accept cover plate load plate, now drive cylinder 413 drives fixture block 412 to be removed to load plate outside, makes fixture block 412
Leave cover plate load plate in convex portion；Then the second feed device 42 accepts the decline of cover plate load plate, and drive cylinder 413 drives fixture block 412
Reset, the second feed device 42 carries out cover plate load plate transfer rotating disk draw frame machine 3 absorption and fitting of cover plate；When on load plate
After cover plate has been drawn, the cover plate load plate of zero load is transplanted under the rewinding position 414 of supporting platform 41 by the second feed device 42
Square, now the second feed device 42 rises the inclined-plane projection 415 at the hollow out edge for making cover plate load plate pass through rewinding position 414, so as to
Projection 264 is set to be abutted with the bottom surface of cover plate load plate so as to play a part of the onboard disk of Supporting cover；The design on the inclined-plane of projection 264, has
Beneficial to cover plate load plate is reduced by the resistance of projection 264, in order to which cover plate load plate can swimmingly slide into the top of projection 264, this
It is easy to the collection of cover plate load plate in rewinding position 414.
In the present embodiment, as depicted in figs. 1 and 2, the rotating disk draw frame machine 3 is included located at cover plate feed mechanism 4 and half
Gantry support 301 between conductor transport mechanism, the rotating disk 302 being connected with gantry support 301, it is respectively arranged on gantry support 301
The suction pushing meanss 303 and fitting pushing meanss 304 of both sides and the second rotational drive motor rotated for driving rotating disk 302
305, second rotational drive motor 305 is DDR motors（Directly drive electric rotating machine）, the motor rotation precision is high, conveniently pacifies
Fill and easy to maintain.Specifically, the lower section of suction pushing meanss 303 is bonded pushing meanss equivalent to the suction position of machine
Bonding position of 304 lower section equivalent to machine.Wherein, circumferential arrangement is located at the multiple true of rotating disk 302 on the rotating disk 302
Suction first 31, the material pushing meanss 303 and fitting pushing meanss 304 are located at the top of vacuum cups 31.Rotating disk 302 is rotating
Vacuum cups 31 is driven to rotate under the driving of mechanism, during rotation, vacuum cups 31 is successively by suction position, cleaning
Device 5, heater 6 and bonding position.
In the present embodiment, as shown in Figure 10, the vacuum cups 31 includes head sucting body 310, vacuum is passed through block 330, true
Suction bar 320, the first reset element 315 and stopping means 340；The head sucting body 310 is provided with the first accommodating chamber 312, second
Accommodating chamber 313 and the steam vent 314 connected with the second accommodating chamber 313；The vacuum is passed through the slip of block 330 and is located at the first accommodating chamber
In 312, the vacuum is passed through block 330 and is provided with passage 332；The vacuum soup stick 320 is slided and is passed through located at vacuum in block 330 simultaneously
Through head sucting body 310, the vacuum soup stick 320 is provided with vacuum sucking holes 321, and the bottom of the vacuum soup stick 320 is connected with
Suction nozzle 325；The stopping means 340 is located at the top of head sucting body 310, leads to limit the vacuum sucking holes 321 with described
Stomata 332 communicates；First reset element 315 is connected in the second accommodating chamber 313 and with vacuum soup stick 320.Specifically,
The suction nozzle 325 is removably connected to vacuum soup stick 320, and its effect is can be easy to the ground demolition and maintenance of suction nozzle 325, and can according to
The size of material and change corresponding suction nozzle 325.
In actual applications, when vacuum cups 31, which turns to suction position, to draw cover plate, suction pushing meanss 303 push away
Dynamic vacuum soup stick 320 moves down and compression spring, the vacuum sucking holes 321 of vacuum soup stick 320 is passed through block 330 simultaneously into vacuum
Connected with passage 332, allow vacuum soup stick 320 to hold material；Pushed away when the sorption cover plate of vacuum cups 31 is rotated away from suction
During dynamic device 303, now stopping means 340 is carried out spacing to vacuum soup stick 320, allows vacuum sucking holes 321 to be kept with passage 332
Communicate, so that vacuum soup stick 320, which is in, vacuumizes state, to hold cover plate rotation；When the sorption cover plate of vacuum cups 31 rotates
During to bonding position, fitting pushing meanss 304 promote vacuum soup stick 320 to move down, and cover plate is moved down into the fitting of semiconductor
Face, cover plate is bonded with semiconductor, now vacuum soup stick 320 vacuum sucking holes 321 enter the second accommodating chamber 313 and with row
Stomata 314 connects, and is in vacuum soup stick 320 and puts vacuum state and discharge cover plate；When vacuum cups 31 continues rotating away from pasting
When closing position, vacuum soup stick 320 is resetted under the elastic force effect of the first reset element 315.In addition, the vacuum cups 31
All it is that it vacuumizes and put vacuum state using mechanical control in whole work process, and in the prior art, most of machines
Each suction nozzle of device is individually furnished with a magnetic valve to control the suction of its gas and put, and compared with prior art, this practicality is new
Type can greatly reduce the use of magnetic valve, so as to lower manufacturing cost of the present utility model.
