CN205640795U - Contain naked brilliant system level packaging LED lighting driver power supply module - Google Patents
Contain naked brilliant system level packaging LED lighting driver power supply module Download PDFInfo
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- CN205640795U CN205640795U CN201620094929.XU CN201620094929U CN205640795U CN 205640795 U CN205640795 U CN 205640795U CN 201620094929 U CN201620094929 U CN 201620094929U CN 205640795 U CN205640795 U CN 205640795U
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
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Abstract
The utility model provides a contain naked brilliant system level packaging LED lighting driver power supply module, characterized by: containing naked brilliant system level packaging part, two rectifier diode are respectively connected at alternating current generating line both ends on the thermally conductive insulating material base plate, form the anodal series connection emitting diode LED positive pole of connecting of direct current, connect the VCC pad of a resistance R1 relinking linear drive IC chip simultaneously, the GATE solder connection MOSFET's of IC chip G pad grid, the sense solder connection MOSFET's of IC chip S pad source electrode, connecting resistance rcs reconnection ground wire simultaneously, the GND solder connection ground wire of IC chip, the LED negative pole is connected in MOSFET's drain electrode. Outside containing naked brilliant system level packaging part, leave the device that the solder joint can weld the naked brilliant encapsulation of other non -s. Wherein IC chip surface will have the non - transparent cover layer of thermal insulation influenced in order to avoid IC chip function, be higher than under certain power condition, heat dissipation is greatly in time wanted enough to IC chip and MOSFET's position distance.
Description
Technical field
This utility model relates to LED illumination and drives power technology and technical field of semiconductor encapsulation.
Background technology
LED illumination drives power supply mainly to have four major types, resistance-capacitance depressurization, current regulator diode, linear power supply and Switching Power Supply.Driving power supply is power supply supply in the case of various to be converted to specific voltage electric current to drive transducer luminous for LED.General power supply input has multiple situation, exports one and be set to and can change the constant current source of voltage with the change of LED forward drop value for LED illumination.
A simplest class drives power supply to be capacitance-resistance voltage reduction circuit, but its electric current is big with voltage pulsation, and not impact resistance can have a strong impact on LED life, and power factor (PF) is low, is only used for some less demanding small power LED illumination situations, and effect is poor.
Driving power supply based on current regulator diode is Second Type, and current regulator diode was originally mainly used in instrument and meter, was used for the situation of some low-power LED because of its constant-current characteristics later.As the constant-current driving of LED illumination, there is circuit structure simple, advantage with low cost, but have and think that the dynamic range of current current regulator diode only has 30V, there may come a time when up to go up the normal voltage waving interval of hectovolt less than electrical network, actually cannot keep constant current, under Larger Dynamic high-voltage case, oneself power consumption is big, system effectiveness is low, temperature rise simultaneously can cause LED light to decline increasing, therefore it is not appropriate for for general illumination, simultaneously bring the concordance of performance bad due to the limitation of current regulator diode production technology the most again and the product proportion of suitable use is relatively low, the serious problems of unstable product quality easily occur when large-scale use.
LED illumination based on IC chip drives power supply to be a large amount of mainstream scheme used at present, has preferable constant current accuracy and various function, is broadly divided into Switching Power Supply and the big type of linear power supply two.
Switching Power Supply type has again isolated form and non-isolation type two kinds, and isolated form is applicable to the constant current output of low-voltage and high-current, and peripheral component is more, and volume is relatively big, is mainly used in external power supply；Non-isolation type is applicable to the output of high voltage small area analysis, and volume is relatively small, and efficiency is high, is mainly used in built-in power.In general, Switching Power Supply is complicated, relates to component number many, including electrochemical capacitor, so being not suitable at present carrying out bare crystalline system in package.
Linear IC chip LED drives power source design to have, and circuit is relatively easy, peripheral component is few, volume is little, the advantage of low cost, being easily integrated, but there is heat dissipation problem in Linear Driving power source design, heat radiation especially can high concentration in linear power supply IC chip and MOSFET power tube.Traditional IC chip and component package use cabinet, and heat conduction is poor, and the heat dissipation problem of Linear Driving power supply can be substantially reduced stability and the reliability of whole system.The IC chip and each components and parts that drive power supply are directly encapsulated into heat conductivility with bare crystalline form and well and then can solve this problem on the substrate of insulation, reduce relevant cost simultaneously.
