CN203535082U - Cantilever probe device - Google Patents
Cantilever probe device Download PDFInfo
- Publication number
- CN203535082U CN203535082U CN201320672757.6U CN201320672757U CN203535082U CN 203535082 U CN203535082 U CN 203535082U CN 201320672757 U CN201320672757 U CN 201320672757U CN 203535082 U CN203535082 U CN 203535082U
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- Prior art keywords
- probe
- cantilever
- silicon chip
- metal structure
- spring metal
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Abstract
The utility model provides a cantilever probe device. The device is used for contacting a silicon chip base pin to detect a silicon chip. The device comprises a probe, a cantilever and a spring metal structure. The probe is connected with the cantilever through the spring metal structure. Through the spring metal structure, the probe achieves elastic telescoping motion along the length direction of the probe. The device is additionally provided with the spring metal structure, so that while the probe is vertically contacted with the silicon chip base pin, the pressure force applied on the silicon chip base pin by the probe is limited by the elastic telescoping of the probe. On the one hand, the device eliminates bias through vertical contact. On the other hand, the pressure force applied on the silicon chip base pin by the probe is prevented from being overlarge through the elastic telescoping, and impression is prevented from being over deep, so that the silicon chip base pin and even the silicon chip bare chip are prevented from being damaged by the probe. The device is a cantilever probe device that can prevent bias and not damage the silicon chip base pin and the silicon chip.
Description
Technical field
The utility model relates to field of semiconductor manufacture, relates in particular to a kind of cantilever probe device.
Background technology
Probe is a kind of test interface, mainly naked core is tested, and by connecting test machine and chip, thereby signal transmission completes chip parameter is tested.
Probe fundamental purpose is the probe in probe directly directly to contact with weld pad or projection on chip, draws chip signal, then coordinates peripheral test instrument and software control to reach the object of automatic measurement.Before probe is applied in IC and not yet encapsulates, for naked crystallographic system, with probe, do functional test, filter out defective products, the encapsulation engineering after carrying out again.Therefore, it is, during IC manufactures, manufacturing cost is affected to one of sizable critical processes.
Please refer to Fig. 1 and Fig. 2, it has shown probe structure of the prior art, and wherein 1 is silicon chip nude film, and 2 is silicon chip pin, 3 is probe (WAT/CP), 4 is side-play amount, and in the prior art, the basic structure of probe 3 is for being permitted anfractuose probe, in use, by certain mode, be fixed in circuit board (pcb board) on the one hand upper, then be connected with tester table by circuit board, on the other hand the end of probe 3 is contacted with silicon chip pin two to be measured.Please refer to Fig. 2, this operating process is easy to cause the phenomenon of skew, has produced side-play amount 4, and then can make the loose contact of probe 3 and silicon chip pin two, finally makes test data portion accurate.Further, along with the development of technology, the size of silicon chip pin two is more and more less, and the skew of probe 3 also can cause it to put under in silicon chip nude film, causes scrapping of silicon chip nude film.
In existing technology, also exist and increase means and the vertical means that contact with silicon chip pin of employing vertical needle that restraining mass is avoided skew, but these means can cause probe excessive to silicon chip pin institute applied pressure, impression is crossed the situations such as dark, and then can be to silicon chip pin, or even silicon chip nude film causes damage.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of phenomenon that can prevent skew, can not damage again the cantilever probe device of silicon chip pin and silicon chip.
The utility model provides a kind of cantilever probe device, in order to contact with silicon chip pin, the detection of realization to silicon chip, comprise probe, cantilever and spring metal structure, described probe is connected with described cantilever by described spring metal structure, and described probe is realized elastic telescopic by described elastic metallic structure along the length direction of described probe.
Preferably, described spring metal structure at least comprises a spring leaf, and the two ends of described spring leaf connect respectively described cantilever and probe.
Preferably, described spring metal structure also comprises housing and be fixedly located at the fixed block in described housing, and one end of described housing is fixedly connected with described cantilever, and one end of described spring leaf is connected with described cantilever with housing by described fixed block.
Preferably, described housing is the cylindrical structure that two ends connect.
Preferably, the inside surface of described housing is provided with internal thread, and described cantilevered distal end is provided with external thread, and described housing is connected and achieves a fixed connection with externally threaded coupling by described internal thread with cantilever.
Preferably, described probe comprises basic courses department and pin portion, the diameter of described basic courses department is greater than described pin portion, described basic courses department only moves in described enclosure interior, described spring leaf is connected with described pin portion by described basic courses department, described pin portion is communicated to space outerpace through one end of described housing, contacts with silicon chip pin.
Preferably, one end of described housing is provided with spacing ring, and the circular hole UNICOM that described pin portion forms through described spacing ring is to space outerpace, and the diameter of described circular hole is less than the diameter of described basic courses department.
Preferably, described cantilever is the vertical vertical section that contacts the setting of silicon chip pin when at least comprising interconnected linkage section and using, and the two ends of described vertical section connect respectively described linkage section and described spring metal structure.
Preferably, the material of described cantilever, spring metal structure and probe is metal.
Preferably, the material of described cantilever, spring metal structure and probe be copper, iron, tungsten, palladium, nickel-chrome, copper beryllium alloy and tungsten-rhenium alloy one of them.
The utility model is by the introducing of spring metal structure, thereby in probe vertical contact silicon chip pin, can by the elastic telescopic of probe, limit probe to silicon chip pin institute applied pressure, on the one hand, the utility model has been eliminated the phenomenon of skew by vertical contact, and then can make fully effectively to contact between the connecing of probe and silicon chip pin, finally make test data more accurate.On the other hand, by elastic telescopic, avoided probe excessive to silicon chip pin institute applied pressure, impression is crossed the situations such as dark, and then has avoided probe to silicon chip pin, or even the damage of silicon chip nude film.A kind of phenomenon that can prevent skew is provided, can damaged again the cantilever probe device of silicon chip pin and silicon chip.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of cantilever probe structure in prior art;
Fig. 2 is the schematic diagram of cantilever probe structure while using in prior art;
Fig. 3 is the structural representation of cantilever probe device in the utility model one embodiment;
Fig. 4 is the structural representation of the utility model one embodiment medi-spring metal construction and probe;
Fig. 5 is the structural representation of spring metal structure and probe while using in the utility model one embodiment;
In figure, 1-silicon chip nude film; 2-silicon chip pin; 3-probe; 4-side-play amount;
10-cantilever; 11-vertical section; 12-linkage section; 13-external thread; 20-spring metal structure; 21-spring leaf; 22-housing; 23-fixed block; 24-internal thread; 25-spacing ring; 30-probe; 31-basic courses department; 32-pin portion; 40-silicon chip pin; 50-silicon chip.
Embodiment
Cantilever probe device the utility model being provided below with reference to Fig. 3 to Fig. 5 is described in detail, it is the utility model one optional embodiment, can think that those skilled in the art can modify and polish it in the scope that does not change the utility model spirit and content.
Please refer to Fig. 3, the utility model provides a kind of cantilever probe device, in order to contact with silicon chip pin 40, the detection of realization to silicon chip 50, comprise probe 30, cantilever 10 and spring metal structure 20, described probe 30 is connected with described cantilever by described spring metal structure, and described probe is realized elastic telescopic by described elastic metallic structure along the length direction of described probe.
Described spring metal structure 20 at least comprises a spring leaf 21, and the two ends of described spring leaf 21 connect respectively described cantilever 10 and probe 30.Please contrast with reference to figure 4 and Fig. 5, the present embodiment utilizes the spring leaf 21 both can be crooked, after bending, can produce again the feature of restoring force, make probe structure there is elastic telescopic function, the large I of pressure is controlled by spring leaf 21 compression degrees, thereby pressure is easily controlled, as long as select suitable spring leaf 21, thereby can be prevented probe bursting silicon chip pin 40 and silicon chip 50.
Further, please refer to Fig. 4 and Fig. 5, described spring metal structure 20 also comprises housing 22 and is fixedly located at the fixed block 23 in described housing 22, one end of described housing 22 is fixedly connected with described cantilever 10, and one end of described spring leaf 21 is connected with described cantilever 10 with housing 22 by described fixed block 23.The cylindrical structure that described housing 22 connects for two ends.Described housing 22 provides rational accommodation space for spring leaf 21.
The inside surface of described housing 22 is provided with internal thread 24, and described cantilever 10 ends are provided with external thread 13, and described housing 22 is connected and achieves a fixed connection with the coupling of external thread 13 by described internal thread 24 with cantilever 10.By this design, the present embodiment has been realized the discrete of cantilever 10 and probe 30, thereby making to pop one's head in 30 can replace separately.Existing cantilever needle construction cannot keep in repair separately single probe, need to scrap whole probe.This design of the present embodiment can effectively reduce the maintenance cost of card.
In addition, because the replaceable of probe 30 also makes the cantilever probe device that the present embodiment provides can change the probe 30 of different-diameter pin portion 32, thereby make pressure more controlled, can control better pin trace size, prevent that silicon chip is punctured.
Described probe 30 comprises basic courses department 31 and pin portion 32, the diameter of described basic courses department 31 is greater than described pin portion 32, described basic courses department 31 is only inner mobile at described housing 22, described spring leaf 21 is connected with described pin portion 32 by described basic courses department 31, described pin portion 32 is communicated to space outerpace through one end of described housing 22, contacts with silicon chip pin 40.The movement of basic courses department 31 in housing 22 can guarantee the moving direction of pin portion 32, and then guarantees that pin portion 32 contacts with the vertical of silicon chip pin 40.In the present embodiment, the diameter of the diameter of described basic courses department 31 and housing 22 should mate, and both can realize and being slidably connected, thus in Fig. 4 and Fig. 5 for clear and definite display unit has shown gap, but in actual design, basic courses department 31 is slidably connected as good with the inside surface of housing 22.
In order to guarantee that described basic courses department 31 is only in the interior movement of described housing 22, one end of described housing 22 is provided with spacing ring 25, and the circular hole UNICOMs that described pin portion 32 forms through described spacing ring 25 are to space outerpace, and the diameter of described circular hole is less than the diameter of described basic courses department 31.Having of spacing ring 25 is beneficial to the movement that limits basic courses department 31.
