CN203859928U - Heat dissipation component and electronic device - Google Patents
Heat dissipation component and electronic device Download PDFInfo
- Publication number
- CN203859928U CN203859928U CN201420219496.7U CN201420219496U CN203859928U CN 203859928 U CN203859928 U CN 203859928U CN 201420219496 U CN201420219496 U CN 201420219496U CN 203859928 U CN203859928 U CN 203859928U
- Authority
- CN
- China
- Prior art keywords
- radiator
- pcb board
- electronic component
- heat dissipation
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 9
- 238000003466 welding Methods 0.000 claims abstract description 24
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 238000009434 installation Methods 0.000 abstract description 2
- 230000009466 transformation Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- IXSZQYVWNJNRAL-UHFFFAOYSA-N etoxazole Chemical compound CCOC1=CC(C(C)(C)C)=CC=C1C1N=C(C=2C(=CC=CC=2F)F)OC1 IXSZQYVWNJNRAL-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat dissipation component and an electronic device. The heat dissipation component is used for heat dissipation of an SIP electronic element on a PCB; pins of the electronic element are fixed on the PCB through welding; the heat dissipation component comprises a radiator and a gasket for supporting and positioning the electronic element; the gasket is arranged between the electronic element and the PCB; the electronic element is arranged between the gasket and the radiator; the gasket extends out from one side of the electronic element so as to be fixedly connected with the radiator, wherein the one side of the electronic element is not provided with pins; and the radiator is fixedly connected with the PCB. According to the heat dissipation component of the utility model, structural transformation is performed on the heat dissipation component, and therefore, a support of a complex structure is not required to be adopted, and one standard fixing gasket is only need to be adopted, and as a result, the electronic element can be leveled. The heat dissipation component has the advantages of simple structure, reliable installation, and being safe and reliable. With the heat dissipation component adopted, screws are no need to fix the radiator.
Description
Technical field
The utility model relates to technical field of electronic devices, relates in particular to a kind of radiating component and electronic device.
Background technology
Electronic component on existing control circuit board during because of its work voltage high, the electric current passing through is large, the power consumption producing during work is large, can produce heat, if carry out not in time heat conduction processing, the temperature rise that can cause element is too high and make component wear.
At present, the heat-conducting method more widely that these heater elements are adopted is on heater element, to install radiator additional, and the temperature range of heater element work is maintained in the scope allowing by self parameter request.
Conventional electronic component has DIP encapsulation (dual in-line package) at present, also has SIP encapsulation (single in-line packages).Wherein, for SIP encapsulating electronic components, owing to only having a row pin to insert in PCB, need to consider evenness and stability requirement, the normal fixed form of plastic stent that adopts fixes electronic component at present, and then fixing cooling fins.But the defect that this support fixed form exists is: due to the IC of each producer chip package difference, cause support cannot unify to produce, bring puzzlement to Standardization work.In addition, fin is generally attached to above IC chip, fix, and this mode technological requirement is strict by screw, and hold-down screw moment must meet certain requirements, damaged otherwise IC chip can be subject to compared with large stress.
Utility model content
Main purpose of the present utility model be to provide a kind of simple in structure, reliable, production efficiency is high radiating component and electronic device be installed.
In order to achieve the above object, the utility model proposes a kind of radiating component, for the heat radiation of SIP encapsulating electronic components on pcb board, the pin of described electronic component is fixed by welding on pcb board; Described radiating component comprises radiator, also comprises: for the pad of electronic component described in supporting and location, described pad is between electronic component and pcb board, and described electronic component is between pad and radiator; Described pad stretches out with described radiator and is fixedly connected with without a side of pin from electronic component; Described radiator is fixedly connected with described pcb board.
Preferably, the relative two side ends of described radiator is respectively equipped with the first welding leg and the second welding leg, and described radiator is weldingly fixed on pcb board by described the first welding leg and the second welding leg.
Preferably, in the relative two side ends of described radiator, wherein the pin of a side and described electronic component is positioned at the same side.
Preferably, described pad is zigzag structure, its bottom near electronic component, without the side of pin, and the bottom margin of radiator, and described pad is fixedly connected with by screw with the bottom margin position of radiator.
Preferably, described pad is right angle zigzag structure.
Preferably, described gasket material is aluminium alloy or copper alloy.
The utility model also proposes a kind of electronic device, comprises pcb board and is arranged on the SIP encapsulating electronic components on pcb board, also comprises radiating component as above.
A kind of radiating component and the electronic device that the utility model proposes, by carry out structure of modification on radiating component, do not need to arrange baroque support, only the setting-up piece of a standard need to be set, by the screw hole position of pad, fix, can reach the object of leveling electronic component, it is simple in structure, install reliably, can produce in batches, improved production efficiency, and radiator is provided with two fixing welding legs, be welded on pcb board, do not need screw fixed heat sink, safe and reliable.
Accompanying drawing explanation
Fig. 1 is the vertical view of radiator in the utility model radiating component embodiment;
Fig. 2 is the upward view of radiator in the utility model radiating component embodiment;
Fig. 3 is the perspective view of electronic component in the utility model embodiment;
Fig. 4 is radiator and electronic component assembling side elevation in the utility model radiating component embodiment;
Fig. 5 is the structural representation of the utility model radiating component embodiment Intermediate gasket;
Fig. 6 is the assembling side elevation of the utility model embodiment radiating component and electronic component and pcb board.
In order to make the technical solution of the utility model clearer, clear, below in conjunction with accompanying drawing, be described in further detail.
Embodiment
Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
As Figure 1-Figure 5, the utility model preferred embodiment proposes a kind of radiating component, heat radiation for electronic component 200 on pcb board 400, is particularly useful for the heat radiation of SIP encapsulating electronic components 200 on pcb board 400, and the present embodiment is given an example with the radiating component of SIP encapsulating electronic components 200.
The present embodiment radiating component comprises radiator 100, also comprises the pad 300 for electronic component described in supporting and location 200, and described pad 300 is between electronic component 200 and pcb board 400, and described electronic component 200 is between pad 300 and radiator 100; Wherein:
The single-row pin 201 of described electronic component 200 is fixed by welding on pcb board 400, its fixed position as shown in Figure 6 402.
Described pad 300 stretches out with described radiator 100 and is fixedly connected with without a side of pin from electronic component 200.
Described radiator 100 comprises radiator 100 bodies and fin 101, and the bottom of radiator 100 bodies is provided with electronic component 200 installing zones 106, and radiator 100 bodies are fixedly connected with described pcb board 400.
Particularly, in order to realize the fixed installation of radiator 100 on pcb board 400, relative two side ends at radiator 100 is respectively equipped with the first welding leg 102 and the second welding leg 103, on radiator 100, be respectively equipped with the fixed hole position of fixing the first welding leg 102 and the second welding leg 103, the fixed hole position 105 of the first welding leg 102 has been shown in Fig. 3, radiator 100 is weldingly fixed on pcb board 400 by described the first welding leg 102 and the second welding leg 103, the first welding leg 102 and the second welding position of welding leg 103 on pcb board 400 respectively as shown in Figure 6 403, 401.
As a kind of execution mode, in the relative two side ends of described radiator 100, wherein the pin of a side and described electronic component 200 is positioned at the same side.
In the present embodiment, described pad 300 is zigzag, be specially a kind of zigzag structure of approximate right angle, three limits of its bending are respectively near the bottom of electronic component 200, side without pin, and the bottom margin of radiator 100, on the flanging of pad 300 held against heat sink 100 bottoms, be provided with screw mounting hole 301, bottom margin correspondence position at radiator 100 is also provided with screw mounting hole 104, described pad 300 is fixedly connected with by screw with the bottom margin position of radiator 100, thereby electronic component 200 is flattened and is positioned between pcb board 400 and radiator 100.
As a kind of execution mode, described pad 300 materials are aluminium alloy or copper alloy; The material of described radiator 100 is aluminium alloy or copper alloy.
In addition, the utility model also proposes a kind of electronic device, comprises pcb board 400 and is arranged on the SIP encapsulating electronic components 200 on pcb board 400, and also comprise radiating component as above, its design feature please refer to above-described embodiment, does not repeat them here.
The present embodiment passes through such scheme, by carry out structure of modification on radiating component, do not need to arrange baroque support, only the setting-up piece 300 of a standard need to be set, screw hole position 301 by pad 300 is fixing, can reach the object of leveling electronic component 200, it is simple in structure, install reliably, can produce in batches, improved production efficiency, and radiator 100 is provided with two fixing welding legs 102,103, be welded on pcb board 400, do not need screw fixed heat sink 100, safe and reliable.
Above are only preferred embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or flow process conversion that utilizes the utility model specification and accompanying drawing content to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (7)
1. a radiating component, for the heat radiation of SIP encapsulating electronic components on pcb board, the pin of described electronic component is fixed by welding on pcb board; Described radiating component comprises radiator, it is characterized in that, also comprises: for the pad of electronic component described in supporting and location, described pad is between electronic component and pcb board, and described electronic component is between pad and radiator; Described pad stretches out with described radiator and is fixedly connected with without a side of pin from electronic component; Described radiator is fixedly connected with described pcb board.
2. radiating component according to claim 1, is characterized in that, the relative two side ends of described radiator is respectively equipped with the first welding leg and the second welding leg, and described radiator is weldingly fixed on pcb board by described the first welding leg and the second welding leg.
3. radiating component according to claim 2, is characterized in that, in the relative two side ends of described radiator, wherein the pin of a side and described electronic component is positioned at the same side.
4. according to the radiating component described in claim 1,2 or 3, it is characterized in that, described pad is zigzag structure, its bottom near electronic component, without the side of pin, and the bottom margin of radiator, described pad is fixedly connected with by screw with the bottom margin position of radiator.
5. radiating component according to claim 4, is characterized in that, described pad is right angle zigzag structure.
6. radiating component according to claim 4, is characterized in that, described gasket material is aluminium alloy or copper alloy.
7. an electronic device, comprises pcb board and is arranged on the SIP encapsulating electronic components on pcb board, it is characterized in that, also comprises the radiating component as described in any one in claim 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420219496.7U CN203859928U (en) | 2014-04-30 | 2014-04-30 | Heat dissipation component and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420219496.7U CN203859928U (en) | 2014-04-30 | 2014-04-30 | Heat dissipation component and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203859928U true CN203859928U (en) | 2014-10-01 |
Family
ID=51609771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420219496.7U Expired - Lifetime CN203859928U (en) | 2014-04-30 | 2014-04-30 | Heat dissipation component and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203859928U (en) |
-
2014
- 2014-04-30 CN CN201420219496.7U patent/CN203859928U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141001 |