CN201466062U - Integrated fine-pitch pin LED drive circuit packaging structure - Google Patents
Integrated fine-pitch pin LED drive circuit packaging structure Download PDFInfo
- Publication number
- CN201466062U CN201466062U CN2009201309746U CN200920130974U CN201466062U CN 201466062 U CN201466062 U CN 201466062U CN 2009201309746 U CN2009201309746 U CN 2009201309746U CN 200920130974 U CN200920130974 U CN 200920130974U CN 201466062 U CN201466062 U CN 201466062U
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- pin
- led drive
- fine
- lead frame
- pitch
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Abstract
The utility model relates to an integrated fine-pitch pin LED drive circuit packaging structure, which comprises a fine-pitch lead frame and a plastic package body. The fine-pitch lead frame, which is made of copper alloy by way of precision die cutting, is used to bear an integrated circuit chip and lead the electrodes of the chip out to pins. The plastic package body is made of epoxy resin material by way of hot pressing and injection molding in a high-precision MGP multi-head injection mold. The utility model successfully solves the problem on how to precisely shape and package the fine-pitch pin frame, and the miniature, fine-pitch pin integrated circuit meets the technical requirement of fine-pitch wiring on an LED drive board.
Description
Technical field
Patent of the present invention relates to a kind of integrated circuit encapsulation technology, especially relates to a kind of close apart from pin LED drive integrated circult encapsulating structure.
Background technology
Along with miniaturization, lightness, the portable and low price of electronic equipment and system, require that supporting integrated circuit package dimension dwindles, thickness attenuation, weight saving, I/O line increase, dispel the heat better, performance and reliability improves and cost reduces.Therefore, miniaturization is that integrated circuit encapsulates topmost developing direction.
LED display has caused people's great attention as a high-tech product, adopts computer control, and the big screen intelligent display screen that light, electricity are combined together has been applied to a lot of fields.The pixel of LED display adopts the LED light-emitting diode, and many light-emitting diodes are lined up with dot matrix way, constitutes led array, and then constitutes the LED screen.By different LED type of drive, can obtain the image of different-effect.Therefore the quality of drive integrated circult plays an important role to the display quality of LED display.
The wiring situation strong correlation of the display quality of LED display and LED drive plate (PCB).Particularly, require the LED drive integrated circult to have little apparent size and close apart from pin for the less LED drive plate wiring of dot spacing.In the profile specification of the LED drive integrated circult series of products that our company produces, existing two kinds of pin-pitch: 1.27mm, 1.00mm, but still can not cover the application that the LED drive plate needs the point off density pitch routing.Therefore, the integrated circuit of the suitable LED drive plate point off density pitch routing requirement of exploitation just becomes the great technical task that solution is badly in need of in company.
Summary of the invention
The purpose of this utility model provides the LED drive integrated circult encapsulating structure that a kind of pin-pitch is 0.635mm.
Technical solution of the present utility model is: a kind of close apart from pin LED drive integrated circult encapsulating structure, comprise close apart from lead frame and plastic-sealed body.Close apart from lead frame employing Cu alloy material, through accurate punching machine-shaping, be used for the bearing integrated chip, and chip electrode is drawn out to pin.Plastic-sealed body adopts epoxy molding material, hot pressing injection mo(u)lding in special high-accuracy MGP bull injection mold.
The solution of the utility model success close apart from the high accuracy moulding of lead frame and the difficult problem of plastic packaging.Close integrated circuit (IC) products apart from pin has satisfied the specification requirement of LED drive plate point off density pitch routing.
Described close apart from lead frame, adopt the thin band of copper alloy of 0.15mm thickness, two-row structure, every row Unit 20, a slice is close apart from lead frame Unit totally 40.Number of pins 24, pin spacing 0.635mm.The substrate zone and the high-purity silver layer of interior pin area electroplating surface of chip are installed, outer pin electroplating surfaces with tin.
Described plastic-sealed body adopts the black epoxy moulding compound, the substrate zone that chip is installed is encapsulated as the plastic body of 8.6 * 3.8 * 1.48mm.Cooperate the runner of MGP bull injection mold to distribute moulding compound helical flow length 80cm.
Described high accuracy MGP bull injection mold is that positioning accuracy reaches the very upper and lower sleeve matched moulds of high level.Die cavity form and runner distribute and design and make by this programme lead frame institute tool characteristics slim, double, close distance.
Description of drawings
Accompanying drawing one is the lead frame overall plan view of the utility model embodiment:
Accompanying drawing two is the lead frame cell floor plan of the utility model embodiment:
Accompanying drawing three is the product shape front view of the utility model embodiment:
Accompanying drawing four is the product shape upward view of the utility model embodiment;
Accompanying drawing five is the product shape left view of the utility model embodiment;
Accompanying drawing six is plastic sealed mould an actor's rendering of an operatic tune distribution map of the utility model embodiment.
