CN203872430U - Flush circuit board - Google Patents
Flush circuit board Download PDFInfo
- Publication number
- CN203872430U CN203872430U CN201420242976.5U CN201420242976U CN203872430U CN 203872430 U CN203872430 U CN 203872430U CN 201420242976 U CN201420242976 U CN 201420242976U CN 203872430 U CN203872430 U CN 203872430U
- Authority
- CN
- China
- Prior art keywords
- line
- wiring board
- substrate
- insulated substrate
- line pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model relates to a flush circuit board. The structure is as follows: a conductive line figure strip is arranged on an insulation substrate, the line figure strip is embedded in the upper surface of the insulation substrate, and the outer surface of the line figure strip and the upper surface of the insulation substrate are disposed at the same plane. The advantages are as follows: one, the reliability is high, and two, the flatness performance is excellent. After the lines of a line figure are embedded in the insulation substrate, damage of the outside of a line is not caused any more, and fractures of the lines are almost impossible unless the substrate itself is physically destroyed, such that the conductive reliability is quite high, and the technical requirement for surface sliding contact conduction is satisfied. The flush circuit board is especially suitable for precision operation with strict environment requirements, such as the spaceflight field, the aviation field, the military field, the medical field and the like.
Description
Technical field
The utility model relates to a kind of printed wiring board, and specifically one flushes wiring board.
Background technology
Printed wiring board industry has more than 40 years in China's developing history, and along with the quickening of electronic industry upgrading speed, printed wiring board occupies more and more consequence in the development of national economy.China is since replacement Japan in 2009 becomes the first in the world printed wiring board manufacture big country, and printed wiring board industry has obtained the development of advancing by leaps and bounds especially, is all bringing into play more and more important effect in all trades and professions that relate to light current field.When printed wiring board application day by day expands, the be not suitable with problem of traditional circuit plate in some industry or in some particular surroundings also becomes increasingly conspicuous, as traditional circuit plate by circuit cloth at substrate surface, cause the surface of printed wiring board to have trickle uneven phenomenon, and this wiring board cannot meet the technical requirement of plane contact conducting in the precision instrument of high reliability request, and there will be the more serious quality problems such as rupture of line, data distortion.
Utility model content
Order of the present utility model is just to provide one and flushes wiring board, cannot meet this technical requirement of plane contact conducting and have the poor problem of protection reliability to solve traditional circuit plate self.
The utility model is achieved in that one flushes wiring board, on insulated substrate, be provided with the line pattern bar of conduction, described line pattern bar embeds the upper surface of described insulated substrate, and the outer surface of described line pattern bar and the upper surface of described insulated substrate are in the same plane.
Described line pattern bar is the copper-foil conducting electricity layer on described insulated substrate by heat pressure adhesive, through film on surface, transfer printing line map, etching take off film and nickel plating gold-plated after institute form, and embed the surface of described insulated substrate by second pressing.
Line pattern bar in the utility model is embedded in substrate inside completely, and line pattern bar surface has conductivity, can meet the technical requirement of surface sliding contact conducting, with the difference of traditional circuit plate maximum is: circuit embeds in base material, surface exposed conducting.
The utility model material therefor is identical with common line plate, and PCB surface is tested by the instrument of plane, and circuit and insulating surface are in same plane.The present invention flushes the advantage of wiring board: the one, and reliability is high, and the 2nd, smooth function admirable.After the lines of line pattern are embedded in insulated substrate, the damaged condition that just no longer has the circuit external world, only the physical property of substrate itself is destroyed, otherwise lines may rupture hardly, thereby conduction reliability is high, meet the technical requirement of surface sliding contact conducting.The utility model is specially adapted to the strict precise operation of environmental requirement, as fields such as space flight, aviation, military affairs, medical treatment.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
As shown in Figure 1, the utility model is the line pattern bar 2 that is provided with conduction on insulated substrate 1, described line pattern bar 2 embeds the upper surface of described insulated substrate 1, and the upper surface of the outer surface of described line pattern bar 2 and described insulated substrate 1 is in the same plane.
Described line pattern bar 2 is the copper-foil conducting electricity layers on described insulated substrate 1 by heat pressure adhesive, through film on surface, transfer printing line map, etching take off film and nickel plating gold-plated after institute form, and embed the surface of described insulated substrate by second pressing.
Line pattern bar 2 in the utility model is embedded in the inside of insulated substrate 1 completely, and lines surface has conductivity, has met the requirement of Surface Contact conducting, with the difference of traditional circuit plate maximum is: circuit exposes and embeds in insulating substrate, surperficial conducting.
Manufacture method of the present utility model comprises the following steps:
One, sawing sheet: according to product design requirement, wiring board is produced and cut into required size with prepreg with cutter.
Two, pre-pressing: be that 120～140 DEG C, pressure are 5～10Kg/cm by the prepreg that has cut size in temperature with hot press
2condition under carry out pre-pressing with Copper Foil, form semi-solid preparation wiring board substrate, namely aforesaid insulated substrate.
Concrete operation step is: Copper Foil and prepreg are stacked, entered mould and send into hot press, at 5～10Kg/cm
2pressure condition under pressing 20～30min, hot press applied pressure reduces and strengthens with the fluidity of prepreg; Before entering mould precompressed, hot press should be warming up to 130 ± 2 DEG C, to ensure the pre-press operation into mould.After depanning, by the gummosis slitter edge excision on described semi-solid preparation wiring board substrate, there is the described semi-solid preparation wiring board substrate of distortion or bow for plate face, also should do smoothing and process, within amount of warpage is controlled to cornerwise 0.5% scope.
Three, figure shifts: on the Copper Foil of described semi-solid preparation wiring board substrate, carry out graphic making.
