CN203423148U - No-pin surface-mount ball-type matrix integrated circuit packaging mold - Google Patents
No-pin surface-mount ball-type matrix integrated circuit packaging mold Download PDFInfo
- Publication number
- CN203423148U CN203423148U CN201320424952.7U CN201320424952U CN203423148U CN 203423148 U CN203423148 U CN 203423148U CN 201320424952 U CN201320424952 U CN 201320424952U CN 203423148 U CN203423148 U CN 203423148U
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- counterdie
- mold
- packaging
- lower mold
- fixing plate
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Abstract
A no-pin surface-mount ball-type matrix integrated circuit packaging mold belongs to high-frequency super-large-chip integrated circuit packaging. The packaging mold mainly comprises an upper mold fixing plate and a lower mold fixing plate, wherein an upper mold cavity and an upper mold center flow channel are installed on the upper mold fixing plate, and a lower mold cavity and a lower mold center plate are installed on the lower mold fixing plate. Lower mold material filling cylinders are installed in the lower mold center plate. During mold closing, the upper mold fixing plate and the lower mold fixing plate are closed, and the multiple lower mold material filling cylinders uniformly push epoxy plastic to enable the epoxy plastic to pass through the lower mold material filling cylinders and the upper mold center flow channel to be filled in the upper mold cavity through pouring gates. The packaging mold increases the number of packaging pins and improves the yield of chip assembly; the packaging mold can package a chip with high power consumption and maintain good electrical characteristics; a packaging body is reduced in size, the consumption of epoxy resin is reduced, and the production cost is lowered; and the packaging mold enables an assembled circuit board to be smaller and lighter.
Description
Technical field
The present invention relates to a kind ofly without pin surface mount ball-type matrix integrated circuit packaging mould, it belongs to the technical field of microchip transistor encapsulation.
Background technology
Along with the development of integrated circuit technique, to the encapsulation of integrated circuit, require more and more stricter.This is because encapsulation is related to the performance of product, and when the frequency of IC surpasses 100MHz, conventional package mode may produce so-called intermodulation noise " Cross-Talk Noise " phenomenon, and when the number of pins of IC is greater than 208 pin, takies substrate area excessive; The warpage issues of Plastic Package is its major defect, i.e. the Coplanarity Problems of tin ball.The standard of coplanarity is in order to reduce warpage, improves the characteristic of encapsulation, should study plastics, bonding die glue and baseplate material, and make these material optimizations.Simultaneously because the cost of substrate is high, and make its price very high.Traditional packaged type has its difficulty.Therefore,, except using existing packaged type, most high pin is counted chip all then is used and encapsulates without pin surface label now.Without pin surface label once the optimal selection that occurs becoming CPU, the encapsulation of high number of pins without the device overwhelming majority of pin surface label encapsulation for high-grade consumption markets such as mobile phone, network and communications equipment, digital camera, microcomputer, notebook, PAD and various types of flat panel displays.
Summary of the invention
The invention provides a kind ofly without pin surface mount ball-type matrix integrated circuit packaging mould, solve the encapsulation problem of the many pins of micro-small outline transistor bilateral.
The technical solution adopted for the present invention to solve the technical problems is: a kind of without pin surface mount ball-type matrix integrated circuit packaging mould, mainly comprise upper mould fixed plate and counterdie fixed head, on upper mould fixed plate, install model cavity and patrix center flow channels, counterdie die cavity and counterdie central plate are installed on counterdie fixed head; In described counterdie central plate, counterdie filling barrel is installed, during work matched moulds, make upper mould fixed plate and counterdie fixed head closed, with a plurality of counterdie filling barrels, evenly advance epoxy plastics, epoxy plastics is filled in the middle of upper model cavity by cast gate through counterdie filling barrel and patrix center flow channels.
In the process of filling, epoxy resin enters into model cavity the inside, by diverse location, different big or small die cavity air discharge duct being set by Bas Discharged die cavity.
The invention has the beneficial effects as follows: this encapsulating mould mainly comprises upper mould fixed plate and counterdie fixed head, on upper mould fixed plate, install model cavity and patrix center flow channels, counterdie die cavity and counterdie central plate are installed on counterdie fixed head.Counterdie filling barrel is installed in counterdie central plate, during work matched moulds, make upper mould fixed plate and counterdie fixed head closed, with a plurality of counterdie filling barrels, evenly advance epoxy plastics, epoxy plastics is filled in the middle of upper model cavity by cast gate through counterdie filling barrel and patrix center flow channels.This Encapsulation Moulds has improved packaging pin quantity, has improved chip assembly yield; Can encapsulate the chip that power consumption is very large, keep good electrical characteristics; Packaging body dwindles, and has reduced the use amount of epoxy resin, has reduced production cost; Make the circuit board that assembles less, lighter.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is described in further detail.
Fig. 1 is the mould-matching structure figure of upper and lower mould.
Fig. 2 is the cavity structure figure of patrix.
In figure: 1, counterdie die cavity, 2, counterdie cast gate, 3, counterdie die cavity pressure-bearing surface, 4, counterdie die cavity sprue, 5, counterdie center flow channels, 6, counterdie fixed head, 7, upper model cavity, 8, patrix central plate, 9, upper mould fixed plate, 10, counterdie thimble fixed head, 11, counterdie thimble backing plate, 12, counterdie fixed head support column, 13, counterdie die cavity thimble, 14, filling barrel, 15, patrix thimble fixed head, 16, patrix thimble backing plate, 17, upper mould fixed plate supports, 18, upper model cavity thimble.
