CN204464250U - chip tray structure - Google Patents
chip tray structure Download PDFInfo
- Publication number
- CN204464250U CN204464250U CN201520201728.0U CN201520201728U CN204464250U CN 204464250 U CN204464250 U CN 204464250U CN 201520201728 U CN201520201728 U CN 201520201728U CN 204464250 U CN204464250 U CN 204464250U
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- China
- Prior art keywords
- chip
- substrate
- engraved structure
- alignment pin
- bight
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Abstract
The utility model relates to a kind of chip tray structure, comprising: substrate; Be opened on described substrate, supply the engraved structure of chip placement, the shape adaptation of described engraved structure is in the shape of described chip, and the area of described engraved structure is greater than the area of described chip, the bight of the corresponding described chip of described engraved structure is formed with opening; Be located at the alignment pin on described substrate, two side edge in described chip bight are located at by described alignment pin, and to be formed on described substrate, for the support lugn of supporting chip, described support lugn is extended towards described engraved structure by described substrate.Adopt the opening of the bight design hollow out being chip on substrate and reduce the contact area of substrate and chip, increase the Free up Memory of liquid flow to greatest extent, liquid in controlled collapsible chip connec-tion is positioned in charging tray at chip flowed out swimmingly, and be unlikely to accumulate in the gap of contact-making surface, reduce accumulating of liquid to the utmost.
Description
Technical field
The utility model relates to chip package field, espespecially a kind of chip tray structure.
Background technology
Miniaturization, the high-density packages form of IC device get more and more, as multimode encapsulation (MCM), system-level packing (SIP), flip-chip (FC, FLIP CHIP) etc., and flip-chip (FLIPCHIP) high reliability, excellent electricity and thermal property, prolongation encapsulation fatigue life and meet in high-density packages etc. and embody advantage, the electric signal transmission range between wafer and substrate can be reduced, be useful in the encapsulation of high speed element, can be cost-saving, its application in recent years becomes main flow gradually.But flip-chip is because have less overall dimension, less sphere diameter and sphere gap, it is to planting ball technique, matrix technique, the compatibility of material, manufacturing process, and checkout equipment and method are proposed unprecedented challenge.Just because of this, to such an extent as to the initial packaging cost of this product is relatively high also.
Encapsulated type due to flip-chip belongs to the encapsulation that can realize smallest element device size and weight, chip package realizes most high density, and the charging tray of existing chip placement, in the production process processes such as face-down bonding or underfill liquid-state epoxy resin material, the liquid overflowed easily produces accumulating of liquid or spot in the position of the corner of charging tray and chip contact-making surface, and then making the charging tray of chip placement when crossing Reflow Soldering or high temperature furnace, these spots are solidified further, are adhered to.Finally not removable vestige under the surface of chip is left over, last chip shipment becomes defective products, causes the return of goods, suffers heavy losses.
Utility model content
The purpose of this utility model is the defect overcoming prior art, provides a kind of material tray structure of chip, solves making chip accumulates spot and becoming defective products of existing charging tray existence, causes the problem of the return of goods.
The technical scheme realizing above-mentioned purpose is:
A kind of chip tray structure of the utility model, comprising:
Substrate;
Be opened on described substrate, supply the engraved structure of chip placement, the shape adaptation of described engraved structure is in the shape of described chip, and the area of described engraved structure is greater than the area of described chip, the bight of the corresponding described chip of described engraved structure is formed with opening;
Be located at the alignment pin on described substrate, two side edge in described chip bight are located at by described alignment pin, and
Be formed on described substrate, for the support lugn supporting described chip, described support lugn is extended towards described engraved structure by described substrate.
Adopt on substrate is the opening of the bight design hollow out of chip and the contact area (namely forming support lugn on substrate) reducing substrate and chip, increase the Free up Memory of liquid flow to greatest extent, liquid in controlled collapsible chip connec-tion is positioned in charging tray at chip flowed out swimmingly, and be unlikely to accumulate in the gap of contact-making surface, reduce accumulating of liquid to the utmost, in actual applications, reach and remove the residual effect of spot, improve the yield of flip-chip.
The further improvement of the utility model chip tray structure is, described support lugn is arc-shaped structure.
The further improvement of the utility model chip tray structure is, the radius of described arc-shaped structure is less than or equal to 0.54mm.
The further improvement of the utility model chip tray structure is, the side of the corresponding described chip of described engraved structure extends to form the projection of hollow out to described chip exterior, described in be projected and formed between the described alignment pin of described side.
The further improvement of the utility model chip tray structure is, the radius of described opening is more than or equal to 1.5mm.
The further improvement of the utility model chip tray structure is, the junction of described engraved structure and described alignment pin is arcuate structure.
The further improvement of the utility model chip tray structure is, described engraved structure arrayed is formed on described substrate.