Concrete operation step is: by the line pattern that designs first through CAD
/cAM makes, draw out black film egative film with optical plotter again, then copy the azo sheet of production use with described black film egative film, more described azo sheet is affixed on to the surface of wiring board according to the mode of hole bit alignment, by the mode of exposure, development, form in the circuit board conducting wire.
The process conditions of wherein exposing and develop are: the mesh of half tone is 77～100T, 75 ± 5 DEG C of preliminary drying temperature, 7～9 grades of exposure progression; Within 15 minutes, carry out development treatment standing, the concentration of developer solution is 0.8～1.2% later, and developing powder is 2.0～3.0m/min, and washing pressure is 2.0～3.0 kg/cm
2 .
Four, etching: by described semi-solid preparation wiring board substrate through figure shift develop after the copper face that exposes acidic copper chloride (CuCl for region
2) etching solution corrodes, and then by NaOH (NaOH) solution, the protective film on line pattern removed, and completes etching, becomes pre-printed wiring board using them.
Etched process conditions are: the proportion of etching solution is 1.28～1.32, and content of copper ion is 110～170g/L, and acid equivalent is 1.0～2.0N, and etch temperature is 50 ± 2 DEG C, and etching speed is 2.5 ± 0.5m/min; Take off film section: the concentration of sodium hydroxide solution is 2～3%, taking off film pressure is 2 ± 0.5kg/cm
2 , moving back film temperature is 50 ± 5 DEG C, and taking off film speed is 2.5 ± 0.5m/min, and bake out temperature is 60 ± 5 DEG C.
Five, surface treatment: on the copper face of the conductive pattern that etching forms on described pre-printed wiring board using them, with the method for plating or chemical plating, first nickel plating, rear gold-plated;
Concrete operation step is: the clean of first carrying out copper face with acid deoiling liquid, fall again the surface copper layer of 0.5～1 micron thick with persulfate or sulfuric acid microcorrosion, then carry out copper face activation processing with palladium sulfate or palladium chloride solution, activation after washing, to remove the residual palladium between circuit, finally carry out nickel plating operation and gold-plated operation.
If employing chemical nickel plating, 85 DEG C of operating temperatures, pH value 4.5～4.8, nickel concentration is about 4.9～5.1 g/l.Chemical gilding, taking citric acid as host, chemical golden groove is containing golden 5g/l, and cell body is taking polypropylene as material, pH value 5.1～5.3, general operation temperature is at 85 DEG C.
Six, flush: carry out second pressing to completing pre-printed wiring board using them described in surface-treated, by nickel plating and gold-plated after conductive pattern be pressed into the top layer of described semi-solid preparation wiring board substrate and flush with top layer.
Concrete operation step is: described pre-printed wiring board using them is put into hot press, put into the steel plate through polishing, as flushing cover plate between the upper and lower template of hot press and described printed circuit board (PCB); Purchase two juxtaposed temperature line, its one end is fixed between upper and lower template and cover plate with adhesive tape, and the other end is received on the master control computer of hot press, for measuring substrate temperature; When hot press is warming up to 80 DEG C, start to measure substrate temperature, continue to heat up, make the heating rate of substrate temperature remain on 1～3 DEG C/min, the pressure of hot press is controlled at 10～20kg/cm
2 , in the time that substrate temperature rises to 140 DEG C, insulation 10～20min; Then make substrate temperature rise to 170～175 DEG C, pressure is adjusted into 25～30kg/cm
2, insulation 60～70min; After insulation finishes, powered-down, in the time that substrate temperature is down to below 40 DEG C, unloads the goods from the airplane, and completes second pressing and flushes operation.
Seven, machining: the printed circuit board (PCB) after flushing is holed and sharp processing by designing requirement.
Eight, inspection: alignment horizontal line road board finished product is tested, packaging, warehouse-in.
Claims (2)
1. one kind flushes wiring board, it is characterized in that, the line pattern bar that is provided with conduction on insulated substrate, described line pattern bar embeds the upper surface of described insulated substrate, and the outer surface of described line pattern bar and the upper surface of described insulated substrate are in the same plane.
2. the wiring board that flushes according to claim 1, it is characterized in that, described line pattern bar is the copper-foil conducting electricity layer on described insulated substrate by heat pressure adhesive, through film on surface, transfer printing line map, etching take off film and nickel plating gold-plated after institute form, and embed the surface of described insulated substrate by second pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420242976.5U CN203872430U (en) | 2014-05-13 | 2014-05-13 | Flush circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420242976.5U CN203872430U (en) | 2014-05-13 | 2014-05-13 | Flush circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203872430U true CN203872430U (en) | 2014-10-08 |
Family
ID=51653347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420242976.5U Expired - Fee Related CN203872430U (en) | 2014-05-13 | 2014-05-13 | Flush circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203872430U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103945644B (en) * | 2014-05-13 | 2016-08-31 | 邢台市海纳电子科技有限责任公司 | Flush wiring board and preparation method thereof |
-
2014
- 2014-05-13 CN CN201420242976.5U patent/CN203872430U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103945644B (en) * | 2014-05-13 | 2016-08-31 | 邢台市海纳电子科技有限责任公司 | Flush wiring board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: XINGTAI HAINA ELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ZHANG BOPING Effective date: 20150127 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 054000 XINGTAI, HEBEI PROVINCE TO: 054700 XINGTAI, HEBEI PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20150127 Address after: 054700 Weixian County Economic Development Zone, Hebei Province, open road, No. 3, No. Patentee after: Xingtai Haina Electronics Technology Co., Ltd Address before: 054000 Weixian County Hebei Xingtai Open Road No. 1 Haina electronics company Patentee before: Zhang Boping |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141008 Termination date: 20170513 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |