CN108447806B - Chip automatic production equipment, system and method thereof - Google Patents
Chip automatic production equipment, system and method thereof Download PDFInfo
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- CN108447806B CN108447806B CN201810276355.1A CN201810276355A CN108447806B CN 108447806 B CN108447806 B CN 108447806B CN 201810276355 A CN201810276355 A CN 201810276355A CN 108447806 B CN108447806 B CN 108447806B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 163
- 238000000034 method Methods 0.000 title claims description 23
- 238000004891 communication Methods 0.000 claims abstract description 27
- 230000005540 biological transmission Effects 0.000 claims abstract description 24
- 238000001514 detection method Methods 0.000 claims abstract description 20
- 230000000007 visual effect Effects 0.000 claims abstract description 19
- 238000012545 processing Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 32
- 238000012546 transfer Methods 0.000 claims description 15
- 238000004806 packaging method and process Methods 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 10
- 230000003993 interaction Effects 0.000 claims description 8
- 230000005856 abnormality Effects 0.000 claims description 5
- 239000000523 sample Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 5
- 238000012795 verification Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000011179 visual inspection Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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Abstract
The invention discloses an automatic chip production system which comprises a main control module, a storage module, an ERP database, a communication module and automatic chip production equipment, wherein the automatic chip production equipment comprises an equipment control module, a read-write code module, a first transmission module, a marking module, a second transmission module, a visual detection module, a third transmission module, a signal identification module and an intelligent clamp which are respectively in communication connection with the equipment control module, the storage module and the main control module are respectively in communication connection with the ERP database through the communication module, and the automatic chip production equipment is arranged under the control of the main control module to carry out automatic production and processing on chips, so that the production efficiency and the yield of the chips are improved.
Description
Technical Field
The invention relates to the field of chip manufacturing, in particular to automatic production equipment, system and method of consumable chips.
Background
Generally, a chip is a generic term for a semiconductor device product, which is a carrier for an integrated circuit and is divided by a wafer. The chip is the most important and core part in the computer or other electronic equipment, bears the core functions of operation, storage and the like, and the application range of the chip almost covers all fields of military industry, civil use, industry and the like. The whole chip manufacturing process comprises the steps of chip design, wafer manufacturing, packaging manufacturing, test verification and the like, and the requirements on the production process are more precise, but the existing chip production process has some defects.
Firstly, the degree of automation of the traditional chip production line is low, and part of working procedures adopt a manual operation mode. Because of the operation errors of operators, production errors and even production accidents are easy to cause, and meanwhile, the yield of products is not high.
Secondly, the production efficiency of manual operation is lower, and the hysteresis quality of the individual working procedures can cause the slow production progress of the whole assembly line, and the yield is not high.
And moreover, even the traditional chip automatic production line basically corresponds to one automatic device at one station, and the integration level is not high. Moreover, the adaptability to chips of different types is not strong, and when chips of different types are produced, the existing automatic production equipment is often required to be subjected to large-scale modification and adjustment to adapt to the chips of different types, so that the equipment cost of the production line is increased.
In view of the foregoing, the current conventional chip production mode cannot meet the increasing and complex chip order quantity and order structure, and a new chip automated production system is needed in the art to solve the above-mentioned problems.
Disclosure of Invention
The invention aims to provide automatic chip production equipment, system and method, which solve the problem of low production efficiency of the conventional consumable chip and improve the production efficiency of the chip.
The invention further aims to provide automatic chip production equipment, system and method, which solve the problem of high production error rate of the existing consumable chips, improve the yield of chip production and avoid production accidents.
Another object of the present invention is to provide an automatic chip production apparatus, system and method thereof, which improves the automation degree of chip production, thereby accelerating the production progress and improving the yield.
Another object of the present invention is to provide an automatic chip production device, system and method thereof, which improve the adaptability of an automatic chip production line, and can simultaneously realize the processing and production of chips of different types without modifying and adjusting the production device in a large range, and simultaneously reduce the equipment modification cost of the production line.
Therefore, in order to achieve the above object, the present invention provides an automated chip production apparatus for automated chip production, comprising:
an equipment control module;
The system comprises a code reading and writing module, a first transmission module, a marking module, a second transmission module, a visual detection module and a third transmission module;
The reading and writing code module, the first transmission module, the marking module, the second transmission module, the visual detection module and the third transmission module are respectively in communication connection with the equipment control module, wherein the reading and writing code module is arranged to burn code information to a chip through a probe corresponding to a chip reading and writing code contact and verify the code information, the marking module is arranged to print identification information to the chip through laser, the visual detection module is arranged to detect the appearance of the chip, the first transmission module is arranged to transmit the chip from the reading and writing code module to the marking module, the second transmission module is arranged to transmit the chip from the marking module to the visual detection module, and the third transmission module is arranged to remove the chip from the visual detection module and transmit the chip to the next procedure.