The further improvement of the utility model chip tray structure is, described support lugn is formed at described alignment pin place.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the utility model chip tray structure;
Fig. 2 is the enlarged diagram at A place in Fig. 1;
Fig. 3 is the structural representation that the utility model chip tray structure placed chip; And
Fig. 4 is the structural representation of a better embodiment of the utility model chip tray structure.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Consult Fig. 1, show the schematic diagram of the utility model chip tray structure.Chip tray structure of the present utility model is not when affecting charging tray overall precision and position dimension, the hollow out position of chip placement and the structure of supporting chip are improved, because chip can touch the fluent material such as epoxy resin as liquid state when each procedure circulation of production line, because certain coefficient of viscosity and volatility can be there is in liquid, so such liquid in viscous, accumulation in a lot of airtight or exiguous space, not easily can flow away.The utility model adopts less support lugn supporting chip, reduce the contact area of substrate and chip, the accumulation of liquid can be reduced to greatest extent, improve engraved structure in addition and form opening at the bight place of chip, the smooth and easy outflow of liquid can be facilitated, make packaged chip surface noresidue vestige.Below in conjunction with accompanying drawing, the utility model chip tray structure is described.
Consult Fig. 1, show the schematic diagram of the utility model chip tray structure, below in conjunction with Fig. 1, the material tray structure of the utility model chip is described.
As shown in Figure 1, the utility model chip tray structure comprises substrate 20, be opened in the engraved structure 201 on substrate 20, be located at the alignment pin 202 on substrate 20, and be formed on substrate 20, for the support lugn 203 of supporting chip, engraved structure 201 is for chip placement, the shape adaptation of this engraved structure 201 is in the shape of chip, and the area of engraved structure 201 is greater than the area of chip, if chip is square structure, so engraved structure 201 is greater than the square structure of chip for area, what make that chip can be unsettled is placed in engraved structure 201 place, such convenience carries out technological operation to chip upper and lower surface on a production line.The bight of the corresponding chip of this engraved structure 201 is formed with opening 2011, and this opening 2011 makes unsettled being placed in chip tray structure in the bight of chip, avoids the phenomenon of the easy residual liquid in chip bight.Alignment pin 202 arranges two side edge in the bight of chip to be installed, and position is near bight, can the installation site in a bight of positioning chip accurately by two alignment pins 202, if square chip, it has four bights, that arranges eight alignment pins with regard to correspondence on the base plate 20, realizes the location of chip mounting location.Support lugn 203, for supporting chip, makes chip prop up and is located at engraved structure 201 place, and this support lugn 203 is extended towards engraved structure 201 by substrate 20, and this support lugn 203 contacts with chip.Preferably; this support lugn 203 is formed at alignment pin 202 place; strengthen the structural strength of this support lugn 203; can either protection objective pin 202 technological problems in an assembling process; chip can be made again to be supported stably, and this support lugn 203 also can not affect the fretwork area of engraved structure 201.The utility model adopts opening 2011 and is formed at the design of support lugn 203 at alignment pin 202 place, the Free up Memory of liquid flow can be increased to greatest extent, make liquid in flip-chip can flow process smoothly in charging tray, greatly reduce the accumulation of liquid on chip, thus the spot eliminated on chip remains, improve the finished product yield of chip.
As shown in Figure 2, in order to reduce substrate 20 and the contact area of chip as far as possible, ensure again the support strength to chip simultaneously, this support lugn 203 is designed to arc-shaped structure, the radius of this arc-shaped structure is less than or equal to 0.54mm, and the radius of arc-shaped structure is preferably 0.54mm.
Alignment pin 202 is for the placement location of positioning chip, as shown in Figure 3, when chip 10 is positioned in chip tray structure, by two sides at the bight place by chip 10 and alignment pin 202 against, can chip 10 be positioned on engraved structure 201 accurately, shown in composition graphs 1, chip 10 is except contacting with support lugn 203, and remainder is all in vacant state.The side of the corresponding chip 10 of engraved structure 201 extends to form the projection 2012 of hollow out to the outside of chip 10, the projection 2012 of this hollow out is between two alignment pins 202 of chip 10 side edge.The opening of engraved structure 201 is preferably circular port, and the radius of circular port is more than or equal to 1.5mm, and the radius of this circular port is preferably 1.5mm.As shown in Figure 2, engraved structure 201 is arcuate structure 204 with the junction of alignment pin 202, can reduce the contact area of substrate 20 and chip 10 further.
As shown in Figure 4, a better embodiment of the utility model chip tray structure, is formed with multiple engraved structure 201 on the base plate 20, and engraved structure 201 arrayed is on substrate 20.According to the requirement of different size specification, can form the engraved structure of varying number on substrate, with chip placement, by material tray structure, by chip, each technique place sent on production line carries out PROCESS FOR TREATMENT, completes the flip-chip packaged of chip.