IC chip and the existing encapsulation technology of components and parts, i.e. semiconductor packaging, develop long-standing, because encapsulation is necessary for IC chip and components and parts, also it is critical that, IC chip and components and parts must be isolated from the outside, and to prevent the impurity in air from causing electric property to decline chip circuit or the corrosion of components and parts material, chip and components and parts after encapsulation also allow for installing and transport simultaneously.Existing encapsulation technology is lead-in wire of IC chip or components and parts ambroin or ceramic material individually being packed, and the quality of encapsulation technology directly influences chip self performance and the design of printing board PCB being attached thereto and manufacture.
The most common semiconductor package is equipped with two big classes: dual-in-line package DIP (Dual In-line Package) and paster packaging SMT (Surface Mounting Technology).Semiconductor device has many concrete packing forms, can be divided into pin insert type, surface attaching type and senior encapsulation three class by the profile of encapsulation, size, textural classification.From DIP, SOP, QFP, PGA, BGA to CSP again to SIP, a technical specification generation is more advanced than a generation.
Dissimilar and size bare crystalline device is included that IC chip integrative packaging, on heat conductive insulating substrate, belongs to system in package.Bare crystalline light emitting diode (LED) and Linear Driving power supply all bare crystalline device are the most successfully encapsulated on a heat conductive insulating substrate by we, but prior art scheme cannot in conjunction with any non-bare crystalline encapsulation device, namely can not by combination be not suitable for bare crystalline encapsulation device change drive power supply electrical characteristic.This utility model relates to the LED illumination containing bare crystalline system in package and drives power supply module, and the device of non-bare crystalline encapsulation can be combined outside bare crystalline system in package part, solve the technology on each related link and process difficulties, can meet the requirement driving some characteristics of power supply module, it is greatly enhanced systematic function and quality conformance, reduce production link in the middle of existing procucts and reduce cost, and mass automatic production LED illumination driving power supply module can be realized.
Summary of the invention
This utility model be the technical scheme is that determine the LED illumination driving electricity optimization scheme being suitable for containing bare crystalline system in package and combining non-bare crystalline packaging with experiment and determine particular electrical circuit, drive the wiring diagram of power supply module according to specific circuit design LED illumination and select suitable heat-conducting insulation material substrate and by wiring diagram to become printed circuit on print conductive materials to substrate, each technological process link is encapsulated and with these technological processes by corresponding bare crystalline IC chip by experimental verification bare crystalline, bare crystalline commutation diode, bare crystalline MOSFET and the whole integrative packaging of resistance are in the printed circuit on aforesaid substrate and do test checking, in the appointment position completed on bare crystalline packed part substrate, weld non-bare crystalline packaging.
Particular electrical circuit described in the utility model has multiple display form, including according to the circuit theory diagrams being suitable for obtained by the LED illumination Linear Driving electricity optimization scheme of bare crystalline encapsulation, according to wiring diagram designed by above-mentioned schematic diagram and make printed circuit and the side circuit of formation after bare crystalline encapsulate the side circuit of rear assembly and combined non-bare crystalline packaging thereafter, it it is all this utility model particular electrical circuit.
This utility model one driving power supply module containing bare crystalline system in package LED illumination is:
A kind of containing bare crystalline system in package LED illumination driving power supply module, it is characterized in that, with particular electrical circuit and semiconductor packaging, driving power supply correlation function device bare crystalline is completely covered on heat-conducting insulation material substrate and by heat conductive insulating opaque material as overall package；Different performance can be realized in conjunction with non-bare crystalline encapsulation function device.