According to one embodiment of the invention, the chip automated production equipment further comprises at least one intelligent clamp and a signal identification module, wherein the intelligent clamp comprises a signal unit, the signal unit is arranged to store identification information corresponding to chips of different types, and the signal identification module is arranged to identify the identification information in the signal unit and control the read-write code module and the marking module to process the chips of corresponding types through the equipment control module.
According to one embodiment of the invention, the intelligent clamp further comprises an adjusting unit, and the adjusting unit enables the clamp to adapt to the imposition of chips with different sizes and different imposition numbers through modularized assembly.
Preferably, the first, second and third transfer modules are implemented as multi-joint robotic arms.
Preferably, the signal unit is an RFID tag, and the signal recognition unit is an RFID reader.
According to one embodiment of the invention, the code reading and writing module comprises an interface unit, and the code reading and writing module realizes updating of codes through the interface unit.
According to one embodiment of the invention, the chip automation production device further comprises an interaction module, wherein the interaction module is in communication connection with the device control module, the interaction module comprises a display unit and an operation unit, the display unit is used for displaying production conditions in real time, and the operation unit is used for a manager to perform manual intervention operation on the automation device.
According to one embodiment of the invention, the chip automated production equipment further comprises a board disassembling module and a packaging module, wherein the board disassembling module and the packaging module are respectively in communication connection with the equipment control module, the board disassembling module is used for disassembling the full-page chips, and the packaging module is used for repackaging the disassembled chips.
According to another aspect of the present invention, there is further provided an automated chip production system comprising:
A main control module;
A storage module;
ERP database;
A communication module; and
The chip automatic production equipment comprises a main control module, a storage module, an ERP database, a communication module, a device control module, a task information acquisition module, a control module and an automatic chip production equipment, wherein the device control module of the chip automatic production equipment is respectively in communication connection with the main control module and the storage module through the communication module, the main control module is in communication connection with the ERP database through the communication module, the main control module is arranged to acquire production information from the ERP database and generate task information after processing, the main control module simultaneously transmits the production information and the task information to the device control module of the chip automatic production equipment, and the automatic chip production equipment is arranged to automatically produce and process chips according to the task information and the production information.
According to one embodiment of the invention, the production information includes order information, material information, code information, and identification information.
According to one embodiment of the invention, the storage module is configured to store equipment information generated by the chip automated production equipment, wherein the equipment information includes the number of finished chips produced, equipment abnormality information, material information, code writing and reading result information, visual detection result information and the like.
According to one embodiment of the invention, the task information refers to a production plan made by the main control module for the chip automatic production equipment according to the production information, and the production plan comprises imposition information for splitting the intelligent clamp, production time and the like.
According to another aspect of the present invention, the present invention further provides an automated chip production method, which includes the steps of:
(A) The main control module 10 starts a production data grabbing and decomposing thread;
(B) Judging whether the chip automation production equipment 50 is connected with the main control module 10, if so: connected, the chip automated production equipment 50 is started; if it is
Not connected, waiting for the chip automated production equipment 50 to be connected with the main control module 10;
(C) Judging whether the chip automatic production equipment 50 is disconnected from the main control module 10, if so:
the chip is automatically produced without disconnection; if it is
Has been disconnected and waits for the chip automated production equipment 50 to connect with the master control module 10.
The above and other objects, features, and advantages of the present invention will become further apparent from the following detailed description, the accompanying drawings, and the appended claims.
