CN204029869U

CN204029869U - The loose heat conduction base plate for packaging of a kind of middle low power LED

Info

Publication number: CN204029869U
Application number: CN201420361147.9U
Authority: CN
Inventors: 陈勇华; 王新军; 雷亮
Original assignee: SHENZHEN JETWAY ELECTRONICS TECH Co Ltd
Current assignee: SHENZHEN JETWAY ELECTRONICS TECH Co Ltd
Priority date: 2014-07-01
Filing date: 2014-07-01
Publication date: 2014-12-17
Anticipated expiration: 2024-07-01

Abstract

The loose heat conduction base plate for packaging of a kind of middle low power LED, comprises LED chip, insulating barrier, loose heat conduction cylinder, via, wherein LED chip be directly welded on loose heat conduction cylindrical above, loose heat conduction cylinder and insulating barrier are combined by laminating technology, and via is located at the inside of insulating barrier; The loose heat conduction base plate for packaging of middle low power LED after the utility model improvement has that brightness is high, rapid heat dissipation, light decay is little, cost is low, thickness requirement can be allocated arbitrarily, reliable and stable feature, is the development trend of applying lighting source in current middle low power LED.

Description

The loose heat conduction base plate for packaging of a kind of middle low power LED

Technical field

The utility model relates to a kind of LED base plate for packaging, relates in particular to the loose heat conduction base plate for packaging of a kind of middle low power LED.

Background technology

LED is as a kind of new type light source, owing to having energy-saving and environmental protection, the life-span is long, toggle speed is fast, can control luminescent spectrum and forbid making the unrivaled advantage of the more high conventional light source of chroma obtain developing on an unprecedented scale with the size of width.But current existing LED element but generally has the problem of poor heat radiation.

Application number is 200820093780, name is called a kind of patent of ceramic heat radiation substrate for sheet-shaped LED encapsulation, this basic upside is provided with the Chip Area for chip is installed and passes through the routing district of welding lead connection-core plate electrode, the downside of substrate is provided with by the pedestal wiring pattern that metallizes and realizes the bottom land being connected with two electrodes of chip, substrate is also provided with for connecting upper and lower double-layer metallization wiring pattern to realize power-on and power-off via, and substrate is provided with high heating column for chip heat is derived and for high heating column being derived to heat dissipation heat dissipation bonding pad out.The heat dissipation path of this technical scheme chip is could heat be derived via high heating column after must seeing through ceramic substrate, still there is the bad defect of heat radiation, if LED heat can not conduct or the heat by conduction that can not fall apart timely, will cause the luminous inefficacy of LED, affect the useful life of LED.

Summary of the invention

The utility model is for the defect of prior art, a kind of middle low power LED heat conduction base plate for packaging that falls apart is provided, the loose heat conduction base plate for packaging of LED after improvement has that brightness is high, rapid heat dissipation, light decay is little, cost is low, thickness requirement can be allocated arbitrarily, reliable and stable feature, is the development trend of applying lighting source in current middle low power LED.

The loose heat conduction base plate for packaging of a kind of middle low power LED, comprise LED chip 2, insulating barrier 4, via 8, it is characterized in that: also comprise loose heat conduction cylinder 5, described LED chip 2 be directly welded on loose heat conduction cylinder 5 above, described loose heat conduction cylinder 5 is combined by laminating technology with insulating barrier 4, described via 8 is located at the inside of insulating barrier 4.

As preferably, the size of described loose heat conduction cylinder 5 sizes and LED chip 2 sizes match.

As preferably, described insulating barrier 4 forms for BT resin material and PP material lamination.

As preferably, described LED is loose, and heat conduction base plate for packaging also comprises circuit solder joint 3 and upper soldering dish 6, and described circuit solder joint 3 is connected to realize power-on and power-off conducting with via 8 respectively with upper soldering dish 6.

As preferably, described LED is loose, and heat conduction base plate for packaging also comprises solder joint gold thread 7, and the positive and negative electrode of described LED chip 2 is connected with the circuit solder joint 3 of LED chip 2 right sides, left both sides by solder joint gold thread 7 respectively, realizes a conductive network.

As preferably, described via 8 is 2 or 4.

As preferably, the upper and lower two ends of the hole wall of described via 8 are provided with conductive layer 9, and described conductive layer 9 extends to circuit solder joint 3 and upper soldering dish 6.

As preferably, described via 8 is hollow via or solid via.

Compared with prior art the utlity model has following advantage:

1.LED chip be directly welded on heat radiation cylindrical above, belong to vertical loose heat conduction, ceramic substrate is that LED chip passes through ceramic insulating layer and heat conduction on copper face again, belongs to the dispersed horizontal heat conduction of integral insulation;

2. loose heat conduction cylinder and insulating barrier are to combine with special laminating technology, do not have the problem of layering under high temperature test condition;

3. after loose heat conduction cylinder material and insulating layer material combination, the color and luster of material does not have xanthochromia for 5 hours at high-temperature baking test 150 degree;

4. the utility model can make that the meticulousst circuit is made and wire sizes requires to be controlled at the standard-required scope of 0.025MM;

5. the loose heat conduction base plate for packaging of the LED after the utility model improvement has that brightness is high, rapid heat dissipation, light decay is little, cost is low, thickness requirement can be allocated arbitrarily, reliable and stable feature, is the development trend of applying lighting source in current middle low power LED.