Above-mentioned particular electrical circuit is to have two external inputs of alternating current bus on heat-conducting insulation material substrate, two inputs respectively connect negative pole and the positive pole of two bare crystalline commutation diodes, through four bare crystalline commutation diodes one unidirectional current positive poles of formation as external output cathode, unidirectional current positive pole is simultaneously connected with a resistance R1 and reconnects the VCC pad of bare crystalline IC chip；The GATE pad of bare crystalline IC chip connects the G pad (grid) of bare crystalline MOSFET；The Sense pad of bare crystalline IC chip connects the S pad (source electrode) of bare crystalline MOSFET, is simultaneously connected with resistance Rcs and reconnects ground wire；The GND pad of bare crystalline IC chip connects ground wire；D pad (drain electrode) connecting line of bare crystalline MOSFET as unidirectional current negative pole as external output negative pole；Externally output cathode and negative pole are for each positive pole connecting series connection light emitting diode (LED) and negative pole；
Above-mentioned particular electrical circuit is with circuit printed by conductive material and simultaneously by the complete circuit formed between conductive wire connection bare crystalline device and printed circuit on heat-conducting insulation material substrate；
In above-mentioned particular electrical circuit, the other parts in addition to placing bare crystalline device position and pad of the circuit surface printed by conductive material are known insulating layer material covering；
In above-mentioned particular electrical circuit, under reaching power situation, bare crystalline IC chip and bare crystalline MOSFET need to have enough physical distances to avoid the heat radiation of MOSFET to affect the normal work of bare crystalline IC chip；
Above-mentioned on heat-conducting insulation material substrate, complete encapsulation after all bare crystalline devices be completely covered by heat conductive insulating opaque material and become physical support structure and the protective layer of above-mentioned particular electrical circuit, especially bare crystalline IC chip surface and need same heat conductive insulating opaque material and be completely covered in order to avoid affecting it and normally working；
Above-mentioned drive power supply module individually containing bare crystalline system in package LED illumination or combine other non-bare crystalline packaging or combination of devices becomes and has the LED illumination of different performance and drive power supply module；
Experimental verification is above-mentioned to be driven power supply module containing bare crystalline system in package LED illumination and combines other non-bare crystalline packaging and be respectively provided with the function of controllable silicon light modulation.
In this utility model, a kind of manufacturing process flow containing bare crystalline system in package LED illumination driving power supply module is:
The first step, substrate manufacturing process flow process:
Heat conductive insulating substrate blank is manufactured by required specification, in the case of using ceramic substrate, then firing ceramics blank；
Determine that the LED illumination being suitable for containing bare crystalline system in package drives electricity optimization scheme and determines particular electrical circuit with experiment, wiring diagram is determined further according to particular electrical circuit, wherein under certain power situation, the setting position of bare crystalline MOSFET and bare crystalline IC chip needs enough distances, by wiring diagram with known technology by print conductive materials to aforesaid substrate blank, row baking-curing becomes printed circuit again, the conductive material being currently used for printed circuit is silver-containing material, it is also possible to be other class；Relevant appointment position in above-mentioned printed circuit, is fixed on appointment position with melting heat-conductivity conducting material by resistance R1 and Rcs setting resistance, and existing is scolding tin with the above-mentioned heat-conductivity conducting material that melts；
Second step, die bond technological process:
At the relevant position of aforesaid substrate printed circuit, four bare crystalline commutation diodes, bare crystalline IC chip, bare crystalline MOSFET being fixed on appointment position with thickness heat-conductivity conducting material, and carry out baking-curing, existing is elargol with above-mentioned thickness heat-conductivity conducting material；
3rd step, bonding wire craft flow process:
It is complete on the substrate to bare crystalline device die bond above-mentioned, on the appointment position of each device, welds conductive wire, to connect the printed circuit traces on substrate, on completing substrate, the circuit of bare crystalline device connects, and above-mentioned conductive wire can be all kinds of conductive material, now uses gold thread；
4th step, test technology flow process:
On the substrate being complete above-mentioned technological process, connecting the power line of corresponding voltage, confirm that having completed technological process reaches requirement, meanwhile, can obtain associated electrical parameter by test, whether checking product reaches designed requirement；
5th step, gluing process flow process:
After completing above-mentioned all technological processes test passes; with heat conductive insulating opaque material all bare crystalline devices are completely covered on the position set by heat-conducting insulation material substrate and become physical support structure and the protective layer of above-mentioned particular electrical circuit; especially bare crystalline IC chip surface needs same heat conductive insulating opaque material and is completely covered in order to avoid affecting it and normally working; and carry out baking-curing, existing is heat conduction opaque black silica gel or the black glue of epoxy resin with described heat conductive insulating opaque material；May select and before gluing process flow process, periphery, needs overlay area thickness heat conduction opaque material is formed a circle and baking-curing, facilitate the enforcement of gluing process flow process, above-mentioned thickness heat conduction opaque material is silica gel, but this optional technological process is optional step；
6th step, point plate and test technology flow process:
In the case of being linked into an integrated entity by multiple substrates and completing above-mentioned flow process simultaneously, at this moment needing above-mentioned multiple substrates are carried out a point plate, the most each substrate is no longer connected with other substrate.To the above-mentioned substrate being complete whole technological process, connecting the power line of corresponding voltage, test obtains associated electrical parameter, confirms that having completed technological process reaches corresponding requirements, and carries out go-on-go classification according to relevant parameter.
7th step, in conjunction with non-bare crystalline packaging technological process:
According to different needs, on the above-mentioned position completed set by whole bare crystalline base plate for packaging, the non-bare crystalline packaging selected by welding or combination of devices, reach designed properties of product.
In above-mentioned whole seven step process flow processs, first to the 3rd step and the 5th step totally four step process flow processs are typical process flow, it it has been the necessary technological process driving power supply module containing bare crystalline system in package LED illumination, 4th and the 6th step process flow process is then assisting workflows, the 7th step then according to the optional technological process that needs.
The beneficial effects of the utility model are the problems that can effectively solve to drive power supply module and non-bare crystalline packaging to combine containing bare crystalline system in package LED illumination, it is greatly enhanced this kind of LED illumination drive the electric property of power supply module and realize the performance multiformity of assembly, reduce existing production link, and mass automatic production LED illumination driving power supply module can be carried out.
Accompanying drawing explanation
Fig. 1 is this utility model case study on implementation bare crystalline IC chip RC001B surface texture figure
Fig. 2, for the basic cut-away view of bare crystalline IC chip needed for this utility model case study on implementation
Fig. 3, for this utility model case study on implementation bare crystalline encapsulation particular electrical circuit circuit theory diagrams
Fig. 4, combine the circuit theory diagrams of non-bare crystalline packaging for this utility model case study on implementation bare crystalline encapsulation particular electrical circuit
Fig. 5, for this utility model case study on implementation particular electrical circuit wiring diagram and printed circuit diagram
Fig. 6, for the structure of this utility model case study on implementation bare crystalline package assembling and line bonding figure
Fig. 7, combine structure and the line bonding figure of non-bare crystalline packaging for this utility model case study on implementation bare crystalline package assembling
Fig. 8, for this utility model case study on implementation bare crystalline package assembling and the dimension scale figure that combines non-bare crystalline packaging
Fig. 9, for this utility model case study on implementation containing bare crystalline system in package LED illumination drive power supply module single EMI test result
Figure 10, power supply module is driven to combine the EMI test result of non-bare crystalline packaging electric capacity for this utility model case study on implementation containing bare crystalline system in package LED illumination
Detailed description of the invention
With reference to the accompanying drawings, the detailed description of the invention of power supply module and manufacturing process is driven to be described in detail described in the utility model containing bare crystalline system in package LED illumination.
We have selected driving IC chip RC001B (China national Department of Intellectual Property Integrated circuit layouts registration number BS.14500659X, June 27 2014 layout-design applying date, date of declaration: on December 17th, 2014, notification number 9835, layout-design has been created day: on May 21st, 2013), Fig. 1 show bare crystalline surface texture figure and the pad mark of RC001B, and the related data of bare crystalline single wafer size thickness, electrode size composition etc. are as follows:
The electrology characteristic of RC001B is as follows:
In addition to special mark, standard test condition is VCC=10V, TA=25 DEG C
Fig. 2 show in linear constant current LED driving IC chip RC001B with this utility model relates to LED illumination Linear Driving prioritization scheme and the relevant necessary part of particular electrical circuit, have internal clamp circuit (Clamp) and UVLO (Under Voltage Lockout) including VCC end；Also include grounding terminal (GND)；Also include internal control (Control) and drive (Driver) part and driving stage GATE end and current sample/SENSE end is set.Above-mentioned internal control and drive part relate to concrete mechanism, and for this utility model, linear constant current LED driving IC chip have above-mentioned corresponding function to realize above-mentioned particular electrical circuit is basic and necessary, and any concrete mechanism realizing corresponding function is all equivalent.