Drawings
FIG. 1 is a schematic configuration diagram of an automated chip production system according to a preferred embodiment of the present invention;
FIG. 2 is a schematic diagram of the configuration of a chip automated production facility of the chip automated production system according to a preferred embodiment of the present invention;
FIG. 3 is a schematic diagram of a smart fixture of a chip automated production facility of a chip automated production system in accordance with a preferred embodiment of the present invention;
FIG. 4 is a flow chart of an automated chip production method according to a preferred embodiment of the present invention;
FIG. 5 is another flow diagram of an automated chip production method according to a preferred embodiment of the invention;
FIG. 6 is another flow diagram of an automated chip production method according to a preferred embodiment of the invention;
In the figure: a main control module 10; a storage module 20; an ERP database 30; a communication module 40; chip automated production equipment 50; a read-write code module 51; a burning unit 511; a verification unit 512; an interface unit 513; a first transfer module 52; a marking module 53; a second transfer module 54; a visual detection module 55; a third transfer module 56; a signal recognition module 57; a device control module 58; a smart clamp 59; a signal unit 591; an adjustment unit 592; an interaction module 501; a display unit 5011; an operation unit 5012; a panel removal module 502; and a packaging module 503.
Detailed Description
The invention will be further described with reference to the drawings and the detailed description, wherein it should be noted that, on the premise of no conflict, the embodiments or technical features described below can be arbitrarily combined to form new embodiments.
The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present invention.
It will be understood that the terms "a" and "an" should be interpreted as referring to "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, while in another embodiment, the number of elements may be plural, and the term "a" should not be interpreted as limiting the number.
Referring to fig. 1 and 2 of the drawings, a chip automation system according to a preferred embodiment of the present invention will be elucidated in the following description, wherein the chip automation system comprises a master control module 10, a storage module 20, an ERP database 30, a communication module 40, and a chip automation device 50, wherein the chip automation device 50 comprises a device control module 58, a read/write code module 51, a first transfer module 52, a marking module 53, a second transfer module 54, a visual detection module 55, a third transfer module 56, a signal recognition module 57, and a smart fixture 59, which are respectively communicatively connected to the device control module 58, wherein the master control module 58 is respectively communicatively connected to the master control module 10, the storage module 20, and wherein the master control module 10 is communicatively connected to the ERP database 30 via the communication module 40.
The main control module 10 is configured to obtain the production information from the ERP database 30, generate a task information after processing, and send the task information to the device control module 58 of the chip automated production device 50, where the device control module 58 is configured to control the read/write code module 51, the first transmission module 52, the marking module 53, the second transmission module 54, the visual detection module 55, the third transmission module 56, the signal recognition module 57, and the intelligent fixture 59 to perform automated production processing on chips according to the task information and the production information.
Specifically, the production information in the ERP database 30 includes order information, material information, code information, identification information, and the like. The master control module 10 is configured to retrieve and process the production information from the ERP data and then generate the task information, and the master control module 10 sends the task information and the production information to the device control module 58 of the chip automated production device 50. The task information refers to a production plan made by the main control module 10 for the chip automated production equipment 50 according to the production information, and includes imposition information for splitting the intelligent fixture 59, production time, and the like.
Further, the code reading and writing module 51 includes a writing unit 511, a verification unit 512, and an interface unit 513. The device control module 58 transmits the code information in the production information to the burning unit 511 of the read-write code module 51 through the interface unit 513. The burning unit 511 is configured to burn the code information to the chip through a probe corresponding to the chip read/write code contact. The verification unit 512 is configured to verify the code written to the chip by the writing unit 511 through a probe corresponding to the chip read/write code contact, and check whether the code written to the chip is complete and correct. The interface unit 513 is configured to receive the code information from the device control module 58 to update the code information in the code reading and writing module 51.
When the chip completes the burning and verification of the code in the code reading and writing module 51, the first transmitting module 52 is configured to transmit the chip from the code reading and writing module 51 to the marking module 53. The device control module 58 sends the marking information in the production information to the marking module 53, and the marking module 53 is configured to print the marking information to the chip by laser. The marking process is a process of marking the chip, such as marking relevant information of a product model and the like.
When the chip is marked by the marking module 53, the second transfer module 54 is configured to transfer the chip from the marking module 53 to the visual inspection module 55. The visual detection module 55 is configured to detect the appearance of the chip, such as whether the mark is clear, whether the contact is short-circuited or the copper is complete. The third transfer module 56 is configured to remove the chip from the vision inspection module 55 and transfer it to the next process.
Preferably, because the code-writing contact and the marking surface of the chip may not be on the same side of the chip, i.e. the chip needs to be flipped over when being transported from the code-reading/writing module 51 to the marking module 53, the first transfer module 52, the second transfer module 54 and the third transfer module 56 are implemented as an articulated robot in order to save device space. Through the arrangement, the turnover of the chip can be realized, and the space can be saved.
