CN207719148U - A kind of intelligent chip composite module semiconductor packaging mold - Google Patents
A kind of intelligent chip composite module semiconductor packaging mold Download PDFInfo
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- CN207719148U CN207719148U CN201721867309.6U CN201721867309U CN207719148U CN 207719148 U CN207719148 U CN 207719148U CN 201721867309 U CN201721867309 U CN 201721867309U CN 207719148 U CN207719148 U CN 207719148U
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- lower die
- intelligent chip
- cavity
- composite module
- fixed plate
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Abstract
The utility model is related to a kind of intelligent chip composite module semiconductor packaging molds, include mainly upper mould fixed plate and lower mold fixed plate；Upper model cavity and upper mold center flow channels are installed on the upper mould fixed plate；Lower die cavity and lower die central plate are installed in the lower mold fixed plate.Intelligent chip composite module semiconductor packaging mold described in the utility model is not only effectively protected more intelligent chips; so that it is played due effect, and is played in the installation of more intelligent chip composite module semiconductor components and devices and application aspect and ensure effect well：The workmanship for effectively raising intelligent chip composite module semiconductor components and devices accelerates the speed of making, reduces the production cost, and keeps more intelligent chips more stable more reliable, and use in more electronic products.
Description
Technical field
The utility model is related to intelligent chip modular combination integrated antenna package technical fields, it particularly relates to one
Kind intelligent chip composite module semiconductor packaging mold.
Background technology
The intelligent chip semiconductor components and devices produced currently on the market, most of is single flake products, single intelligent chip
Operation effect is poor, can not meet the application of number smart electronics product now.As more intelligent chip composite modules are partly led in market
The wilderness demand of volume elements device, traditional single intelligent chip encapsulating mould are difficult the production for meeting more intelligent chip composite modules,
Wherein because the volume encapsulated required for more intelligent chip composite module semiconductors is big, epoxide resin material is influenced by mobility
It is difficult filling molding, can leads to that filling is discontented, flash, bubble generate.Especially intelligent chip composite module semiconductor
Pin in lead frame, it is easy to be deformed by the strong extruding of traditional moulds, or local pin is by epoxy resin
A large amount of packages, when molding autonomous intelligence chip semiconductor component being caused to be used on required circuit board, can not correctly align
Installation is welded on circuit boards less than secured, damage easy to fall off.
Utility model content
Epoxide resin material, which cannot be efficiently controlled, for the single intelligent chip encapsulating mould of solution tradition is filled up completely molding,
The pin that lead frame cannot be controlled weighs a large amount of waste products caused by encapsulated problem wounded, increases processing cost.This practicality is new
Type provides a kind of intelligent chip composite module semiconductor packaging mold, and the lead frame with more intelligent chips is accurately solid
It is scheduled on required position, is encapsulated with epoxide resin material and can reach one-pass molding, and ensure that in lead frame
Lead it is indeformable, do not wrapped up by extra epoxide resin material.
In order to solve the above technical problems, the purpose of this utility model is achieved through the following technical solutions：
A kind of intelligent chip composite module semiconductor packaging mold includes mainly upper mould fixed plate and lower mold fixed plate；
Upper model cavity and upper mold center flow channels are installed on the upper mould fixed plate；It is installed in the lower mold fixed plate
There are lower die cavity and lower die central plate.
3 lead frame pilot pins are installed on the lower die cavity, can precise positioning lead frame position, described 3
Root lead frame pilot pin is made of 1 round pin and 2 diamond shape needles.Ensure to move during mold movement and changes position
It sets.
It is provided with multigroup wire lead slot on the upper model cavity.
Under the molding state that works, upper mould fixed plate and lower mold fixed plate are closed, make to be fixed on drawing on lower die cavity
Wire frame is exactly into the wire lead slot in model cavity.Lead in protection lead frame will not be weighed wounded, will not be by
Epoxy resin is encapsulated.
2 groups of runners are set on the lower die cavity, and lower die cavity surrounding is provided with the exhaust different from depth of multigroup size
Slot installs lower die filling barrel in the lower die central plate.