It is determined through experimentation based on RC001B and is suitable for the LED illumination Linear Driving electricity optimization scheme containing bare crystalline system in package, determine particular electrical circuit, the circuit theory of above-mentioned particular electrical circuit is as shown in Figure 3, above-mentioned particular electrical circuit only has rectifier bridge, linear IC chip, MOSFET and two resistance R1 and Rcs, and in figure, series LED is the External connecting part of above-mentioned particular electrical circuit；
In above-mentioned particular electrical circuit, when alternating current bus is opened, alternating current becomes the DC conductance LED to series connection by rectifier bridge, the most linear driving IC chip is charged by connecting galvanic startup resistance (R1), made VCC voltage stabilization in certain numerical value by internal clamp circuit (Clamp) when reaching to set V, and be automatically switched off Linear Driving IC chip when dropping to UVLO (Under Voltage Lockout) threshold voltage.
In above-mentioned particular electrical circuit, by Rcs resistance, to LED current sampling, also and IC internal reference voltage Vref compares generation control signal to Linear Driving IC chip, reaches the target of LED constant current output.It is Ipeak=Vref/Rcs by the peak point current of series LED, and the Vref of Linear Driving IC chip has fixed when IC design and production, the Vref of RC001B is 400mV, thus sets peak point current Ipeak when Rcs just can be turned on by Linear Driving IC chip controls LED.
It is determined through experimentation the scheme driving power supply module to combine non-bare crystalline packaging based on RC001B the applicable LED illumination containing bare crystalline system in package, the circuit theory of such scheme is as shown in Figure 4, an electric capacity is added in above-mentioned original particular electrical circuit, can change above-mentioned electromagnetic interference (EMI) characteristic driving power supply module containing bare crystalline system in package LED illumination, in figure, series LED is the External connecting part of above-mentioned particular electrical circuit.
According to above-mentioned particular electrical circuit, can be designed for being printed onto the wiring diagram of substrate, Fig. 5 is typical wiring diagram based on above-mentioned particular electrical circuit.
Experiment finds, in the case of reaching certain power, bare crystalline IC chip and bare crystalline MOSFET position on substrate must keep enough physical distances, in the case of both have bonding wire to connect, the heat that bare crystalline MOSFET produces badly influences the normal performance of bare crystalline IC chip, lead to system abnormity, when both positions on ceramic substrate separate enough distances and do not have bonding wire to be connected, then bare crystalline IC chip performance is acted normally, it can be seen that containing bare crystalline system in package, the impact of each device physics and electric property is different from each device situation when individually encapsulation.
Experiment finds that the surface of bare crystalline IC chip needs heat conductive insulating opaque material and covers, and otherwise bare crystalline IC chip can be produced impact at light in some cases and cause performance abnormal, and experiment proves that using heat conduction opaque material to cover solves the problems referred to above.
According to above-mentioned wiring diagram, by on print conductive materials to heat-conducting insulation material substrate, become corresponding printed circuit, then in above-mentioned printed circuit, the bare crystalline of all devices is included that IC chip is all encapsulated into the relevant position of above-mentioned printed circuit, particular location is as shown in fig. 6, four bare crystalline commutation diodes (being labeled as four solid blockages of MB6S letter), one bare crystalline Linear Driving IC chip (being labeled as a blockage of RC001B letter), one bare crystalline MOSFET (being labeled as a blockage of MOS letter), R1 (being labeled as the solid rectangular block of R1 letter) and Rcs (being labeled as the solid rectangular block of Rcs letter).After the system in package containing bare crystalline completes, thus alternating current bus two ends respectively connect negative pole and the positive pole of two bare crystalline commutation diodes, unidirectional current positive pole through four bare crystalline commutation diodes formation is used for connecting the positive pole of series connection light emitting diode (LED), is simultaneously connected with a resistance R1 and reconnects the VCC pad of bare crystalline Linear Driving IC chip；The GATE pad of bare crystalline IC connects the G pad (grid) of bare crystalline MOSFET；The Sense pad of bare crystalline Linear Driving IC chip connects the S pad (source electrode) of bare crystalline MOSFET, is simultaneously connected with resistance Rcs and reconnects ground wire；The GND pad of bare crystalline Linear Driving IC chip connects ground wire；The D pad (drain electrode) of bare crystalline MOSFET is used for connecting the negative pole of series LED as output negative pole；Ultimately form complete circuit.