Preferably, the chip automation production device 50 further includes the smart fixture 59 and the signal recognition module 57, and the smart fixture 59 includes a signal unit 591 and an adjustment unit 592. The smart fixture 59 is configured to hold a full-page chip. The signal unit 591 is configured to store identification information corresponding to chips of different models, and the signal identification module 57 is configured to identify the identification information in the signal unit 591 and control the read-write code module 51 and the marking module 53 to process the chips of the corresponding models through the device control module 58. By the mode, chips of different types in the same chip can be processed simultaneously.
Referring to fig. 3 of the drawings, an exemplary full-page chip contains m×n chips, assuming that m×n=10×10. If 10×10 chips are chips with a large number of the same model, the signal unit 591 is configured to store the identification information corresponding to the model, and the signal identification module 57 identifies the identification information of the model chip and controls the code reading and writing module 51 and the marking module 53 to directly read and mark the model chip with 10×10 being a whole version through the device control module 58, so that the productivity is greatly increased.
For model chips with the demand less than 100, multi-model chip imposition operation can be performed, for example, the identification information of the corresponding chip of 1-20 is A, the code table to be written is A1, and the marking information to be performed is A2; the identification information of the chip corresponding to 21-50 is B, the code table to be written is B1, the marking information to be carried out is B2, the identification information of the chip corresponding to 51-100 is C, the code table to be written is C1, and the marking information to be carried out is C2. The identification information A, B, C is stored in the signal unit 591 at the same time, when the signal identification unit identifies that the identification information is a, the signal identification unit controls the code reading and writing module 51 to write the code table A1 into the 1-20 chip through the device control module 58, and controls the marking module 53 to mark the 1-20 chip with the marking signal A2; when the signal identification unit identifies that the identification information is B, the signal identification unit controls the read-write code module 51 to write a code table B1 into the 21-50 chip through the equipment control module 58, and controls the marking module 53 to mark a marking signal B2 on the 21-50 chip; when the signal identification unit identifies that the identification information is C, the signal identification unit controls the read-write code module 51 to write the code table C1 into the 51-100 chip through the equipment control module 58, and controls the marking module 53 to mark the 51-100 chip with a marking signal C2. Thus, the intelligent jigs 59 and the signal recognition modules 57 realize simultaneous manufacturing of chips of various types, thereby greatly improving productivity and working efficiency of automation equipment.
It will be appreciated by those skilled in the art that the code information and the label information of the different types of chips can be simultaneously transmitted to the code reading and writing module 51 and the marking module 53 through the main control module 10 and the device control module 58.
It will be further appreciated by those skilled in the art that a plurality of the smart jigs 59 may be provided, and the signal unit 591 of each smart jig 59 stores identification information of different types of chips, thereby further reducing the manufacturing time of different chips and improving productivity. The correspondence between the different identification information of the signal unit 591 and the different types of chips may be preset by the main control module 10. The master control module 10 is configured to generate an optimal imposition scheme according to the order information in the ERP database 30.
It should be noted that the adjustment unit 592 can adapt the smart fixture 59 to different sizes of chips and different numbers of impositions through modular assembly. As will be appreciated by those skilled in the art, the modular assembly refers to adapting the smart fixture 59 to different sized chips and different imposition numbers by adjusting the length and width dimensions of the smart fixture 59.
Preferably, the signal unit 591 is implemented as an RFID tag and the signal recognition module 57 is provided as an RFID reader.
Further, the chip automation production device 50 further includes an interaction module 501, and the interaction module 501 is communicatively connected to the device control module 58. The interactive module 501 includes a display unit 5011 and an operation unit 5012, where the display unit 5011 is configured to display the operation results of each module, and display the production conditions in real time, such as the number of finished chips, equipment abnormality information, material information, code reading result information, visual inspection result information, and the like.
Preferably, the display unit 5011 is implemented as a liquid crystal display.
The operation unit 5012 is provided for a manager to perform manual intervention operations on the automation apparatus, such as start-stop control of the chip automation production apparatus 50, and the like.
Preferably, the operation unit 5011 is implemented as a virtual key.
Preferably, the chip automation device 50 further includes a board disassembly module 502 and a packaging module 503, where the board disassembly module 502 and the packaging module 503 are respectively communicatively connected to the device control module 58. The board detaching module 502 is configured to detach the full-page chip, and the packaging module 503 is configured to repackage the detached chip.
It will be appreciated by those skilled in the art that the unpacking module 502 and the packaging module 503 may be implemented as any mechanical structure that enables unpacking and packaging of full-page chips.