In the present embodiment, due in the technical process of the fitting of semiconductor again, it is necessary to be heated to semiconductor, in order to cover
Plate is preferably bonded in semiconductor, and therefore, the material receiving 201 and material conveying platform 21 are equipped with heating board 215, the heating board
215 be microcrystal glass plate（As shown in Figure 9）.
In the present embodiment, as shown in figure 9, the material conveying platform 21 is provided with vacuum through holes 211, the vacuum through holes 211 may be used also
To install sucker 2101, load plate is held using sucker 2101, load plate is not likely to produce deviation in moving process, ensures feeding
Platform 21 positions the precision and stability of feeding, improves practicality of the present utility model.
In the present embodiment, as shown in Fig. 2 the workbench 1 is additionally provided with the cover plate positioner 8 for being positioned to cover plate
With for the semiconductor positioner 7 to semiconductor, the cover plate positioner 8 located at cleaning device 5 and heater 6 it
Between, the semiconductor positioner 7 is located at the front of fitting pushing meanss 304.Specifically, semiconductor positioner 7 and cover plate
The equal CCD automatic station-keeping systems of positioner 8.The system can be analyzed according to the positioning of cover plate and the positioning of semiconductor, analysis
The first feed device 202 can carry out rotating the bonding position of adjustment semiconductor afterwards, to ensure that cover plate can be accurately right with semiconductor
Position fitting, the accuracy of fitting is improved, reduces cover plate and the fitting deviation partly led, so as to improve the quality product of the utility model production
Rate.
It is described above, only it is the utility model preferred embodiment, not the utility model is made any formal
Limitation, although the utility model is disclosed as above with preferred embodiment, but is not limited to the utility model, any to be familiar with sheet
Technical professional, do not departing from the range of technical solutions of the utility model, made when using the technology contents of the disclosure above
A little change or the equivalent embodiment for being modified to equivalent variations, as long as being without departing from the content of the technical scheme of the utility model, foundation
The utility model technology refers to any simple modification, equivalent change and modification made to above example, belongs to this practicality
In the range of new technique scheme.
Claims (10)
1. a kind of semiconductor cover plate make-up machine, including workbench, cover plate load plate and semiconductor load plate, it is characterised in that：It is described
Workbench is provided with cover plate feed mechanism, rotating disk draw frame machine, cleaning device, heater and semiconductor feed mechanism, described
Cover plate feed mechanism and semiconductor feed mechanism are located at the both sides of rotating disk draw frame machine, the rotating disk draw frame machine suction cap respectively
Plate successively fits in cover plate on semiconductor after cleaning device and heater.
A kind of 2. semiconductor cover plate make-up machine according to claim 1, it is characterised in that：The semiconductor feed mechanism
Including the material receiving for receiving semiconductor load plate, the first feed device, for drive the first feed device respectively along X-axis and
First XY axles drive mechanism of Y-axis displacement and the conveying robot above material receiving and the first feed device, it is described
First feed device includes material conveying platform, the lift drive mechanism for driving material conveying platform lifting and for driving material conveying platform
The rotating drive mechanism of rotation.
A kind of 3. semiconductor cover plate make-up machine according to claim 2, it is characterised in that：The lift drive mechanism bag
Several first feed screw nuts for include lifter plate, being connected with lifter plate and the first screw mandrel coordinated with the first feed screw nut, with the
The belt pulley of one leading screw connection, the driving belt for being set around belt pulley and the lifting for driving driving belt to move drive electricity
Machine, the lifting motor and the first screw mandrel are connected with material conveying platform.
A kind of 4. semiconductor cover plate make-up machine according to claim 2, it is characterised in that：The rotating drive mechanism bag
The fixed seat being connected with the first XY axle drive mechanisms is included, the rotary shaft of fixed seat is connected to, is connected to the first of fixed seat side
Rotational drive motor and be connected to fixed seat relative to the second leading screw of the first rotational drive motor opposite side and with second
The second feed screw nut that thick stick coordinates；The rotary shaft is connected with lifter plate, is provided between the lifter plate and the second feed screw nut
Rotational variations compensation device.
A kind of 5. semiconductor cover plate make-up machine according to claim 4, it is characterised in that：The rotational variations compensation dress
Put including the fixed block being connected with second feed screw nut, the sliding block being connected with fixed block, with sliding block coordinate slide rail and with
The projection of slide rail connection, the bottom of the projection are connected with slide rail, and the top of the projection is connected with lifter plate.