Drive in power supply module above-mentioned based on RC001B the applicable LED illumination containing bare crystalline system in package, in conjunction with a non-bare crystalline packaging, in above-mentioned original assembly, i.e. add an electric capacity C1, as shown in Figure 7, it is possible to change above-mentioned electromagnetic interference (EMI) characteristic driving power supply module containing bare crystalline system in package LED illumination.
Through repeatedly testing, determine driving power supply module containing bare crystalline system in package LED illumination and combining the manufacturing process flow of non-bare crystalline packaging and be in this utility model:
The first step, substrate manufacturing process flow process:
Heat conductive insulating substrate blank is manufactured by required specification, this utility model case study on implementation uses ceramic substrate, then fire specification be unit area 19mm*19mm thickness be the ceramic blank sheet of 1mm, every block of independent potsherd contains 21 unit potsherds, leave line of cut each other, so as follow-up point of plate；
Determine that according to experiment the LED illumination being suitable for containing bare crystalline system in package drives power supply module, the circuit theory diagrams of determined particular electrical circuit such as Fig. 3, wiring diagram is determined further according to above-mentioned particular electrical circuit circuit theory diagrams, such as Fig. 5, by above-mentioned wiring diagram with known technology by print conductive materials to aforesaid substrate blank, row baking-curing becomes printed circuit again, the most as shown in Figure 5, although wiring diagram and printed circuit pattern are the same, but wiring diagram is design drawing, and printed circuit has been the side circuit being printed on ceramic substrate, this utility model case is silver-containing material for the conductive material of printed circuit；Relevant as shown in Figure 6 specify position, with scolding tin the R1 (being labeled as the solid rectangular block of R1) and Rcs (being labeled as the solid rectangular block of Rcs) of appropriate resistance be fixed on and specify position；
Second step, die bond technological process:
At relevant position as shown in Figure 6, with heat-conductivity conducting material, four bare crystalline commutation diodes (being labeled as four solid blockages of MB6S letter), bare crystalline Linear Driving IC chip (being labeled as a solid blockage of RC001B letter), bare crystalline MOSFET (being labeled as the closed square of MOS letter) are fixed on appointment position, and carrying out baking-curing, in this utility model case, above-mentioned heat-conductivity conducting material is elargol；
3rd step, bonding wire craft flow process:
It is complete on the substrate to bare crystalline Linear Driving IC chip and other bare crystalline device die bond above-mentioned, as shown in Figure 6, on the appointment position of each device, welding conductive wire, to connect the printed circuit traces on substrate, whole circuit ON on completing substrate, in this utility model case, above-mentioned conductive wire uses gold thread；
4th step, test technology flow process:
On the substrate being complete above-mentioned technological process, the LED light source of one specified design power of series connection, connect the power line of 220V voltage, confirm that having completed technological process reaches requirement, meanwhile, obtaining associated electrical parameter by test, whether checking product reaches designed requirement；
5th step, gluing process flow process:
After completing above-mentioned all technological processes test passes, aforesaid substrate use heat conductive insulating opaque material note the setting regions at 10mm*14mm, as shown in Figure 8, make height and be about 1mm, glue-line, covers whole bare crystalline device, then carries out baking-curing；Heat conductive insulating opaque material described in this utility model case is heat conduction black epoxy glue or heat conduction black silica gel；
6th step, point plate and test technology flow process:
Being connected into by 21 unit substrate in this utility model case and a piece of complete above-mentioned flow process simultaneously, more above-mentioned 21 unit substrate are carried out a point plate, the most each unit substrate is no longer connected with other unit substrate.To the above-mentioned substrate being complete whole technological process, connecting the power line of corresponding 220V voltage, test obtains associated electrical parameter, confirms that having completed whole technological process reaches corresponding requirements, and carries out go-on-go classification according to relevant parameter；
7th step, in conjunction with non-bare crystalline packaging technological process:
Driving in power supply module containing bare crystalline system in package LED illumination of six step process flow processs is completed above-mentioned, two pins of one non-bare crystalline packaging electric capacity C1 are welded on appointment position, as shown in Figure 7, it is possible to change above-mentioned electromagnetic interference (EMI) characteristic driving power supply module containing bare crystalline system in package LED illumination；Above-mentioned combination non-bare crystalline packaging electric capacity C1 drives power supply module as shown in Figure 8 containing bare crystalline system in package LED illumination.