Further, the storage module 20 is configured to store equipment information generated by the chip automated production equipment 50, where the equipment information includes the number of finished chips produced, equipment abnormality information, material information, code writing and reading result information, visual inspection result information, and the like.
Referring to fig. 4 of the drawings, the present invention further provides an automated chip production method, which includes the steps of:
(A) The main control module 10 starts a production data grabbing and decomposing thread;
(B) Judging whether the chip automation production equipment 50 is connected with the main control module 10, if so:
Connected, the chip automated production equipment 50 is started; if it is
Not connected, waiting for the chip automated production equipment 50 to be connected with the main control module 10;
(C) Judging whether the chip automatic production equipment 50 is disconnected from the main control module 10, if so:
the chip is automatically produced without disconnection; if it is
Has been disconnected and waits for the chip automated production equipment 50 to connect with the master control module 10. Specifically, the step (a) includes the steps of:
(A1) The main control module 10 obtains production information from the ERP database 30, wherein the production information at least comprises order information, material information, code information and identification information;
(A2) And decomposing, distributing and processing the production information and generating task information, wherein the task information comprises at least one piece of imposition information.
Further, the step (A2) further includes a step (a 21): judging whether the ERP database 30 has the undegraded order information, then:
When there is no undegraded order information in the ERP database 30, generating imposition information according to the current decomposed order information;
When the ERP database 30 has the undegraded order information, it is determined whether the fixed-point material receiving time is reached, then:
when the material receiving time is up, generating material receiving information and imposition information according to the undegraded order information;
when the material receiving time is not up, generating imposition information according to the order information which is decomposed currently.
By the method, imposition information is generated according to the existing disassembled order information, meanwhile, the material receiving time is considered, and material and personnel management confusion caused by frequent material receiving of the undegraded order information is prevented.
Still further, before the step (C), further comprising the steps of:
(B1) Judging whether an unfinished order exists currently, if so:
The main control module 10 sends the corresponding production information and the imposition information to the chip automatic production equipment 50 to process chips when an order is not produced; if it is
The production information and the imposition information are received in a waiting mode when an order which is not produced is not available;
(B2) Judging whether the current material is produced, if so:
the device control module 58 sends device information to the storage module 20, wherein the device information at least comprises the number of finished chips, device abnormality information, material information, code reading result information, visual detection result information and the like; if it is
After the production is completed, the device control module 58 determines whether other materials are not being produced, if:
with other materials not being produced, the equipment control module 58 sends the information of the material not being produced to the storage module 20; if it is
No other materials are not produced, and the communication between the chip automatic production equipment 50 and the main control module 10 is ended;
(B3) The main control module 10 receives and determines whether the production is wrong according to the equipment information and the unproductive material information in the storage module 20, if:
a production error occurs, and the main control module 10 writes error information and normal production information into the storage module 20; if it is
No production error occurs, and the main control module 10 writes normal production information into the storage module 20.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.
Claims (9)
1. Chip automated production equipment for carry out automated production to the chip, its characterized in that includes:
an equipment control module;
The system comprises a code reading and writing module, a first transmission module, a marking module, a second transmission module, a visual detection module and a third transmission module;
The read-write code module, the first transmission module, the marking module, the second transmission module, the visual detection module and the third transmission module are respectively in communication connection with the equipment control module, wherein the read-write code module is arranged to burn code information to a chip through a probe corresponding to a chip read-write code contact and verify the code information, the marking module is arranged to print identification information to the chip through laser, the visual detection module is arranged to perform appearance detection on the chip, the first transmission module is arranged to transmit the chip from the read-write code module to the marking module, the second transmission module is arranged to transmit the chip from the marking module to the visual detection module, and the third transmission module is arranged to remove the chip from the visual detection module and transmit the chip to the next procedure;
the intelligent clamp comprises a signal unit and an adjusting unit, wherein the signal unit is arranged to store identification information corresponding to chips of different sizes, the signal identification module is arranged to identify the identification information in the signal unit and control the read-write code module and the marking module to process the chips of corresponding models through the equipment control module, and the adjusting unit is arranged to enable the clamp to adapt to the makeup of the chips of different sizes and the makeup number of the chips of different sizes through modularized assembly.