The beneficial effect of the utility model chip tray structure is: adopting on substrate is the opening of the bight design hollow out of chip and the contact area (namely forming support lugn on substrate) reducing substrate and chip, increase the Free up Memory of liquid flow to greatest extent, liquid in controlled collapsible chip connec-tion is positioned in charging tray at chip flowed out swimmingly, and be unlikely to accumulate in the gap of contact-making surface, reduce accumulating of liquid to the utmost, in actual applications, reach and remove the residual effect of spot, improve the yield of flip-chip.The utility model has the advantage of low cost, and has accomplished with minimum contact area, and the most smooth circulation style avoids the spot residue problem produced in production technology.
Below embodiment has been described in detail the utility model by reference to the accompanying drawings, and those skilled in the art can make many variations example to the utility model according to the above description.Thus, some details in embodiment should not formed restriction of the present utility model, the utility model by the scope that defines using appended claims as protection range of the present utility model.
Claims (8)
1. a chip tray structure, is characterized in that, comprising:
Substrate;
Be opened on described substrate, supply the engraved structure of chip placement, the shape adaptation of described engraved structure is in the shape of described chip, and the area of described engraved structure is greater than the area of described chip, the bight of the corresponding described chip of described engraved structure is formed with opening;
Be located at the alignment pin on described substrate, two side edge in described chip bight are located at by described alignment pin; And
Be formed on described substrate, for the support lugn supporting described chip, described support lugn is extended towards described engraved structure by described substrate.
2. chip tray structure as claimed in claim 1, it is characterized in that, described support lugn is arc-shaped structure.
3. chip tray structure as claimed in claim 2, it is characterized in that, the radius of described arc-shaped structure is less than or equal to 0.54mm.
4. chip tray structure as claimed in claim 1, is characterized in that, the side of the corresponding described chip of described engraved structure extends to form the projection of hollow out to described chip exterior, described in be projected and formed between the described alignment pin of described side.
5. chip tray structure as claimed in claim 1, it is characterized in that, the radius of described opening is more than or equal to 1.5mm.
6. chip tray structure as claimed in claim 1, it is characterized in that, the junction of described engraved structure and described alignment pin is arcuate structure.
7. chip tray structure as claimed in claim 1, it is characterized in that, described engraved structure arrayed is formed on described substrate.
8. chip tray structure as claimed in claim 1, it is characterized in that, described support lugn is formed at described alignment pin place.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520201728.0U CN204464250U (en) | 2015-04-07 | 2015-04-07 | chip tray structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520201728.0U CN204464250U (en) | 2015-04-07 | 2015-04-07 | chip tray structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204464250U true CN204464250U (en) | 2015-07-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520201728.0U Withdrawn - After Issue CN204464250U (en) | 2015-04-07 | 2015-04-07 | chip tray structure |
Country Status (1)
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| CN (1) | CN204464250U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107134425A (en) * | 2017-05-04 | 2017-09-05 | 北京中电科电子装备有限公司 | A kind of table assembly of separator |
| CN109979846A (en) * | 2017-12-28 | 2019-07-05 | 全球能源互联网研究院有限公司 | It is sintered fixture, compression joint type IGBT module single side sintering method and submodule group obtained |
| CN110034028A (en) * | 2019-03-29 | 2019-07-19 | 上海中航光电子有限公司 | Chip packaging method and chip-packaging structure |
-
2015
- 2015-04-07 CN CN201520201728.0U patent/CN204464250U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107134425A (en) * | 2017-05-04 | 2017-09-05 | 北京中电科电子装备有限公司 | A kind of table assembly of separator |
| CN107134425B (en) * | 2017-05-04 | 2020-03-06 | 北京中电科电子装备有限公司 | Workbench assembly of sorting machine |
| CN109979846A (en) * | 2017-12-28 | 2019-07-05 | 全球能源互联网研究院有限公司 | It is sintered fixture, compression joint type IGBT module single side sintering method and submodule group obtained |
| CN110034028A (en) * | 2019-03-29 | 2019-07-19 | 上海中航光电子有限公司 | Chip packaging method and chip-packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171128 Address after: 201107 Shanghai city Minhang District Zhu Jian Lu Lane 333 No. 2 layer, two layer Patentee after: Shanghai LANCO Semiconductor Equipment Co., Ltd. Address before: 201203 Shanghai Guo Shou Jing Road, Zhangjiang High Tech Park of Pudong New Area No. 351 Building No. 2 room 657-20 Patentee before: Shanghai Rising Sun Automation Technology Co., Ltd. |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20150708 Effective date of abandoning: 20210207 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20150708 Effective date of abandoning: 20210207 |