This utility model case is typical process flow by above-mentioned first to the 3rd step and the 5th step totally four step process flow processs, it it has been the necessary technological process containing bare crystalline system in package, 4th and the 6th step process flow process is then assisting workflows, mainly ensure that product quality and final products use, it is not necessary to need the technological process having；7th step process flow process is then according to whether select to use when changing the electric property driving power supply module containing bare crystalline system in package LED illumination.
In this utility model case study on implementation, having power is driving power supply module containing bare crystalline system in package LED illumination and combining non-bare crystalline packaging electric capacity as exemplary embodiments of W, and concrete device source and parameter set as follows:
R1 resistance is 820 kilohms, and Rcs resistance is 9.1 ohm, is all from Taiwan ROYALOHM and improves people's living condition producer；
Bare crystalline commutation diode product type is MB6S, comes Electronic Science and Technology Co., Ltd. purchased from Shenzhen Si Date；
Bare crystalline MOSFET product type is 2N60, purchased from China Resources Hua Jing Microtronics A/S；
Bare crystalline Linear Driving IC chip discloses for own product, its detail parameters in this utility model case study on implementation.
C1 safety capacitance is 0.1UF, rated voltage 275V, purchased from Foshan City with smooth Electronics Co., Ltd.；
Above-mentioned exemplary embodiments drives power supply module containing bare crystalline system in package LED illumination and combines the product test result of non-bare crystalline packaging electric capacity and be: voltage is 220.01V, and electric current is 0.03029A, and power is 6.017W, and power factor (PF) is 0.9029.
Power supply module single EMI test result is driven as shown in Figure 9 containing bare crystalline system in package LED illumination.
Power supply module is driven to combine the EMI test result of non-bare crystalline packaging electric capacity as shown in Figure 10 containing bare crystalline system in package LED illumination.
This utility model case study on implementation has completed to will not enumerate the test in the case of multiple power and test, design parameter and test result.
Detailed description of the invention of the present utility model and exemplary embodiments is described above with reference to accompanying drawing, but those skilled in the art it will be appreciated that, in the case of without departing from spirit and scope of the present utility model, detailed description of the invention can also be made various change and replacement, and these changes and replacement all fall in claims of the present invention limited range.