Described cantilever 10 is the vertical vertical section 11 that contacts 40 settings of silicon chip pin when at least comprising interconnected linkage section 12 and using, and the two ends of described vertical section 11 connect respectively described linkage section 12 and described spring metal structure 20.The structure of cantilever 10 can be complicated, a plurality of warp architectures, consists of, and the present embodiment has only exemplified linkage section 12 and vertical section 11, and vertical section 11 is in order to be connected with spring metal structure 20, thereby probe 30 can be contacted with silicon chip pin 40 is vertical.
The material of described cantilever 10, spring metal structure 20 and probe 30 is metal.Specifically, the material of described cantilever 10, spring metal structure 20 and probe 30 can for copper, iron, tungsten, palladium, nickel-chrome, copper beryllium alloy and tungsten-rhenium alloy one of them.
Claims (10)
1. a cantilever probe device, in order to contact with silicon chip pin, the detection of realization to silicon chip, comprise probe, it is characterized in that: also comprise cantilever and spring metal structure, described probe is connected with described cantilever by described spring metal structure, and described probe is realized elastic telescopic by described elastic metallic structure along the length direction of described probe.
2. cantilever probe device as claimed in claim 1, is characterized in that: described spring metal structure at least comprises a spring leaf, and the two ends of described spring leaf connect respectively described cantilever and probe.
3. cantilever probe device as claimed in claim 2, it is characterized in that: described spring metal structure also comprises housing and is fixedly located at the fixed block in described housing, one end of described housing is fixedly connected with described cantilever, one end of described spring leaf is connected with described housing by described fixed block, and then being connected of realization and cantilever.
4. cantilever probe device as claimed in claim 3, is characterized in that: described housing is the cylindrical structure that two ends connect.
5. cantilever probe device as claimed in claim 4, is characterized in that: the inside surface of described housing is provided with internal thread, and described cantilevered distal end is provided with external thread, and described housing is connected and achieves a fixed connection with externally threaded coupling by described internal thread with cantilever.
6. cantilever probe device as claimed in claim 3, it is characterized in that: described probe comprises basic courses department and pin portion, the diameter of described basic courses department is greater than described pin portion, described basic courses department only moves in described enclosure interior, described spring leaf is connected with described pin portion by described basic courses department, described pin portion is communicated to space outerpace through one end of described housing, contacts with silicon chip pin.
7. cantilever probe device as claimed in claim 6, is characterized in that: one end of described housing is provided with spacing ring, and the circular hole UNICOM that described pin portion forms through described spacing ring is to space outerpace, and the diameter of described circular hole is less than the diameter of described basic courses department.
8. cantilever probe device as claimed in claim 1, is characterized in that: when described cantilever at least comprises linkage section and uses, in order to the vertical section of vertical contact silicon chip pin, the two ends of described vertical section connect respectively described linkage section and described spring metal structure.
9. the cantilever probe device as described in one of as any in claim 1 to 8, is characterized in that: the material of described cantilever, spring metal structure and probe is metal.
10. cantilever probe device as claimed in claim 9, is characterized in that: the material of described cantilever, spring metal structure and probe be copper, iron, tungsten, palladium, nickel-chrome, copper beryllium alloy and tungsten-rhenium alloy one of them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320672757.6U CN203535082U (en) | 2013-10-29 | 2013-10-29 | Cantilever probe device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320672757.6U CN203535082U (en) | 2013-10-29 | 2013-10-29 | Cantilever probe device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203535082U true CN203535082U (en) | 2014-04-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320672757.6U Expired - Fee Related CN203535082U (en) | 2013-10-29 | 2013-10-29 | Cantilever probe device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203535082U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109752575A (en) * | 2019-03-13 | 2019-05-14 | 深圳市艺盛科五金电子有限公司 | A kind of changeable type structure stainless steel metal probe mould group and preparation method thereof |
| US10393773B2 (en) | 2015-09-23 | 2019-08-27 | Mpi Corporation | Spring probe and probe card having spring probe |
| TWI682179B (en) * | 2019-06-03 | 2020-01-11 | 中國探針股份有限公司 | Electrical connection assembly |
| CN111537864A (en) * | 2020-05-27 | 2020-08-14 | 浪潮电子信息产业股份有限公司 | PCB impedance test fixture |
-
2013
- 2013-10-29 CN CN201320672757.6U patent/CN203535082U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10393773B2 (en) | 2015-09-23 | 2019-08-27 | Mpi Corporation | Spring probe and probe card having spring probe |
| CN109752575A (en) * | 2019-03-13 | 2019-05-14 | 深圳市艺盛科五金电子有限公司 | A kind of changeable type structure stainless steel metal probe mould group and preparation method thereof |
| TWI682179B (en) * | 2019-06-03 | 2020-01-11 | 中國探針股份有限公司 | Electrical connection assembly |
| CN111537864A (en) * | 2020-05-27 | 2020-08-14 | 浪潮电子信息产业股份有限公司 | PCB impedance test fixture |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140409 Termination date: 20191029 |