Epoxide resin material enters upper mold center flow channels by lower die filling barrel, then passes through 2 groups of runners on lower die cavity
It enters in the cavity that lower die cavity is formed with upper model cavity.
Gas in the cavity is arranged multigroup air discharge duct by lower die cavity surrounding and is quickly discharged, and ensures lead frame and draws
Intelligent chip epoxy encapsulation above wire frame is complete, becomes an independent semiconductor components and devices.
Intelligent chip composite module semiconductor packaging mold described in the utility model belongs to intelligent chip modular combination
Integrated antenna package technology.2 groups of runners are arranged in the encapsulating mould on lower die cavity, and epoxy resin material is filled to cavity
Material, installs 3 lead frame pilot pins in lower die cavity, and the position of precise positioning lead frame allows lead frame in molding
Lead in frame is exactly into model cavity in wire lead slot.Ensure that the lead in lead frame will not be by epoxy resin
It is encapsulated.It is distributed multigroup size air discharge duct different from depth in the cavity surrounding of lower die so that after epoxy resin enters cavity,
Occupying the gas in cavity smoothly can quickly exclude cavity.Ensure lead frame and the intelligent chip epoxy above lead frame
Resin-encapsulated is complete, becomes an independent semiconductor components and devices.
The beneficial effects of the utility model are：
Intelligent chip composite module semiconductor packaging mold described in the utility model can will be with more intelligent chips
Lead frame is accurately fixed on required position, is encapsulated with epoxide resin material and be can reach one-time formed effect
Fruit, and ensure that the lead in the lead frame of more intelligent chips is indeformable, more intelligent chips are not by extra epoxy resin
It is wrapped up.Intelligent chip composite module semiconductor packaging mold described in the utility model is not only effectively protected more intelligent cores
Piece makes it play due effect, and is risen in the installation of more intelligent chip composite module semiconductor components and devices and application aspect
Good guarantee effect is arrived.Intelligent chip composite module semiconductor packaging mold described in the utility model effectively raises
The workmanship of intelligent chip composite module semiconductor components and devices, accelerates the speed of making, reduces the production cost, and makes more intelligence
Energy chip is more stable more reliable, and uses in more electronic products.
Description of the drawings
Fig. 1 is the mould-matching structure schematic diagram of the upper and lower mould of intelligent chip composite module semiconductor packaging mold；
Fig. 2 is the upper mold cavity structure schematic diagram of intelligent chip composite module semiconductor packaging mold；
Fig. 3 is the lower die cavity structure schematic diagram of intelligent chip composite module semiconductor packaging mold；
Wherein, 1- upper mould fixed plates；2- lower mold fixed plates；The upper model cavities of 3-；4- upper mold center flow channels；5- wire lead slots；6-
Lower die cavity；7- lower die central plates；8- lower die filling barrels；9- lead frame pilot pins；10- runners；11- air discharge ducts.
Specific implementation mode
The utility model is described in further detail below in conjunction with attached drawing：The present embodiment is with the utility model skill
Implemented under premised on art scheme, give detailed embodiment, but the scope of protection of the utility model be not limited to it is following
Embodiment.
Fig. 1,2,3 show a kind of structure chart of intelligent chip composite module semiconductor packaging mold.
As shown in Figure 1, a kind of intelligent chip composite module semiconductor packaging mold, mainly including upper mould fixed plate 1 under
Mould fixed plate 2；
Upper model cavity 3 and upper mold center flow channels 4 are installed on the upper mould fixed plate 1；In the lower mold fixed plate 2
Lower die cavity 6 and lower die central plate 7 are installed.
Under the molding state that works, upper mould fixed plate 1 and lower mold fixed plate 2 are closed, make to be fixed on lower die cavity 6
Lead frame is exactly into the wire lead slot 5 in model cavity 3.Lead in protection lead frame will not be weighed wounded, no
It can be encapsulated by epoxy resin.
As shown in Fig. 2, being provided with multigroup wire lead slot 5 on the upper model cavity 3.
As shown in figure 3,3 lead frame pilot pins 9 are installed on the lower die cavity 6, it can precise positioning lead frame
Position, 3 lead frame pilot pins 9 are made of 1 round pin and 2 diamond shape needles.Ensure during mold movement
It will not move and change position.