1, substrate zone; 2, interior pin area; 3, outer pin; 4, plastic-sealed body; 5, mould bases; 6, die cavity; 7, runner; 8, injecting head
Embodiment
Embodiment: a kind of close as shown in the figure apart from pin LED drive integrated circult chip-packaging structure, comprise close apart from lead frame and plastic-sealed body.Closely set up substrate zone apart from lead frame and be used to install chip, establish pin area and be used to draw chip electrode.Plastic-sealed body adopts epoxy molding material hot pressing injection mo(u)lding.For close special high-accuracy MGP bull injection mold apart from the supporting design of lead frame is provided with radial runner and many injecting heads mechanism.
Shown in Figure 1 is close apart from lead frame, is made as two rows, every row Unit 20, and full wafer is Unit totally 40.
Shown in Figure 2 is close apart from the lead frame unit, is provided with substrate zone 1, interior pin area 2, outer pin 3.The high-purity silver layer of the electroplating surface of substrate zone 1, interior pin area 2, silver coating thickness 3-5 μ m.
Product shape shown in Figure 3 has plastic-sealed body 4,3 liang of parts of outer pin.Seal overall dimension 8.6 * 3.8 * 1.48mm of plastic-sealed body 4 after the moulding.
Product shape shown in Figure 4, the quantity 24 of outer pin 3, pin is apart from 0.635mm, and outer pin 3 electroplating surfaces with tin are also done anti-oxidation processing.
Product shape shown in Figure 5, outer pin 3 bending and moldings.
Special high-accuracy MGP bull injection mold shown in Figure 6 is provided with mould bases 5, establishes six groups of die cavities 6 on the mould bases 5, and every group of die cavity 6 can be placed two lead frames.Every group of die cavity 6 established four injecting heads 8, and each injecting head 8 is established five radial runners 7, two unit products of each runner 7 injection moulding simultaneously.
Claims (3)
- One kind close apart from pin LED drive integrated circult encapsulating structure, comprise close apart from lead frame and plastic-sealed body (4), it is characterized in that: close apart from lead frame set up substrate zone (1), interior pin area (2) and outside pin (3), plastic-sealed body (4) is encapsulated in substrate zone (1), interior pin area (2) in the black epoxy moulding compound.
- 2. according to claim 1 close apart from pin LED drive integrated circult encapsulating structure, it is characterized in that: the close thin band of copper alloy that adopts 0.15mm thickness apart from lead frame, the monolithic lead frame is established Unit 40 altogether, is two-row structure, every row Unit 20, the high-purity silver layer of electroplating surface of substrate zone (1), interior pin area (2), silver coating thickness 3-5 μ m, the pin number of outer pin (3) is 24, the pin of outer pin (3) is apart from 0.635mm, outer pin (3) electroplating surfaces with tin, outer pin (3) bending and molding.
- 3. according to claim 1 close apart from pin LED drive integrated circult encapsulating structure, it is characterized in that: overall dimension 8.6 * 3.8 * 1.48mm of plastic-sealed body (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201309746U CN201466062U (en) | 2009-04-29 | 2009-04-29 | Integrated fine-pitch pin LED drive circuit packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201309746U CN201466062U (en) | 2009-04-29 | 2009-04-29 | Integrated fine-pitch pin LED drive circuit packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201466062U true CN201466062U (en) | 2010-05-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201309746U Expired - Lifetime CN201466062U (en) | 2009-04-29 | 2009-04-29 | Integrated fine-pitch pin LED drive circuit packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201466062U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104316676A (en) * | 2014-11-05 | 2015-01-28 | 长兴电子材料（昆山）有限公司 | Mold for detecting mold flow marks of epoxy molding plastic |
| CN107731692A (en) * | 2017-10-13 | 2018-02-23 | 上海贝岭股份有限公司 | The method and integrated circuit of the Plastic Package of integrated circuit |
| CN112984451A (en) * | 2019-12-02 | 2021-06-18 | Sl株式会社 | Vehicle lamp and method of assembling vehicle lamp |
-
2009
- 2009-04-29 CN CN2009201309746U patent/CN201466062U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104316676A (en) * | 2014-11-05 | 2015-01-28 | 长兴电子材料（昆山）有限公司 | Mold for detecting mold flow marks of epoxy molding plastic |
| CN107731692A (en) * | 2017-10-13 | 2018-02-23 | 上海贝岭股份有限公司 | The method and integrated circuit of the Plastic Package of integrated circuit |
| CN112984451A (en) * | 2019-12-02 | 2021-06-18 | Sl株式会社 | Vehicle lamp and method of assembling vehicle lamp |
| CN112984451B (en) * | 2019-12-02 | 2024-01-19 | Sl株式会社 | Vehicle lamp and method of assembling vehicle lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100512 |