CN110676191A - A method of separating and combining LED wafer testing machine based on MES system - Google Patents
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Abstract
本发明公开了一种基于MES系统的LED晶圆测试拆机分组合收方法,通过扫码枪上传条形码上记录的信息并且与MES系统上的信息进行比对,无需人工肉眼进行比对,减少操作人员的核对报表的工作量,同时能够做到信息核对的百分百正确,避免子批次与生产设备配对错误的问题,减少生产出错率;利用MES系统实时监控子批次的生产情况,操作人员能够准确地判断子批次合并的时间,提高生产的效率,从而大幅度缩减拆分批次的时间,做到精准化控制的管理。
The present invention discloses a LED wafer test disassembly grouping and collection method based on the MES system. The information recorded on the barcode is uploaded by a barcode scanning gun and compared with the information on the MES system. There is no need for manual comparison with the naked eye, which reduces the workload of operators in checking reports. At the same time, the information verification can be 100% correct, avoiding the problem of incorrect pairing of sub-batches with production equipment and reducing the production error rate. The MES system is used to monitor the production status of sub-batches in real time, so that operators can accurately judge the time for merging sub-batches and improve production efficiency, thereby greatly reducing the time for splitting batches and achieving precise control management.
Description
技术领域technical field
本发明涉及LED芯片测试生产技术领域,尤其是涉及一种基于MES系统的LED晶圆测试拆机分组合收方法。The invention relates to the technical field of LED chip testing and production, in particular to a method for separating, assembling, and collecting an LED wafer testing machine based on an MES system.
背景技术Background technique
LED晶圆是LED的核心部分,事实上,LED的波长、亮度、正向电压等主要光电参数基本上取决于晶圆材料。LED的相关电路元件的加工与制作都是在晶圆上完成的,所以晶圆技术与设备是晶圆制造技术的关键所在。The LED wafer is the core part of the LED. In fact, the main optoelectronic parameters such as the wavelength, brightness, and forward voltage of the LED basically depend on the wafer material. The processing and production of related circuit components of LEDs are all completed on wafers, so wafer technology and equipment are the key to wafer manufacturing technology.
目前LED前端芯片制造设备决定了每一批次晶圆大约为40片以上,LED芯片测试设备每片测试时间,根据产品的尺寸和测试条件的变化,大约为控制在3-7小时,为了缩短测试时间,需要将每一批次晶圆拆分成多个子批次,由多台测试机同时进行测试,多台测试机均完成对应的测试任务后再将子批次合并为原来的母批次,进行下一步生产工艺。At present, the LED front-end chip manufacturing equipment determines that each batch of wafers is about 40 or more. The test time of each LED chip testing equipment is controlled at about 3-7 hours according to the size of the product and the change of test conditions. In order to shorten the time In the testing time, each batch of wafers needs to be divided into multiple sub-batches, which are tested by multiple testing machines at the same time. After multiple testing machines have completed the corresponding testing tasks, the sub-batches are merged into the original parent batch. Next, proceed to the next production process.
目前绝大部分企业还是采用人工报表记录的方式跟踪各子批次生产作业情况,依靠物理位置区分各个设备应该对应生产哪一批次的产品,当操作人员将产品拉到对应的设备前方,需要通过肉眼将报表中的数据进行一一对应,需要核对的数据包括客户代码、产品型号、工站、移入日期、开工日期等,若稍有不慎就会核对错误,人工报表跟踪工作量大,且时效性差,影响了产品的生产周期,另外分拆生产后,由于每个批次的开始测试时间和完成时间不同,因此人工难以准确地判断所以批次都完成生产的时间。At present, most enterprises still use manual report records to track the production operations of each sub-batch, and rely on the physical location to distinguish which batch of products each equipment should produce. When the operator pulls the product to the front of the corresponding equipment, it is necessary to The data in the report is matched one by one with the naked eye. The data to be checked includes customer code, product model, work station, date of move-in, start date, etc. If there is a little carelessness, there will be errors in checking, and the workload of manual report tracking is large. Moreover, the timeliness is poor, which affects the production cycle of the product. In addition, after the split production, since the start test time and completion time of each batch are different, it is difficult for humans to accurately judge the time when all batches are completed.
因此急需一个能够便于大型车间产品生产的拆分、合并管理办法,来提高产品拆分批次生产的效率。Therefore, there is an urgent need for a split and merge management method that can facilitate the production of large-scale workshop products, so as to improve the efficiency of product split batch production.
发明内容SUMMARY OF THE INVENTION
针对现有技术存在的不足,本发明的目的是提供一种基于MES系统的LED晶圆测试拆机分组合收方法,以解决上述问题。In view of the deficiencies in the prior art, the purpose of the present invention is to provide a method for separating and assembling an LED wafer testing machine based on an MES system, so as to solve the above problems.