2 groups of runners 10 are set on the lower die cavity 6, and it is different from depth that 6 surrounding of lower die cavity is provided with multigroup size
Air discharge duct 11, installation lower die filling barrel 8 in the lower die central plate 7.
Epoxide resin material enters upper mold center flow channels 4 by lower die filling barrel 8, then passes through 2 groups of streams on lower die cavity 6
Road 10 enters in the cavity that lower die cavity 6 is formed with upper model cavity 3.
The quickly discharge of multigroup air discharge duct 11 is arranged by 6 surrounding of lower die cavity in gas in the cavity, ensures lead frame
It is complete with the intelligent chip epoxy encapsulation above lead frame, become an independent semiconductor components and devices.
The preferable specific implementation mode of the above, only the utility model, these specific implementation modes are all based on this
Different realization methods under utility model general idea, and the scope of protection of the utility model is not limited thereto, it is any ripe
Know those skilled in the art within the technical scope disclosed by the utility model, the change or replacement that can be readily occurred in, all
It should cover and be within the protection scope of the utility model.
Claims (5)
1. a kind of intelligent chip composite module semiconductor packaging mold, it is characterised in that：
It include mainly upper mould fixed plate（1）And lower mold fixed plate（2）；
In the upper mould fixed plate（1）On model cavity is installed（3）With upper mold center flow channels（4）；In the lower mold fixed plate
（2）On lower die cavity is installed（6）With lower die central plate（7）；
The lower die cavity（6）On 3 lead frame pilot pins are installed（9）, 3 lead frame pilot pins（9）By 1
Round pin and 2 diamond shape needles form；
The upper model cavity（3）On be provided with multigroup wire lead slot（5）.
2. intelligent chip composite module semiconductor packaging mold according to claim 1, it is characterised in that：
Under the molding state that works, by upper mould fixed plate（1）With lower mold fixed plate（2）It is closed, makes to be fixed on lower die cavity（6）On
Lead frame enter model cavity（3）In wire lead slot（5）It is interior.
3. intelligent chip composite module semiconductor packaging mold according to claim 1, it is characterised in that：
The lower die cavity（6）2 groups of runners of upper setting（10）, lower die cavity（6）It is different from depth that surrounding is provided with multigroup size
Air discharge duct（11）, the lower die central plate（7）Middle installation lower die filling barrel（8）.
4. intelligent chip composite module semiconductor packaging mold according to claim 3, it is characterised in that：
Epoxide resin material is by lower die filling barrel（8）Enter upper mold center flow channels（4）, then pass through lower die cavity（6）On 2 groups
Runner（10）Enter lower die cavity（6）With upper model cavity（3）In the cavity of composition.
5. intelligent chip composite module semiconductor packaging mold according to claim 4, it is characterised in that：
Gas in the cavity is by lower die cavity（6）Multigroup air discharge duct is arranged in surrounding（11）Quickly discharge ensures lead frame
It is complete with the intelligent chip epoxy encapsulation above lead frame, become an independent semiconductor components and devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721867309.6U CN207719148U (en) | 2017-12-28 | 2017-12-28 | A kind of intelligent chip composite module semiconductor packaging mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721867309.6U CN207719148U (en) | 2017-12-28 | 2017-12-28 | A kind of intelligent chip composite module semiconductor packaging mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207719148U true CN207719148U (en) | 2018-08-10 |
Family
ID=63050478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721867309.6U Active CN207719148U (en) | 2017-12-28 | 2017-12-28 | A kind of intelligent chip composite module semiconductor packaging mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207719148U (en) |
-
2017
- 2017-12-28 CN CN201721867309.6U patent/CN207719148U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A Semiconductor Packaging Mold for Intelligent Chip Combination Module Effective date of registration: 20230726 Granted publication date: 20180810 Pledgee: China Construction Bank Corporation Dalian Free Trade Zone sub branch Pledgor: DALIAN TAIEE SEMICONDUCTOR EQUIPMENT CO.,LTD. Registration number: Y2023980049865 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |