CN203307439U - 用于电镀的不可渗透基板载体 - Google Patents

用于电镀的不可渗透基板载体 Download PDF

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Publication number
CN203307439U
CN203307439U CN2011900005857U CN201190000585U CN203307439U CN 203307439 U CN203307439 U CN 203307439U CN 2011900005857 U CN2011900005857 U CN 2011900005857U CN 201190000585 U CN201190000585 U CN 201190000585U CN 203307439 U CN203307439 U CN 203307439U
Authority
CN
China
Prior art keywords
substrate
carrier
carrier element
intermediate plate
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2011900005857U
Other languages
English (en)
Chinese (zh)
Inventor
伊曼纽尔·楚阿·阿巴斯
陈真安
马小冰
卡里安纳·巴尔加瓦·甘地
埃德蒙多·阿尼达·迪威诺
杰克·兰德尔·G·尔米塔
乔斯·弗朗西斯科·S·卡普隆
阿诺德·维拉莫尔·卡斯帝罗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SunPower Corp
Original Assignee
SunPower Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/889,228 external-priority patent/US8221600B2/en
Priority claimed from US12/889,232 external-priority patent/US8221601B2/en
Priority claimed from US12/889,219 external-priority patent/US8317987B2/en
Application filed by SunPower Corp filed Critical SunPower Corp
Application granted granted Critical
Publication of CN203307439U publication Critical patent/CN203307439U/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN2011900005857U 2010-09-23 2011-07-11 用于电镀的不可渗透基板载体 Expired - Lifetime CN203307439U (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US12/889,228 US8221600B2 (en) 2010-09-23 2010-09-23 Sealed substrate carrier for electroplating
US12/889,228 2010-09-23
US12/889,219 2010-09-23
US12/889,232 2010-09-23
US12/889,232 US8221601B2 (en) 2010-09-23 2010-09-23 Maintainable substrate carrier for electroplating
US12/889,219 US8317987B2 (en) 2010-09-23 2010-09-23 Non-permeable substrate carrier for electroplating
PCT/US2011/043571 WO2012039816A1 (en) 2010-09-23 2011-07-11 Non-permeable substrate carrier for electroplating

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201320681505.XU Division CN203795007U (zh) 2010-09-23 2011-07-11 用于电镀的不可渗透基板载体

Publications (1)

Publication Number Publication Date
CN203307439U true CN203307439U (zh) 2013-11-27

Family

ID=45874099

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2011900005857U Expired - Lifetime CN203307439U (zh) 2010-09-23 2011-07-11 用于电镀的不可渗透基板载体
CN201320681505.XU Expired - Lifetime CN203795007U (zh) 2010-09-23 2011-07-11 用于电镀的不可渗透基板载体

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201320681505.XU Expired - Lifetime CN203795007U (zh) 2010-09-23 2011-07-11 用于电镀的不可渗透基板载体

Country Status (6)

Country Link
EP (2) EP3150748B1 (de)
JP (2) JP5792820B2 (de)
KR (2) KR101764275B1 (de)
CN (2) CN203307439U (de)
ES (1) ES2605805T3 (de)
WO (3) WO2012039817A2 (de)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4297197A (en) * 1980-11-13 1981-10-27 International Telephone And Telegraph Corp. Electroplating rack
US4796157A (en) * 1988-01-04 1989-01-03 Motorola, Inc. Substrate mounting assembly
US5078852A (en) * 1990-10-12 1992-01-07 Microelectronics And Computer Technology Corporation Plating rack
KR100616198B1 (ko) * 1998-04-21 2006-08-25 어플라이드 머티어리얼스, 인코포레이티드 기판상에 전기도금하는 전기화학적 증착 시스템 및 방법
JP2001234397A (ja) 2000-02-24 2001-08-31 Matsushita Electric Works Ltd 電気メッキ用冶具
JP3413185B2 (ja) 2000-11-15 2003-06-03 古河電気工業株式会社 めっき用治具
US7172184B2 (en) * 2003-08-06 2007-02-06 Sunpower Corporation Substrate carrier for electroplating solar cells
US7930006B2 (en) * 2004-09-08 2011-04-19 Belkin International, Inc. Holder, electrical supply, and RF transmitter unit for electronic devices
US20080248596A1 (en) * 2007-04-04 2008-10-09 Endicott Interconnect Technologies, Inc. Method of making a circuitized substrate having at least one capacitor therein
EP1717351A1 (de) * 2005-04-27 2006-11-02 Enthone Inc. Galvanikbad
DE102005039100A1 (de) * 2005-08-09 2007-02-15 Gebr. Schmid Gmbh & Co. Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung
US7718888B2 (en) * 2005-12-30 2010-05-18 Sunpower Corporation Solar cell having polymer heterojunction contacts
WO2009042669A1 (en) * 2007-09-24 2009-04-02 Chemical Specialties Manufacturing Corp. Cleaning device

Also Published As

Publication number Publication date
KR20170091755A (ko) 2017-08-09
JP6080320B2 (ja) 2017-02-15
KR101828394B1 (ko) 2018-02-12
EP2619349B1 (de) 2016-11-09
EP3150748A1 (de) 2017-04-05
WO2012039817A2 (en) 2012-03-29
WO2012039817A3 (en) 2014-03-20
EP2619349A1 (de) 2013-07-31
JP2016014192A (ja) 2016-01-28
EP2619349A4 (de) 2016-01-27
WO2012039816A1 (en) 2012-03-29
ES2605805T3 (es) 2017-03-16
WO2012039818A1 (en) 2012-03-29
KR101764275B1 (ko) 2017-08-03
JP5792820B2 (ja) 2015-10-14
EP3150748B1 (de) 2018-05-09
JP2013537941A (ja) 2013-10-07
KR20130121704A (ko) 2013-11-06
CN203795007U (zh) 2014-08-27

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C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20131127

CX01 Expiry of patent term