A kind of 6. semiconductor cover plate make-up machine according to claim 1, it is characterised in that：The cover plate feed mechanism bag
Include for bear cover plate load plate supporting platform, the second feed device and for drive the second feed device respectively along X-axis and Y
2nd XY axle drive mechanisms of axial displacement；The supporting platform is respectively equipped with upper material position and the rewinding position of hollow out, the upper material position
The both sides of hollow out are provided with the fixture block for clamping cover plate load plate and the drive cylinder for driving fixture block to slide, and the fixture block is provided with
Chimb for the onboard disk of Supporting cover；The hollow out edge of the rewinding position is provided with inclined-plane projection.
A kind of 7. semiconductor cover plate make-up machine according to claim 1, it is characterised in that：The rotating disk draw frame machine bag
Include located at the gantry support between cover plate feed mechanism and semiconductor transport mechanism, the rotating disk being connected with gantry support, set respectively
Driving electricity is rotated in the suction pushing meanss and fitting pushing meanss of gantry support both sides and for driving rotating disk rotates second
Machine, circumferential arrangement is located at multiple vacuum cups of rotating disk on the rotating disk, and the material pushing meanss and fitting pushing meanss are located at
The top of vacuum cups.
A kind of 8. semiconductor cover plate make-up machine according to claim 7, it is characterised in that：The vacuum cups includes inhaling
Head main body, vacuum are passed through block, vacuum soup stick, the first reset element and stopping means；The head sucting body be provided with the first accommodating chamber,
Second accommodating chamber and the steam vent connected with the second accommodating chamber；The vacuum is passed through block and slided in the first accommodating chamber, described
Vacuum is passed through block and is provided with passage；The vacuum soup stick, which slides, to be passed through in block located at vacuum and through head sucting body, described true
Suction bar is provided with vacuum sucking holes, and the bottom of the vacuum soup stick is connected with suction nozzle；The stopping means is located at the top of head sucting body
End, is communicated to limit the vacuum sucking holes with the passage；First reset element in the second accommodating chamber and with
Vacuum soup stick connects.
A kind of 9. semiconductor cover plate make-up machine according to claim 2, it is characterised in that：The material receiving and feeding
Platform is equipped with heating board.
A kind of 10. semiconductor cover plate make-up machine according to claim 1, it is characterised in that：The workbench is additionally provided with
Set for the cover plate positioner positioned to cover plate and for the semiconductor positioner to semiconductor, the cover plate positioner
Between cleaning device and heater, the semiconductor positioner is located at the front of fitting pushing meanss.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720464804.6U CN206742198U (en) | 2017-04-28 | 2017-04-28 | A kind of semiconductor cover plate make-up machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720464804.6U CN206742198U (en) | 2017-04-28 | 2017-04-28 | A kind of semiconductor cover plate make-up machine |
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| CN206742198U true CN206742198U (en) | 2017-12-12 |
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| CN201720464804.6U Active CN206742198U (en) | 2017-04-28 | 2017-04-28 | A kind of semiconductor cover plate make-up machine |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106971968A (en) * | 2017-04-28 | 2017-07-21 | 东莞市安达自动化设备有限公司 | A kind of semiconductor cover plate make-up machine |
| CN108573905A (en) * | 2018-04-14 | 2018-09-25 | 安徽吉乃尔电器科技有限公司 | A kind of semiconductor element cleaning equipment and its application method |
| CN109390258A (en) * | 2018-11-06 | 2019-02-26 | 深圳格兰达智能装备股份有限公司 | A kind of automatic gland equipment of chip |
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2017
- 2017-04-28 CN CN201720464804.6U patent/CN206742198U/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106971968A (en) * | 2017-04-28 | 2017-07-21 | 东莞市安达自动化设备有限公司 | A kind of semiconductor cover plate make-up machine |
| CN108573905A (en) * | 2018-04-14 | 2018-09-25 | 安徽吉乃尔电器科技有限公司 | A kind of semiconductor element cleaning equipment and its application method |
| CN108573905B (en) * | 2018-04-14 | 2020-12-01 | 芜湖拓达电子科技有限公司 | Semiconductor element cleaning equipment and using method thereof |
| CN109390258A (en) * | 2018-11-06 | 2019-02-26 | 深圳格兰达智能装备股份有限公司 | A kind of automatic gland equipment of chip |
| CN109390258B (en) * | 2018-11-06 | 2020-12-08 | 深圳格兰达智能装备股份有限公司 | Automatic capping equipment of chip |
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Address after: No.17, xiangxidong District Road, Liaobu Town, Dongguan City, Guangdong Province 523000 Patentee after: Guangdong anda Intelligent Equipment Co., Ltd Address before: 523000, No. 6, pine West Road, Southern China industrial town, Liaobu Town, Guangdong, Dongguan Patentee before: ANDA AUTOMATIC EQUIPMENT (DONGGUAN) Co.,Ltd. |