Brief description of the drawings

Figure 1 shows that the middle low power LED heat conduction package substrate construction schematic diagram that falls apart;

Figure 2 shows that the loose conductive structure schematic diagram in the loose heat conduction base plate for packaging of middle low power LED;

Figure 3 shows that solid through-hole structure schematic diagram in the loose heat conduction base plate for packaging of middle low power LED.

Embodiment

As shown in Figure 1, Figure 2, Figure 3 shows, a kind of middle low power LED heat conduction base plate for packaging that falls apart, comprises spherical package body 1, LED chip 2, circuit solder joint 3, insulating barrier 4, loose heat conduction cylinder 5, upper soldering dish 6, solder joint gold thread 7, via 8, conductive layer 9; The direction of arrow shown in figure is that LED chip is through the vertically direction of loose heat conduction of loose heat conduction cylinder.

The loose heat conduction base plate for packaging of a kind of middle low power LED, the LED chip 2 of this substrate be directly welded on loose heat conduction cylinder 5 above, the positive and negative electrode of LED chip 2 is connected with the circuit solder joint 3 of LED chip 2 right sides, left both sides by solder joint gold thread 7 respectively, realize a conductive network, the heat that LED chip 2 produces when luminous can be directly through the vertical loose heat conduction of loose heat conduction cylinder 5; Loose heat conduction cylinder 5 is combined by laminating technology with insulating barrier 4, loose heat conduction cylinder 5 is pure copper material, loose heat conduction cylinder 5 is made through special process, the size of loose heat conduction cylinder 5 sizes has strict demand, need to match with the size of LED chip 2 sizes, and will according to use time produce heat energy set; Insulating barrier 4 forms for BT resin material and PP material lamination.

As shown in Figure 2 and Figure 3, via 8 is arranged on the inside of insulating barrier 4, for connection line solder joint 3 and upper soldering dish 6 to realize power-on and power-off conducting; The quantity of via 8 is to consider that according to the both positive and negative polarity of the conductive network of via the electric network of actual product after energising steadily waits and require to determine, it can be 2 or 4, increase the good conduction of circuit by the quantity of via 8, and ensure the circuit electric conductivity at the positive back side; Via 8 can be hollow via, can be solid via, and the packing material of solid via is the resin composition of high molecular inorganic material and epoxy type, can firm combining after high temperature together, suitable with the resistance to ability of the material requirements of BT material.The upper and lower two ends of hole wall of each via 8 are provided with conductive layer 9, and conductive layer 9 extends to circuit solder joint 3 and upper soldering dish 6; Conductive layer 9 is copper pool material.

In the utility model, LED chip 2 be directly welded on loose heat conduction cylinder 5 above, the positive and negative electrode of LED chip 2 is connected with the circuit solder joint 3 of LED chip 2 right sides, left both sides by solder joint gold thread 7 respectively, realize a conductive network, again after 1 encapsulation of spherical package body, upper soldering dish 6 is welded on PCB support plate and is switched on, and a LEDs light source is just realized principle of luminosity, and the heat that LED chip 2 produces when luminous can be directly through the vertical loose heat conduction of loose heat conduction cylinder 5.

Embodiment disclosed herein is exemplary, and it is only for the utility model is explained, and is not to restriction of the present utility model, and the improvement those skilled in the art will envision that and expansion are included in protection range of the present utility model.

Claims

1. the loose heat conduction base plate for packaging of middle low power LED, comprise LED chip (2), insulating barrier (4), via (8), it is characterized in that: also comprise loose heat conduction cylinder (5), described LED chip (2) be directly welded on loose heat conduction cylinder (5) above, described loose heat conduction cylinder (5) is combined by laminating technology with insulating barrier (4), and described via (8) is located at the inside of insulating barrier (4).

2. the loose heat conduction base plate for packaging of middle low power LED according to claim 1, is characterized in that: the size of described loose heat conduction cylinder (5) size and LED chip (2) size match.

3. the loose heat conduction base plate for packaging of middle low power LED according to claim 1, is characterized in that: described insulating barrier (4) forms for BT resin material and PP material lamination.

4. the loose heat conduction base plate for packaging of middle low power LED according to claim 1, it is characterized in that: described LED is loose, and heat conduction base plate for packaging also comprises circuit solder joint (3) and upper soldering dish (6), and described circuit solder joint (3) is connected to realize power-on and power-off conducting with via (8) respectively with upper soldering dish (6).

5. according to the loose heat conduction base plate for packaging of the middle low power LED described in claim 1 or 4, it is characterized in that: described LED is loose, and heat conduction base plate for packaging also comprises solder joint gold thread (7), the positive and negative electrode of described LED chip (2) respectively circuit solder joints (3) right with LED chip (2) by solder joint gold thread (7), left both sides is connected, and realizes a conductive network.

6. the loose heat conduction base plate for packaging of middle low power LED according to claim 1, is characterized in that: described via (8) is 2 or 4.

7. according to the loose heat conduction base plate for packaging of the middle low power LED described in claim 1 or 4, it is characterized in that: the upper and lower two ends of hole wall of described via (8) are provided with conductive layer (9), described conductive layer (9) extends to circuit solder joint (3) and upper soldering dish (6).

8. the loose heat conduction base plate for packaging of middle low power LED according to claim 1, is characterized in that: described via (8) is hollow via or solid via.