Embodiment
Referring to accompanying drawing, structure of the present invention is described further.
Fig. 1,2 shows a kind of structure chart without pin surface mount ball-type matrix integrated circuit packaging mould.In figure, a kind of without pin surface mount ball-type matrix integrated circuit packaging mould, mainly comprise upper mould fixed plate 5 and counterdie fixed head 8, on upper mould fixed plate 5, install model cavity 3, patrix center flow channels 4 counterdie die cavity 6, counterdie central plate 7 are installed on counterdie fixed head 8; In described counterdie central plate 7, counterdie filling barrel 14 is installed, during work matched moulds, make upper mould fixed plate 5 and counterdie fixed head 8 closures, with a plurality of counterdie filling barrels 14, evenly advance epoxy plastics, epoxy plastics is filled in the middle of upper model cavity 3 by cast gate 1 through counterdie filling barrel 14 and patrix center flow channels 4; In the bottom of described upper mould fixed plate 5, be fixedly connected with upper mould fixed plate support column 17, in the bottom of described counterdie fixed head 8, be fixedly connected with counterdie fixed head support column 13; Upper model cavity thimble 18, is connected with patrix thimble backing plate 16 by patrix thimble fixed head 15, and is fixed on patrix thimble fixed head 15.By patrix thimble backing plate 16, in control, 18 motions of model cavity thimble eject the product of model cavity 3 the insides.Ic substrate is fixed on counterdie die cavity 6 by the ic substrate pilot pin 12 being arranged on counterdie die cavity 6.Counterdie die cavity thimble 11 is connected with counterdie thimble backing plate 10 by counterdie thimble fixed head 9, counterdie die cavity thimble 11 is fixed on counterdie thimble fixed head 9, by counterdie thimble backing plate 10, control 11 motions of counterdie die cavity thimble, make to be fixed on ic substrate on counterdie die cavity 6 and eject.
Described upper model cavity 3 distribution diverse locations and big or small cast gate 1, make epoxy resin enter upper model cavity 3 by cast gate 1, carries out packaged IC substrate.
In the process of epoxy resin filling, the air of upper model cavity 3 the insides discharges by diverse location and big or small die cavity air discharge duct 2 mobility that die cavities improve epoxy resin, guarantees the complete of encapsulation.
Counterdie thimble backing plate 10 is controlled 11 motions of counterdie die cavity thimble, makes counterdie die cavity thimble 11 act on and be fixed on ic substrate on counterdie die cavity 6 through counterdie die cavity 6, and product is departed from completely on mould.
Claims (2)
1. one kind without pin surface mount ball-type matrix integrated circuit packaging mould, mainly comprise upper mould fixed plate (5) and counterdie fixed head (8), on upper mould fixed plate (5), install model cavity (3) and patrix center flow channels (4), at upper counterdie die cavity (6) and the counterdie central plate (7) installed of counterdie fixed head (8); It is characterized in that: counterdie filling barrel (14) is installed in described counterdie central plate (7), during work matched moulds, make upper mould fixed plate (5) and counterdie fixed head (8) closure, with a plurality of counterdie filling barrels (14), evenly advance epoxy plastics, epoxy plastics is filled in the middle of upper model cavity (3) by cast gate (1) through counterdie filling barrel (14) and patrix center flow channels (4).
2. according to claim 1 a kind of without pin surface mount ball-type matrix integrated circuit packaging mould, it is characterized in that: in the process of filling, epoxy resin enters into model cavity (3) the inside, by diverse location, different big or small die cavity air discharge duct (2) being set by Bas Discharged die cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320424952.7U CN203423148U (en) | 2013-07-17 | 2013-07-17 | No-pin surface-mount ball-type matrix integrated circuit packaging mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320424952.7U CN203423148U (en) | 2013-07-17 | 2013-07-17 | No-pin surface-mount ball-type matrix integrated circuit packaging mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203423148U true CN203423148U (en) | 2014-02-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320424952.7U Expired - Fee Related CN203423148U (en) | 2013-07-17 | 2013-07-17 | No-pin surface-mount ball-type matrix integrated circuit packaging mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203423148U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108058335A (en) * | 2017-12-28 | 2018-05-22 | 大连泰半导体设备有限公司 | A kind of flat transistor semiconductor multiple spot material feeding form encapsulating mould of middle power |
-
2013
- 2013-07-17 CN CN201320424952.7U patent/CN203423148U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108058335A (en) * | 2017-12-28 | 2018-05-22 | 大连泰半导体设备有限公司 | A kind of flat transistor semiconductor multiple spot material feeding form encapsulating mould of middle power |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Dalian City Development Zone, Liaoning province 116600 District No. 26 special mold factory 1-1 Patentee after: Dalian Tai Semiconductor Equipment Co., Ltd. Address before: Dalian City Development Zone, Liaoning province 116600 District No. 26 special mold factory 1-1 Patentee before: Dalian Taiyi Precision Mold Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140205 Termination date: 20170717 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |