CN110676191A - LED wafer test disassembly group combining and collecting method based on MES system - Google Patents
LED wafer test disassembly group combining and collecting method based on MES system Download PDFInfo
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- CN110676191A CN110676191A CN201910950757.XA CN201910950757A CN110676191A CN 110676191 A CN110676191 A CN 110676191A CN 201910950757 A CN201910950757 A CN 201910950757A CN 110676191 A CN110676191 A CN 110676191A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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Abstract
The invention discloses an LED wafer test disassembly and assembly method based on an MES system, which is characterized in that information recorded on a bar code is uploaded by a code scanning gun and is compared with information on the MES system without manual naked eyes, so that the workload of checking a report form by an operator is reduced, the information can be checked in hundreds of correct percentage, the problem of mismatching of a sub-batch and production equipment is avoided, and the production error rate is reduced; the MES system is utilized to monitor the production condition of the sub-batches in real time, and operators can accurately judge the merging time of the sub-batches, so that the production efficiency is improved, the time for splitting the batches is greatly shortened, and the management of precise control is realized.
Description
Technical Field
The invention relates to the technical field of LED chip test production, in particular to an LED wafer test disassembly and assembly method based on an MES system.
Background
The LED wafer is the core part of the LED, and in fact, the wavelength, brightness, forward voltage, and other major optoelectronic parameters of the LED basically depend on the wafer material. Processing and fabrication of the related circuit elements of the LED are all completed on the wafer, so the wafer technology and equipment are the key points of the wafer manufacturing technology.
At present, the manufacturing equipment of the LED front-end chip determines that each batch of wafers is about more than 40, each piece of testing time of the LED chip testing equipment is controlled to be about 3-7 hours according to the size of a product and the change of testing conditions, in order to shorten the testing time, each batch of wafers needs to be split into a plurality of sub-batches, a plurality of testing machines are used for testing simultaneously, and after the plurality of testing machines complete corresponding testing tasks, the sub-batches are combined into the original parent batch to carry out the next production process.
At present, most enterprises still adopt a manual report recording mode to track the production operation condition of each sub-batch, which batch of products should be produced by each device is distinguished by depending on physical positions, when an operator pulls the products to the front of the corresponding devices, data in the report needs to be in one-to-one correspondence by naked eyes, the data needing to be checked comprises client codes, product models, work stations, immigration dates, start dates and the like, if the data are checked carelessly, the manual report tracking workload is large, the timeliness is poor, the production cycle of the products is influenced, and after the batch is produced by splitting, the time for completing the production of the batch is difficult to accurately judge by manual because the starting test time and the completing time of each batch are different.
Therefore, a splitting and combining management method which is convenient for the production of large-scale workshop products is urgently needed to improve the efficiency of the production of splitting batches of products.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide an LED wafer test disassembling, assembling and collecting method based on an MES system to solve the problems.
In order to achieve the purpose, the invention adopts the technical scheme that:
an LED wafer test disassembly group combining and collecting method based on an MES system comprises the following steps:
1) information of a parent batch of LED wafers needing to be tested is input into an MES system, and the parent batch of LED wafers are physically split into at least two sub-batches and placed in corresponding containers.
2) And distributing each sub-batch to different production lines for detection through an MES (manufacturing execution system), generating a corresponding bar code, and attaching the bar code to the surface of the sub-batch container, wherein the bar code records the information of the LED wafer of the parent batch.
3) And (3) conveying the container loaded with the sub-batch of LED wafers to a corresponding production line, scanning the bar codes through a code scanning gun, comparing the sub-batch information with the sub-batch information distributed by the MES system, if the information is correctly matched, normally producing the sub-batch, and if the information is incorrectly matched, verifying that the sub-batch is not produced by the production line and needs to be re-matched with the correct production line.
4) And the MES system monitors the production condition on each production line in real time, judges whether each sub-batch completes production, and automatically merges the information of each sub-batch and prompts workers to merge the sub-batches when all the sub-batches complete the production of the detection process.
5) And after the prompt of the MES system is received, the bar codes loaded with the sub-batch containers are scanned by using a code scanning gun, the bar codes are paired with the information in the MES system, and when the information pairing is correct, all the sub-batches are combined and loaded into the same container to complete the material object combination.
In a further technical solution, the information of the LED wafer at least includes: customer code, PTN/Lot, C/Lot, product model, Work station, MASK, Work Order, move in date, start date, status, Qly.
In a further technical scheme, in the step 3), the MES system displays the production condition of each sub-batch on a monitor screen, the background color of the sub-batch in production is white, and when a certain sub-batch is finished, the background color is changed to green.
Compared with the prior art, the method has the advantages that: 1. the information recorded on the bar code is uploaded by the bar code scanning gun and is compared with the information on the MES system, manual and visual comparison is not needed, the workload of an operator for checking a report is reduced, meanwhile, the information can be checked in hundreds of percent correctly, the problem of wrong matching of a sub-batch and production equipment is avoided, and the production error rate is reduced; 2. the MES system monitors the production condition of the sub-batches in real time, so that an operator can accurately judge the merging time of the sub-batches, the production efficiency is improved, the time for splitting the batches is greatly shortened, and the precise control management is realized.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic illustration of a split batch;
FIG. 2 is a system diagram of the MES system monitoring the sub-batch to detect the production condition in step 3);
fig. 3 is a block diagram of the steps of the present invention.