为了实现上述目的,本发明所采用的技术方案是:In order to achieve the above object, the technical scheme adopted in the present invention is:
一种基于MES系统的LED晶圆测试拆机分组合收方法,包括以下步骤:A method for separating and combining LED wafer testing machine based on MES system, comprising the following steps:
1)将需要进行测试的一母批次LED晶圆的信息录入至MES系统中,将母批次LED晶圆实物拆分成至少两个子批次并且放置在对应的容器中。1) Enter the information of a mother batch of LED wafers to be tested into the MES system, and physically split the mother batch of LED wafers into at least two sub-batches and place them in corresponding containers.
2)通过MES系统将各子批次分配到不同的生产线上进行检测,并且生成对应的条码,将条码贴在子批次容器的表面,该条码记录有母批次LED晶圆的信息。2) Assign each sub-batch to different production lines for detection through the MES system, and generate a corresponding barcode, which is pasted on the surface of the sub-batch container, and the barcode records the information of the parent batch of LED wafers.
3)将装载有子批次LED晶圆的容器运送至对应的生产线上,通过扫码枪扫面条形码,与MES系统分配的子批次信息进行对比,若信息配对正确,则正常生产,若信息配对错误,证明子批次不是由该生产线生产,需要重新配对正确的生产线。3) Transport the container loaded with sub-batch LED wafers to the corresponding production line, scan the barcode with the barcode scanner, and compare with the sub-batch information allocated by the MES system. If the information is paired correctly, the production will be normal. The information is incorrectly paired, which proves that the sub-lot is not produced by this production line and needs to be re-paired to the correct production line.
4)MES系统实时监控各生产线上的生产情况,判断各子批次是否完成生产,当所有子批次均完成该检测工序的生产时,MES系统自动将各子批次信息合并,同时提示工作人员对子批次实物合并。4) The MES system monitors the production status of each production line in real time, and judges whether the production of each sub-batch has been completed. When all the sub-batches have completed the production of the inspection process, the MES system automatically merges the information of each sub-batch and prompts the work at the same time. Personnel physically merges sub-batches.
5)接收到MES系统的提示后,利用扫码枪对装载有子批次容器的条码进行扫描,与MES系统内的信息进行配对,当信息配对无误,将所有子批次合并装到同一个容器内,完成实物合并。5) After receiving the prompt from the MES system, use the barcode scanner to scan the barcode loaded with the sub-batch container, and pair it with the information in the MES system. When the information is paired correctly, combine all the sub-batches into the same one. In the container, the physical merger is completed.
进一步的技术方案中,LED晶圆的信息至少包括:客户代码、PTN/Lot、C/Lot、产品型号、工站、MASK、Work Order、移入日期、开工日期、状态、Qly。In a further technical solution, the LED wafer information at least includes: customer code, PTN/Lot, C/Lot, product model, station, MASK, Work Order, move-in date, start-up date, status, and Qly.
进一步的技术方案中,步骤3)中,MES系统将各子批次的生产情况在监控屏幕上显示出来,处于生产中的子批次背景颜色为白色,当某一子批次完成生产后,背景颜色更改为绿色。In a further technical solution, in step 3), the MES system displays the production status of each sub-batch on the monitoring screen, and the background color of the sub-batch in production is white, and when a certain sub-batch completes production, Change the background color to green.
采用上述方法,本发明和现有技术相比所具有的优点是:1、通过扫码枪上传条形码上记录的信息并且与MES系统上的信息进行比对,无需人工肉眼进行比对,减少操作人员的核对报表的工作量,同时能够做到信息核对的百分百正确,避免子批次与生产设备配对错误的问题,减少生产出错率;2、通过MES系统实时监控子批次的生产情况,操作人员能够准确地判断子批次合并的时间,提高生产的效率,从而大幅度缩减拆分批次的时间,做到精准化控制的管理。By adopting the above method, the advantages of the present invention compared with the prior art are: 1. Upload the information recorded on the barcode through the code scanning gun and compare it with the information on the MES system, without the need for manual comparison with the naked eye, reducing operations The workload of personnel checking reports, and at the same time, the information checking can be 100% correct, avoiding the problem of incorrect pairing of sub-batches with production equipment, and reducing the production error rate; 2. Real-time monitoring of the production of sub-batches through the MES system , the operator can accurately judge the time of sub-batch merging and improve the production efficiency, thereby greatly reducing the time for splitting batches and achieving precise control management.
附图说明Description of drawings
下面结合附图和实施例对本发明进一步说明。The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
图1是拆分批次的示意图;Fig. 1 is the schematic diagram of split batch;
图2是步骤3)中MES系统监控子批次检测生产情况的系统图;Fig. 2 is the system diagram of MES system monitoring sub-batch detection production situation in step 3);
图3是本发明的步骤框图。Figure 3 is a block diagram of the steps of the present invention.
