CN203339212U - 一种led发光二极管体的封装结构 - Google Patents

一种led发光二极管体的封装结构 Download PDF

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CN203339212U
CN203339212U CN2013203076817U CN201320307681U CN203339212U CN 203339212 U CN203339212 U CN 203339212U CN 2013203076817 U CN2013203076817 U CN 2013203076817U CN 201320307681 U CN201320307681 U CN 201320307681U CN 203339212 U CN203339212 U CN 203339212U
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chip
positive electrode
negative electrode
compression molding
emitting diodes
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季伟源
邵丽娟
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Jiangsu Soul Photoelectric Technology Co Ltd
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Jiangsu Soul Photoelectric Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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Abstract

本实用新型公开了一种LED发光二极管体的封装结构，包括印刷电路板、芯片、透明的模压成型部，所述印刷电路板上设有正电极和负电极，所述芯片粘接于正电极或负电极上，芯片的正极和负极分别与正电极、负电极电接，所述模压成型部设置于印刷电路板上且覆盖所述芯片。由于所属模压成型部为透明的，不会对芯片发出的光造成任何阻挡，所以该芯片实现了高光效、低光衰、较大发光角度(大于130°)的效果。

Description

一种LED发光二极管体的封装结构
技术领域
本发明涉及到一种LED发光二极管体的封装结构。 
背景技术
目前使用的LED芯片，包括印刷电路板、芯片，该印刷电路板设置有正、负电极，其印刷电路板两侧设有凸台，该凸台之间构成成型模腔，往成型模腔内加入液态树脂固化形成模压成型部，凸台为不透明的材料，芯片发出的光只有其上方的可以透出，侧面的光则被成型模具所阻挡，导致光的亮度低下，已无法满足目前市场追求高光效、低光衰、较大发光角度(大于130°)的效果。 
另外，该凸台的存在需要耗费更多的人力、物力、财力，增加了生产成本，进而推高产品的单价，不利于市场竞争。 
发明内容
本发明所要解决的技术问题是：提供一种LED发光二极管体的封装结构，该LED芯片实现了高光效、低光衰、较大发光角度(大于130°)的效果，解决了目前亮度低、光衰大的问题。 
为解决上述技术问题，本发明的技术方案是：一种LED发光二极管体的封装结构，其特征在于：包括印刷电路板、芯片、透明的模压成型部，所述印刷电路板上设有正电极和负电极，所述芯片粘接于正电极或负电极上，芯片的正极和负极分别与正电极、负电极电接，所述模压成型部设置于印刷电路板上且覆盖所述芯片。 
作为一种优选的方案，所述一种LED发光二极管体的封装结构还包括导电线，芯片通过非导电性胶粘接于正电极或负电极上，芯片的正极、负极分别通过导电线与正电极、负电极相电接。 
作为一种优选的方案，所述LED芯片还包括导电线，芯片通过导电性胶粘接于正电极或负电极上，芯片的正极或负极与导电性胶相接触，芯片的负极或 正极通过导电线与负电极或正电极相电接。 
作为一种优选的方案，所述模压成型部为硅树脂。 
作为一种优选的方案，所述模压成型部为硅树脂和荧光粉的混合物。 
作为一种优选的方案，所述导电线为金线或合金线。 
作为一种优选的方案，所述的模压成型部为硅树脂，所述芯片上喷涂有荧光粉。 
作为一种优选的方案，所述模压成型部的形状为梯形或者半球型。 
采用了上述技术方案后，本发明的有益效果是：由于所述模压成型部为透明的，并且四周并未有任何其他非透明的凸台，不会对芯片发出的光造成任何阻挡，所以该芯片实现了高光效、低光衰、较大发光角度(大于130°)的效果，该模压成型部可以利用模具直接在印刷电路板上固化成型。 
又由于所述模压成型部为硅树脂或硅树脂和荧光粉的混合物，不需要额外的模具，有效减少了人力、物力、财力的投入，降低了生产成本，使得该芯片更具市场竞争优势。 
附图说明
下面结合附图和实施例对本发明作进一步说明。 
图1是本发明实施例1的结构剖视图； 
图2是本发明实施例2的结构剖视图； 
图3是本发明实施例3的结构剖视图； 
附图1至3中：1.印刷电路板；2.正电极；3.负电极；4.芯片；5.非导电性胶；6.模压成型部；6-1.荧光粉；7.导电线。 
具体实施方式
下面通过具体实施例对本发明所述的一种LED发光二极管体的封装结构作进一步的详细描述。 
实施例1 
如图1所示，一种LED发光二极管体的封装结构，包括印刷电路板1、电 极、芯片4、透明的模压成型部6，所述印刷电路板1上设有正电极2和负电极3，正电极2和负电极3均安装于印刷电路板1上表面，所述芯片4粘接于正电极2或负电极3上，芯片4的正极和负极分别与正电极2、负电极3电接，所述模压成型部6位于正电极2、负电极3、芯片4及印刷电路板1的上部并且模压成型部6设置于印刷电路板1的上表面并将芯片4以及部分正电极2、负电极3覆盖。 
本实施例中，所述芯片4还包括导电线7，芯片4通过非导电性胶5粘接于正电极2或负电极3上，芯片4的正极、负极分别通过导电线7与正电极2、负电极3相电接。当然，芯片4还可以通过导电性胶粘接于正电极2或负电极3上，此时芯片4的正极或负极与导电性胶相接触，芯片4的负极或正极通过导电线7与负电极3或正电极2相电接。所述导电线7的材质为金线或合金线。 
该实施例中，模压成型部6的形状为梯形，且该模压成型部6用的材料为硅树脂或者硅树脂和荧光粉的混合物，芯片4发出的光转换为白光。 
实施例2 
该实施例与实施例1的结构基本相同，只是模压成型部6的材质为硅树脂，而芯片4的表面喷涂有荧光粉。 
实施例3 
该实施例与实施例2的结构基本相同，只是模压成型部6的形状为半圆形。 