2. The chip automation production device of claim 1, wherein the first, second and third transfer modules are implemented as multi-joint robotic arms, wherein the signal unit is an RFID tag, the signal recognition module is an RFID reader, wherein the code reading and writing module comprises an interface unit through which the code reading and writing module realizes updating of the code, wherein the chip automation production device further comprises an interaction module in communication with the device control module, the interaction module comprises a display unit and an operation unit, wherein the display unit is configured to display production conditions in real time, the operation unit is configured for manual intervention operation of a manager on the chip automation device, wherein the chip automation production device further comprises a board disassembly module and a packaging module, the board disassembly module and the packaging module are respectively in communication with the device control module, the board disassembly module is configured to disassemble the integrated chip, and the packaging module is configured to repackage the disassembled chip.
3. Chip automated production system, its characterized in that includes:
A main control module;
A storage module;
ERP database;
A communication module; and
The chip automation production device of claim 1, wherein the device control module of the chip automation production device is in communication connection with the master control module and the storage module through the communication module, the master control module is in communication connection with the ERP database through the communication module, wherein the master control module is configured to acquire production information from the ERP database and generate task information after processing, the master control module simultaneously transmits the production information and the task information to the device control module of the chip automation production device, the chip automation production device is configured to perform automatic production processing on chips according to the task information and the production information, the production information comprises order information, material information, code information and identification information, the task information comprises imposition information for splitting the intelligent fixture, the storage module is configured to store the device information generated by the chip automation production device, the device information comprises the number of finished chips, the code reading result information, and the visual detection result information.
4. The chip automated production method is suitable for the chip automated production system of claim 3, and is characterized by comprising the following steps:
the main control module starts a production data grabbing and decomposing thread;
b, judging whether the chip automatic production equipment is connected with the main control module, if so:
the communication thread of the chip automatic production equipment is started after the connection; if it is
The chip automatic production equipment is not connected and is waited to be connected with the main control module;
c, judging whether the chip automatic production equipment is disconnected with the main control module, and if so:
the chip is automatically produced without disconnection; if it is
And the automatic chip production equipment is disconnected and is waited to be connected with the main control module.
5. The automated chip production method of claim 4, wherein the step a comprises the steps of:
The method comprises the steps that A1, a main control module obtains production information from an ERP database, wherein the production information comprises one or more of order information, material information, code information and identification information;
a2, decomposing and distributing the production information and generating task information, wherein the task information comprises at least one piece of imposition information.
6. The automated chip production method of claim 5, wherein the step A2 further comprises a step a21: judging whether the ERP database has the undegraded order information, and if so:
When the ERP database has no undegraded order information, generating imposition information according to the current graded order information;
when the ERP database has the undegraded order information, judging whether the fixed-point material receiving time is reached, and then:
when the material receiving time is up, generating material receiving information and imposition information according to the undegraded order information;
when the material receiving time is not up, generating imposition information according to the order information which is decomposed currently.
7. The automated chip production method according to claim 5 or 6, further comprising the following step B1 before the step C: judging whether an unfinished order exists currently, if so:
The main control module sends corresponding production information and imposition information to the chip automatic production equipment to process chips when an order is not produced; if it is
And waiting to receive new production information and imposition information without an unproductive order.
8. The automated chip production method of claim 7, further comprising step B2 between the step B1 and the step C: judging whether the current material is produced, if so:
The equipment control module sends equipment information to the storage module after the production is completed, wherein the equipment information at least comprises the number of finished chips, equipment abnormality information, material information, code reading result information and visual detection result information; if it is
After the production is finished, the equipment control module judges whether other materials are not produced, and if so:
the equipment control module sends information of the unproductive material to the storage module; if it is
And (3) no other materials are not produced, and the communication between the chip automatic production equipment and the main control module is ended.
9. The automated chip production method of claim 8, further comprising a step B3 between the step B2 and the step C:
The main control module receives and judges whether production errors exist according to the equipment information and the unproductive material information in the storage module, and if so:
The main control module writes error information and normal production information into the storage module when production errors occur; if it is
And if no production error occurs, the main control module writes normal production information into the storage module.
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| CN109784815A (en) * | 2019-01-22 | 2019-05-21 | 珠海天威技术开发有限公司 | Chip automatic production method, computer installation and computer readable storage medium |
| CN109940394B (en) * | 2019-03-28 | 2020-11-03 | 上海永太汽车零部件有限公司 | Circular sheet nut system of processing |
| CN113571442B (en) * | 2020-04-29 | 2023-09-29 | 长鑫存储技术有限公司 | Wafer processing apparatus and wafer transfer method |
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