具体实施方式Detailed ways
下面对本发明的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
如图1所示,需要检测一个母批次的LED晶圆时,为了加快检测效率将该批次的LED晶圆拆分成4个子批次,并且每个子批次中包含有3个晶圆,采用本发明提供的MES系统的LED晶圆测试批次拆分合并管理系统进行批次的拆分生产处理,如图3所示,包括以下步骤:As shown in Figure 1, when a parent batch of LED wafers needs to be inspected, in order to speed up the inspection efficiency, the batch of LED wafers is divided into 4 sub-batches, and each sub-batch contains 3 wafers , using the LED wafer test batch split and merge management system of the MES system provided by the present invention to perform batch split production processing, as shown in Figure 3, including the following steps:
1)在生产完毕待检测的状态时的母批次LED晶圆,统一装在一个“布丁桶”容器内,将需要进行测试的母批次LED晶圆的信息录入至MES系统中,具体信息内容包括但不限于客户代码、PTN/Lot、C/Lot、产品型号、工站、MASK、Work Order、移入日期、开工日期、状态、Qty、st-age;生产员工将母批次LED晶圆实物拆分成四个子批次并且放置在对应的小“布丁桶”容器中。1) The mother batch of LED wafers in the state to be tested after production is uniformly packed in a "pudding bucket" container, and the information of the mother batch of LED wafers to be tested is entered into the MES system. The specific information The contents include but are not limited to customer code, PTN/Lot, C/Lot, product model, station, MASK, Work Order, move-in date, start date, status, Qty, st-age; The object is split into four sub-lots and placed in corresponding small "pudding bucket" containers.
2)MES系统将各子批次分配到不同的生产线上进行检测生产,并且生成条码,将条码贴在小“布丁桶”容器的表面,该条码记录有母批次LED晶圆的信息。2) The MES system assigns each sub-batch to different production lines for inspection and production, and generates a barcode, which is pasted on the surface of the small "pudding bucket" container. The barcode records the information of the parent batch of LED wafers.
3)将装载有子批次LED晶圆的容器运送至对应的生产线上,通过扫码枪扫面条形码,与MES系统分配的子批次信息进行对比,若信息配对正确,则正常生产,若信息配对错误,证明子批次不是由该生产线生产,需要重新配对正确的生产线;MES系统将各子批次的生产情况在监控屏幕上显示出来,如图2所示,处于生产中的子批次背景颜色为白色,当某一子批次完成生产后,背景颜色更改为绿色。3) Transport the container loaded with sub-batch LED wafers to the corresponding production line, scan the barcode with the barcode scanner, and compare with the sub-batch information allocated by the MES system. If the information is paired correctly, the production will be normal. The information is incorrectly paired, which proves that the sub-batch is not produced by this production line, and the correct production line needs to be paired again; the MES system displays the production status of each sub-batch on the monitoring screen, as shown in Figure 2, the sub-batch in production The secondary background color is white, and when a sub-lot is finished production, the background color changes to green.
此步骤可以通过扫码枪上传条形码上记录的信息并且与MES系统上的信息进行比对,无需人工肉眼进行比对,减少操作人员的核对报表的工作量,同时能够做到信息核对的百分百正确,避免子批次与生产设备配对错误的问题,减少生产出错率。In this step, the information recorded on the barcode can be uploaded through the barcode scanner and compared with the information on the MES system, without the need for manual comparison with the naked eye, reducing the workload of the operator to check the report, and at the same time, the percentage of information checking can be achieved. 100 correct, avoid the problem of incorrect pairing of sub-batches with production equipment, and reduce the production error rate.
4)MES系统实时监控各生产线上的生产情况,判断各子批次是否完成生产,工作人员通过监控屏幕发现所有子批次的背景颜色都变成绿色后,表示所有子批次均完成该检测工序的生产,MES系统自动将各子批次信息合并。4) The MES system monitors the production status of each production line in real time, and judges whether the production of each sub-batch is completed. After the staff finds that the background color of all sub-batches has turned green through the monitoring screen, it means that all sub-batches have completed the inspection. During the production of the process, the MES system automatically merges the information of each sub-batch.
通过MES系统实时监控子批次的生产情况,操作人员能够准确地判断子批次合并的时间,提高生产的效率,从而大幅度缩减拆分批次的时间,做到精准化控制的管理。Through the real-time monitoring of the production of sub-batches through the MES system, operators can accurately judge the time for merging sub-batches and improve production efficiency, thereby greatly reducing the time for splitting batches and achieving precise control management.
5)接收到MES系统的提示后,利用扫码枪对装载有子批次容器的条码进行扫描,与MES系统内的信息进行配对,当信息配对无误,同时工作人员对子批次实物进行合并,将所有小“布丁桶”容器内LED晶圆放置在一个“布丁桶”内,完成实物合并。5) After receiving the prompt from the MES system, use the barcode scanner to scan the barcode loaded with the sub-batch container, and pair it with the information in the MES system. When the information is paired correctly, the staff will merge the sub-batch physical objects at the same time. , place all the LED wafers in the small "pudding bucket" containers in a "pudding bucket" to complete the physical consolidation.
以上内容仅为本发明的较佳实施例,对于本领域的普通技术人员,依据本发明的思想,在具体实施方式及应用范围上均会有改变之处,本说明书内容不应理解为对本发明的限制。The above contents are only preferred embodiments of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific embodiments and application scope. limits.
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CN113035733A (en) * | 2021-02-25 | 2021-06-25 | 长鑫存储技术有限公司 | Automatic wafer processing method and automatic wafer processing device |
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