Detailed Description
The technical solutions of the present invention are described clearly and completely below, and it is obvious that the described embodiments are some, not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, when an LED wafer of a mother lot needs to be detected, in order to accelerate the detection efficiency, the LED wafer of the lot is split into 4 sub-lots, and each sub-lot includes 3 wafers, the LED wafer test lot splitting and merging management system of the MES system provided by the present invention is adopted to perform the splitting production process of the lot, as shown in fig. 3, including the following steps:
1) the method comprises the steps that mother batch of LED wafers in a state to be detected after production is finished are uniformly arranged in a 'pudding barrel' container, information of the mother batch of LED wafers needing to be tested is input into an MES system, and specific information content comprises but is not limited to customer codes, PTN/Lot, C/Lot, product models, Work stations, MASK, Work Order, shift-in date, start date, state, Qty and st-age; production personnel physically split a parent batch of LED wafers into four sub-batches and place them in corresponding small "pudding tub" containers.
2) And the MES system distributes each sub-batch to different production lines for detection production, generates a bar code, and attaches the bar code to the surface of a small pudding barrel container, wherein the bar code records the information of the LED wafers of the parent batch.
3) Conveying the containers loaded with the sub-batch of LED wafers to a corresponding production line, scanning the bar codes through a code scanning gun, comparing the sub-batch information with the sub-batch information distributed by the MES system, if the information is correctly matched, normally producing the sub-batch, and if the information is incorrectly matched, verifying that the sub-batch is not produced by the production line and needs to be re-matched with the correct production line; the MES system displays the production status of each sub-batch on the monitor screen, as shown in fig. 2, the background color of the sub-batch in production is white, and when a certain sub-batch is finished, the background color is changed to green.
According to the step, the information recorded on the bar code can be uploaded through the bar code scanning gun and compared with the information on the MES system, manual naked eyes are not needed for comparison, the workload of checking the report form of an operator is reduced, meanwhile, the information can be checked in hundreds of correct percentage, the problem of wrong matching of the sub-batch and the production equipment is avoided, and the production error rate is reduced.
4) And the MES system monitors the production condition on each production line in real time, judges whether each sub-batch is finished, indicates that all the sub-batches finish the production of the detection process after a worker finds that the background colors of all the sub-batches are green through the monitoring screen, and automatically merges the information of each sub-batch.
The MES system monitors the production condition of the sub-batches in real time, so that an operator can accurately judge the merging time of the sub-batches, the production efficiency is improved, the time for splitting the batches is greatly shortened, and the precise control management is realized.
5) After the prompt of the MES system is received, the bar codes loaded with the sub-batch containers are scanned by using a code scanning gun, the bar codes are matched with information in the MES system, when the information is matched, workers combine sub-batch real objects at the same time, and LED wafers in all small 'pudding barrels' containers are placed in one 'pudding barrel', so that the real object combination is completed.
The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description of the present invention, which should be interpreted as a limitation.
Claims (3)
1. An LED wafer test disassembly group combining and collecting method based on an MES system is characterized by comprising the following steps:
1) inputting information of a parent batch of LED wafers to be tested into an MES system, splitting the parent batch of LED wafers into at least two sub-batches and placing the sub-batches in corresponding containers;
2) distributing each sub-batch to different production lines through an MES (manufacturing execution system) for detection, generating a corresponding bar code, and pasting the bar code on the surface of a sub-batch container, wherein the bar code records the information of the LED wafer of the parent batch;
3) conveying the containers loaded with the sub-batch of LED wafers to a corresponding production line, scanning the bar codes through a code scanning gun, comparing the sub-batch information with the sub-batch information distributed by the MES system, if the information is correctly matched, normally producing the sub-batch, and if the information is incorrectly matched, verifying that the sub-batch is not produced by the production line and needs to be re-matched with the correct production line;
4) the MES system monitors the production condition of each production line in real time, judges whether each sub-batch completes production, and when all the sub-batches complete the production of the detection process, the MES system automatically combines the information of each sub-batch and prompts workers to combine the sub-batches;
5) and after the prompt of the MES system is received, the bar codes loaded with the sub-batch containers are scanned by using a code scanning gun, the bar codes are paired with the information in the MES system, and when the information pairing is correct, all the sub-batches are combined and loaded into the same container to complete the material object combination.
2. The method as claimed in claim 1, wherein the information of the LED wafer at least comprises: customer code, PTN/Lot, C/Lot, product model, work station, MASK, WorkOrder, move in date, start date, status, Qly.
3. The method as claimed in claim 1, wherein in step 3), the MES system displays the production status of each sub-lot on the monitor screen, the background color of the sub-lot is white, and the background color is changed to green after a certain sub-lot is completely produced.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111653505A (en) * | 2020-05-27 | 2020-09-11 | 南京泰治自动化技术有限公司 | Frame state management method and system in IC packaging chip mounting process |
| CN113035733A (en) * | 2021-02-25 | 2021-06-25 | 长鑫存储技术有限公司 | Automatic wafer processing method and automatic wafer processing device |
| CN114266330A (en) * | 2021-12-13 | 2022-04-01 | 通威太阳能（合肥）有限公司 | Automatic support separating method based on MES |
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| CN114266330B (en) * | 2021-12-13 | 2023-09-26 | 通威太阳能（合肥）有限公司 | Automatic supporting dividing method based on MES |
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