Claims (7)

1.一种LED发光二极管体的封装结构，其特征在于：包括印刷电路板、芯片、透明的模压成型部，所述印刷电路板上设有正电极和负电极，所述芯片粘接于正电极或负电极上，芯片的正极和负极分别与正电极、负电极电接，所述模压成型部设置于印刷电路板上且覆盖所述芯片。
2.如权利要求1所述一种LED发光二极管体的封装结构，其特征在于：所述LED芯片还包括导电线，芯片通过非导电性胶粘接于正电极或负电极上，芯片的正极、负极分别通过导电线与正电极、负电极相电接。
3.如权利要求1所述一种LED发光二极管体的封装结构，其特征在于：所述LED芯片还包括导电线，芯片通过导电性胶粘接于正电极或负电极上，芯片的正极或负极与导电性胶相接触，芯片的负极或正极通过导电线与负电极或正电极相电接。
4.如权利要求1至3任一项所述一种LED发光二极管体的封装结构，其特征在于：所述模压成型部为硅树脂。
5.如权利要求3所述一种LED发光二极管体的封装结构，其特征在于：所述导电线为金线或合金线。
6.如权利要求1至3任一项所述一种LED发光二极管体的封装结构，其特征在于：所述的模压成型部为硅树脂，所述芯片上喷涂有荧光粉。
7.如权利要求6所述一种LED发光二极管体的封装结构，其特征在于：所述模压成型部的形状为梯形或者半球型。
CN2013203076817U 2013-05-31 2013-05-31 一种led发光二极管体的封装结构 Expired - Fee Related CN203339212U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103325920A (zh) * 2013-05-31 2013-09-25 江苏索尔光电科技有限公司 一种led发光二极管体的封装形式

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103325920A (zh) * 2013-05-31 2013-09-25 江苏索尔光电科技有限公司 一种led发光二极管体的封装形式

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