Claims (8)
1. one kind drives power supply module containing bare crystalline system in package LED illumination, it is characterized in that, with particular electrical circuit and semiconductor packaging, driving power supply correlation function device bare crystalline is completely covered on heat-conducting insulation material substrate and by heat conductive insulating opaque material as overall package；Different performance can be realized in conjunction with non-bare crystalline encapsulation function device；
Above-mentioned particular electrical circuit is to have two external inputs of alternating current bus on heat-conducting insulation material substrate, two inputs respectively connect negative pole and the positive pole of two bare crystalline commutation diodes, through four bare crystalline commutation diodes one unidirectional current positive poles of formation as external output cathode, unidirectional current positive pole is simultaneously connected with a resistance R1 and reconnects the VCC pad of bare crystalline IC chip；The GATE pad of bare crystalline IC chip connects the G pad grid of bare crystalline MOSFET；The Sense pad of bare crystalline IC chip connects the S pad source electrode of bare crystalline MOSFET, is simultaneously connected with resistance Rcs and reconnects ground wire；The GND pad of bare crystalline IC chip connects ground wire；The D pad drain bond wires of bare crystalline MOSFET as unidirectional current negative pole as external output negative pole；Externally output cathode and negative pole are for each positive pole connecting series connection light emitting diode (LED) and negative pole；
Above-mentioned particular electrical circuit is with circuit printed by conductive material and simultaneously by the complete circuit formed between conductive wire connection bare crystalline device and printed circuit on heat-conducting insulation material substrate；
In above-mentioned particular electrical circuit, the other parts in addition to placing bare crystalline device position and pad of the circuit surface printed by conductive material are known insulating layer material covering；
In above-mentioned particular electrical circuit, under reaching power situation, bare crystalline IC chip and bare crystalline MOSFET need to have enough physical distances to avoid the heat radiation of MOSFET to affect the normal work of bare crystalline IC chip；
Above-mentioned on heat-conducting insulation material substrate, complete encapsulation after all bare crystalline devices be completely covered by heat conductive insulating opaque material and become physical support structure and the protective layer of above-mentioned particular electrical circuit, bare crystalline IC chip surface needs same heat conductive insulating opaque material and is completely covered in order to avoid affecting it and normally working；
Above-mentioned drive power supply module individually containing bare crystalline system in package LED illumination or combine other non-bare crystalline packaging or combination of devices becomes and has the LED illumination of different performance and drive power supply module.
The most according to claim 1 containing bare crystalline system in package LED illumination driving power supply module, it is characterized in that heat-conducting insulation material substrate is ceramic substrate.
The most according to claim 1 containing bare crystalline system in package LED illumination driving power supply module, it is characterized in that bare crystalline IC chip is Linear Driving IC chip, basic necessary part includes that VCC end has internal clamp circuit (Clamp) and UVLO (Under Voltage Lockout)；Also include grounding terminal (GND)；Also include internal control (Control) and drive (Driver) part and driving stage GATE end and current sample/SENSE end is set.
The most according to claim 1 containing bare crystalline system in package LED illumination driving power supply module, it is characterized in that the conductive material of printed circuit used by particular electrical circuit is silver-containing material.
The most according to claim 1 containing bare crystalline system in package LED illumination driving power supply module, it is characterized in that the conductive wire connecting the complete circuit formed between bare crystalline device and printed circuit is the plain conductors such as gold thread, copper cash, aluminum steel or alloy wire.
The most according to claim 1 drive power supply module containing bare crystalline system in package LED illumination, it is characterized in that becoming the physical support structure of particular electrical circuit and protective layer and to cover the heat conductive insulating opaque material of all bare crystalline devices be heat conduction opaque black silica gel or epoxy resin black glue.
The most according to claim 1 containing bare crystalline system in package LED illumination driving power supply module, it is characterized in that the above-mentioned driving power supply module containing bare crystalline system in package LED illumination combines other non-bare crystalline packaging or combination of devices is well-known device or well-known device combination.
The driving power supply module containing bare crystalline system in package LED illumination the most according to claim 7 combines other non-bare crystalline packaging, it is characterized in that other non-bare crystalline packaging is electric capacity.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105698137A (en) * | 2016-01-29 | 2016-06-22 | 中山昂帕微电子技术有限公司 | MOSFET-containing system-in-package LED lighting driving power assembly and manufacturing process |
| CN110493914A (en) * | 2019-08-14 | 2019-11-22 | 广州竟合电子科技有限公司 | A kind of car light constant current driving device and its manufacturing method |
| CN111564434A (en) * | 2020-04-03 | 2020-08-21 | 深圳市晶导电子有限公司 | Integrated chip structure and power module |
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2016
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105698137A (en) * | 2016-01-29 | 2016-06-22 | 中山昂帕微电子技术有限公司 | MOSFET-containing system-in-package LED lighting driving power assembly and manufacturing process |
| CN110493914A (en) * | 2019-08-14 | 2019-11-22 | 广州竟合电子科技有限公司 | A kind of car light constant current driving device and its manufacturing method |
| CN111564434A (en) * | 2020-04-03 | 2020-08-21 | 深圳市晶导电子有限公司 | Integrated chip structure and power module |
| CN111564434B (en) * | 2020-04-03 | 2022-04-22 | 深圳市晶导电子有限公司 | Integrated chip structure and power module |
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